类别是'嵌入式 - 微控制器'
嵌入式 - 微控制器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 最大功率耗散 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 界面 | 内存大小 | 振荡器类型 | 电源电流 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 比特数 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 电源电流-最大值 | 位元大小 | 访问时间 | 有ADC | DMA 通道 | 数据总线宽度 | 脉宽调制通道 | 数模转换器通道 | 定时器/计数器的数量 | 决议案 | 地址总线宽度 | 采样率 | 密度 | 核心架构 | EEPROM 大小 | 片上程序 ROM 宽度 | 处理器系列 | 最高频率 | 边界扫描 | 低功率模式 | 筛选水平 | A/D转换器数量 | 可编程I/O数 | 格式 | 集成缓存 | 内存(字) | UART 通道数 | ADC通道数量 | 串行I/O数 | 只读存储器可编程性 | 外部中断数量 | PWM通道数 | I2C通道数 | 片上数据 RAM 宽度 | SPI 通道数 | DMA通道数 | USB 通道数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||||||
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 | SPC560D40L1C4E0X | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 26 Weeks | 45 | A/D 16x12b | 16K x 8 | 表面贴装 | 64-LQFP | YES | 有 | -40°C~125°C TA | Tape & Reel (TR) | Automotive, AEC-Q100, SPC56 | 活跃 | 3 (168 Hours) | 64 | ALSO OPERATES AT 5 V | QUAD | 鸥翼 | 3.3V | 0.5mm | SPC560D | S-PQFP-G64 | 3.6V | 3V | CAN, SCI, SPI | Internal | 256kB | 3V~5.5V | MICROCONTROLLER, RISC | e200z0h | DMA, LVD, POR, PWM, WDT | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, LINbus, SPI, UART/USART | 100mA | 32 | YES | YES | 32b | YES | NO | 2 | 8 | 48MHz | YES | YES | FIXED-POINT | NO | 16 | 1.6mm | 10mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| STM8S208RBT3 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 52 | 6K x 8 | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 表面贴装 | 64-LQFP | 64 | A/D 16x10b | -40°C~125°C TA | Tube | STM8S | 活跃 | 3 (168 Hours) | 64 | EAR99 | QUAD | 鸥翼 | 未说明 | 3.3V | 0.5mm | 24MHz | 未说明 | STM8S208 | 64 | 不合格 | 5.5V | 3V | CAN, I2C, IrDA, LIN, SPI, UART, USART | Internal | 128kB | 2.95V~5.5V | MICROCONTROLLER | STM8 | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 8-Bit | 128KB 128K x 8 | CANbus, I2C, IrDA, LINbus, SPI, UART/USART | 8 | YES | NO | YES | NO | 3 | 2K x 8 | 32 | 1.6mm | 10mm | 10mm | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATTINY25-20PU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 6 | 有 | 128 x 8 | Tin | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | A/D 4x10b | -40°C~85°C TA | Tube | 1997 | AVR® ATtiny | e3 | yes | 活跃 | 1 (Unlimited) | 8 | DUAL | 5V | 20MHz | ATTINY25 | 5.5V | 3/5V | SPI | Internal | 2kB | 2.7V~5.5V | MICROCONTROLLER, RISC | AVR | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 8-Bit | 2KB 1K x 16 | USI | 8 | 20 μs | YES | NO | 8b | YES | 2 | 128 x 8 | 6 | 4 | 1 | 4.953mm | 10.16mm | 7.112mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MKE02Z64VQH4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 57 | 4096 | 65536 | 表面贴装 | 64-QFP | YES | A/D 16x12b; D/A 2x6b | -40°C~105°C TA | Tray | 2002 | Kinetis KE02 | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | 哑光锡 | 从制造商网站考虑的柱塞尺寸 | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3V | 40 | S-PQFP-G64 | 5.5V | 2.7V | Internal | 40MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | 20MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, SPI, UART/USART | YES | NO | YES | NO | 256 x 8 | 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MKV30F64VFM10 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 26 | 表面贴装 | 32-VFQFN Exposed Pad | YES | A/D 2x16b; D/A 1x12b | -40°C~105°C TA | Tray | 2002 | Kinetis KV | 活跃 | 3 (168 Hours) | 