类别是'嵌入式 - CPLD（复杂可编程逻辑器件）'
嵌入式 - CPLD（复杂可编程逻辑器件） (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 可编程类型 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 电源电流 | 时钟频率 | 传播延迟 | 接通延迟时间 | 建筑学 | 输入数量 | 逻辑元件/单元数 | 阀门数量 | 最高频率 | 逻辑块数(LABs) | 速度等级 | 输出功能 | 宏细胞数 | JTAG BST | 专用输入数量 | 内部供电电压 | 延迟时间 tpd(1)最大 | 逻辑元素/块的数量 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | ATF1500A-10AU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 32 | Tin | 表面贴装 | 表面贴装 | 44-TQFP | 44 | FLASH | -40°C~85°C TA | Tray | 1997 | ATF15xx | e3 | yes | 活跃 | 3 (168 Hours) | 44 | QUAD | 鸥翼 | 260 | 5V | 0.8mm | 125MHz | 40 | ATF1500 | 不合格 | 5V | In System Programmable (min 100 program/erase cycles) | 5.5V | 4.5V | 10 ns | 10 ns | 1000 | 10 | MACROCELL | 32 | 4.5V~5.5V | 1.2mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||
 | XCR3032XL-10VQ44I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | EEPROM | 表面贴装 | 表面贴装 | 44-TQFP | 44 | 36 | -40°C~85°C TA | Tray | 1996 | CoolRunner XPLA3 | e0 | no | 活跃 | 3 (168 Hours) | 44 | EAR99 | Tin/Lead (Sn85Pb15) | YES | QUAD | 鸥翼 | 225 | 3.3V | 0.8mm | 30 | XCR3032XL | 44 | 3.3V | 3.6V | In System Programmable (min 1K program/erase cycles) | 10 ns | 10 ns | 2 | 750 | 95MHz | 10 | MACROCELL | 32 | YES | 2.7V~3.6V | 9.1ns | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||
 | XC9572XL-5VQG64C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 52 | Tin | 表面贴装 | 表面贴装 | 64-TQFP | 64 | FLASH | 0°C~70°C TA | Tray | 1996 | XC9500XL | e3 | yes | 活跃 | 3 (168 Hours) | 64 | EAR99 | QUAD | 鸥翼 | 260 | 3.3V | 178.6MHz | 30 | XC9572XL | 64 | 不合格 | 3.3V | In System Programmable (min 10K program/erase cycles) | 3.6V | 3V | 5 ns | 5 ns | 4 | 1600 | 5 | MACROCELL | 72 | YES | 3V~3.6V | 1.2mm | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||||||||||||
 | EPM240ZM100C7N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 100-TFBGA | YES | 80 | 0°C~85°C TJ | Tray | 2003 | MAX® II | e1 | 活跃 | 3 (168 Hours) | 100 | EAR99 | 锡银铜 | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.8V | 0.5mm | 40 | EPM240 | S-PBGA-B100 | 不合格 | 1.89V | 1.5/3.31.8V | 1.71V | 系统内可编程 | 12 ns | MACROCELL | 192 | YES | 1.71V~1.89V | 7.5ns | 240 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
 | EPM240T100A5N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 100-TQFP | YES | 80 | -40°C~125°C TJ | Tray | 2003 | MAX® II | e3 | 活跃 | 3 (168 Hours) | 100 | EAR99 | MATTE TIN (472) OVER COPPER | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 40 | EPM240 | S-PQFP-G100 | 不合格 | 2.625V | 1.5/3.32.5/3.3V | 2.375V | 系统内可编程 | 7.5 ns | MACROCELL | 192 | YES | 2.5V 3.3V | 4.7ns | 240 | 1.2mm | 14mm | 14mm | 符合RoHS标准 | |||||||||||||||||||||||||||||
| EPM7064AETI100-7N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 100-TQFP | YES | 68 | -40°C~85°C TA | Tray | MAX® 7000A | e3 | 活跃 | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | EPM7064 | S-PQFP-G100 | 68 | 不合格 | 3.6V | 2.5/3.33.3V | 3V | 系统内可编程 | 135.1MHz | 7.5 ns | PLA-TYPE | 68 | 1250 | MACROCELL | 64 | YES | 3V~3.6V | 7.5ns | 4 | 1.27mm | 符合RoHS标准 | |||||||||||||||||||||||||||||
