类别是'嵌入式 - CPLD（复杂可编程逻辑器件）'
嵌入式 - CPLD（复杂可编程逻辑器件） (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 可编程类型 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 端口的数量 | 电源电流 | 时钟频率 | 传播延迟 | 接通延迟时间 | 地址总线宽度 | 逻辑元件/单元数 | 密度 | 阀门数量 | 最高频率 | 可编程I/O数 | 逻辑块数(LABs) | 速度等级 | 输出功能 | 宏细胞数 | JTAG BST | 专用输入数量 | 内部供电电压 | 延迟时间 tpd(1)最大 | 逻辑元素/块的数量 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | LC4256V-75T100C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 64 | 表面贴装 | 表面贴装 | 100-LQFP | 100 | EEPROM | 0°C~90°C TJ | Tray | 2000 | ispMACH® 4000V | e0 | no | Obsolete | 3 (168 Hours) | 100 | EAR99 | Tin/Lead (Sn/Pb) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 240 | 3.3V | 0.5mm | 178.57MHz | 30 | LC4256 | 100 | 3.3V | 系统内可编程 | 3.6V | 3V | 12.5mA | 12.5mA | 7.5 ns | 7.5 ns | 36 | 48 | MACROCELL | 256 | YES | 10 | 3V~3.6V | 16 | 1.6mm | 14mm | 14mm | 无 | Non-RoHS Compliant | 无铅 | |||||||||||||||||||||||
 | XCR3128XL-10CS144I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 108 | 表面贴装 | 144-TFBGA, CSPBGA | YES | 144 | EEPROM | -40°C~85°C TA | Bulk | 1996 | CoolRunner XPLA3 | e0 | no | 活跃 | 3 (168 Hours) | 144 | EAR99 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 240 | 3.3V | 30 | 144 | 3.3V | 3.6V | In System Programmable (min 1K program/erase cycles) | 10 ns | 10 ns | 8 | 3000 | 95MHz | 10 | MACROCELL | 128 | YES | 2.7V~3.6V | 9.1ns | 1.2mm | 12mm | 12mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||
 | XCR3256XL-12FTG256I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 164 | 表面贴装 | 表面贴装 | 256-LBGA | EEPROM | -40°C~85°C TA | Tray | 2003 | CoolRunner XPLA3 | e1 | yes | 活跃 | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | 8542.39.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 30 | 256 | 不合格 | 3.3V | 3.6V | In System Programmable (min 1K program/erase cycles) | 12 ns | 16 | 6000 | 88MHz | 12 | MACROCELL | 256 | YES | 2.7V~3.6V | 10.8ns | 1.55mm | 17mm | 17mm | ROHS3 Compliant | |||||||||||||||||||||||||||||
 | EPM570GF256C3 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 256-BGA | YES | 160 | 0°C~85°C TJ | Tray | 2014 | MAX® II | e0 | 活跃 | 3 (168 Hours) | 256 | EAR99 | 锡铅 | YES | 8542.39.00.01 | BOTTOM | BALL | 220 | 1.8V | 1mm | 30 | EPM570 | S-PBGA-B256 | 不合格 | 1.89V | 1.5/3.31.8V | 1.71V | 系统内可编程 | 5.4 ns | MACROCELL | 440 | YES | 1.71V~1.89V | 5.4ns | 570 | 2.2mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
 | ATF1508AS-15QC100 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 80 | Lead, Tin | 表面贴装 | 表面贴装 | 100-BQFP | 100 | 100-PQFP (14x20) | EEPROM | 0°C~70°C TA | Tray | 1997 | ATF15xx | Obsolete | 3 (168 Hours) | 70°C | 0°C | ATF1508AS | 5V | In System Programmable (min 10K program/erase cycles) | 5.25V | 4.75V | 15 ns | 3000 | 100MHz | 80 | 8 | 15 | 128 | 4.75V~5.25V | 15ns | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||
 | XC2C256-7PQG208C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Tin | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 173 | 0°C~70°C TA | Tray | 2001 | CoolRunner II | e3 | yes | 活跃 | 3 (168 Hours) | 208 | EAR99 | 真正的数字设计技术 | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 1.8V | 0.5mm | 30 | XC2C256 | 208 | 不合格 | 1.8V | 系统内可编程 | 1.9V | 1.7V | 7.5 ns | 7.5 ns | 16 | 6000 | 152MHz | 7 | MACROCELL | 256 | YES | 1.7V~1.9V | 6.7ns | 4.1mm | 28mm | 28mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||
