类别是'卡边缘连接器 - 边缘板连接器'
卡边缘连接器 - 边缘板连接器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 房屋材料 | 材料 - 绝缘 | PCB安装方向 | 厂商 | 操作温度 | 包装 | 系列 | 终端 | 连接器类型 | 定位的数量 | 最高工作温度 | 最小工作温度 | 颜色 | 行数 | 性别 | 触点类型 | 螺距 | 方向 | 额定电流 | 触点表面处理 | 接头数量 | 房屋颜色 | 引线长度 | 工作电源电压 | 磁卡种类 | 读出 | 定位/湾/行数 | 法兰特性 | 弱电 | 导线/电缆规格 | 触点额定电流 | 绝缘直径 | 导线/电缆直径 | 连接器系统 | 预载 | 产品 | 安装角 | 特征 | 高度 | 触点表面处理厚度 | 磁卡厚度 | PCB厚度 | 板厚 | 辐射硬化 | 可燃性等级 | ||||||||
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 | 896-047-559-102 | EDAC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 896-047 | 活跃 | Copper Alloy | 面板安装 | Gold | Through Hole, Right Angle | Polyphenylene Sulfide (PPS) | Polyphenylene Sulfide (PPS) | EDAC Inc. | Bulk | -40°C ~ 125°C | 896 | Solder | 47 | Black | 1 | Female | Cantilever | 0.125 (3.18mm) | Gold | Non Specified - Single Edge | Single | 47 | Flush Mount, Top Opening, Unthreaded, 0.128 (3.25mm) Dia | Receptacles | 直角 | - | 10.0µin (0.25µm) | 0.054 ~ 0.070 (1.37mm ~ 1.78mm) | 1.57 mm | ||||||||||||||||||||||||||||
| 726-011-527-101 | EDAC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 726-011 | 活跃 | Copper Alloy | 通孔 | 聚酯热塑性塑料 | EDAC Inc. | Bulk | -40°C ~ 105°C | 726 | Press-Fit | 11 | Black | 1 | Female | Cantilever | 0.125 (3.18mm) | Gold | Non Specified - Single Edge | Single | 11 | - | - | 30.0µin (0.76µm) | 0.054 ~ 0.070 (1.37mm ~ 1.78mm) | ||||||||||||||||||||||||||||||||||
| 745-010-525-106 | EDAC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 745-010 | 活跃 | Copper Alloy | 压装 | Gold | 通孔 | 热塑性聚酯 | 聚酯热塑性塑料 | EDAC Inc. | Bulk | -40°C ~ 105°C | 745 | Press-Fit | 10 | Black | 1 | Female | Cantilever | 0.100 (2.54mm) | Gold | Non Specified - Single Edge | Single | 10 | - | Receptacles | Vertical | - | 30.0µin (0.76µm) | 0.054 ~ 0.070 (1.37mm ~ 1.78mm) | 1.57 mm | ||||||||||||||||||||||||||||
| G630HAA12247AEU | Amphenol | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MEC1-105-02-LM-D-NP-LC-K | Samtec | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Production (Last Updated: 1 year ago) | PRODUCTION (Last Updated: 1 year ago) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MBB-VM-10-62-30-ST | CarlisleIT | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | - | Bag | 表面贴装 | - | CarlisleIT | MBB-VM-10 | -55°C ~ 125°C | - | Solder | 20 | Black | 2 | Female | Cantilever | 0.031 (0.80mm) | Gold | Non Specified - Dual Edge | Dual | - | - | Board Guide, Solder Retention | 30.0µin (0.76µm) | 0.062 (1.57mm) | ||||||||||||||||||||||||||||||||||
| MBB-VM-30-93-30-ST | CarlisleIT | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | MBB-VM-30 | 活跃 | - | 表面贴装 | - | CarlisleIT | Bag | -55°C ~ 125°C | - | Solder | 60 | Black | 2 | Female | Cantilever | 0.031 (0.80mm) | Gold | Non Specified - Dual Edge | Dual | - | - | 电路板指南 | 30.0µin (0.76µm) | 0.093 (2.36mm) | ||||||||||||||||||||||||||||||||||
| 317-026-542-608 | EDAC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 317-026 | 活跃 | Copper Alloy | 通孔 | Diallyl Phthalate (DAP) | EDAC Inc. | Bulk | -65°C ~ 125°C | 317 | Wire Wrap | 26 | Green | 1 | Female | Cantilever with Back-Up Spring | 0.156 (3.96mm) | Gold | Non Specified - Single Edge | Single | 26 | Top Mount Opening, Threaded Insert, 4-40 | - | 10.0µin (0.25µm) | 0.054 ~ 0.070 (1.37mm ~ 1.78mm) | ||||||||||||||||||||||||||||||||||
