类别是'嵌入式 - CPLD(复杂可编程逻辑器件)'
嵌入式 - CPLD(复杂可编程逻辑器件) (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 可编程类型 | 电压 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 电源电流 | 内存大小 | 最大电源电流 | 时钟频率 | 传播延迟 | 接通延迟时间 | 建筑学 | 输入数量 | 逻辑元件/单元数 | 阀门数量 | 最高频率 | 筛选水平 | 可编程I/O数 | 逻辑块数(LABs) | 速度等级 | 输出功能 | 宏细胞数 | JTAG BST | 专用输入数量 | 内部供电电压 | 延迟时间 tpd(1)最大 | 逻辑元素/块的数量 | 产品条款数量 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||
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![]() | GAL16V8D-15LPI | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 通孔 | 20-DIP (0.300, 7.62mm) | 20 | 8 | -40°C~85°C TA | Bulk | 1996 | GAL®16V8 | e0 | no | Obsolete | 3 (168 Hours) | 20 | EAR99 | Tin/Lead (Sn/Pb) | DUAL | 225 | 5V | 2.54mm | 62.5MHz | 30 | GAL16V8 | 20 | 8 | 5V | 5V | EE PLD | 5V | 5.5V | 4.5V | 130mA | 15 ns | 15 ns | PAL-TYPE | MACROCELL | 8 | 8 | 4.5V~5.5V | 64 | 5.334mm | 26.162mm | 7.62mm | 无 | Non-RoHS Compliant | 无铅 | ||||||||||||||||||||||||||||||
![]() | EPM2210F256A5 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 256-BGA | YES | 204 | -40°C~125°C TJ | Tray | MAX® II | e0 | 活跃 | 3 (168 Hours) | 256 | 3A001.A.7.A | 锡铅 | YES | 8542.39.00.01 | BOTTOM | BALL | 220 | 1mm | 30 | EPM2210 | S-PBGA-B256 | 不合格 | 1.5/3.32.5/3.3V | 系统内可编程 | 11.2 ns | 1700 | YES | 2.5V 3.3V | 7ns | 2210 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||
![]() | LC4512V-35FTN256C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 208 | 表面贴装 | 表面贴装 | 256-LBGA | 256 | EEPROM | 0°C~90°C TJ | Tray | 2000 | ispMACH® 4000V | e1 | yes | 活跃 | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | 8542.39.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 384.6MHz | 40 | LC4512 | 256 | 不合格 | 3.3V | 系统内可编程 | 3.6V | 3V | 14mA | 14mA | 3.5 ns | 36 | MACROCELL | 512 | YES | 4 | 3V~3.6V | 32 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||
![]() | EPM7160SLC84-6 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 84-LCC (J-Lead) | YES | 64 | 0°C~70°C TA | Tray | MAX® 7000S | e0 | Obsolete | 3 (168 Hours) | 84 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | J BEND | 220 | 5V | 1.27mm | 30 | EPM7160 | S-PQCC-J84 | 不合格 | 5.25V | 3.3/55V | 4.75V | 系统内可编程 | 166.7MHz | 6 ns | 3200 | MACROCELL | 160 | YES | 4.75V~5.25V | 6ns | 10 | 5.08mm | 29.3116mm | 29.3116mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||
![]() | EPM7128STC100-6N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 100-TQFP | YES | 84 | 0°C~70°C TA | Tray | MAX® 7000S | e3 | Obsolete | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | QUAD | 鸥翼 | 260 | 5V | 0.5mm | compliant | 40 | EPM7128 | S-PQFP-G100 | 不合格 | 5.25V | 3.3/55V | 4.75V | 系统内可编程 | 166.7MHz | 6 ns | 2500 | MACROCELL | 128 | YES | 4.75V~5.25V | 6ns | 8 | 1.27mm | 14mm | 14mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||