 | XCR3064XL-10CS48I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 40 | Lead, Tin | 表面贴装 | 表面贴装 | 48-FBGA, CSPBGA | 48 | EEPROM | -40°C~85°C TA | Tray | 1996 | CoolRunner XPLA3 | e0 | no | 活跃 | 3 (168 Hours) | 48 | EAR99 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 240 | 3.3V | 0.8mm | 30 | XCR3064XL | 48 | 3.3V | In System Programmable (min 1K program/erase cycles) | 3.6V | 2.7V | 10 ns | 10 ns | 4 | 1500 | 95MHz | 10 | MACROCELL | 64 | YES | 2.7V~3.6V | 9.1ns | 1.8mm | 7mm | 7mm | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||
 | XC95108-10PC84C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 69 | 表面贴装 | 表面贴装 | 84-LCC (J-Lead) | 84 | FLASH | 0°C~70°C TA | Tube | 1996 | XC9500 | e0 | no | Obsolete | 3 (168 Hours) | 84 | EAR99 | YES | QUAD | J BEND | 225 | 5V | 1.27mm | 30 | XC95108 | 84 | 5V | In System Programmable (min 10K program/erase cycles) | 10 ns | 8 | 2400 | 66.7MHz | 10 | MACROCELL | 108 | YES | 4.75V~5.25V | 6 | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||
 | EPM1270GT144C5N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 144-LQFP | YES | 116 | 0°C~85°C TJ | Tray | MAX® II | e3 | 活跃 | 3 (168 Hours) | 144 | 3A991 | Matte Tin (Sn) - annealed | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 1.8V | 0.5mm | 40 | EPM1270 | S-PQFP-G144 | 不合格 | 1.89V | 1.5/3.31.8V | 1.71V | 系统内可编程 | 10 ns | MACROCELL | 980 | YES | 1.71V~1.89V | 6.2ns | 1270 | 1.6mm | 20mm | 20mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
 | EPM7032AETC44-4 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 44-TQFP | YES | 36 | 0°C~70°C TA | Tray | MAX® 7000A | e0 | 活跃 | 3 (168 Hours) | 44 | Tin/Lead (Sn/Pb) | QUAD | 鸥翼 | 235 | 3.3V | 0.8mm | 30 | EPM7032 | S-PQFP-G44 | 不合格 | 3.6V | 3V | 系统内可编程 | 4.5 ns | 600 | MACROCELL | 32 | YES | 3V~3.6V | 4.5ns | 2 | 10mm | 10mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||
 | EPM7256AETC100-7 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 100-TQFP | YES | 84 | 0°C~70°C TA | Tray | 1998 | MAX® 7000A | e0 | 活跃 | 3 (168 Hours) | 100 | 3A991 | Tin/Lead (Sn85Pb15) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 235 | 3.3V | 0.5mm | not_compliant | 30 | EPM7256 | S-PQFP-G100 | 不合格 | 3.6V | 2.5/3.33.3V | 3V | 系统内可编程 | 126.6MHz | 7.5 ns | 5000 | MACROCELL | 256 | YES | 3V~3.6V | 7.5ns | 16 | 1.27mm | 14mm | 14mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||
 | ATF1504ASV-15JU44 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 32 | Tin | 表面贴装 | 表面贴装 | 44-LCC (J-Lead) | 44 | EEPROM | -40°C~85°C TA | Tube | 1997 | ATF15xx | e3 | yes | 活跃 | 3 (168 Hours) | 44 | YES | QUAD | J BEND | 245 | 3.3V | 1.27mm | 76.9MHz | 40 | ATF1504ASV | 不合格 | 3.3V | In System Programmable (min 10K program/erase cycles) | 3.6V | 3V | 15 ns | 15 ns | 1500 | 15 | MACROCELL | 64 | YES | 3V~3.6V | 4.572mm | 16.586mm | 16.586mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||
