类别是'嵌入式 - CPLD（复杂可编程逻辑器件）'
嵌入式 - CPLD（复杂可编程逻辑器件） (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 可编程类型 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 电源电流 | 时钟频率 | 传播延迟 | 接通延迟时间 | 逻辑元件/单元数 | 阀门数量 | 最高频率 | 可编程I/O数 | 逻辑块数(LABs) | 速度等级 | 输出功能 | 宏细胞数 | JTAG BST | 专用输入数量 | 内部供电电压 | 延迟时间 tpd(1)最大 | 逻辑元素/块的数量 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | XC9536XL-7VQG64C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 36 | 表面贴装 | 表面贴装 | 64-TQFP | 64 | FLASH | 0°C~70°C TA | Tray | 1996 | XC9500XL | e3 | yes | 活跃 | 3 (168 Hours) | 64 | EAR99 | Matte Tin (Sn) | YES | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 30 | XC9536XL | 64 | 不合格 | 3.3V | 3.6V | In System Programmable (min 10K program/erase cycles) | 7.5 ns | 2 | 800 | 125MHz | 7 | MACROCELL | 36 | YES | 3V~3.6V | 10mm | 10mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||
 | EPM3128ATC100-7N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 100-TQFP | YES | 80 | 0°C~70°C TA | Tray | MAX® 3000A | e3 | Obsolete | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | YES | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | compliant | 40 | EPM3128 | S-PQFP-G100 | 不合格 | 3.6V | 2.5/3.33.3V | 3V | 系统内可编程 | 129.9MHz | 7.5 ns | 2500 | MACROCELL | 128 | YES | 3V~3.6V | 7.5ns | 8 | 1.27mm | 14mm | 14mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||
| EPM240T100C5 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 100-TQFP | YES | 80 | 0°C~85°C TJ | Tray | 2003 | MAX® II | e3 | 活跃 | 3 (168 Hours) | 100 | Matte Tin (Sn) - annealed | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 40 | EPM240 | S-PQFP-G100 | 不合格 | 2.625V | 1.5/3.32.5/3.3V | 2.375V | 系统内可编程 | 7.5 ns | MACROCELL | 192 | YES | 2.5V 3.3V | 4.7ns | 240 | 1.2mm | 14mm | 14mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||
 | XC95144XL-10CSG144C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 117 | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 144-TFBGA, CSPBGA | FLASH | 0°C~70°C TA | Tray | 1996 | XC9500XL | e1 | yes | 活跃 | 3 (168 Hours) | 144 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | BOTTOM | BALL | 260 | 3.3V | 30 | XC95144XL | 144 | 3.3V | In System Programmable (min 10K program/erase cycles) | 3.6V | 3V | 10 ns | 10 ns | 8 | 3200 | 100MHz | 10 | MACROCELL | 144 | YES | 3V~3.6V | 1.2mm | 12mm | 12mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||
| EPM240T100I5 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 100-TQFP | YES | 80 | -40°C~100°C TJ | Tray | 2003 | MAX® II | e0 | 活跃 | 3 (168 Hours) | 100 | EAR99 | 锡铅 | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | QUAD | 鸥翼 | 235 | 2.5V | 0.5mm | 30 | EPM240 | S-PQFP-G100 | 不合格 | 2.625V | 1.5/3.32.5/3.3V | 2.375V | 系统内可编程 | 7.5 ns | MACROCELL | 192 | YES | 2.5V 3.3V | 4.7ns | 240 | 1.2mm | 14mm | 14mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