![]() | CY37064VP44-100AXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 37 | Gold, Tin | 表面贴装 | 表面贴装 | 44-LQFP | 44 | EEPROM | 0°C~70°C TA | Tray | 2001 | Ultra37000™ | e4 | Obsolete | 3 (168 Hours) | 44 | Nickel/Palladium/Gold (Ni/Pd/Au) | QUAD | 鸥翼 | 260 | 3.3V | 0.8mm | 100MHz | 20 | CY37064 | 44 | 3.3V | In-System Reprogrammable™ (ISR™) Flash | 3.6V | 3V | 12 ns | 12 ns | 2000 | 4 | 100 | MACROCELL | 64 | YES | 1 | 3V~3.6V | 1.6mm | 10mm | 10mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||
![]() | XCR3384XL-12TQG144I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 118 | 表面贴装 | 表面贴装 | 144-LQFP | 144 | EEPROM | -40°C~85°C TA | Tray | 1996 | CoolRunner XPLA3 | e3 | yes | 活跃 | 3 (168 Hours) | 144 | EAR99 | Matte Tin (Sn) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 30 | 144 | 不合格 | 3.3V | 3.6V | In System Programmable (min 1K program/erase cycles) | 12 ns | 24 | 9000 | 83MHz | 12 | MACROCELL | 384 | YES | 2.7V~3.6V | 10.8ns | 1.6mm | 20mm | 20mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||
![]() | XC95216-15PQG160C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 133 | 表面贴装 | 表面贴装 | 160-BQFP | 160 | FLASH | 0°C~70°C TA | Tray | 1996 | XC9500 | e3 | yes | Obsolete | 3 (168 Hours) | 160 | EAR99 | Matte Tin (Sn) | YES | QUAD | 鸥翼 | 245 | 5V | 0.65mm | 30 | XC95216 | 160 | 5V | In System Programmable (min 10K program/erase cycles) | 15 ns | 15 ns | 8 | 4800 | 55.6MHz | 15 | MACROCELL | 216 | YES | 4.75V~5.25V | 12 | 3.7mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||
![]() | XC95108-15PC84I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 69 | 表面贴装 | 表面贴装 | 84-LCC (J-Lead) | 84 | FLASH | -40°C~85°C TA | Tube | 1996 | XC9500 | e0 | no | Obsolete | 3 (168 Hours) | 84 | EAR99 | YES | QUAD | J BEND | 225 | 5V | 1.27mm | 30 | XC95108 | 84 | 5V | In System Programmable (min 10K program/erase cycles) | 15 ns | 8 | 2400 | 55.6MHz | 15 | MACROCELL | 108 | YES | 4.5V~5.5V | 6 | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||
![]() | LC5512MV-45F484C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 253 | 表面贴装 | 表面贴装 | 484-BBGA | 484 | EEPROM, SRAM | 0°C~90°C TJ | Tray | 2000 | ispXPLD® 5000MV | no | Obsolete | 3 (168 Hours) | EAR99 | 8542.39.00.01 | not_compliant | LC5512 | 484 | 3.3V | 系统内可编程 | 3.6V | 3V | 33mA | 33mA | 275MHz | 176 | 512 | 3V~3.6V | 4.5ns | 16 | Non-RoHS Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||
![]() | LC4064V-25TN44C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 30 | 表面贴装 | 表面贴装 | 44-TQFP | 44 | EEPROM | 0°C~90°C TJ | Tray | 2000 | ispMACH® 4000V | e3 | yes | 活跃 | 3 (168 Hours) | 44 | EAR99 | Matte Tin (Sn) | YES | QUAD | 鸥翼 | 260 | 3.3V | 0.8mm | 454.5MHz | 40 | LC4064 | 44 | 3.3V | 系统内可编程 | 3.6V | 3V | 12mA | 12mA | 2.5 ns | 2.5 ns | 272 | 36 | MACROCELL | 64 | YES | 2 | 3V~3.6V | 4 | 1.2mm | 10mm | 10mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||
![]() | GAL16V8D-25QPN | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 通孔 | 20-DIP (0.300, 7.62mm) | 20 | 8 | 0°C~75°C TA | Bulk | 1996 | GAL®16V8 | e3 | yes | Obsolete | 1 (Unlimited) | 20 | EAR99 | Matte Tin (Sn) | DUAL | 5V | 2.54mm | 41.6MHz | GAL16V8 | 20 | 8 | 5V | 5V | EE PLD | 5.25V | 4.75V | 55mA | 55mA | 25 ns | 25 ns | PAL-TYPE | 16 | MACROCELL | 8 | 8 | 4.75V~5.25V | 64 | 5.334mm | 7.62mm | 无 | 无SVHC | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||
