类别是'时钟/计时 - 时钟缓冲器，驱动器'
时钟/计时 - 时钟缓冲器，驱动器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | 包装方式 | 最大功率耗散 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 输出量 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 极性 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 通道数量 | 电路数量 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 负载电容 | 端口的数量 | 电源电流 | 功率耗散 | 比特数 | 传播延迟 | 静态电流 | 接通延迟时间 | 家人 | 逻辑功能 | 数据率 | 最大输入电压 | 输出特性 | 无卤素 | 输入 | 比率-输入：输出 | 逻辑IC类型 | 最大 I(ol) | 差分 - 输入：输出 | Prop. Delay@Nom-Sup | 高电平输出电流 | 传播延迟(tpd) | 低水平输出电流 | 最大工作周期 | 控制类型 | fmax-Min | 计数方向 | 同边偏斜-最大(tskwd) | 真实输出的数量 | 占空比 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||
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 | NB3N106KMNG | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | ACTIVE (Last Updated: 1 week ago) | 表面贴装 | 表面贴装 | 24-VFQFN Exposed Pad | 24 | 928.191737mg | -40°C~85°C | Tube | 2006 | e3 | yes | 活跃 | 1 (Unlimited) | 24 | Fanout Buffer (Distribution) | Tin (Sn) | 3V~3.6V | QUAD | 1 | 3.3V | 0.5mm | 400MHz | NB3N106 | HCSL, LVDS | 24 | 12 | 3.3V | 3.6V | 3V | 1 | 260mA | 1.1 ns | 1.1 ns | 3N | Clock | 850mV | 无卤素 | HCSL, LVCMOS, LVDS, LVPECL, LVTTL | 1:6 | Yes/Yes | 950μm | 4mm | 4mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | MC10EP11DTR2G | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | 3GHz | -40°C~85°C | Tape & Reel (TR) | 2000 | 10EP | e3 | yes | Obsolete | 3 (168 Hours) | 8 | Fanout Buffer (Distribution) | NECL MODE: VCC=0 WITH VEE = -3.0V TO -5.5V | 3V~5.5V | DUAL | 鸥翼 | 260 | 1 | 3.3V | 0.65mm | 40 | MC10EP11 | ECL, PECL | 8 | 4 | 5.5V | -3.0/-5.5V | 3V | 1 | 270 ps | 300 ps | 无卤素 | ECL, PECL | 1:2 | Yes/Yes | 0.32 ns | 3mm | 3mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | CDC1104RVKR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 3 days ago) | Gold | 表面贴装 | 表面贴装 | 12 | 12-WQFN (3x3) | 120Hz | -40°C~85°C | Tape & Reel (TR) | e4 | yes | 活跃 | 2 (1 Year) | 12 | EAR99 | Buffer/Driver | TR | 3.8V~5.5V | QUAD | 260 | 1 | 5V | CDC1104 | 4 | 5V | 3.8V | 1 | CDC | TTL | 1:4 | 0.008 A | No/No | 51 % | 51 % | 3mm | 3mm | 750μm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ZL40234LDF1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 32-VFQFN Exposed Pad | 32-QFN (5x5) | 1.6GHz | -40°C~85°C | Tape & Reel (TR) | 2017 | 活跃 | Fanout Buffer (Distribution), Multiplexer | 1.35V~3.465V | HCSL, LVCMOS, LVDS, LVPECL | 1 | CML, HCSL, LVCMOS, LVDS, LVPECL, SSTL | 3:5 | Yes/Yes | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | NB7L585MNG | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | ACTIVE (Last Updated: 1 week ago) | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad | 32 | 5GHz | -40°C~85°C | Tube | 2007 | GigaComm™ | e3 | yes | 活跃 | 1 (Unlimited) | 32 | Fanout Buffer (Distribution), Multiplexer, Data | Tin (Sn) | ALSO OPERATES AT 3.3 V | 2.375V~3.6V | QUAD | 1 | 2.5V | NB7L585 | LVPECL | 32 | 2.625V | 2.5/3.3V | 2.375V | 1 | 185mA | 225mA | 7L | Buffer, Clock, Translator | 10 Gbps | 无卤素 | CML, LVDS, LVPECL | 1:6 | Yes/Yes | 0.3 ns | 0.25 ns | 5000 MHz | 0.02 ns | 950μm | 5mm | 5mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