| EPM1270T144C3 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 144-LQFP | YES | 116 | 0°C~85°C TJ | Tray | 2003 | MAX® II | e0 | 活跃 | 3 (168 Hours) | 144 | 3A991 | 锡铅 | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | QUAD | 鸥翼 | 220 | 2.5V | 0.5mm | 30 | EPM1270 | S-PQFP-G144 | 不合格 | 2.625V | 1.5/3.32.5/3.3V | 2.375V | 系统内可编程 | 6.2 ns | MACROCELL | 980 | YES | 2.5V 3.3V | 6.2ns | 1270 | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
| XC2C384-10FTG256I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 212 | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 256-LBGA | 256 | ROMless | -40°C~85°C TA | Tray | 2001 | CoolRunner II | e1 | yes | 活跃 | 3 (168 Hours) | 256 | 3A991.D | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.8V | 1mm | 30 | XC2C384 | 256 | 1.8V | 系统内可编程 | 1.9V | 1.7V | 10 ns | 10 ns | 24 | 9000 | 125MHz | 10 | MACROCELL | 384 | YES | 1.7V~1.9V | 9.2ns | 1.55mm | 17mm | 17mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||
 | EPM7064SLC84-10 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 84-LCC (J-Lead) | YES | 68 | 0°C~70°C TA | Tray | MAX® 7000S | e0 | Obsolete | 2 (1 Year) | 84 | Tin/Lead (Sn/Pb) | CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | QUAD | J BEND | 220 | 5V | 1.27mm | 30 | EPM7064 | 不合格 | 5.25V | 3.3/55V | 系统内可编程 | 125MHz | 10 ns | 1250 | MACROCELL | 64 | YES | 4.75V~5.25V | 10ns | 4 | 5.08mm | 29.3116mm | 29.3116mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
 | EPM7064QC100-12 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 100-BQFP | YES | 68 | 0°C~70°C TA | Tray | MAX® 7000 | e0 | Obsolete | 3 (168 Hours) | 100 | 锡铅 | CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | QUAD | 鸥翼 | 220 | 5V | 0.65mm | compliant | 30 | EPM7064 | R-PQFP-G100 | 不合格 | 5.25V | 3.3/55V | EE PLD | 125MHz | 12 ns | 1250 | MACROCELL | 64 | NO | 4.75V~5.25V | 12ns | 4 | 3.65mm | 20mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
 | XA2C256-8VQG100Q | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Automotive grade | Tin | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 80 | -40°C~105°C TA | Tray | 2001 | CoolRunner II | e3 | yes | 活跃 | 3 (168 Hours) | 100 | EAR99 | 真正的数字设计技术 | QUAD | 鸥翼 | 260 | 1.8V | 0.5mm | 30 | XA2C256 | 100 | 不合格 | 1.8V | 系统内可编程 | 1.9V | 1.7V | 1 | 7.5 ns | 7.5 ns | 17b | 16 | 1 Mb | 6000 | 139MHz | 8 | MACROCELL | 256 | YES | 1.7V~1.9V | 7ns | ROHS3 Compliant | ||||||||||||||||||||||||||
| XCR3256XL-12PQ208C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 164 | 表面贴装 | 208-BFQFP | YES | 208 | EEPROM | 0°C~70°C TA | Bulk | 2003 | CoolRunner XPLA3 | e0 | no | 活跃 | 3 (168 Hours) | 208 | EAR99 | Tin/Lead (Sn85Pb15) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 225 | 3.3V | 0.5mm | 30 | 208 | 不合格 | 3.3V | 3.6V | In System Programmable (min 1K program/erase cycles) | 12 ns | 6000 | 88MHz | 12 | MACROCELL | 256 | YES | 3V~3.6V | 10.8ns | 16 | 4.1mm | 28mm | 28mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||