| 7-2378762-4 | AMP | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | Copper Alloy | 表面贴装 | Plastic | TE Connectivity AMP 连接器 | Tray | -40°C ~ 85°C | PCIe Gen 5 | Solder | 164 | Black | 2 | Female | Cantilever | 0.039 (1.00mm) | Gold | PCI Express™ | Dual | 11; 71 | - | Board Guide, Locking Ramp, Solder Retention | 30.0µin (0.76µm) | 0.062 (1.57mm) | |||||||||||||||||||||||||||||||||||
| MDT180M01001 | ICC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 1-1355181-0 | TE Connectivity | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Production (Last Updated: 3 weeks ago) | Non-Compliant | Tin | PBT | 直角 | Signal | Carton | IDC | Connector, Receptacle, Socket | 10 | 110 °C | -40 °C | Natural | 1 | 2.5 mm | 直角 | 2 A | 10 | Natural | 63 V | Compliant | 22 AWG | 2 A | 1.2954 mm | 1.2954 mm | Wire-to-Board | 有 | 7.35 mm | 1.4986 mm | UL94 V-0 | ||||||||||||||||||||||||||||
| 336-023-541-608 | EDAC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 336-023 | 活跃 | Copper Alloy | 通孔 | Diallyl Phthalate (DAP) | EDAC Inc. | Bulk | -65°C ~ 125°C | 336 | Wire Wrap | 23 | Green | 1 | Female | Cantilever | 0.156 (3.96mm) | Gold | Non Specified - Single Edge | Single | 23 | Top Mount Opening, Threaded Insert, 4-40 | - | 10.0µin (0.25µm) | 0.054 ~ 0.070 (1.37mm ~ 1.78mm) | ||||||||||||||||||||||||||||||||||
| 336-028-541-809 | EDAC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 336-028 | 活跃 | Copper Alloy | 通孔 | Diallyl Phthalate (DAP) | EDAC Inc. | Bulk | -65°C ~ 125°C | 336 | Wire Wrap | 28 | Green | 2 | Female | Cantilever | 0.156 (3.96mm) | Gold | Non Specified - Dual Edge | Dual | 14 | Top Mount Opening, Unthreaded, 0.178 (4.52mm) Dia | - | 10.0µin (0.25µm) | 0.054 ~ 0.070 (1.37mm ~ 1.78mm) | ||||||||||||||||||||||||||||||||||
| 2-2371899-3 | AMP | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | Copper Alloy | 表面贴装 | Plastic | TE Connectivity AMP 连接器 | Tray | -40°C ~ 85°C | PCIe Gen 5 | Solder | 98 | Black | 2 | Female | Cantilever | 0.039 (1.00mm) | Gold | PCI Express™ | Dual | 11; 38 | - | Board Guide, Locking Ramp, Solder Retention | 30.0µin (0.76µm) | 0.062 (1.57mm) | |||||||||||||||||||||||||||||||||||
| 336-017-541-608 | EDAC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 336-017 | 活跃 | Copper Alloy | 通孔 | Diallyl Phthalate (DAP) | EDAC Inc. | Bulk | -65°C ~ 125°C | 336 | Wire Wrap | 17 | Green | 1 | Female | Cantilever | 0.156 (3.96mm) | Gold | Non Specified - Single Edge | Single | 17 | Top Mount Opening, Threaded Insert, 4-40 | - | 10.0µin (0.25µm) | 0.054 ~ 0.070 (1.37mm ~ 1.78mm) | ||||||||||||||||||||||||||||||||||
| 317-042-542-601 | EDAC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 317-042 | 活跃 | Copper Alloy | 通孔 | Diallyl Phthalate (DAP) | EDAC Inc. | Bulk | -65°C ~ 125°C | 317 | Wire Wrap | 42 | Green | 1 | Female | Cantilever with Back-Up Spring | 0.156 (3.96mm) | Gold | Non Specified - Single Edge | Single | 42 | - | - | 10.0µin (0.25µm) | 0.054 ~ 0.070 (1.37mm ~ 1.78mm) | ||||||||||||||||||||||||||||||||||