 | ZL40201LDF1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 16-VFQFN Exposed Pad | 16-QFN (3x3) | 750MHz | -40°C~85°C | Tape & Reel (TR) | 活跃 | 3 (168 Hours) | Fanout Buffer (Distribution) | 85°C | -40°C | 2.375V~3.465V | LVPECL | 1 | 2 ns | CML, HCSL, LVCMOS, LVDS, LVPECL | 1:2 | Yes/Yes | 2 % | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CDCVF111FNRG4 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | ACTIVE (Last Updated: 2 days ago) | Gold | 表面贴装 | 表面贴装 | 28-LCC (J-Lead) | 28 | 650MHz | -40°C~85°C | Tape & Reel (TR) | e4 | yes | 活跃 | 1 (Unlimited) | 28 | Fanout Buffer (Distribution) | TR | 525mW | 3V~3.6V | QUAD | J BEND | 260 | 1 | 3.3V | CDCVF111 | 28 | 9 | 3.3V | 3.6V | 3V | 1 | 525mW | 600 ps | 100mA | 600 ps | 111 | LVPECL | 1:9 | Yes/Yes | 0.6 ns | 650 MHz | 0.05 ns | 4.57mm | 11.51mm | 11.51mm | 4.06mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
 | SY89834UMG-TR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 表面贴装 | 16-VFQFN Exposed Pad, 16-MLF® | 16 | 16-MLF® (3x3) | 1GHz | -40°C~85°C | Tape & Reel (TR) | 2000 | Precision Edge® | 活跃 | 3 (168 Hours) | Fanout Buffer (Distribution) | 85°C | -40°C | 2.375V~3.6V | SY89834 | LVPECL | 1 | 1 | 3.6V | 2.375V | 75mA | LVCMOS, LVTTL | 2:4 | No/Yes | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png) | SN54HC244J | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ACTIVE (Last Updated: 3 days ago) | 通孔 | CDIP | 20 | 2 | 20 | EAR99 | 125°C | -55°C | TUBE | DUAL | 2 | 5V | 20 | 8 | 5V | Non-Inverting | MILITARY | 6V | 2V | 150pF | 2 | 4 | 300 ns | 8μA | 300 ns | HC/UH | Buffer | 3-STATE | 总线驱动器 | 34 ns | -7.8mA | 7.8mA | 低电平 | UNIDIRECTIONAL | 5.08mm | 24.2mm | 6.92mm | 4.57mm | 无 | 符合RoHS标准 | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NB7VQ58MMNHTBG | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 16-VFQFN Exposed Pad | 16 | 7GHz | -40°C~85°C | Tape & Reel (TR) | 2009 | GigaComm™ | yes | Obsolete | 1 (Unlimited) | 16 | Multiplexer, Data | Nickel/Gold/Palladium (Ni/Au/Pd) | 1.71V~3.6V | QUAD | 260 | 1 | 1.8V | 0.5mm | 40 | NB7VQ58M | CML | 16 | 3.6V | 1 | 22 ns | 150mA | 7V | Translator | 无卤素 | CML, LVDS, LVPECL | 2:1 | Yes/Yes | 0.24 ns | 60 % | 950μm | 3mm | 3mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SY898531LTZ | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 32-TQFP | 32 | 500MHz | 0°C~70°C | Tray | 2009 | Precision Edge® | e3 | 活跃 | 3 (168 Hours) | 32 | Fanout Buffer (Distribution), Multiplexer | Matte Tin (Sn) | 3.135V~3.465V | QUAD | 鸥翼 | 260 | 1 | 3.3V | 0.8mm | 40 | SY898531 | LVPECL | 3.465V | 1 | HCSL, LVDS, LVHSTL, LVPECL, SSTL | 2:9 | Yes/Yes | 2 ns | 500 MHz | 0.05 ns | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NB7L14MMN | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 16-VFQFN Exposed Pad | 16 | 8GHz | -40°C~85°C | Tube | 2006 | e0 | Obsolete | 1 (Unlimited) | 16 | Fanout Buffer (Distribution), Translator, Data | 2.375V~3.465V | QUAD | 无铅 | 240 | 1 | 2.5V | 0.5mm | not_compliant | 30 | NB7L14M | CML | 16 | 8 | 不合格 | 3.465V | 2.5/3.3V | 2.375V | 1 | 150 ps | 7L | CML, LVCMOS, LVDS, LVPECL, LVTTL | 1:4 | Yes/Yes | 3mm | 3mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SY100E111JC | Micrel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NB7L14MN1TXG | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | 表面贴装 | 表面贴装 | 16-VFQFN Exposed Pad | 16 | 8GHz | -40°C~85°C | Tape & Reel (TR) | 2011 | GigaComm™ | e3 | yes | Obsolete | 1 (Unlimited) | 16 | Fanout Buffer (Distribution) | Tin (Sn) | 2.375V~3.6V | QUAD | 无铅 | 未说明 | 1 | 2.5V | 0.5mm | 未说明 | NB7L14 | LVPECL | 16 | 4 | 不合格 | 3.6V | 2.5/3.3V | 2.375V | 1 | 105mA | 165 ps | 105mA | 200 ps | 7L | 无卤素 | CML, LVCMOS, LVDS, LVPECL, LVTTL | 1:4 | Yes/Yes | 0.2 ns | 0.05 ns | 55 % | 3mm | 3mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||
 | 8302AMILFT | Renesas Electronics America Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8-SOIC | 200MHz | -40°C~85°C | Tape & Reel (TR) | 活跃 | 1 (Unlimited) | Fanout Buffer (Distribution) | 3.135V~3.465V | ICS8302 | LVCMOS, LVTTL | 1 | LVCMOS, LVTTL | 1:2 | No/No | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PL133-97QI-R | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 16-WFQFN Exposed Pad | 150MHz | -40°C~85°C | Tape & Reel (TR) | 2014 | e4 | 活跃 | 3 (168 Hours) | 16 | Fanout Buffer (Distribution) | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.25V~3.63V | QUAD | 无铅 | 未说明 | 1 | 2.5V | 0.5mm | 未说明 | PL133 | 3.63V | 2.25V | 1 | 3-STATE | LVCMOS | 1:9 | No/No | 9.2 ns | 0.25 ns | 9 | 0.8mm | 3mm | 3mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NB3L202KMNTXG | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | ACTIVE (Last Updated: 1 week ago) | 表面贴装 | 16-VFQFN Exposed Pad | YES | 350MHz | -40°C~85°C TA | Tape & Reel (TR) | 2006 | e3 | yes | 活跃 | 1 (Unlimited) | 16 | Fanout Buffer (Distribution) | Tin (Sn) | ALSO OPERATES AT 2.97 TO 3.63 V SUPPLY | 2.375V~3.63V | QUAD | 无铅 | 未说明 | 1 | 2.5V | 0.5mm | 未说明 | HCSL | 2.625V | 2.375V | 1 | NB3 | HCSL, LVCMOS, LVDS, LVPECL, LVTTL | 1:2 | Yes/Yes | 350 MHz | 0.02 ns | 3mm | 3mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PI6C48533-01LE | Diodes Incorporated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 20-TSSOP (0.173, 4.40mm Width) | 20 | 800MHz | -40°C~85°C | Tube | 2015 | e3 | Obsolete | 1 (Unlimited) | 20 | EAR99 | Fanout Buffer (Distribution), Multiplexer | 3V~3.6V | DUAL | 鸥翼 | 260 | 1 | 3.3V | 0.65mm | 40 | PI6C48533 | LVPECL | 16 | 3.3V | 3.6V | 3V | 1 | 60mA | 6C | CML, HCSL, LVDS, LVHSTL, LVPECL, SSTL | 2:4 | Yes/Yes | 2 ns | 800 MHz | 6.5mm | 4.4mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | NB100EP223FAG | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 64-LQFP Exposed Pad | 32 | 0°C~85°C | Tray | 2006 | 100EP | e3 | yes | Obsolete | 3 (168 Hours) | 64 | Fanout Buffer (Distribution), Multiplexer | Tin (Sn) | 3V~3.6V | QUAD | 鸥翼 | 260 | 1 | 3.3V | 0.5mm | 500MHz | 40 | NB100EP223 | HSTL | 64 | S-PQFP-G64 | 3.3V | 3.6V | 3V | 1 | 100mA | 1.35 ns | 无卤素 | HSTL, LVDS, LVPECL | 2:22 | Yes/Yes | 0.065 ns | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 8SLVD1204NLGI | Renesas Electronics America Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) | 2GHz | -40°C~85°C | Tube | 活跃 | 3 (168 Hours) | Fanout Buffer (Distribution), Multiplexer | 2.375V~2.625V | LVDS | 1 | LVDS, LVPECL | 2:4 | Yes/Yes | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CDCL1810ARGZT | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 5 days ago) | Gold | 表面贴装 | 表面贴装 | 48-VFQFN Exposed Pad | 48 | 650MHz | -40°C~85°C | Tape & Reel (TR) | e4 | yes | 活跃 | 3 (168 Hours) | 48 | EAR99 | Fanout Buffer (Distribution), Divider | TR | 1.7V~1.9V | QUAD | 无铅 | 260 | 1 | 1.8V | 0.5mm | 未说明 | CDCL1810 | CML | 10 | 1.8V | 1 | LVDS | 1:10 | Yes/Yes | 650 MHz | 0.064 ns | 1mm | 7mm | 7mm | 900μm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LMK01801BISQX/NOPB | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | ACTIVE (Last Updated: 4 days ago) | 表面贴装 | 48-WFQFN Exposed Pad | YES | 48 | 3.1GHz | -40°C~85°C | Tape & Reel (TR) | e3 | yes | 活跃 | 3 (168 Hours) | 48 | EAR99 | Fanout Buffer (Distribution), Divider, Multiplexer | Matte Tin (Sn) | TR | 3.15V~3.45V | QUAD | 无铅 | 260 | 2 | 3.3V | 0.5mm | 未说明 | LMK01801 | LVCMOS, LVDS, LVPECL | 48 | 12 | 不合格 | 3.45V | 3.3V | 3.15V | 2 | 10pF | LVCMOS, LVDS, LVPECL, RF Sinewave | 1:8, 1:6 | 0.001 A | Yes/Yes | 3100 MHz | 800μm | 7mm | 7mm | 750μm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||
 | SI5330M-B00232-GM | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 24-VFQFN Exposed Pad | YES | 24 | 250MHz | -40°C~85°C | Tray | 1997 | 活跃 | 2 (1 Year) | 24 | Fanout Buffer (Distribution), Translator | 1.71V~3.63V | QUAD | 无铅 | 260 | 1 | 2.5V | 0.5mm | 40 | SI5330 | HCSL | 24 | 4 | 2.75V | 2.25V | 1 | 2.5 ns | CMOS, HSTL, LVTTL, SSTL | 1:4 | No/Yes | 60 % | 0.9mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 854S006AGILF | Renesas Electronics America Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 24-TSSOP (0.173, 4.40mm Width) | 1.7GHz | -40°C~85°C | Tube | 活跃 | 1 (Unlimited) | Fanout Buffer (Distribution) | 2.375V~3.465V | ICS854S006 | LVDS | 1 | HCSL, LVDS, LVHSTL, LVPECL, SSTL | 1:6 | Yes/Yes | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 83905AGILFT | Renesas Electronics America Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 16-TSSOP (0.173, 4.40mm Width) | 100MHz | -40°C~85°C | Tape & Reel (TR) | 活跃 | 1 (Unlimited) | Fanout Buffer (Distribution) | 1.6V~3.465V | ICS83905 | LVCMOS, LVTTL | 1 | Crystal | 1:6 | No/No | ROHS3 Compliant |