类别是'卡边缘连接器 - 边缘板连接器'
卡边缘连接器 - 边缘板连接器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 引脚数 | 材料 | 房屋材料 | 质量 | 材料 - 绝缘 | PCB安装方向 | 底板材料 | 制造商包装标识符 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终端 | ECCN 代码 | 连接器类型 | 定位的数量 | 最高工作温度 | 最小工作温度 | 颜色 | 行数 | 性别 | 附加功能 | HTS代码 | MIL一致性 | 符合 DIN 标准 | IEC一致性 | 过滤功能 | 触点类型 | 混合接触 | 选项 | 螺距 | 触头总数 | 方向 | 深度 | Reach合规守则 | 额定电流 | 导体数量 | 参考标准 | 触点表面处理 | 电压 - 额定交流 | 可靠性 | 本体长度/直径 | PCB行数 | 螺纹距离 | 接头数量 | PCB接触图案 | 本体宽度 | UL可燃性规范 | 房屋颜色 | 引线长度 | 本体深度 | 工作电源电压 | 额定电流(信号) | 触点样式 | 触点电阻 | 磁卡种类 | 读出 | 绝缘电阻 | 定位/湾/行数 | 行间距 | 法兰特性 | 主体/外壳样式 | 弱电 | 最大额定电压(交流) | 最大额定电流 | 介电耐压 | 耐用性 | 触点表面处理 终端 | 触点图案 | 拉坯力 - 最小值 | 触点额定电流 | 端子柱长度 | 特征 | 高度 | 长度 | 宽度 | 触点表面处理厚度 | 电镀厚度 | 磁卡厚度 | 长度 - 终端 | 长度-尾部 | PCB厚度 | 板厚 | 辐射硬化 | 达到SVHC | RoHS状态 | 可燃性等级 | 无铅 | |||
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![]() | 306-012-500-102 | EDAC Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | Panel | 面板安装 | Thermoplastic | 聚酯热塑性塑料 | Copper, Nickel, Tin Alloy | -65°C~125°C | Bulk | 2010 | 306 | 活跃 | 1 (Unlimited) | Solder Eyelet(s) | EAR99 | 卡边缘连接器 | 24 | Green | 2 | Female | 8536.69.40.40 | 0.156 3.96mm | Gold | Non Specified - Dual Edge | Single | 12 | Flush Mount, Top Opening, Unthreaded, 0.128 (3.25mm) Dia | 0.062 1.57mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 306-010-520-101 | EDAC Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 通孔 | 通孔 | 聚酯热塑性塑料 | Copper, Nickel, Tin Alloy | -65°C~125°C | Bulk | 2005 | 306 | 活跃 | 1 (Unlimited) | Solder | EAR99 | 卡边缘连接器 | 20 | Green | 2 | Female | 8536.69.40.40 | 0.156 3.96mm | Gold | Non Specified - Dual Edge | Single | 10 | 0.062 1.57mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5650181-2 | TE Connectivity AMP Connectors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 36 Weeks | 磷青铜 | ACTIVE (Last Updated: 1 week ago) | Tin, Gold | 通孔 | 通孔 | Thermoplastic | Nickel | Signal | Bulk | 2005 | Standard Edge .050 | 活跃 | 1 (Unlimited) | Solder, Staggered | Connector, Receptacle, Socket | 80 | 85°C | -55°C | Brown | 2 | Female | 0.050 1.27mm | Vertical | 1A | Gold | 3.56mm | 203V | Non Specified - Dual Edge | Dual | Compliant | 1A | 电路板指南 | 13.97mm | 30.0μin 0.76μm | 760 nm | 0.062 1.57mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 346-060-558-202 | EDAC Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 铜合金 | 镍镀金 | e3 | 活跃 | EAR99 | 卡边缘连接器 | 8536.69.40.40 | 镍镀锡 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 306-022-520-102 | EDAC Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 通孔 | 通孔 | Polyester | 聚酯热塑性塑料 | Copper, Nickel, Tin Alloy | -65°C~125°C | Bulk | 2010 | 306 | yes | 活跃 | 1 (Unlimited) | Solder | EAR99 | 卡边缘连接器 | 44 | Green | 2 | Female | 8536.69.40.40 | 0.156 3.96mm | Straight | Gold | 10mOhm | Non Specified - Dual Edge | Single | 22 | Flush Mount, Top Opening, Unthreaded, 0.128 (3.25mm) Dia | 5A | 9.65mm | 95mm | 8.71mm | 0.062 1.57mm | ROHS3 Compliant | UL94 V-0 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 345-024-520-201 | EDAC Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 通孔 | 通孔 | Thermoplastic | 聚酯热塑性塑料 | Copper, Nickel, Tin Alloy | -65°C~105°C | Bulk | 2005 | 345 | 活跃 | 1 (Unlimited) | Solder | 卡边缘连接器 | 24 | Green | 2 | Female | 0.100 2.54mm | Gold | Non Specified - Dual Edge | Dual | 12 | 0.062 