32 | 3A991.A.2 | 8542.31.00.01 | QUAD | 无铅 | 260 | 3.3V | 0.5mm | 40 | 3.6V | 1.71V | Internal | 100MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, PWM, WDT | 32MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, SPI, UART/USART | 32 | YES | YES | YES | 5mm | 5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | DSPIC33FJ64MC804-E/PT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 35 | 有 | 16K x 8 | 表面贴装 | 表面贴装 | 44-TQFP | 44 | A/D 9x10b/12b; D/A 6x16b | -40°C~125°C TA | Tray | 2010 | Automotive, AEC-Q100, dsPIC™ 33F | e3 | yes | 活跃 | 3 (168 Hours) | 44 | 3A991.A.2 | Matte Tin (Sn) - annealed | QUAD | 鸥翼 | 260 | 3.3V | 0.8mm | 40MHz | 40 | DSPIC33FJ64MC804 | 44 | 3.3V | 3.6V | CAN, I2C, IrDA, LIN, SPI, UART, USART | Internal | 64kB | 3V~3.6V | MICROCONTROLLER | dsPIC | Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, I2C, IrDA, LINbus, SPI, UART/USART | 16 | YES | YES | 16b | YES | YES | 5 | 512 kb | 24 | YES | YES | FLOATING-POINT | NO | 8192 | 2 | 3 | 16 | 8 | 1.2mm | 10mm | 无 | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | MK30DX256VLL7 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 70 | 262144 | 表面贴装 | 100-LQFP | YES | A/D 38x16b; D/A 1x12b | -40°C~105°C TA | Tray | 2002 | Kinetis K30 | e3 | 活跃 | 3 (168 Hours) | 100 | 3A991.A.2 | 哑光锡 | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MK30DX256 | S-PQFP-G100 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 72MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, I2C, IrDA, SD, SPI, UART/USART | 32 | YES | YES | YES | YES | 2K x 8 | CORTEX-M4 | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MK20DX128VFT5 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 29 | 131072 | 表面贴装 | 48-VFQFN Exposed Pad | YES | A/D 11x16b | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | 活跃 | 3 (168 Hours) | 48 | 3A991.A.2 | 8542.31.00.01 | QUAD | 无铅 | 260 | 3.3V | 0.5mm | 40 | MK20DX128 | S-XQCC-N48 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 50MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 2K x 8 | CORTEX-M4 | 1mm | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATMEGA162V-8PU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | 有 | 1K x 8 | Tin | 通孔 | 通孔 | 40-DIP (0.600, 15.24mm) | 40 | 35 | -40°C~85°C TA | Tube | 1997 | AVR® ATmega | e3 | yes | 活跃 | 1 (Unlimited) | 40 | DUAL | 3V | 8MHz | ATMEGA162 | 5.5V | 2/5V | 2.7V | EBI/EMI, SPI, UART, USART | Internal | 16kB | 1.8V~5.5V | MICROCONTROLLER, RISC | 8 | AVR | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 8-Bit | 16KB 8K x 16 | EBI/EMI, SPI, UART/USART | 8 | 8 μs | NO | NO | 8b | NO | 4 | 128 kb | 512 x 8 | 6 | 1 | 4.826mm | 52.58mm | 13.97mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | STM32F101CBT6TR | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 37 | 有 | 16K x 8 | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 48-LQFP | YES | 48 | A/D 10x12b | -40°C~85°C TA | Tape & Reel (TR) | STM32F1 | e4 | 活跃 | 3 (168 Hours) | 48 | Nickel/Palladium/Gold (Ni/Pd/Au) | 363mW | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 36MHz | 30 | STM32F101 | 48 | 2V | I2C, IrDA, LIN, SPI, UART, USART | Internal | 128kB | 2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M3 | DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT | FLASH | 32-Bit | 128KB 128K x 8 | I2C, IrDA, LINbus, SPI, UART/USART | 28.6mA | 32 | YES | YES | 