| 3-2371900-4 | AMP | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Copper Alloy | 活跃 | 表面贴装 | Thermoplastic | TE Connectivity AMP 连接器 | Tray | -40°C ~ 85°C | PCIe Gen 5 | Solder | 164 | Black | 2 | Female | Cantilever | 0.039 (1.00mm) | Gold | PCI Express™ | Dual | 11; 71 | - | Board Guide, GEN5, Pick and Place Cap, Solder Retention | Flash | 0.062 (1.57mm) | |||||||||||||||||||||||||||||||||||
| MBB-VM-30-62-30-00 | CarlisleIT | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | MBB-VM-30 | 活跃 | - | 表面贴装 | - | CarlisleIT | Bag | -55°C ~ 125°C | - | Solder | 60 | Black | 2 | Female | Cantilever | 0.031 (0.80mm) | Gold | Non Specified - Dual Edge | Dual | - | - | 电路板指南 | 30.0µin (0.76µm) | 0.062 (1.57mm) | ||||||||||||||||||||||||||||||||||
| MBB-VM-30-93-30-00 | CarlisleIT | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | MBB-VM-30 | 活跃 | - | 表面贴装 | - | CarlisleIT | Bag | -55°C ~ 125°C | - | Solder | 60 | Black | 2 | Female | Cantilever | 0.031 (0.80mm) | Gold | Non Specified - Dual Edge | Dual | - | - | 电路板指南 | 30.0µin (0.76µm) | 0.093 (2.36mm) | ||||||||||||||||||||||||||||||||||
| MBB-VM-30-62-30-ST | CarlisleIT | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | MBB-VM-30 | 活跃 | - | 表面贴装 | - | CarlisleIT | Bag | -55°C ~ 125°C | - | Solder | 60 | Black | 2 | Female | Cantilever | 0.031 (0.80mm) | Gold | Non Specified - Dual Edge | Dual | - | - | Board Guide, Solder Retention | 30.0µin (0.76µm) | 0.062 (1.57mm) | ||||||||||||||||||||||||||||||||||
| 5145236-2 | TE Connectivity | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Compliant | Gold | 通孔 | Bronze | Bulk | Solder | 146 | 1.27 mm | 146 | -2.79 mm | Compliant | 无 | ||||||||||||||||||||||||||||||||||||||||||||||
| 7-2371437-4 | AMP | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | - | 表面贴装 | - | TE Connectivity AMP 连接器 | Tray | -40°C ~ 85°C | PCIe Gen 5 | Solder | 164 | Black | 2 | Female | - | 0.039 (1.00mm) | - | PCI Express™ | Dual | 11; 71 | - | Board Guide, GEN5, Locking Ramp, Solder Retention | 30.0µin (0.76µm) | - | |||||||||||||||||||||||||||||||||||
| 307-014-458-201 | EDAC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 307-014 | 活跃 | Copper Alloy | 面板安装 | Gold | Through Hole, Right Angle | 热塑性聚酯 | 聚酯热塑性塑料 | EDAC Inc. | Bulk | -40°C ~ 105°C | 307 | Solder | 14 | Green | 2 | Female | 半波纹管 | 0.156 (3.96mm) | Tin | Non Specified - Dual Edge | Dual | 7 | - | Receptacles | 直角 | - | - | 0.054 ~ 0.070 (1.37mm ~ 1.78mm) | 1.57 mm | ||||||||||||||||||||||||||||
| 307-013-401-107 | EDAC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | 307-013 | Bulk | 面板安装 | Gold | 通孔 | 热塑性聚酯 | 聚酯热塑性塑料 | EDAC Inc. | Copper Alloy | -40°C ~ 105°C | 307 | Solder Eyelet(s) | 26 | Green | 2 | Female | 半波纹管 | 0.156 (3.96mm) | Tin | Non Specified - Dual Edge | Dual | 13 | Flush Mount, Top Opening, Threaded Insert, M3 | Receptacles | Vertical | - | - | 0.054 ~ 0.070 (1.37mm ~ 1.78mm) | 1.57 mm | ||||||||||||||||||||||||||||
| 307-012-440-204 | EDAC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 307-012 | 活跃 | Copper Alloy | 面板安装 | Gold | 通孔 | 热塑性聚酯 | 聚酯热塑性塑料 | EDAC Inc. | Bulk | -40°C ~ 105°C | 307 | Wire Wrap | 12 | Green | 2 | Female | 半波纹管 | 0.156 (3.96mm) | Tin | Non Specified - Dual Edge | Dual | 6 | Flush Mount, Top Opening, Unthreaded, 0.156 (3.96mm) Dia | Receptacles | Vertical | - | - | 0.054 ~ 0.070 (1.37mm ~ 1.78mm) | 1.57 mm |