 | XC2C128-7TQ144C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 100 | 表面贴装 | 表面贴装 | 144-LQFP | 144 | ROMless | 0°C~70°C TA | Tray | 2001 | CoolRunner II | e0 | no | 活跃 | 3 (168 Hours) | 144 | EAR99 | YES | QUAD | 鸥翼 | 225 | 1.8V | 0.5mm | not_compliant | 30 | XC2C128 | 144 | 不合格 | 1.8V | 1.9V | 系统内可编程 | 7.5 ns | 8 | 3000 | 152MHz | 7 | MACROCELL | 128 | YES | 1.7V~1.9V | 7ns | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | |||||||||||||||||||||||||
| EPM570T100C3N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 100-TQFP | YES | 76 | 0°C~85°C TJ | Tray | MAX® II | e3 | 活跃 | 3 (168 Hours) | 100 | MATTE TIN (472) OVER COPPER | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 40 | EPM570 | S-PQFP-G100 | 不合格 | 2.625V | 1.5/3.32.5/3.3V | 2.375V | 系统内可编程 | 5.4 ns | MACROCELL | 440 | YES | 2.5V 3.3V | 5.4ns | 570 | 1.2mm | 14mm | 14mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||
| XC2C32A-6VQ44C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 33 | 表面贴装 | 表面贴装 | 44-TQFP | 44 | ROMless | 0°C~70°C TA | Tray | 2001 | CoolRunner II | e0 | no | 活跃 | 3 (168 Hours) | 44 | EAR99 | Tin/Lead (Sn85Pb15) | 真正的数字设计技术 | QUAD | 鸥翼 | 225 | 1.8V | 0.8mm | not_compliant | 30 | XC2C32A | 44 | 不合格 | 1.8V | 1.9V | 系统内可编程 | 6 ns | 2 | 750 | 200MHz | 6 | MACROCELL | 32 | YES | 1.7V~1.9V | 5.5ns | 10mm | 10mm | Non-RoHS Compliant | |||||||||||||||||||||||||
 | LC4128V-75TN128C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 92 | 表面贴装 | 表面贴装 | 128-LQFP | 503.487531mg | EEPROM | 0°C~90°C TJ | Tray | 2000 | ispMACH® 4000V | e3 | yes | 活跃 | 3 (168 Hours) | 128 | EAR99 | Matte Tin (Sn) | YES | QUAD | 鸥翼 | 260 | 3.3V | 0.4mm | 178.57MHz | 40 | LC4128 | 128 | 3.3V | 系统内可编程 | 3.6V | 3V | 12mA | 2.7 ns | 7.5 ns | 36 | MACROCELL | 128 | YES | 4 | 3V~3.6V | 8 | 1.6mm | 14mm | 14mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||
| XCR3064XL-6VQG44C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 36 | 表面贴装 | 表面贴装 | 44-TQFP | 44 | EEPROM | 0°C~70°C TA | Tray | 1996 | CoolRunner XPLA3 | e3 | yes | 活跃 | 3 (168 Hours) | 44 | EAR99 | Matte Tin (Sn) | YES | QUAD | 鸥翼 | 260 | 3.3V | 0.8mm | 30 | 44 | 不合格 | 3.3V | In System Programmable (min 1K program/erase cycles) | 6 ns | 4 | 1500 | 192MHz | 6 | MACROCELL | 64 | YES | 3V~3.6V | 5.5ns | 1.2mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||||
 | XC95288XL-10FG256C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 192 | 表面贴装 | 256-BGA | YES | FLASH | 0°C~70°C TA | Bulk | 1996 | XC9500XL | e0 | no | 活跃 | 3 (168 Hours) | 256 | EAR99 | Tin/Lead (Sn63Pb37) | YES | 8542.39.00.01 | BOTTOM | BALL | 225 | 3.3V | 1mm | not_compliant | 30 | 256 | S-PBGA-B256 | 不合格 | 3.3V | 3.6V | In System Programmable (min 10K program/erase cycles) | 10 ns | 6400 | 100MHz | 10 | MACROCELL | 288 | YES | 3V~3.6V | 16 | 2mm | 17mm | 17mm | Non-RoHS Compliant | |||||||||||||||||||||||||