![]() | 5M240ZT100C4N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 100-TQFP | YES | 79 | 0°C~85°C TJ | Tray | MAX® V | e3 | 活跃 | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) - annealed | YES | 8542.39.00.01 | QUAD | 鸥翼 | 未说明 | 1.8V | 0.5mm | 未说明 | 5M240Z | S-PQFP-G100 | 不合格 | 1.89V | 1.81.2/3.3V | 1.71V | 系统内可编程 | 184.1MHz | 7.9 ns | MACROCELL | 192 | YES | 1.71V~1.89V | 7.5ns | 240 | 1.2mm | 14mm | 14mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||
![]() | ATF750C-15GM/883 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 10 | Military grade | Lead, Tin | 通孔 | 通孔 | 24-CDIP (0.300, 7.62mm) | 24 | EEPROM | -55°C~125°C TA | Tube | 1997 | ATF750C(L) | e0 | yes | 活跃 | 1 (Unlimited) | 24 | Tin/Lead (Sn/Pb) | NO | DUAL | 5V | 2.54mm | 71MHz | ATF750 | 5V | 5V | In System Programmable (min 1K program/erase cycles) | 5.5V | 4.5V | 15 ns | 15 ns | 750 | MIL-STD-883 | 15 | MACROCELL | 10 | NO | 11 | 4.5V~5.5V | 5.08mm | 32mm | 7.62mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||
![]() | EPM7512BFC256-5 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 256-BGA | YES | 212 | 0°C~70°C TA | Tray | MAX® 7000B | e0 | Obsolete | 3 (168 Hours) | 256 | 3A991 | Tin/Lead (Sn/Pb) | YES | 8542.39.00.01 | BOTTOM | BALL | 220 | 2.5V | 1mm | 30 | EPM7512 | S-PBGA-B256 | 不合格 | 2.625V | 1.8/3.32.5V | 2.375V | 系统内可编程 | 163.9MHz | 5.5 ns | 10000 | MACROCELL | 512 | YES | 2.375V~2.625V | 5.5ns | 32 | 3.5mm | 17mm | 17mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
![]() | EPM7032BTI44-5 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 44-TQFP | 36 | -40°C~85°C TA | Tray | MAX® 7000B | Obsolete | 3 (168 Hours) | EPM7032 | 系统内可编程 | 600 | 32 | 2.375V~2.625V | 5ns | 2 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EPM7256BUC169-5 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 169-LFBGA | YES | 141 | 0°C~70°C TA | Tray | MAX® 7000B | e0 | Obsolete | 3 (168 Hours) | 169 | 3A991 | Tin/Lead (Sn/Pb) | YES | 8542.39.00.01 | BOTTOM | BALL | 235 | 2.5V | 0.8mm | compliant | 30 | EPM7256 | 不合格 | 2.625V | 1.8/3.32.5V | 2.375V | 系统内可编程 | 188.7MHz | 5 ns | 5000 | MACROCELL | 256 | YES | 2.375V~2.625V | 5ns | 16 | 1.55mm | 11mm | 11mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
![]() | EPM7128BTC100-4N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 100-TQFP | YES | 84 | 0°C~70°C TA | Tray | MAX® 7000B | e3 | Obsolete | 3 (168 Hours) | 100 | 3A991 | Matte Tin (Sn) | YES | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | compliant | 40 | EPM7128 | S-PQFP-G100 | 不合格 | 2.625V | 2.375V | 系统内可编程 | 243.9MHz | 4 ns | 2500 | MACROCELL | 128 | YES | 2.375V~2.625V | 4ns | 8 | 1.27mm | 14mm | 14mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||
