类别是'嵌入式 - CPLD（复杂可编程逻辑器件）'
嵌入式 - CPLD（复杂可编程逻辑器件） (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 可编程类型 | 最大电源电压 | 最小电源电压 | 内存大小 | 工作电源电流 | 电源电流 | 时钟频率 | 传播延迟 | 接通延迟时间 | 建筑学 | 输入数量 | 逻辑元件/单元数 | 阀门数量 | 最高频率 | 可编程I/O数 | 逻辑块数(LABs) | 速度等级 | 输出功能 | 宏细胞数 | JTAG BST | 最大结点温度（Tj） | 专用输入数量 | 内部供电电压 | 延迟时间 tpd(1)最大 | 环境温度范围高 | 逻辑元素/块的数量 | 系统内可编程 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | LC4256V-5TN144C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 96 | 表面贴装 | 表面贴装 | 144-LQFP | 144 | EEPROM | 0°C~90°C TJ | Tray | 2000 | ispMACH® 4000V | e3 | yes | 活跃 | 3 (168 Hours) | 144 | EAR99 | Matte Tin (Sn) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 227.27MHz | 40 | LC4256 | 144 | 3.3V | 系统内可编程 | 3.6V | 3V | 12.5mA | 12.5mA | 5 ns | 5 ns | 858 | 388 | MACROCELL | 256 | YES | 4 | 3V~3.6V | 16 | 1.6mm | 20mm | 20mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||
 | 5M570ZT100C4N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 100-TQFP | YES | 74 | 0°C~85°C TJ | Tray | 2003 | MAX® V | e3 | 活跃 | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) - annealed | YES | 8542.39.00.01 | QUAD | 鸥翼 | 未说明 | 1.8V | 0.5mm | 未说明 | 5M570Z | S-PQFP-G100 | 不合格 | 1.89V | 1.81.2/3.3V | 1.71V | 系统内可编程 | 184.1MHz | 9.5 ns | MACROCELL | 440 | YES | 1.71V~1.89V | 9ns | 570 | 1.2mm | 14mm | 14mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||
 | XC2C384-10FT256I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 212 | 表面贴装 | 表面贴装 | 256-LBGA | 256 | ROMless | -40°C~85°C TA | Tray | 2001 | CoolRunner II | e0 | no | 活跃 | 3 (168 Hours) | 256 | 3A991.D | Tin/Lead (Sn63Pb37) | YES | 8542.39.00.01 | BOTTOM | BALL | 240 | 1.8V | 1mm | 30 | XC2C384 | 256 | 1.8V | 1.9V | 系统内可编程 | 10 ns | 24 | 9000 | 125MHz | 10 | MACROCELL | 384 | YES | 1.7V~1.9V | 9.2ns | 1.55mm | 17mm | 17mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
| XC95288XL-7FGG256I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 192 | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 256-BGA | 256 | FLASH | -40°C~85°C TA | Tray | 1996 | XC9500XL | e1 | yes | 活跃 | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | 8542.39.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 30 | XC95288XL | 256 | 不合格 | 3.3V | In System Programmable (min 10K program/erase cycles) | 3.6V | 3V | 7.5 ns | 7.5 ns | 16 | 6400 | 125MHz | 7 | MACROCELL | 288 | YES | 3V~3.6V | 2mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
| EPM7160STC100-10N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 100-TQFP | YES | 84 | 0°C~70°C TA | Tray | MAX® 7000S | e3 | Obsolete | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.5mm | compliant | 40 | EPM7160 | 不合格 | 5.25V | 3.3/55V | 4.75V | 系统内可编程 | 125MHz | 3200 | MACROCELL | 160 | YES | 4.75V~5.25V | 10ns | 10 | 1.27mm | 14mm | 14mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||
 | XC95288XL-10CSG280C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 192 | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 280-TFBGA, CSPBGA | 280 | FLASH | 0°C~70°C TA | Tray | 1996 | XC9500XL | e1 | yes | 活跃 | 3 (168 Hours) | 280 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | 8542.39.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.8mm | 30 | XC95288XL | 280 | 不合格 | 3.3V | In System Programmable (min 10K program/erase cycles) | 3.6V | 3V | 10 ns | 10 ns | 16 | 6400 | 100MHz | 10 | MACROCELL | 288 | YES | 3V~3.6V | 1.2mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
