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类别是'嵌入式 - 片上系统（SoC）'

图片

产品型号

品牌

数据表

有效性

单价(CNY)

询价

认证

包装/外壳

表面安装

供应商器件包装

终端数量

厂商

操作温度

包装

系列

JESD-609代码

零件状态

端子表面处理

HTS代码

子类别

技术

端子位置

终端形式

峰值回流焊温度（摄氏度）

端子间距

Reach合规守则

基本部件号

JESD-30代码

输出的数量

资历状况

工作电源电压

电源

温度等级

速度

内存大小

核心处理器

周边设备

程序内存大小

连接方式

建筑学

输入数量

组织结构

座位高度-最大

可编程逻辑类型

产品类别

主要属性

逻辑块数量

逻辑单元数

核数量

闪光大小

产品类别

长度

宽度
XC7Z030-1SBG485C XC7Z030-1SBG485C

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

484-FBGA, FCBGA

Tray

XC7Z030

活跃

484-FCBGA (19x19)

AMD

130

0°C ~ 85°C (TJ)

Zynq®-7000

667MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Kintex™-7 FPGA, 125K Logic Cells

-

XCZU7EG-1FBVB900E XCZU7EG-1FBVB900E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

900-BBGA, FCBGA

Tray

XCZU7

活跃

900-FCBGA (31x31)

AMD

204

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

AGFA022R31C2I2V AGFA022R31C2I2V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

-

Tray

活跃

-

Intel

720

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.2M Logic Elements

-

XCZU2EG-L1UBVA530I XCZU2EG-L1UBVA530I

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

530-WFBGA, FCBGA

Tray

活跃

2 x 32 kB, 4 x 32 kB

103320 LE

+ 100 C

- 40 C

SMD/SMT

2 x 32 kB, 4 x 32 kB

256 kB

530-FCBGA (16x9.5)

AMD 赛灵思

82

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

850 mV

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

7 Core

-

AGFB019R25A1I1V AGFB019R25A1I1V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

-

Tray

活跃

-

Intel

480

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

-

XC7Z010-1CLG400I XC7Z010-1CLG400I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

400-LFBGA, CSPBGA

Tray

XC7Z010

活跃

400-CSPBGA (17x17)

AMD

130

-40°C ~ 100°C (TJ)

Zynq®-7000

667MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Artix™-7 FPGA, 28K Logic Cells

-

10AS022E3F29I2LG 10AS022E3F29I2LG

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

FBGA-780

Non-Compliant

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

220000 LE

1

SMD/SMT

27500 LAB

973474

Intel

Intel / Altera

Arria 10 SoC

2 x 32 kB

-

BGA, BGA780,28X28,40

网格排列

PLASTIC/EPOXY

BGA780,28X28,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

有

10AS022E3F29I2LG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.46

SoC FPGA

YES

780

288

-40°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B780

288

不合格

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

288

3.35 mm

现场可编程门阵列

FPGA - 220K Logic Elements

220000

2 Core

--

SoC FPGA

29 mm

29 mm

XCVM1502-2LSENFVB1369 XCVM1502-2LSENFVB1369

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

AMD

478

Versal™ Prime

450MHz, 1.08GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1M Logic Cells

-

AGFA019R25A2E3V AGFA019R25A2E3V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

-

Tray

活跃

-

Intel

480

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

-

XCZU47DR-1FFVG1517I XCZU47DR-1FFVG1517I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

1517-BBGA, FCBGA

Tray

活跃

1517-FCBGA (40x40)

AMD

561

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

AGFA014R24B2I3V AGFA014R24B2I3V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

-

Tray

活跃

-

Intel

768

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.4M Logic Elements

-

XCZU2CG-1UBVA530I XCZU2CG-1UBVA530I

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

530-WFBGA, FCBGA

Tray

活跃

2 x 32 kB, 2 x 32 kB

103320 LE

+ 100 C

- 40 C

SMD/SMT

2 x 32 kB, 2 x 32 kB

256 kB

530-FCBGA (16x9.5)

AMD 赛灵思

82

-40°C ~ 100°C (TJ)

-

850 mV

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

4 Core

-

XCVC1802-2LSEVSVA2197 XCVC1802-2LSEVSVA2197

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

2197-BFBGA, FCBGA

Tray

活跃

2197-FCBGA (45x45)