![]() | EPM570ZM144I8N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 144-TFBGA | 116 | -40°C~100°C TJ | Tray | MAX® II | 活跃 | 3 (168 Hours) | EPM570 | 系统内可编程 | 440 | 1.71V~1.89V | 9ns | 570 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | LC5512MV-45F256C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 193 | 表面贴装 | 表面贴装 | 256-BGA | 256 | EEPROM, SRAM | 0°C~90°C TJ | Tray | 2000 | ispXPLD® 5000MV | e0 | no | Obsolete | 3 (168 Hours) | 256 | EAR99 | Tin/Lead (Sn63Pb37) | YES | 8542.39.00.01 | BOTTOM | BALL | 225 | 3.3V | 1mm | 333MHz | 30 | LC5512 | 256 | 3.3V | 系统内可编程 | 3.6V | 3V | 33mA | 33mA | 32kB | 4.5 ns | 4.5 ns | 16 | 100 | MACROCELL | 512 | YES | 3V~3.6V | 2.1mm | 17mm | 17mm | 无 | Non-RoHS Compliant | 无铅 | |||||||||||||||||||||||||||
![]() | XC95108-20PQ100C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 81 | 表面贴装 | 表面贴装 | 100-BQFP | 100 | FLASH | 0°C~70°C TA | Tray | 1996 | XC9500 | e0 | no | Obsolete | 3 (168 Hours) | 100 | EAR99 | YES | QUAD | 鸥翼 | 225 | 5V | 30 | XC95108 | 100 | 5V | In System Programmable (min 10K program/erase cycles) | 20 ns | 20 ns | 8 | 2400 | 50MHz | 20 | MACROCELL | 108 | YES | 4.75V~5.25V | 6 | 3.4mm | 14mm | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||
![]() | EPM570GF256C5 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 256-BGA | YES | 160 | 0°C~85°C TJ | Tray | MAX® II | e0 | 活跃 | 3 (168 Hours) | 256 | EAR99 | 锡铅 | YES | 8542.39.00.01 | BOTTOM | BALL | 220 | 1.8V | 1mm | 30 | EPM570 | S-PBGA-B256 | 不合格 | 1.89V | 1.5/3.31.8V | 1.71V | 系统内可编程 | 8.7 ns | MACROCELL | 440 | YES | 1.71V~1.89V | 5.4ns | 570 | 2.2mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
![]() | EPM570T144A5N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 144-LQFP | YES | 116 | -40°C~125°C TJ | Tray | MAX® II | e3 | 活跃 | 3 (168 Hours) | 144 | EAR99 | MATTE TIN (472) OVER COPPER | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 40 | EPM570 | S-PQFP-G144 | 不合格 | 2.625V | 1.5/3.32.5/3.3V | 2.375V | 系统内可编程 | 8.7 ns | MACROCELL | 440 | YES | 2.5V 3.3V | 5.4ns | 570 | 1.6mm | 20mm | 20mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||
![]() | LC4064C-25T48C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 32 | 表面贴装 | 表面贴装 | 48-LQFP | 48 | EEPROM | 0°C~90°C TJ | Tray | 2000 | ispMACH® 4000C | e0 | no | Obsolete | 3 (168 Hours) | 48 | EAR99 | Tin/Lead (Sn85Pb15) | YES | QUAD | 鸥翼 | 240 | 1.8V | 0.5mm | not_compliant | 454.5MHz | 30 | LC4064 | 48 | 不合格 | 1.8V | 系统内可编程 | 1.95V | 1.65V | 2mA | 2mA | 2.5 ns | 36 | 256 | MACROCELL | 64 | YES | 4 | 1.65V~1.95V | 4 | 1.2mm | 7mm | 7mm | Non-RoHS Compliant | 无铅 | |||||||||||||||||||||||||||
![]() | XA2C128-8CPG132Q | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Automotive grade | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 132-TFBGA, CSPBGA | 132 | 100 | -40°C~105°C TA | Tray | 2003 | CoolRunner II | e1 | yes | 活跃 | 3 (168 Hours) | 132 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | BOTTOM | BALL | 260 | 1.8V | 0.5mm | 30 | XA2C128 | 132 | 不合格 | 1.8V | 系统内可编程 | 1.9V | 1.7V | 7.5 ns | 7.5 ns | 8 | 3000 | 152MHz | MACROCELL | 128 | YES | 1.7V~1.9V | 7ns | 1.1mm | ROHS3 Compliant |