1.57mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CR22A-34D-2.54DS(70) | Hirose Electric Co Ltd | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 通孔 | 通孔 | Polybutylene Terephthalate (PBT) | Copper Alloy | -30°C~85°C | Tray | CR22 | e3 | 活跃 | 1 (Unlimited) | Solder | EAR99 | 卡边缘连接器 | 34 | Black | 2 | Female | POLARIZED | 8536.69.40.40 | NO | NO | NO | NO | NO | GENERAL PURPOSE | 0.100 2.54mm | 34 | unknown | Gold | 94V-0 | Non Specified - Dual Edge | Dual | 0.063 1.60mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MEC1-130-02-S-D-A-K-TR | Samtec Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | Polymer | Liquid Crystal Polymer (LCP) | 磷青铜 | -55°C~125°C | Tape & Reel (TR) | 2009 | MEC1 | 活跃 | 1 (Unlimited) | Solder | 环形波纹管 | 60 | Black | 2 | Female | POLARIZED | NO | NO | NO | NO | 环形波纹管 | NO | GENERAL PURPOSE | 0.039 1.00mm | 58 | Straight | Gold | Non Specified - Dual Edge | Dual | 300V | 2A | Board Guide, Pick and Place | 30.0μin 0.76μm | 0.062 1.57mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | HSEC8-160-01-S-DV-A-BL-K | Samtec Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | 表面贴装 | 表面贴装 | Polymer | Liquid Crystal Polymer (LCP) | 铍铜 | -55°C~125°C | Tray | 2013 | Edge Rate™ HSEC8 | e3 | 活跃 | Solder | 卡边缘连接器 | 120 | Black | 2 | Female | Cantilever | 0.031 0.80mm | Straight | Gold | Non Specified - Dual Edge | Dual | 60 | 3.1A | Board Guide, Board Lock | 30.0μin 0.76μm | 0.062 1.57mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | HSEC8-180-01-S-DV-A-BL | Samtec Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3 Weeks | 表面贴装 | 表面贴装 | Liquid Crystal Polymer (LCP) | 铍铜 | -55°C~125°C | Tray | 2013 | Edge Rate™ HSEC8 | e3 | 活跃 | Solder | EAR99 | 卡边缘连接器 | 160 | Black | 2 | Female | 8536.69.40.40 | Cantilever | 0.031 0.80mm | 160 | ONE | Gold | COMMERCIAL | 2 | 0.314 inch | 15mOhm | Non Specified - Dual Edge | Dual | 1000000000Ohm | 80 | 1000 Cycles | Board Guide, Board Lock | 30.0μin 0.76μm | 30μin | 0.062 1.57mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 395-026-520-201 | EDAC Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 通孔 | 通孔 | 聚酯热塑性塑料 | Copper, Nickel, Tin Alloy | -65°C~105°C | Bulk | 2005 | 395 | e3 | 活跃 | 1 (Unlimited) | Solder | EAR99 | 卡边缘连接器 | 26 | Black | 2 | Female | 8536.69.40.40 | 0.100 2.54mm | Gold | Non Specified - Dual Edge | Dual | 13 | 0.062 1.57mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10018784-10003TLF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Gold | 通孔 | 通孔 | Nylon | Polyamide (PA), Nylon, Glass Filled | Copper Alloy | -55°C~85°C | Tray | HPCE® | 活跃 | 1 (Unlimited) | Solder, Staggered | Cantilever | 164 | 85°C | -55°C | Black | 2 | Female | Cantilever | 0.039 1.00mm | Straight | 1.1A | Gold | 300V | 164 | Black | PCI Express™ | Dual | 1GOhm | 300V | Board Guide, Locking Ramp | 89mm | 7.4mm | 30.0μin 0.76μm | 0.062 1.57mm | 1.56mm | 符合RoHS标准 | UL94 V-0 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10018783-11111TLF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Gold | PCB, Through Hole | 通孔 | Glass, Nylon | Nylon | Polyamide (PA), Nylon, Glass Filled | Copper Alloy | -55°C~85°C | Tray | HPCE® | 活跃 | 1 (Unlimited) | Solder, Staggered | Cantilever | 64 | 85°C | -55°C | Black | 2 | Female | Cantilever | 0.039 1.00mm | Straight | 8.8mm | 1.1A | Gold | 300V | 1mm | 64 | Black | 3.1mm | 30mOhm | PCI Express™ | Dual | 1GOhm | 11; 21 | 2 mm | 300V | Board Lock, Locking Ramp | 11.25mm | 39mm | 11.25mm | 15.0μin 0.38μm | 0.062 1.57mm | 2.36mm | 2.36mm | 无SVHC | 符合RoHS标准 | UL94 V-0 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 345-020-521-201 | EDAC Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 通孔 | 通孔 | 聚酯热塑性塑料 | Copper, Nickel, Tin Alloy | -65°C~105°C | Bulk | 2010 | 345 | e3 | 活跃 | 1 (Unlimited) | Solder | EAR99 | 卡边缘连接器 | 20 | Green | 2 | Female | 8536.69.40.40 | 0.100 2.54mm | Straight | Gold | 10mOhm | Non Specified - Dual Edge | Dual | 10 | 3A | 0.062 1.57mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MM70-314B2-1-R500 | JAE Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | Gold | 表面贴装 | Surface Mount, Right Angle | 314 | Liquid Crystal Polymer (LCP), Glass Filled | MM70-314B2-1-R500 | Copper Alloy | -40°C~85°C | Tape & Reel (TR) | 2008 | MM70 | 活跃 | 1 (Unlimited) | Solder | 314 | 85°C | -40°C | Black | 2 | Female | 0.020 0.50mm | 500mA | Gold | 314 | MXM 3.0 | Dual | 4.5mm | 11.8μin 0.30μm | 0.047 1.20mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 307-024-520-201 | EDAC Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 通孔 | 通孔 | 聚酯热塑性塑料 | Copper, Nickel, Tin Alloy | -40°C~105°C | Bulk | 2012 | 307 | 活跃 | 1 (Unlimited) | Solder | 卡边缘连接器 | 24 | Green | 2 | Female | 0.156 3.96mm | Straight | Gold | 10mOhm | Non Specified - Dual Edge | Dual | 12 | 5A | 0.062 1.57mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10018783-11012TLF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | Gold | 通孔 | 通孔 | Nylon | Polyamide (PA), Nylon, Glass Filled | Copper Alloy | -55°C~85°C | Tray | HPCE® | 活跃 | 1 (Unlimited) | Solder, Staggered | Cantilever | 98 | 85°C | -55°C | Black | 2 | Female | Cantilever | 0.039 1.00mm | Straight | 1.1A | Gold | 300V | 98 | Black | PCI Express™ | Dual | 1GOhm | 300V | Board Lock, Locking Ramp | 56mm | 7.4mm | 30.0μin 0.76μm | 0.062 1.57mm | 2.36mm | 符合RoHS标准 | UL94 V-0 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EB83-S0D1260X | Vishay Dale | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | Gold | 通孔 | 通孔 | Polyester, Glass Filled | 磷青铜 | -55°C~125°C | Bulk | 2016 | EB8 | 活跃 | 不适用 | Solder | 环形波纹管 | 24 | 125°C | -55°C | Black | 2 | Female | 环形波纹管 | 0.156 3.96mm | Gold | Non Specified - Dual Edge | Dual | 12 | Flush Mount, Top Opening, Unthreaded, 0.128 (3.25mm) Dia | 0.054 ~ 0.071 1.37mm ~ 1.80mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5-6437269-2 | TE Connectivity AMP Connectors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3 Weeks | 通孔 | Through Hole, Right Angle | Thermoplastic | Thermoplastic, Glass Filled | 直角 | Copper Alloy | -40°C~100°C | Bulk | 2008 | yes | Obsolete | 不适用 | Solder | EAR99 | 卡边缘连接器 | 36 | Black | 2 | Female | NO | NO | NO | NO | NO | GENERAL PURPOSE | 0.100 2.54mm | 直角 | Gold | 18 | 94V-0 | 3.56mm | Non Specified - Dual Edge | Dual | 3.81 mm | Compliant | 0.054 ~ 0.071 1.37mm ~ 1.80mm | 符合RoHS标准 | UL94 V-0 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | HSEC8-125-01-L-DV-A-WT | Samtec Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3 Weeks | 表面贴装 | 表面贴装 | Polymer | Liquid Crystal Polymer (LCP) | 铍铜 | -55°C~125°C | Tray | Edge Rate™ HSEC8 | e3 | yes | 活跃 | Solder | 