 | XC2C512-10FG324I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 324-BBGA | 324 | 270 | -40°C~85°C TA | Tray | 2001 | CoolRunner II | e0 | no | 活跃 | 3 (168 Hours) | 324 | 3A991.D | Tin/Lead (Sn63Pb37) | YES | 8542.39.00.01 | BOTTOM | BALL | 225 | 1.8V | 1mm | not_compliant | 30 | XC2C512 | 324 | 不合格 | 1.8V | 1.9V | 系统内可编程 | 10 ns | 32 | 12000 | 128MHz | 10 | MACROCELL | 512 | YES | 1.7V~1.9V | 9.2ns | 2.5mm | 23mm | 23mm | Non-RoHS Compliant | ||||||||||||||||||||||||
 | LC4128V-5TN100C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 64 | 表面贴装 | 表面贴装 | 100-LQFP | 100 | EEPROM | 0°C~90°C TJ | Tray | 2000 | ispMACH® 4000V | e3 | yes | 活跃 | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | YES | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 227.27MHz | 30 | LC4128 | 100 | 3.3V | 系统内可编程 | 3.6V | 3V | 12mA | 12mA | 5 ns | 5 ns | 540 | MACROCELL | 128 | YES | 10 | 3V~3.6V | 8 | 1.6mm | 14mm | 14mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||
 | EPM1270F256C5 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 256-BGA | YES | 212 | 0°C~85°C TJ | Tray | MAX® II | e0 | 活跃 | 3 (168 Hours) | 256 | 3A991 | 锡铅 | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | BOTTOM | BALL | 220 | 2.5V | 1mm | 30 | EPM1270 | S-PBGA-B256 | 不合格 | 2.625V | 1.5/3.32.5/3.3V | 2.375V | 系统内可编程 | 10 ns | MACROCELL | 980 | YES | 2.5V 3.3V | 6.2ns | 1270 | 2.2mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
 | XCR3064XL-10VQG100I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 68 | 表面贴装 | 表面贴装 | 100-TQFP | 100 | EEPROM | -40°C~85°C TA | Tray | 1996 | CoolRunner XPLA3 | e3 | yes | 活跃 | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | YES | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 30 | 100 | 3.3V | 3.6V | In System Programmable (min 1K program/erase cycles) | 10 ns | 10 ns | 4 | 1500 | 95MHz | 10 | MACROCELL | 64 | YES | 2.7V~3.6V | 9.1ns | 1.2mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||
| XCR3032XL-10VQG44C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 36 | Tin | 表面贴装 | 表面贴装 | 44-TQFP | 44 | EEPROM | 0°C~70°C TA | Tray | 2003 | CoolRunner XPLA3 | e3 | yes | 活跃 | 3 (168 Hours) | 44 | EAR99 | YES | QUAD | 鸥翼 | 260 | 3.3V | 0.8mm | 30 | XCR3032XL | 44 | 3.3V | In System Programmable (min 1K program/erase cycles) | 3.6V | 3V | 10 ns | 10 ns | 2 | 750 | 95MHz | 10 | MACROCELL | 32 | YES | 3V~3.6V | 9.1ns | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||
 | EPM7128SLC84-15N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 84-LCC (J-Lead) | YES | 68 | 0°C~70°C TA | Tray | 1998 | MAX® 7000S | e3 | Obsolete | 3 (168 Hours) | 84 | EAR99 | Matte Tin (Sn) | CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | QUAD | J BEND | 245 | 5V | 1.27mm | compliant | 40 | EPM7128 | 不合格 | 5.25V | 3.3/55V | 4.75V | 系统内可编程 | 100MHz | 15 ns | 2500 | MACROCELL | 128 | YES | 4.75V~5.25V | 15ns | 8 | 29.3116mm | 29.3116mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||
| 5M80ZT100C5N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 100-TQFP | YES | 79 | 0°C~85°C TJ | Tray | 2003 | MAX® V | e3 | 活跃 | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 未说明 | 1.8V | 0.5mm | 未说明 | 5M80Z | S-PQFP-G100 | 不合格 | 1.89V | 1.81.2/3.3V | 1.71V | 系统内可编程 | 118.3MHz | 14 ns | MACROCELL | 64 | YES | 1.71V~1.89V | 7.5ns | 80 | 1.2mm | 14mm | 14mm | 符合RoHS标准 | ||||||||||||||||||||||||||||