 | EPM2210GF256C3N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 256-BGA | YES | 204 | 0°C~85°C TJ | Tray | MAX® II | e1 | 活跃 | 3 (168 Hours) | 256 | 3A991 | Tin/Silver/Copper (Sn/Ag/Cu) | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.8V | 1mm | 40 | EPM2210 | S-PBGA-B256 | 不合格 | 1.89V | 1.5/3.31.8V | 1.71V | 系统内可编程 | 7 ns | MACROCELL | 1700 | YES | 1.71V~1.89V | 7ns | 2210 | 2.2mm | 17mm | 17mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||
 | ATF750C-10JU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 10 | 表面贴装 | 表面贴装 | 28-LCC (J-Lead) | 28 | 1.182714g | EEPROM | -40°C~85°C TA | Tube | 1997 | ATF750C(L) | e3 | yes | 活跃 | 3 (168 Hours) | 28 | Matte Tin (Sn) - annealed | NO | QUAD | J BEND | 245 | 5V | 1.27mm | 90MHz | 40 | ATF750 | 5V | 5V | In System Programmable (min 1K program/erase cycles) | 5.5V | 4.5V | 10 ns | 10 ns | 750 | MACROCELL | 10 | NO | 11 | 4.5V~5.5V | 4.572mm | 11.5062mm | 11.5062mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||
 | EPM7256SRC208-7 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 208-BFQFP Exposed Pad | YES | 164 | 0°C~70°C TA | Tray | MAX® 7000S | e0 | Obsolete | 3 (168 Hours) | 208 | 锡铅 | CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 8542.39.00.01 | QUAD | 鸥翼 | 220 | 5V | 0.5mm | 30 | EPM7256 | S-PQFP-G208 | 不合格 | 5.25V | 3.3/55V | 4.75V | 系统内可编程 | 7.5 ns | 5000 | MACROCELL | 256 | YES | 4.75V~5.25V | 7.5ns | 16 | 4.1mm | 28mm | 28mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
 | XC2C256-6TQG144C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 118 | Tin | 表面贴装 | 表面贴装 | 144-LQFP | 144 | 144-TQFP (20x20) | EEPROM | 0°C~70°C TA | Tray | 2001 | CoolRunner II | 活跃 | 3 (168 Hours) | 70°C | 0°C | 256MHz | XC2C256 | 1.8V | 系统内可编程 | 1.9V | 1.7V | 6 ns | 6 ns | 16 | 6000 | 256MHz | 16 | 6 | 256 | 1.7V~1.9V | 5.7ns | 16 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||
 | ATF1508ASV-15AU100-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 表面贴装 | 100-TQFP | YES | 80 | -40°C~85°C TA | Tape & Reel (TR) | ATF15xx | 活跃 | 3 (168 Hours) | 100 | QUAD | 鸥翼 | 3.3V | 0.5mm | ATF1508ASV | S-PQFP-G100 | 3.6V | 3V | In System Programmable (min 10K program/erase cycles) | 100MHz | 15 ns | MACROCELL | 128 | 3V~3.6V | 15ns | 1.2mm | 14mm | 14mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||
 | LC4064ZC-75MN56C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 32 | 表面贴装 | 表面贴装 | 56-LFBGA, CSPBGA | 56 | EEPROM | 0°C~90°C TJ | Tray | 2000 | ispMACH® 4000Z | e1 | yes | 活跃 | 3 (168 Hours) | 56 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1.8V | 0.5mm | 178.57MHz | 40 | LC4064 | 56 | 1.8V | 系统内可编程 | 1.9V | 1.7V | 80μA | 80μA | 7.5 ns | 7.5 ns | 484 | 36 | MACROCELL | 64 | YES | 12 | 1.7V~1.9V | 4 | 1.35mm | 6mm | 6mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||
 | EPM1270T144I5 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 144-LQFP | YES | 116 | -40°C~100°C TJ | Tray | 2003 | MAX® II | e0 | 活跃 | 3 (168 Hours) | 144 | 3A991 | Tin/Lead (Sn/Pb) | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | QUAD | 鸥翼 | 220 | 2.5V | 0.5mm | 30 | EPM1270 | S-PQFP-G144 | 不合格 | 2.625V | 1.5/3.32.5/3.3V | 2.375V | 系统内可编程 | 10 ns | MACROCELL | 980 | YES | 2.5V 3.3V | 6.2ns | 1270 | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