卡边缘连接器 | 50 | Black | 2 | Female | 边缘率接触 | NO | NO | NO | NO | Cantilever | NO | GENERAL PURPOSE | 0.031 0.80mm | 50 | Straight | ONE | Gold | COMMERCIAL | 2 | 0.314 inch | 15mOhm | Non Specified - Dual Edge | Dual | 1000000000Ohm | 25 | SOCKET | 1000 Cycles | Board Guide, Solder Retention | 10.0μin 0.25μm | 10μin | 0.062 1.57mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MEC8-120-02-L-DV-A-K | Samtec Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3 Weeks | 表面贴装 | 表面贴装 | Polymer | Liquid Crystal Polymer (LCP) | 磷青铜 | -55°C~125°C | Tray | 2013 | MEC8 - DV | e4 | yes | 活跃 | Solder | 卡边缘连接器 | 40 | Black | 2 | Female | PICK&PLACE PAD | NO | NO | NO | NO | 发夹式波纹管 | NO | GENERAL PURPOSE | 0.031 0.80mm | 40 | Straight | ONE | UL | Gold | COMMERCIAL | 0.937 inch | 2 | RECTANGULAR | 0.341 inch | 1.7A | 15mOhm | Non Specified - Dual Edge | Dual | 5000000000Ohm | RECEPTACLE | 265V | 630VAC V | 100 Cycles | 电路板指南 | 10.0μin 0.25μm | 10μin | 0.062 1.57mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 1-1775801-1 | TE Connectivity AMP Connectors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 磷青铜 | ACTIVE (Last Updated: 4 days ago) | Tin | 通孔 | 通孔 | Thermoplastic | 2.551457g | Polyamide (PA46), Nylon 4/6 | Vertical | Signal | -40°C~85°C | Tray | 2005 | Obsolete | 1 (Unlimited) | Solder, Staggered | 36 | 85°C | -40°C | Black | 2 | Female | 0.039 1.00mm | Vertical | 1.1A | Gold | 36 | Black | 2.3114mm | 50V | PCI Express™ | Dual | Compliant | 2.3mm | Board Lock, Locking Ramp | 10.9982mm | 25mm | 8.7884mm | Flash | 2.54μm | 0.062 1.57mm | 1.5748mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 145154-4 | TE Connectivity / AMP | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Gold | 通孔 | Thermoplastic | Bronze | Bulk | e0 | Solder | EAR99 | 卡边缘连接器 | 85°C | -55°C | White | 2 | Female | 交错配置 | 8536.69.40.40 | NO | NO | NO | NO | NO | GENERAL PURPOSE | 1.27mm | Straight | ONE | CSA | COMMERCIAL | 3.34 inch | 4 | 1.27mm | 120 | STAGGERED | 0.35 inch | 0.61 inch | 1A | 黄光型 | 30mOhm | 1000000000Ohm | RECEPTACLE | 203V | 500VAC V | 100 Cycles | RECTANGULAR | .139 N | 30μin | 1.5748mm | 0.1 inch | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 7-1734774-8 | TE Connectivity AMP Connectors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ACTIVE (Last Updated: 5 days ago) | Tin | 通孔 | 通孔 | 64 | 3.912234g | Polyamide (PA46), Nylon 4/6 | Vertical | Phosphor Bronze - Tin Plated | 2011 | 活跃 | 1 (Unlimited) | Solder, Staggered | 64 | 85°C | -40°C | White | 2 | Female | Cantilever | 0.039 1.00mm | Vertical | 1.1A | Gold | 64 | White | 2.3114mm | 50V | PCI Express™ | Dual | 2.3mm | Board Guide, Locking Ramp | 10.0076mm | 38.989mm | 8.7884mm | Flash | 2.54μm | 0.062 1.57mm | 1.5748mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10037901-11110TLF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | Gold | 通孔 | 通孔 | Nylon | Polyamide (PA), Nylon, Glass Filled | Copper Alloy | -55°C~85°C | Tray | HPCE® | 活跃 | 1 (Unlimited) | Solder, Staggered | Cantilever | 280 | 85°C | -55°C | Black | 2 | Female | Cantilever | 0.039 1.00mm | Straight | 7.5mm | 1.1A | Gold | 300V | 280 | Black | PCI Express™ | Dual | 1GOhm | 11; 38; 91 | 300V | Board Guide, Locking Ramp | 150mm | 11.25mm | 15.0μin 0.38μm | 0.062 1.57mm | 2.36mm | 符合RoHS标准 | UL94 V-0 | 无铅 |