32b | YES | NO | 3 | ARM | 8 | 1.6mm | 7mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | STM32F105V8T6 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 80 | 有 | 64K x 8 | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 100-LQFP | YES | 100 | A/D 16x12b; D/A 2x12b | -40°C~85°C TA | Tray | STM32F1 | 活跃 | 3 (168 Hours) | 100 | SMD/SMT | 434mW | QUAD | 鸥翼 | 3.3V | 0.5mm | 72MHz | STM32F105 | CAN, I2C, I2S, IrDA, LIN, SPI, UART, USART, USB | Internal | 64kB | 2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M3 | DMA, POR, PWM, Voltage Detect, WDT | FLASH | 32-Bit | 64KB 64K x 8 | CANbus, I2C, IrDA, LINbus, SPI, UART/USART, USB OTG | 68mA | 32 | YES | YES | 32b | YES | 7 | 512 kb | ARM | 16 | 2 | 3 | 1.45mm | 14mm | 14.2mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT91SAM9RL64-CU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 118 | 有 | 72K x 8 | 表面贴装 | 表面贴装 | 217-LFBGA | 217 | A/D 6x10b | -40°C~85°C TA | Tray | 2005 | SAM9R | yes | 活跃 | 3 (168 Hours) | 217 | SMD/SMT | BOTTOM | BALL | 1.2V | 0.8mm | 240MHz | AT91SAM9RL64 | 3.3V | 2-Wire, EBI/EMI, I2C, I2S, MMC, SPI, UART, USART, USB | Internal | 32kB | 1.65V~3.6V | MICROCONTROLLER, RISC | ARM926EJ-S | AC'97, LCD, POR, PWM, WDT | ROM | 16/32-Bit | 32KB 32K x 8 | EBI/EMI, I2C, Memory Card, SPI, SSC, UART/USART, USB | 32 | YES | YES | 32b | ARM | 6 | FLASH | 4 | 2 | 1 | 900μm | 15mm | 15.05mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PIC18F4610-I/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 36 | 有 | 3.8K x 8 | 通孔 | 通孔 | 40-DIP (0.600, 15.24mm) | 40 | A/D 13x10b | -40°C~85°C TA | Tube | 2004 | PIC® 18F | e3 | yes | 活跃 | 不适用 | 40 | SMD/SMT | EAR99 | Matte Tin (Sn) | 1W | DUAL | 5V | 40MHz | PIC18F4610 | 40 | 5V | 5V | I2C, SPI, UART, USART | Internal | 64kB | 4.2V~5.5V | MICROCONTROLLER | 8 | PIC | Brown-out Detect/Reset, HLVD, POR, PWM, WDT | FLASH | 8-Bit | 64KB 32K x 16 | I2C, SPI, UART/USART | 16 | 40 μs | YES | NO | 8b | 4 | 512 kb | PIC | 25 | 13 | 5 | 1 | 4.953mm | 53.213mm | 14.732mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||
| PIC12CE674-04/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3 Weeks | FLASH | 5 | 有 | 128 x 8 | 通孔 | 8-DIP (0.300, 7.62mm) | NO | 8 | A/D 4x8b | 0°C~70°C TA | Tube | PIC® 12C | e3 | yes | 活跃 | 不适用 | 8 | EAR99 | Matte Tin (Sn) | 700mW | DUAL | 5V | 4MHz | PIC12CE674 | 8 | 3V | Internal | 3.5kB | 3V~5.5V | MICROCONTROLLER, RISC | PIC | POR, WDT | OTP | 8-Bit | 3.5KB 2K x 14 | 3.3mA | 8 | 4 μs | YES | NO | 8b | NO | 1 | 16 x 8 | PIC | 4 | 3.68mm | 9.78mm | 6.6mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | DSPIC33EP64MC202-I/MM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 22 Weeks | 21 | 有 | 4K x 16 | 表面贴装 | 28-VQFN Exposed Pad | YES | 28 | A/D 6x10b/12b | -40°C~85°C TA | Tube | 2011 | dsPIC™ 33EP | e3 | 活跃 | 1 (Unlimited) | 28 | Matte Tin (Sn) - annealed | QUAD | 260 | 3.3V | 70MHz | 40 | DSPIC33EP64MC202 | 28 | 3.3V | I2C, IrDA, LIN, SPI, UART, USART | Internal | 64kB | 3V~3.6V | MICROCONTROLLER | dsPIC | Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT | FLASH | 16-Bit | 64KB 22K x 24 | I2C, IrDA, LINbus, QEI, SPI, UART/USART | 16 | YES | YES | 16b | YES | 5 | FLOATING-POINT | 6 | 2 | 950μm | 6mm | 6mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MSP430FG437IPN | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 48 | 32768 | 有 | 1K x 8 | ACTIVE (Last Updated: 4 days ago) | 表面贴装 | 80-LQFP | YES | 80 | 465.697616mg | A/D 12x12b; D/A 2x12b | -40°C~85°C TA | Tray | MSP430x4xx | e4 | yes | 活跃 | 3 (168 Hours) | 80 | SMD/SMT | Nickel/Palladium/Gold (Ni/Pd/Au) | QUAD | 鸥翼 | 260 | 2.2V | 0.5mm | 8MHz | 80 | 3.6V | SPI, UART, USART | Internal | 32kB | 1.8V~3.6V | MICROCONTROLLER, RISC | 16 | MSP430 | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT | FLASH | 16-Bit | 32KB 32K x 8 + 256B | SPI, UART/USART | 0.57mA | 16 | 8 μs | YES | YES | 16b | YES | YES | 4 | 256 kb | YES | YES | 12 | 48 | FIXED-POINT | NO | 1 | 1 | 1 | 1.6mm | 12mm | 12mm | 1.4mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||
 | PIC16F1509-I/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3 Weeks | 17 | 有 | 512 x 8 | Tin | 通孔 | 20-DIP (0.300, 7.62mm) | NO | 20 | A/D 12x10b; D/A 1x5b | -40°C~85°C TA | Tube | 2011 | PIC® XLP™ 16F | e3 | 活跃 | 1 (Unlimited) | 20 | EAR99 | 800mW | DUAL | 5V | 20MHz | PIC16F1509 | 20 | 5.5V | 2.5/5V | 2.5V | I2C, LIN, SPI, UART, USART | Internal | 14kB | 2.3V~5.5V | MICROCONTROLLER, RISC | PIC | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 8-Bit | 14KB 8K x 14 | I2C, LINbus, SPI, UART/USART | 8 | YES | NO | 8b | 3 | PIC | 18 | 12 | 4 | 1 | 4.953mm | 26.92mm | 7.112mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PIC16LF73-I/SS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 22 | 4096 | 有 | 192 x 8 | 表面贴装 | 表面贴装 | 28-SSOP (0.209, 5.30mm Width) | 28 | A/D 5x8b | -40°C~85°C TA | Tube | 1996 | PIC® 16F | e3 | yes | 活跃 | 2 (1 Year) | 28 | EAR99 | Matte Tin (Sn) | OPERATES AT 2 V MINIMUM SUPPLY @ 4 MHZ | 1W | DUAL | 鸥翼 | 260 | 5V | 20MHz | 40 | PIC16LF73 | 28 | 3V | I2C, SPI, UART, USART | External | 400μA | 7kB | 2V~5.5V | MICROCONTROLLER, RISC | PIC | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 8-Bit | 7KB 4K x 14 | I2C, SPI, UART/USART | 8 | 20 μs | YES | NO | 8b | YES | 3 | 8b | PIC | 5 | 1 | 1.83mm | 10.34mm | 5.38mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | MSP430FR2422IRHLR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 15 | 7680 | ACTIVE (Last Updated: 3 days ago) | 表面贴装 | 20-VFQFN Exposed Pad | YES | 20 | A/D 8x10b | -40°C~85°C TA | Tape & Reel (TR) | MSP430™ FRAM | e4 | yes | 活跃 | 2 (1 Year) | 20 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | QUAD | 无铅 | 260 | 3V | 0.5mm | 未说明 | 3.6V | Internal | 16MHz | 2K x 8 | 2V~3.6V | MICROCONTROLLER, RISC | MSP430 | Brown-out Detect/Reset, PWM, WDT | FRAM | 16-Bit | 7.5KB 7.5K x 8 | I2C, IrDA, SCI, SPI, UART/USART | 16 | YES | NO | YES | NO | 1 | 1mm | 4.5mm | 3.5mm | 900μm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC5125YVN400 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 324-BBGA | YES | 64 | -40°C~125°C TJ | Tray | 2002 | MPC51xx | e2 | 活跃 | 3 (168 Hours) | 324 | 3A991.A.2 | Tin/Silver (Sn/Ag) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.4V | 1mm | 40 | MPC5125 | S-PBGA-B324 | 不合格 | 1.47V | 1.43.3V | 1.33V | External | 400MHz | 32K x 8 | 1.08V~3.6V | MICROCONTROLLER | e300 | DMA, WDT | 35MHz | ROMless | 32-Bit | CANbus, EBI/EMI, Ethernet, I2C, USB OTG | 32 | NO | YES | NO | NO | FLASH | 2.55mm | 23mm | 23mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATSAMD51G19A-MUT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 19 Weeks | 37 | Automotive grade | 表面贴装 | 48-VFQFN Exposed Pad | YES | A/D 20x12b; D/A 2x12b | -40°C~85°C TA | Cut Tape (CT) | SAM D51 | e3 | 活跃 | 3 (168 Hours) | 48 | Matte Tin (Sn) | QUAD | 无铅 | 未说明 | 3.3V | 0.5mm | 未说明 | ATSAMD51 | S-XQCC-N48 | 3.63V | 1.71V | Internal | 120MHz | 192K x 8 | 1.71V~3.63V | MICROCONTROLLER, RISC | ARM® Cortex®-M4F | Brown-out Detect/Reset, DMA, I2S, POR, PWM | 48MHz | FLASH | 32-Bit | 512KB 512K x 8 | EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB | 32 | YES | YES | YES | YES | 8 | ISO/TS-16949 | 0.9mm | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PIC18F8680-E/PT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 68 | 有 | 3.25K x 8 | 表面贴装 | 表面贴装 | 80-TQFP | 80 | A/D 16x10b | -40°C~125°C TA | Tray | 2004 | PIC® 18F | e3 | yes | 活跃 | 3 (168 Hours) | 80 | EAR99 | Matte Tin (Sn) | 1W | QUAD | 鸥翼 | 260 | 5V | 40MHz | 40 | PIC18F8680 | 80 | 5V | 5V | CAN, EBI/EMI, I2C, SPI, UART, USART | External | 64kB | 4.2V~5.5V | MICROCONTROLLER, RISC | 8 | PIC | Brown-out Detect/Reset, LVD, POR, PWM, WDT | FLASH | 8-Bit | 64KB 32K x 16 | CANbus, EBI/EMI, I2C, SPI, UART/USART | 8 | 40 μs | YES | NO | 8b | YES | 5 | 1K x 8 | PIC | 69 | 16 | 1 | 1.05mm | 12mm | 12mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | ATMEGA164P-B15AZ | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | FLASH, OTP | 32 | 8192 | 有 | Automotive grade | 1K x 8 | Tin | 表面贴装 | 表面贴装 | 44-TQFP | 44 | A/D 8x10b | -40°C~125°C TA | Tape & Reel (TR) | 2006 | Automotive, AEC-Q100, AVR® ATmega | e3 | yes | 活跃 | 3 (168 Hours) | 44 | ALSO OPERATES AT 2.7 V MINIMUM SUPPLY AT 8 MHZ. | QUAD | 鸥翼 | 260 | 5V | 0.8mm | 16MHz | 40 | ATMEGA164P | 不合格 | 5.5V | 4.5V | I2C, SPI, UART, USART | Internal | 7kB | 2.7V~5.5V | MICROCONTROLLER, RISC | AVR | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 8-Bit | 16KB 8K x 16 | I2C, SPI, UART/USART | 8 | YES | NO | 8b | YES | NO | 3 | 512 x 8 | AEC-Q100; TS 16949 | 1.2mm | 10mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | STM32L152VBH6 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 83 | 131072 | 有 | 16K x 8 | 表面贴装 | 100-UFBGA | YES | 100 | A/D 24x12b; D/A 2x12b | -40°C~85°C TA | Tray | STM32L1 | e1 | 活跃 | 3 (168 Hours) | 100 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 339mW | BOTTOM | BALL | 260 | 3V | 0.5mm | 32MHz | 30 | STM32L152 | 100 | 3.6V | 2/3.3V | I2C, IrDA, LIN, SPI, UART, USART, USB | Internal | 128kB | 1.8V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M3 | Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT | FLASH | 32-Bit | 128KB 128K x 8 | I2C, IrDA, LINbus, SPI, UART/USART, USB | 32 | YES | YES | 32b | YES | YES | 8 | ARM | 4K x 8 | 8 | CORTEX-M3 | 0.6mm | 7mm | 无 | Unknown | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | ADUC848BSZ62-3 | Analog Devices Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 34 | 有 | 2.25K x 8 | PRODUCTION (Last Updated: 4 weeks ago) | Tin | 表面贴装 | 表面贴装 | 52-QFP | 52 | A/D 10x16b; D/A 1x12b, 2x16b | -40°C~125°C TA | Tray | MicroConverter® ADuC8xx | e3 | no | 活跃 | 3 (168 Hours) | 52 | SMD/SMT | EAR99 | QUAD | 鸥翼 | 260 | 3V | 0.65mm | 12.58MHz | 30 | ADUC848 | 52 | 不合格 | 3V | I2C, SPI, UART, USART | Internal | 62kB | 2.7V~3.6V | MICROCONTROLLER | 8 | 8052 | POR, PSM, PWM, Temp Sensor, WDT | FLASH | 8-Bit | 62KB 62K x 8 | I2C, SPI, UART/USART | 8 | 12.6 μs | YES | NO | 8b | 3 | 2 B | 1.37 ksps | 496 kb | 4K x 8 | 24 | 10 | 2 | 1 | 2mm | 10mm | 10mm | 无SVHC | ROHS3 Compliant | 含铅 |