类别是'嵌入式 - 片上系统（SoC）'
嵌入式 - 片上系统（SoC） (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 界面 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 程序内存大小 | 传播延迟 | 连接方式 | 建筑学 | 数据总线宽度 | 逻辑元件/单元数 | 核心架构 | 阀门数量 | 最高频率 | 边界扫描 | 速度等级 | 内存(字) | 主要属性 | 寄存器数量 | 核数量 | 总线兼容性 | 可擦除紫外线 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | ||||||||||||||||||
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 | XC7Z035-2FFG900I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 900-BBGA, FCBGA | 130 | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | 活跃 | 4 (72 Hours) | 900 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | BOTTOM | BALL | 245 | 1V | 1mm | 800MHz | 30 | S-PBGA-B900 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.05V | 950mV | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 100 ps | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | ARM | YES | 2 | Kintex™-7 FPGA, 275K Logic Cells | 343800 | 3.35mm | 31mm | 31mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z045-3FFG900E | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 130 | Copper, Silver, Tin | 900-BBGA, FCBGA | YES | ROMless | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | 活跃 | 4 (72 Hours) | 900 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 1GHz | 30 | XC7Z045 | S-PBGA-B900 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -3 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 3.35mm | 31mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | XC7Z015-2CLG485I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 484-LFBGA, CSPBGA | 485 | 485-CSBGA (19x19) | 130 | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | 活跃 | 3 (168 Hours) | 100°C | -40°C | 766MHz | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 766MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | 766MHz | Artix™-7 FPGA, 74K Logic Cells | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png) | A2F500M3G-FGG484 | Atmel (Microchip Technology) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Details | SMD/SMT | 80 MHz | - | - | 64 kB | 6000 LE | 204 I/O | 0 C | + 85 C | 有 | - | 60 | SmartFusion | FPBGA-484 | This product may require additional documentation to export from the United States. | Tray | A2F500 | 1.5 V | 16.5 mA | 512 kB | 500000 | 1 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | XC7Z030-1FBG484I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 484-BBGA, FCBGA | YES | 484 | 130 | -40°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | 活跃 | 4 (72 Hours) | 484 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1V | 1mm | 667MHz | 30 | XC7Z030 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -1 | 256000 | Kintex™-7 FPGA, 125K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 2.54mm | 23mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | XC7Z010-2CLG400E | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 400-LFBGA, CSPBGA | YES | 400 | 130 | 0°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | 活跃 | 3 (168 Hours) | 400 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 766MHz | XC7Z010 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -2 | 256000 | Artix™-7 FPGA, 28K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 1.6mm | 17mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
| A2F500M3G-FGG484I | Atmel (Microchip Technology) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SMD/SMT | 80 MHz | - | - | 64 kB | 6000 LE | 204 I/O | - 40 C | + 100 C | 有 | - | 60 | SmartFusion | 0.062696 oz | FPBGA-484 | Details | Tray | A2F500 | 1.5 V | 16.5 mA | 512 kB | 500000 | 1 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | XC7Z010-1CLG225C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 225-LFBGA, CSPBGA | YES | 225 | 86 | 0°C~85°C TJ | Tray | 2010 | Zynq®-7000 | e1 | 活跃 | 3 (168 Hours) | 225 | EAR99 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 667MHz | 30 | XC7Z010 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -1 | 256000 | Artix™-7 FPGA, 28K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 1.5mm | 13mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | XC7Z035-1FFG676I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 676-BBGA, FCBGA | 130 | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | 活跃 | 4 (72 Hours) | 676 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 未说明 | 1V | 667MHz | 未说明 | S-PBGA-B676 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.05V | 950mV | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 120 ps | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | ARM | YES | 1 | 256000 | Kintex™-7 FPGA, 275K Logic Cells | 343800 | CAN; ETHERNET; I2C; SPI; UART; USB | 3.37mm | 27mm | 27mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z045-2FFG676E | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 130 | Copper, Silver, Tin | 676-BBGA, FCBGA | YES | ROMless | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | 活跃 | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 800MHz | 30 | XC7Z045 | S-PBGA-B676 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -2 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 3.37mm | 27mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
| A2F200M3F-FGG256I | Atmel (Microchip Technology) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SMD/SMT | 80 MHz | - | - | 64 kB | 2000 LE | 117 I/O | - 40 C | + 100 C | 有 | - | 90 | SmartFusion | 0.690329 oz | FPBGA-256 | Details | Tray | A2F200 | 1.5 V | 7 mA | 256 kB | 200000 | 1 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z007S-2CLG400E | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 400-LFBGA, CSPBGA | YES | 100 | 0°C~100°C TJ | Tray | 2016 | Zynq®-7000 | e3 | yes | 活跃 | 3 (168 Hours) | 400 | Matte Tin (Sn) | 8542.31.00.01 | BOTTOM | BALL | 未说明 | 1V | 0.8mm | 未说明 | S-PBGA-B400 | 1.05V | 0.95V | 766MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 800MHz | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | YES | 256000 | Artix™-7 FPGA, 23K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 1.6mm | 17mm | 17mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z045-2FFG900E | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 130 | Copper, Silver, Tin | 900-BBGA, FCBGA | YES | ROMless | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | 活跃 | 4 (72 Hours) | 900 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 800MHz | 30 | XC7Z045 | S-PBGA-B900 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -2 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 3.35mm | 31mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | XC7Z030-1SBG485C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 484-FBGA, FCBGA | YES | 485 | 130 | 0°C~85°C TJ | Tray | 2009 | Zynq®-7000 | e1 | 活跃 | 4 (72 Hours) | 485 | EAR99 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1V | 0.8mm | 667MHz | 未说明 | 不合格 | 1.05V | 11.8V | 0.95V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | 微处理器电路 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -1 | 256000 | Kintex™-7 FPGA, 125K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | N | 2.44mm | 19mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
| XC7Z007S-1CLG225C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 225-LFBGA, CSPBGA | YES | 54 | 0°C~85°C TJ | Tray | 2016 | Zynq®-7000 | e1 | yes | 活跃 | 3 (168 Hours) | 225 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1V | 0.8mm | 30 | S-PBGA-B225 | 1.05V | 0.95V | 667MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 667MHz | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | ARM | YES | 256000 | Artix™-7 FPGA, 23K Logic Cells | CAN; ETHERNET; I2C; PCI; SPI; UART; USB | 1.5mm | 13mm | 13mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z045-1FBG676C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 130 | Copper, Silver, Tin | 676-BBGA, FCBGA | YES | 676 | ROMless | 0°C~85°C TJ | Tray | 2009 | Zynq®-7000 | e1 | 活跃 | 3 (168 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 667MHz | 30 | XC7Z045 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 3.3V | 1.2V | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | 190000 | ARM | YES | -1 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 2.54mm | 27mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
| XC7Z030-2FBG484E | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 484-BBGA, FCBGA | YES | 484 | 130 | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | 活跃 | 4 (72 Hours) | 484 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1V | 1mm | 800MHz | 30 | XC7Z030 | 1.05V | 0.95V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -2 | 256000 | Kintex™-7 FPGA, 125K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 2.54mm | 23mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
| XC7Z030-2FFG676E | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 676-BBGA, FCBGA | YES | 676 | 130 | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | 活跃 | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 800MHz | 30 | XC7Z030 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -2 | 256000 | Kintex™-7 FPGA, 125K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 3.24mm | 27mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
| M2S005-TQG144 | Atmel (Microchip Technology) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SMD/SMT | 166 MHz | - | - | 64 kB | 6060 LE | 84 I/O | 0 C | + 85 C | 191 kbit | 有 | 505 LAB | 60 | 0.035380 oz | TQFP-144 | Details | Tray | SmartFusion2 | 1.2 V | 128 kB | 1 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z045-2FBG676I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 130 | Copper, Silver, Tin | 676-BBGA, FCBGA | YES | 676 | ROMless | -40°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | 活跃 | 3 (168 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 800MHz | 30 | XC7Z045 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -2 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 2.54mm | 27mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
| XC7Z020-2CLG484E | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 484-LFBGA, CSPBGA | YES | 484 | 130 | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | 活跃 | 3 (168 Hours) | 484 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 766MHz | 30 | XC7Z020 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -2 | 256000 | Artix™-7 FPGA, 85K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 1.6mm | 19mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | XC7Z100-2FFG1156I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 1156-BBGA, FCBGA | 250 | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | 活跃 | 4 (72 Hours) | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | not_compliant | 800MHz | 30 | S-PBGA-B1156 | 1.05V | 0.95V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | 256000 | Kintex™-7 FPGA, 444K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 3.1mm | 35mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z015-3CLG485E | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 484-LFBGA, CSPBGA | 485 | 130 | 0°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | 活跃 | 3 (168 Hours) | 485 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1V | 0.8mm | 866MHz | 未说明 | 不合格 | 1.05V | 11.8V | 0.95V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | 微处理器电路 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | 256000 | Artix™-7 FPGA, 74K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | N | 1.6mm | 19mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
| M2S005S-TQG144 | Atmel (Microchip Technology) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Details | 166 MHz | - | - | 64 kB | 6060 LE | 有 | 505 LAB | 60 | This product may require additional documentation to export from the United States. | Tray | SmartFusion2 | 128 kB | 1 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z007S-1CLG400C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 400-LFBGA, CSPBGA | YES | 100 | 0°C~85°C TJ | Tray | 2016 | Zynq®-7000 | e3 | yes | 活跃 | 3 (168 Hours) | 400 | Matte Tin (Sn) | 8542.31.00.01 | BOTTOM | BALL | 未说明 | 1V | 0.8mm | 未说明 | S-PBGA-B400 | 1.05V | 0.95V | 667MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 667MHz | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | YES | 256000 | Artix™-7 FPGA, 23K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 1.6mm | 17mm | 17mm | ROHS3 Compliant |