| EPM7256AEFC256-7 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 256-BGA | YES | 164 | 0°C~70°C TA | Tray | MAX® 7000A | e0 | 活跃 | 3 (168 Hours) | 256 | 3A991 | Tin/Lead (Sn63Pb37) | YES | 8542.39.00.01 | BOTTOM | BALL | 220 | 3.3V | 1mm | not_compliant | 30 | EPM7256 | 不合格 | 3.6V | 2.5/3.33.3V | 3V | 系统内可编程 | 126.6MHz | 7.5 ns | 5000 | MACROCELL | 256 | YES | 3V~3.6V | 7.5ns | 16 | 2.1mm | 17mm | 17mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||
| EPM7064AETC100-4N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 100-TQFP | YES | 68 | 0°C~70°C TA | Tray | 1998 | MAX® 7000A | e3 | 活跃 | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | EPM7064 | S-PQFP-G100 | 不合格 | 3.6V | 2.5/3.33.3V | 3V | 系统内可编程 | 222.2MHz | 1250 | MACROCELL | 64 | YES | 3V~3.6V | 4.5ns | 4 | 1.27mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
| ATF750CL-15JU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 10 | 表面贴装 | 表面贴装 | 28-LCC (J-Lead) | 28 | 1.182714g | EEPROM | -40°C~85°C TA | Tube | 1997 | ATF750C(L) | e3 | yes | 活跃 | 2 (1 Year) | 28 | Matte Tin (Sn) - annealed | NO | QUAD | J BEND | 245 | 5V | 1.27mm | 71MHz | ATF750 | 5V | 5V | In System Programmable (min 1K program/erase cycles) | 5.5V | 4.5V | 15 ns | 15 ns | 750 | 15 | MACROCELL | 10 | NO | 11 | 4.5V~5.5V | 4.572mm | 11.5062mm | 11.5062mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||
 | XC2C512-7FTG256C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 212 | 0°C~70°C TA | Tray | 2001 | CoolRunner II | e1 | yes | 活跃 | 3 (168 Hours) | 256 | 3A991.D | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.8V | 1mm | 30 | XC2C512 | 256 | 1.8V | 1.9V | 系统内可编程 | 7.5 ns | 32 | 12000 | 179MHz | 7 | MACROCELL | 512 | YES | 1.7V~1.9V | 7.1ns | 1.55mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||
 | EPM2210F324C4N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 324-BGA | YES | 272 | 0°C~85°C TJ | Tray | MAX® II | e1 | 活跃 | 3 (168 Hours) | 324 | 锡银铜 | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | BOTTOM | BALL | 260 | 2.5V | 1mm | 40 | EPM2210 | S-PBGA-B324 | 不合格 | 2.625V | 1.5/3.32.5/3.3V | 2.375V | 系统内可编程 | 9.1 ns | MACROCELL | 1700 | YES | 2.5V 3.3V | 7ns | 2210 | 2.2mm | 19mm | 19mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
 | EPM7192EGC160-15 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 160-BPGA | NO | 124 | 0°C~70°C TA | Tray | MAX® 7000 | e0 | Obsolete | 3 (168 Hours) | 160 | EAR99 | Tin/Lead (Sn/Pb) | CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 8542.39.00.01 | PERPENDICULAR | PIN/PEG | 220 | 5V | 2.54mm | compliant | 30 | EPM7192 | S-CPGA-P160 | 不合格 | 5.25V | 3.3/55V | 4.75V | EE PLD | 100MHz | 15 ns | 3750 | MACROCELL | 192 | NO | 4.75V~5.25V | 15ns | 12 | 5.34mm | 39.624mm | 39.624mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||
| EPM570T100C4N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 100-TQFP | YES | 76 | 0°C~85°C TJ | Tray | 2014 | MAX® II | e3 | 活跃 | 3 (168 Hours) | 100 | MATTE TIN (472) OVER COPPER | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 40 | EPM570 | S-PQFP-G100 | 不合格 | 2.625V | 1.5/3.32.5/3.3V | 2.375V | 系统内可编程 | 7 ns | MACROCELL | 440 | YES | 2.5V 3.3V | 5.4ns | 570 | 1.2mm | 14mm | 14mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||