 | XCR3256XL-10TQ144I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 120 | 表面贴装 | 144-LQFP | YES | 144 | EEPROM | -40°C~85°C TA | Tray | 2003 | CoolRunner XPLA3 | e0 | no | 活跃 | 3 (168 Hours) | 144 | EAR99 | Tin/Lead (Sn85Pb15) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 225 | 3.3V | 0.5mm | 30 | 144 | 不合格 | 3.3V | 3.6V | In System Programmable (min 1K program/erase cycles) | 10 ns | 6000 | 105MHz | 10 | MACROCELL | 256 | YES | 2.7V~3.6V | 9.1ns | 16 | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
 | XCR3128XL-7CS144C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 108 | 表面贴装 | 表面贴装 | 144-TFBGA, CSPBGA | 144 | EEPROM | 0°C~70°C TA | Tray | 1996 | CoolRunner XPLA3 | e0 | no | 活跃 | 3 (168 Hours) | 144 | EAR99 | YES | BOTTOM | BALL | 240 | 3.3V | not_compliant | 30 | XCR3128XL | 144 | 不合格 | 3.3V | 3.6V | In System Programmable (min 1K program/erase cycles) | 7.5 ns | 8 | 3000 | 119MHz | 7 | MACROCELL | 128 | YES | 3V~3.6V | 7ns | 1.2mm | 12mm | 12mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||
 | EPM2210F256C5 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 256-BGA | YES | 204 | 0°C~85°C TJ | Tray | MAX® II | e0 | 活跃 | 3 (168 Hours) | 256 | 3A991 | Tin/Lead (Sn/Pb) | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | BOTTOM | BALL | 220 | 2.5V | 1mm | 30 | EPM2210 | S-PBGA-B256 | 不合格 | 2.625V | 1.5/3.32.5/3.3V | 2.375V | 系统内可编程 | 11.2 ns | MACROCELL | 1700 | YES | 2.5V 3.3V | 7ns | 2210 | 2.2mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||
.png) | XC9536XL-5VQ64C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FLASH | 36 | 表面贴装 | TQFP | 64 | 178.6MHz | Bulk | e0 | no | 3 (168 Hours) | 64 | EAR99 | 70°C | 0°C | QUAD | 鸥翼 | 225 | 3.3V | not_compliant | 30 | 64 | 不合格 | 3.3V | 3.6V | COMMERCIAL | 5 ns | 800 | 2 | 5 | MACROCELL | 36 | YES | YES | 10mm | 10mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||
| XC95144XL-7TQG144C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 117 | 表面贴装 | 表面贴装 | 144-LQFP | FLASH | 0°C~70°C TA | Tray | 1996 | XC9500XL | e3 | yes | 活跃 | 3 (168 Hours) | 144 | EAR99 | Matte Tin (Sn) | YES | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 125MHz | 30 | XC95144XL | 144 | 不合格 | 3.3V | In System Programmable (min 10K program/erase cycles) | 3.6V | 3V | 7.5 ns | 8 | 3200 | 7 | MACROCELL | 144 | YES | 3V~3.6V | 1.4mm | 20mm | 20mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||
| XC2C256-7FTG256I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 256-LBGA | 184 | -40°C~85°C TA | Tray | 2000 | CoolRunner II | e1 | yes | 活跃 | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 真正的数字设计技术 | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.8V | 30 | XC2C256 | 256 | 不合格 | 1.8V | 系统内可编程 | 1.9V | 1.7V | 7.5 ns | 7.5 ns | 16 | 6000 | 152MHz | 7 | MACROCELL | 256 | YES | 1.7V~1.9V | 6.7ns | 1mm | 17mm | 17mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
