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类别是'嵌入式 - 片上系统（SoC）'

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数据表

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认证

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供应商器件包装

终端数量

厂商

操作温度

包装

系列

零件状态

HTS代码

子类别

技术

端子位置

终端形式

峰值回流焊温度（摄氏度）

端子间距

Reach合规守则

JESD-30代码

输出的数量

资历状况

电源

温度等级

速度

内存大小

核心处理器

周边设备

程序内存大小

连接方式

建筑学

输入数量

座位高度-最大

可编程逻辑类型

产品类别

主要属性

逻辑单元数

核数量

闪光大小

产品类别

长度

宽度
MPFS095T-1FCSG325T2 MPFS095T-1FCSG325T2

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

325-TFBGA

Tray

活跃

325-BGA (11x11)

微芯片技术

MCU - 102, FPGA - 80

-40°C ~ 125°C (TJ)

-

-

857.6KB

RISC-V

DMA, PCI, PWM

CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

128KB

XCVC1502-1LSINSVG1369 XCVC1502-1LSINSVG1369

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

1369-BFBGA

Tray

活跃

1369-BGA (35x35)

AMD 赛灵思

478

-40°C ~ 100°C (TJ)

Versal™ AI Core

400MHz, 1GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 80k Logic Cells

-

XC7Z010-1CL225I XC7Z010-1CL225I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

225-LFBGA, CSPBGA

Tray

XC7Z010

活跃

225-CSPBGA (13x13)

AMD

84

0°C ~ 85°C (TJ)

Zynq®-7000

667MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Artix™-7 FPGA, 28K Logic Cells

-

AGFB014R24B2I3V AGFB014R24B2I3V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

-

Tray

活跃

-

Intel

768

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.4M Logic Elements

-

AGFA027R31C3I3V AGFA027R31C3I3V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

-

Tray

活跃

-

Intel

720

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.7M Logic Elements

-

XCVM1302-2HSINSVF1369 XCVM1302-2HSINSVF1369

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

1369-BFBGA

Tray

活跃

1369-BGA (35x35)

AMD 赛灵思

316

-40°C ~ 100°C (TJ)

Versal™ Prime

800MHz, 1.65GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-

AGFA006R24C3I3E AGFA006R24C3I3E

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

-

Tray

活跃

-

Intel

576

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 573K Logic Elements

-

1SX065HH1F35I2VG 1SX065HH1F35I2VG

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

1152-BBGA, FCBGA

Tray

活跃

1152-FBGA (35x35)

Intel

392

-40°C ~ 100°C (TJ)

Stratix® 10 SX

1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 650K Logic Elements

-

XCVP1202-1MSEVSVA2785 XCVP1202-1MSEVSVA2785

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

2785-BFBGA

Tray

活跃

2785-BGA (50x50)

AMD

780

0°C ~ 100°C (TJ)

Versal® Premium

600MHz, 1.3GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Premium FPGA, 2M Logic Cells

-

XCZU19EG-1FFVC1760E XCZU19EG-1FFVC1760E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

1760-BBGA, FCBGA

Tray

XCZU19

活跃

1760-FCBGA (42.5x42.5)

AMD

512

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

-

1SX040HH2F35E2LG 1SX040HH2F35E2LG

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

1152-BBGA, FCBGA

Tray

活跃

1152-FBGA (35x35)

Intel

374

0°C ~ 100°C (TJ)

Stratix® 10 SX

1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 400K Logic Elements

-

XCVM1502-2LSENFVB1369 XCVM1502-2LSENFVB1369

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

XCVM1502

10AS048E4F29E3LG 10AS048E4F29E3LG

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

FBGA-780

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

480000 LE

1

SMD/SMT

60000 LAB

965300

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

BGA, BGA780,28X28,40

网格排列

PLASTIC/EPOXY

BGA780,28X28,40

0.9 V

未说明

0.87 V

100 °C

有

10AS048E4F29E3LG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.47

SoC FPGA

YES

780

360

0°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B780

360

不合格

0.9 V

OTHER

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

360

3.35 mm

现场可编程门阵列

FPGA - 480K Logic Elements

480000

2 Core

--

SoC FPGA

29 mm

29 mm

AGIB027R31B1E2V AGIB027R31B1E2V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

-

Tray

活跃

-

Intel

720

0°C ~ 100°C (TJ)

Agilex I

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.7M Logic Elements

-

AGFB012R24C2I3E AGFB012R24C2I3E

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

-

Tray

活跃

-

Intel

744

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.2M Logic Elements

-

10AS048H3F34I2SG 10AS048H3F34I2SG

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

FBGA-1152

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

480000 LE

1

SMD/SMT

60000 LAB

965065

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

SoC FPGA

492

-40°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

SOC - Systems on a Chip

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 480K Logic Elements

2 Core

--

SoC FPGA

10AS048H4F34E3LG 10AS048H4F34E3LG

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

FBGA-1152

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

480000 LE

1

SMD/SMT

60000 LAB

965353

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

0.9 V

未说明

0.87 V

100 °C

有

10AS048H4F34E3LG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.47

SoC FPGA

YES

1152

492

0°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

492

不合格

0.9 V

OTHER

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

492

3.65 mm

现场可编程门阵列

FPGA - 480K Logic Elements

480000

2 Core

--

SoC FPGA

35 mm

35 mm

XCZU19EG-1FFVC1760I XCZU19EG-1FFVC1760I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

1760-BBGA, FCBGA

Tray

XCZU19

活跃

1760-FCBGA (42.5x42.5)

AMD

512

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

-

AGFB023R25A1E1V AGFB023R25A1E1V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

-

Tray

活跃

-

Intel

480

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

-

AGIB022R31B2E2V AGIB022R31B2E2V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

-

Tray

活跃

-

Intel

720

0°C ~ 100°C (TJ)

Agilex I

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.2M Logic Elements

-

XCZU9EG-L2FFVB1156E XCZU9EG-L2FFVB1156E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

1156-BBGA, FCBGA

Bulk

XCZU9

活跃

1156-FCBGA (35x35)

AMD

328

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

-

XCVC1702-1MLIVSVA2197 XCVC1702-1MLIVSVA2197

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

活跃

AMD

Tray

*

AGFA006R24C2I3V AGFA006R24C2I3V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

-

Tray

活跃

-

Intel

576

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 573K Logic Elements

-

AGIB022R31B1E2V AGIB022R31B1E2V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

-

Tray

活跃

-

Intel

720

0°C ~ 100°C (TJ)

Agilex I

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.2M Logic Elements

-

XCZU5EG-1FBVB900I XCZU5EG-1FBVB900I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

900-BBGA, FCBGA

Tray

XCZU5

活跃

900-FCBGA (31x31)

AMD

204

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

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