AMD 赛灵思

770

0°C ~ 100°C (TJ)

Versal™ AI Core

450MHz, 1.08GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.5M Logic Cells

-

XCVM1802-2LLEVSVA2197 XCVM1802-2LLEVSVA2197

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

2197-BFBGA, FCBGA

活跃

2197-FCBGA (45x45)

AMD 赛灵思

770

0°C ~ 100°C (TJ)

450MHz, 1.08GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.9M Logic Cells

-

XCVC1702-2MSEVSVA1596 XCVC1702-2MSEVSVA1596

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

活跃

AMD

Tray

*

5ASXMB5E4F31I5N 5ASXMB5E4F31I5N

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

896-BBGA, FCBGA

FBGA-896

网格排列

PLASTIC/EPOXY

BGA896,30X30,40

-40 °C

1.1 V

未说明

1.07 V

100 °C

有

5ASXMB5E4F31I5N

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

1.13 V

5.28

YES

896-FBGA (31x31)

896

MCU - 208, FPGA - 250

-40°C ~ 100°C (TJ)

Tray

Arria V SX

e1

活跃

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

BALL

未说明

1 mm

compliant

5ASXMB5

S-PBGA-B896

250

INDUSTRIAL

800MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

250

17434 CLBS

2.7 mm

现场可编程门阵列

FPGA - 462K Logic Elements

17434

462000

--

31 mm

31 mm

5CSXFC5D6F31C6N 5CSXFC5D6F31C6N

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

896-BGA

BGA, BGA896,30X30,40

网格排列

PLASTIC/EPOXY

BGA896,30X30,40

1.1 V

未说明

1.07 V

85 °C

有

5CSXFC5D6F31C6N

BGA

SQUARE

Intel Corporation

活跃

INTEL CORP

1.13 V

5.57

YES

896-FBGA (31x31)

896

MCU - 181, FPGA - 288

0°C ~ 85°C (TJ)

Tray

Cyclone® V SX

活跃

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

5CSXFC5

S-PBGA-B896

288

不合格

1.1,1.2/3.3,2.5 V

OTHER

925MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

288

2 mm

现场可编程门阵列

FPGA - 85K Logic Elements

85000

--

31 mm

31 mm

5CSEBA6U19A7N 5CSEBA6U19A7N

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

484-FBGA

484-UBGA (19x19)

MCU - 151, FPGA - 66

-40°C ~ 125°C (TJ)

Tray

Automotive, AEC-Q100, Cyclone® V SE

活跃

5CSEBA6

700MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 110K Logic Elements

--

5CSEBA2U23I7LN 5CSEBA2U23I7LN

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

*

活跃

5ASXBB5D4F35C5N 5ASXBB5D4F35C5N

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

1152-BBGA, FCBGA

1152-FBGA (35x35)

MCU - 208, FPGA - 385

0°C ~ 85°C (TJ)

Tray

Arria V SX

活跃

5ASXBB5

800MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 462K Logic Elements

--

5CSXFC6C6U23A7N 5CSXFC6C6U23A7N

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

672-FBGA

672-UBGA (23x23)

MCU - 181, FPGA - 145

-40°C ~ 125°C (TJ)

Tray

Automotive, AEC-Q100, Cyclone® V SE

活跃

5CSXFC6

700MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 110K Logic Elements

--

AGFA006R24C3E4X AGFA006R24C3E4X

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

-

Tray

活跃

-

Intel

576

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 573K Logic Elements

-

AGIB027R31B2I1V AGIB027R31B2I1V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

-

Tray

活跃

-

Intel

720

-40°C ~ 100°C (TJ)

Agilex I

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.7M Logic Elements

-

XCVC1502-1LLINSVG1369 XCVC1502-1LLINSVG1369

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

1369-BFBGA

Tray

活跃

1369-BGA (35x35)

AMD 赛灵思

478

-40°C ~ 100°C (TJ)

Versal™ AI Core

400MHz, 1GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 80k Logic Cells

-

XCVM1302-1MSENSVF1369 XCVM1302-1MSENSVF1369

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

1369-BFBGA

Tray

活跃

1369-BGA (35x35)

AMD 赛灵思

316

0°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.3GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-