 | EPM240F100C4N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 100-LBGA | YES | 80 | 0°C~85°C TJ | Tray | MAX® II | e1 | 活跃 | 3 (168 Hours) | 100 | EAR99 | 锡银铜 | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | BOTTOM | BALL | 260 | 2.5V | 1mm | 40 | EPM240 | S-PBGA-B100 | 不合格 | 2.625V | 1.5/3.32.5/3.3V | 2.375V | 系统内可编程 | 6.1 ns | MACROCELL | 192 | YES | 2.5V 3.3V | 4.7ns | 240 | 1.7mm | 11mm | 11mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
| EPM570GF256C3N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 256-BGA | YES | 160 | 0°C~85°C TJ | Tray | MAX® II | e1 | 活跃 | 3 (168 Hours) | 256 | EAR99 | 锡银铜 | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.8V | 1mm | 40 | EPM570 | S-PBGA-B256 | 不合格 | 1.89V | 1.5/3.31.8V | 1.71V | 系统内可编程 | 5.4 ns | MACROCELL | 440 | YES | 1.71V~1.89V | 5.4ns | 570 | 2.2mm | 17mm | 17mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
 | XCR3032XL-5VQG44C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 36 | 表面贴装 | 表面贴装 | 44-TQFP | 44 | EEPROM | 0°C~70°C TA | Tray | 1996 | CoolRunner XPLA3 | e3 | yes | 活跃 | 3 (168 Hours) | 44 | EAR99 | Matte Tin (Sn) | YES | QUAD | 鸥翼 | 260 | 3.3V | 0.8mm | 30 | 44 | 不合格 | 3.3V | 3.6V | In System Programmable (min 1K program/erase cycles) | 5 ns | 2 | 750 | 213MHz | 5 | MACROCELL | 32 | YES | 3V~3.6V | 4.5ns | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||
 | XC95144-10PQ100I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 81 | 表面贴装 | 表面贴装 | 100-BQFP | 100 | FLASH | -40°C~85°C TA | Tray | 1996 | XC9500 | e0 | no | Obsolete | 3 (168 Hours) | 100 | EAR99 | YES | QUAD | 鸥翼 | 225 | 5V | 0.65mm | 30 | XC95144 | 100 | 5V | In System Programmable (min 10K program/erase cycles) | 10 ns | 10 ns | 8 | 3200 | 66.7MHz | 10 | MACROCELL | 144 | YES | 4.5V~5.5V | 3.4mm | 20mm | 14mm | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||
| EPM1270T144C4 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 144-LQFP | YES | 116 | 0°C~85°C TJ | Tray | 2003 | MAX® II | e0 | 活跃 | 3 (168 Hours) | 144 | 3A991 | 锡铅 | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | QUAD | 鸥翼 | 220 | 2.5V | 0.5mm | 30 | EPM1270 | S-PQFP-G144 | 不合格 | 2.625V | 1.5/3.32.5/3.3V | 2.375V | 系统内可编程 | 8.1 ns | MACROCELL | 980 | YES | 2.5V 3.3V | 6.2ns | 1270 | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
 | LC4256V-75TN176I | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 128 | 表面贴装 | 表面贴装 | 176-LQFP | 176 | EEPROM | -40°C~105°C TJ | Tray | 2000 | ispMACH® 4000V | e3 | yes | 活跃 | 3 (168 Hours) | 176 | EAR99 | Matte Tin (Sn) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 178.57MHz | 40 | LC4256 | 176 | 3.3V | 系统内可编程 | 3.6V | 3V | 12.5mA | 7.5 ns | 7.5 ns | 16 | MACROCELL | 256 | YES | 4 | 3V~3.6V | 1.6mm | 24mm | 24mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||
| EPM1270F256C3N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 256-BGA | YES | 212 | 0°C~85°C TJ | Tray | 2003 | MAX® II | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | BOTTOM | BALL | 260 | 2.5V | 1mm | 40 | EPM1270 | S-PBGA-B256 | 不合格 | 2.625V | 1.5/3.32.5/3.3V | 2.375V | 系统内可编程 | 6.2 ns | MACROCELL | 980 | YES | 2.5V 3.3V | 6.2ns | 1270 | 2.2mm | 17mm | 17mm | 符合RoHS标准 |