 | XC9572XL-5PC44C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 34 | 表面贴装 | 表面贴装 | 44-LCC (J-Lead) | 44 | FLASH | 0°C~70°C TA | Tube | 1996 | XC9500XL | e0 | no | Obsolete | 3 (168 Hours) | 44 | EAR99 | QUAD | J BEND | 225 | 3.3V | 1.27mm | 30 | XC9572XL | 44 | 不合格 | 3.3V | 3.6V | In System Programmable (min 10K program/erase cycles) | 5 ns | 4 | 1600 | 178.6MHz | 5 | MACROCELL | 72 | YES | 3V~3.6V | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||
 | XCR3032XL-10CS48C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 36 | 表面贴装 | 48-FBGA, CSPBGA | YES | 48 | EEPROM | 0°C~70°C TA | Bulk | 1996 | CoolRunner XPLA3 | e0 | no | 活跃 | 3 (168 Hours) | 48 | EAR99 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 240 | 3.3V | 0.8mm | 30 | XCR3032XL | 48 | 3.3V | 3.6V | In System Programmable (min 1K program/erase cycles) | 10 ns | 10 ns | 2 | 750 | 95MHz | 10 | MACROCELL | 32 | YES | 3V~3.6V | 9.1ns | 1.8mm | 7mm | 7mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
| XC95288XL-7FGG256C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 192 | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 256-BGA | 256 | FLASH | 0°C~70°C TA | Tray | 1996 | XC9500XL | e1 | yes | 活跃 | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | 8542.39.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 30 | XC95288XL | 256 | 不合格 | 3.3V | In System Programmable (min 10K program/erase cycles) | 3.6V | 3V | 7.5 ns | 7.5 ns | 16 | 6400 | 125MHz | 7 | MACROCELL | 288 | YES | 3V~3.6V | 2mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
| EPM3064ATI100-10N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 100-TQFP | YES | 66 | -40°C~85°C TA | Tray | MAX® 3000A | e3 | Obsolete | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | YES | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | compliant | 40 | EPM3064 | S-PQFP-G100 | 不合格 | 3.6V | 2.5/3.33.3V | 3V | 系统内可编程 | 100MHz | 10 ns | 1250 | MACROCELL | 64 | YES | 3V~3.6V | 10ns | 4 | 1.27mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||
 | XC9572XL-10CSG48I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 38 | 表面贴装 | 表面贴装 | 48-FBGA, CSPBGA | 48 | FLASH | -40°C~85°C TA | Tray | 1996 | XC9500XL | e1 | yes | 活跃 | 3 (168 Hours) | 48 | EAR99 | BOTTOM | BALL | 260 | 3.3V | 0.8mm | 100MHz | 30 | XC9572XL | 48 | 3.3V | 3.6V | In System Programmable (min 10K program/erase cycles) | 10 ns | 10 ns | 4 | 1600 | 10 | MACROCELL | 72 | YES | 3V~3.6V | 1.8mm | 7mm | 7mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||
| XC9536XL-7CSG48I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 36 | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 48-FBGA, CSPBGA | 48 | FLASH | -40°C~85°C TA | Tray | 1996 | XC9500XL | e1 | yes | 活跃 | 3 (168 Hours) | 48 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | BOTTOM | BALL | 260 | 3.3V | 0.8mm | 30 | XC9536XL | 48 | 不合格 | 3.3V | In System Programmable (min 10K program/erase cycles) | 3.6V | 3V | 7.5 ns | 7.5 ns | 2 | 800 | 125MHz | 7 | MACROCELL | 36 | YES | 3V~3.6V | 1.8mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||