 | XC2C512-10FTG256I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 212 | -40°C~85°C TA | Tray | 2000 | CoolRunner II | e1 | yes | 活跃 | 3 (168 Hours) | 256 | 3A991.D | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.8V | 30 | XC2C512 | 256 | 1.8V | 系统内可编程 | 1.9V | 1.7V | 10 ns | 32 | 12000 | 128MHz | 10 | MACROCELL | 512 | YES | 1.7V~1.9V | 9.2ns | 1mm | 17mm | 17mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||
| XCR3032XL-7VQG44I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 36 | 表面贴装 | 表面贴装 | 44-TQFP | 44 | EEPROM | -40°C~85°C TA | Tray | 2003 | CoolRunner XPLA3 | e3 | yes | 活跃 | 3 (168 Hours) | 44 | EAR99 | Matte Tin (Sn) | YES | QUAD | 鸥翼 | 260 | 3.3V | 0.8mm | 30 | 44 | 不合格 | 3.3V | 3.6V | In System Programmable (min 1K program/erase cycles) | 7.5 ns | 2 | 750 | 119MHz | 7 | MACROCELL | 32 | YES | 2.7V~3.6V | 7ns | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||||
| EPM240T100C3N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 100-TQFP | YES | 80 | 0°C~85°C TJ | Tray | 2003 | MAX® II | e3 | 活跃 | 3 (168 Hours) | 100 | MATTE TIN (472) OVER COPPER | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 40 | EPM240 | S-PQFP-G100 | 不合格 | 2.625V | 1.5/3.32.5/3.3V | 2.375V | 系统内可编程 | 4.7 ns | MACROCELL | 192 | YES | 2.5V 3.3V | 4.7ns | 240 | 1.2mm | 14mm | 14mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||
| XC9572XL-5VQ44C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 34 | 表面贴装 | 表面贴装 | 44-TQFP | 44 | FLASH | 0°C~70°C TA | Tray | 1996 | XC9500XL | e0 | no | 活跃 | 3 (168 Hours) | 44 | EAR99 | QUAD | 鸥翼 | 225 | 3.3V | 0.8mm | 30 | XC9572XL | 44 | 不合格 | 3.3V | 3.6V | In System Programmable (min 10K program/erase cycles) | 5 ns | 4 | 1600 | 178.6MHz | 5 | MACROCELL | 72 | YES | 3V~3.6V | 1.2mm | 10mm | 10mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||
| XC9572XL-7VQ64C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 52 | 表面贴装 | 表面贴装 | 64-TQFP | 64 | FLASH | 0°C~70°C TA | Tray | 1996 | XC9500XL | e0 | no | 活跃 | 3 (168 Hours) | 64 | EAR99 | Tin/Lead (Sn85Pb15) | QUAD | 鸥翼 | 225 | 3.3V | 0.5mm | not_compliant | 30 | XC9572XL | 64 | 不合格 | 3.3V | 3.6V | In System Programmable (min 10K program/erase cycles) | 7.5 ns | 4 | 1600 | 125MHz | 7 | MACROCELL | 72 | YES | 3V~3.6V | 1.2mm | 10mm | 10mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||
 | XC9536XL-5CS48C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 36 | 表面贴装 | 表面贴装 | 48-FBGA, CSPBGA | 48 | FLASH | 0°C~70°C TA | Tray | 1996 | XC9500XL | e0 | no | 活跃 | 3 (168 Hours) | 48 | EAR99 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 240 | 3.3V | 0.8mm | not_compliant | 30 | XC9536XL | 48 | 不合格 | 3.3V | 3.6V | In System Programmable (min 10K program/erase cycles) | 5 ns | 2 | 800 | 178.6MHz | 5 | MACROCELL | 36 | YES | 3V~3.6V | 1.8mm | 7mm | 7mm | Non-RoHS Compliant | 含铅 |