| XC2C384-10FT256C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 212 | 表面贴装 | 表面贴装 | 256-LBGA | 256 | ROMless | 0°C~70°C TA | Tray | 2001 | CoolRunner II | e0 | no | 活跃 | 3 (168 Hours) | 256 | 3A991.D | Tin/Lead (Sn63Pb37) | YES | 8542.39.00.01 | BOTTOM | BALL | 240 | 1.8V | 1mm | 30 | XC2C384 | 256 | 1.8V | 1.9V | 系统内可编程 | 10 ns | 24 | 9000 | 125MHz | 10 | MACROCELL | 384 | YES | 1.7V~1.9V | 9.2ns | 1.55mm | 17mm | 17mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||
 | EPM7064TC44-15 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 44-TQFP | YES | 36 | 0°C~70°C TA | Tray | MAX® 7000 | e0 | Obsolete | 3 (168 Hours) | 44 | EAR99 | 锡铅 | QUAD | 鸥翼 | 235 | 5V | 0.8mm | compliant | 30 | EPM7064 | 不合格 | 5.25V | 3.3/55V | EE PLD | 100MHz | 15 ns | 1250 | MACROCELL | 64 | NO | 4.75V~5.25V | 15ns | 4 | 1.27mm | 10mm | 10mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
| CY37032VP44-100AXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 37 | 表面贴装 | 表面贴装 | 44-LQFP | 44 | EEPROM | 0°C~70°C TA | Tray | 2001 | Ultra37000™ | e4 | Obsolete | 3 (168 Hours) | 44 | Nickel/Palladium/Gold (Ni/Pd/Au) | QUAD | 鸥翼 | 260 | 3.3V | 0.8mm | 100MHz | 20 | CY37032 | 44 | 3.3V | In-System Reprogrammable™ (ISR™) CMOS | 3.6V | 3V | 12 ns | 12 ns | 960 | 2 | 100 | MACROCELL | 32 | YES | 1 | 3V~3.6V | 1.6mm | 10mm | 10mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||
 | XCR3128XL-10CS144C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 108 | 表面贴装 | 144-TFBGA, CSPBGA | YES | 144 | EEPROM | 0°C~70°C TA | Bulk | 1996 | CoolRunner XPLA3 | e0 | no | 活跃 | 3 (168 Hours) | 144 | EAR99 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 240 | 3.3V | 30 | 144 | 3.3V | 3.6V | In System Programmable (min 1K program/erase cycles) | 10 ns | 10 ns | 8 | 3000 | 95MHz | 10 | MACROCELL | 128 | YES | 3V~3.6V | 9.1ns | 1.2mm | 12mm | 12mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||
 | EPM3256AQC208-10N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 208-BFQFP | YES | 158 | 0°C~70°C TA | Tray | 1998 | MAX® 3000A | e3 | Obsolete | 3 (168 Hours) | 208 | EAR99 | Matte Tin (Sn) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 3.3V | 0.5mm | compliant | 40 | EPM3256 | S-PQFP-G208 | 不合格 | 3.6V | 2.5/3.33.3V | 3V | 系统内可编程 | 95.2MHz | 10 ns | 5000 | MACROCELL | 256 | YES | 3V~3.6V | 10ns | 16 | 4.1mm | 28mm | 28mm | 符合RoHS标准 | ||||||||||||||||||||||||||||
| EPM7512AEFC256-7 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 256-BGA | YES | 212 | 0°C~70°C TA | Tray | MAX® 7000A | e0 | 活跃 | 3 (168 Hours) | 256 | 3A991 | Tin/Lead (Sn63Pb37) | 8542.39.00.01 | BOTTOM | BALL | 220 | 3.3V | 1mm | not_compliant | 30 | EPM7512 | S-PBGA-B256 | 不合格 | 3.6V | 2.5/3.33.3V | 3V | 系统内可编程 | 116.3MHz | 7.5 ns | 10000 | MACROCELL | 512 | YES | 3V~3.6V | 7.5ns | 32 | 2.1mm | 17mm | 17mm | Non-RoHS Compliant |