| EPM7128AETI100-7 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 100-TQFP | YES | 84 | -40°C~85°C TA | Tray | MAX® 7000A | e0 | 活跃 | 3 (168 Hours) | 100 | 3A991 | Tin/Lead (Sn/Pb) | QUAD | 鸥翼 | 235 | 3.3V | 0.5mm | 20 | EPM7128 | S-PQFP-G100 | 84 | 不合格 | 3.6V | 2.5/3.33.3V | 3V | 系统内可编程 | 129.9MHz | 7.5 ns | PLA-TYPE | 84 | 2500 | MACROCELL | 128 | YES | 3V~3.6V | 7.5ns | 8 | 1.27mm | 14mm | 14mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
 | EPM2210F324C3N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 324-BGA | YES | 272 | 0°C~85°C TJ | Tray | MAX® II | e1 | 活跃 | 3 (168 Hours) | 324 | 锡银铜 | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | BOTTOM | BALL | 260 | 2.5V | 1mm | 40 | EPM2210 | S-PBGA-B324 | 不合格 | 2.625V | 1.5/3.32.5/3.3V | 2.375V | 系统内可编程 | 7 ns | MACROCELL | 1700 | YES | 2.5V 3.3V | 7ns | 2210 | 2.2mm | 19mm | 19mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||
| LC4256V-10TN144I | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 96 | 表面贴装 | 表面贴装 | 144-LQFP | 144 | EEPROM | -40°C~105°C TJ | Tray | 2000 | ispMACH® 4000V | e3 | yes | 活跃 | 3 (168 Hours) | 144 | EAR99 | Matte Tin (Sn) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 125MHz | 40 | LC4256 | 144 | 3.3V | 系统内可编程 | 3.6V | 3V | 12.5mA | 12.5mA | 10 ns | 10 ns | 16 | MACROCELL | 256 | YES | 4 | 3V~3.6V | 1.6mm | 20mm | 20mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||
 | XC95288XL-7PQG208I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 168 | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | FLASH | -40°C~85°C TA | Tray | 1996 | XC9500XL | e3 | yes | 活跃 | 3 (168 Hours) | 208 | EAR99 | Matte Tin (Sn) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 3.3V | 0.5mm | 30 | XC95288XL | 208 | 不合格 | 3.3V | 3.6V | In System Programmable (min 10K program/erase cycles) | 7.5 ns | 16 | 6400 | 125MHz | 7 | MACROCELL | 288 | YES | 3V~3.6V | 4.1mm | 28mm | 28mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||
| 5M570ZT100C5N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 74 | 表面贴装 | 100-TQFP | YES | FLASH | 0°C~85°C TJ | Tray | MAX® V | e3 | 活跃 | 3 (168 Hours) | 100 | EAR99 | 哑光锡 | YES | QUAD | 鸥翼 | 未说明 | 1.8V | 未说明 | 5M570Z | S-PQFP-G100 | 不合格 | 1.81.2/3.3V | 系统内可编程 | 3.6V | 1.14V | 8kB | 118.3MHz | 9 ns | 57 | 5 | MACROCELL | 440 | YES | 85°C | 1.71V~1.89V | 135°C | 570 | 1.2mm | 14mm | 14mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
| XCR3384XL-10TQG144I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 118 | 表面贴装 | 表面贴装 | 144-LQFP | 144 | EEPROM | -40°C~85°C TA | Tray | 1996 | CoolRunner XPLA3 | e3 | yes | 活跃 | 3 (168 Hours) | 144 | EAR99 | Matte Tin (Sn) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 30 | 144 | 不合格 | 3.3V | 3.6V | In System Programmable (min 1K program/erase cycles) | 10 ns | 24 | 9000 | 102MHz | 10 | MACROCELL | 384 | YES | 2.7V~3.6V | 9ns | 1.6mm | 20mm | 20mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||
 | XC2C256-7VQ100I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 80 | -40°C~85°C TA | Tray | 2001 | CoolRunner II | e0 | no | 活跃 | 3 (168 Hours) | 100 | EAR99 | Tin/Lead (Sn85Pb15) | 真正的数字设计技术 | 8542.39.00.01 | QUAD | 鸥翼 | 225 | 1.8V | 0.5mm | 30 | XC2C256 | 100 | 不合格 | 1.8V | 1.9V | 系统内可编程 | 7.5 ns | 16 | 6000 | 152MHz | 7 | MACROCELL | 256 | YES | 1.7V~1.9V | 6.7ns | 1.2mm | 14mm | 14mm | Non-RoHS Compliant |