类别是'时钟/计时 - 时钟缓冲器，驱动器'
时钟/计时 - 时钟缓冲器，驱动器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | 包装方式 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 输出量 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 输出类型 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 通道数量 | 电路数量 | 最大电源电压 | 最小电源电压 | 电源电流 | 输出电流 | 传播延迟 | 静态电流 | 接通延迟时间 | 家人 | 逻辑功能 | 最大输入电压 | 输出特性 | 无卤素 | 输入 | 比率-输入：输出 | 最大 I(ol) | 主时钟/晶体频率-名 | 差分 - 输入：输出 | Prop. Delay@Nom-Sup | 高电平输出电流 | 传播延迟(tpd) | 低水平输出电流 | 最大工作周期 | 电源电流-最大值(ICC) | fmax-Min | 同边偏斜-最大(tskwd) | 真实输出的数量 | 占空比 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |
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 | ZL40221LDF1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 32-VFQFN Exposed Pad | 32-QFN (5x5) | 750MHz | -40°C~85°C | Tape & Reel (TR) | 活跃 | 3 (168 Hours) | Fanout Buffer (Distribution), Multiplexer | 85°C | -40°C | 2.375V~3.465V | LVDS | 1 | 2 ns | CML, HCSL, LVCMOS, LVDS, LVPECL | 2:6 | Yes/Yes | 5 % | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SI5330L-B00229-GM | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 24-VFQFN Exposed Pad | YES | 24 | 350MHz | -40°C~85°C | Tray | 1997 | 活跃 | 2 (1 Year) | 24 | Fanout Buffer (Distribution), Translator | 1.71V~3.63V | QUAD | 无铅 | 260 | 1 | 2.5V | 0.5mm | 40 | SI5330 | LVDS | 24 | 4 | 2.75V | 2.25V | 1 | 10mA | 4 ns | 2.5 ns | CMOS, HSTL, LVTTL, SSTL | 1:4 | No/Yes | 60 % | 0.9mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | 8SLVP2102ANLGI/W | Renesas Electronics America Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 16-VFQFN Exposed Pad | 2GHz | -40°C~85°C | Tape & Reel (TR) | 活跃 | 3 (168 Hours) | Fanout Buffer (Distribution) | 2.375V~3.465V | IDT8SLVP2102 | LVPECL | 2 | CML, LVDS, LVPECL | 1:2 | Yes/Yes | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SY10H841ZH | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | 16 | 16-SOIC | 160MHz | 0°C~85°C | Tube | 2000 | Precision Edge® | Obsolete | 2 (1 Year) | Fanout Buffer (Distribution) | 85°C | 0°C | 4.75V~5.25V | SY10H841 | TTL | TTL | 5V | 4 | 1 | 5.25V | 4.75V | 40mA | 3.7 ns | 3.7 ns | Translator | PECL | 1:4 | Yes/Yes | -15mA | 24mA | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | PL135-37SC-R | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 40MHz | -40°C~85°C | Tape & Reel (TR) | 2012 | Discontinued | 3 (168 Hours) | 8 | EAR99 | Fanout Buffer (Distribution) | 1.62V~3.63V | DUAL | 鸥翼 | 未说明 | 1.8V | 未说明 | PL135 | LVCMOS | R-PDSO-G8 | 1 | Crystal | 1:3 | 40MHz | No/No | 4.9mm | 3.9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC10H641FNR2 | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 28-LCC (J-Lead) | 28 | 65MHz | 0°C~85°C | Tape & Reel (TR) | 2006 | e0 | Obsolete | 1 (Unlimited) | 28 | Fanout Buffer (Distribution) | Tin/Lead (Sn/Pb) | 4.75V~5.25V | QUAD | J BEND | 240 | 1 | 5V | not_compliant | 30 | MC10H641 | TTL | 28 | 不合格 | 5.25V | 5V | 4.75V | 1 | 6.27 ns | 10H | PECL | 1:9 | 0.024 A | Yes/Yes | 6.4 ns | 65 MHz | 0.35 ns | 4.57mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||
 | 8SLVP1208ANBGI/W | Renesas Electronics America Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 28-WFQFN Exposed Pad | 28-VFQFPN (5x5) | 2GHz | -40°C~85°C | Tape & Reel (TR) | 活跃 | 1 (Unlimited) | Fanout Buffer (Distribution), Multiplexer | 2.375V~3.465V | IDT8SLVP1208 | LVPECL | 1 | CML, LVDS, LVPECL | 2:8 | Yes/Yes | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | HMC724LC3TR | Analog Devices Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | PRODUCTION (Last Updated: 3 months ago) | 表面贴装 | 表面贴装 | 16-VFCQFN Exposed Pad | 16 | 14GHz | -40°C~85°C | Tape & Reel (TR) | no | 活跃 | 3 (168 Hours) | 16 | Fanout Buffer (Distribution) | -3V~-3.6V | QUAD | 无铅 | 260 | 1 | 0.5mm | 30 | HMC724 | 16 | 不合格 | -3.3V | 1 | 724 | CML | 1:2 | Yes/Yes | 0.92mm | 3mm | 3mm | ROHS3 Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SY54020ARMG-TR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 表面贴装 | 16-VFQFN Exposed Pad, 16-MLF® | 16 | 16-MLF® (3x3) | 3.2GHz | -40°C~85°C | Tape & Reel (TR) | Precision Edge® | 活跃 | 2 (1 Year) | Fanout Buffer (Distribution) | 85°C | -40°C | 2.375V~2.625V | SY54020 | CML | 8 | 2.5V | 1 | 2.625V | 2.375V | 320 ps | 84mA | CML, LVDS, LVPECL | 1:4 | Yes/Yes | 55 % | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CDCLVP111RHBT | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 5 days ago) | Gold | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad | 32 | 71.809342mg | 3.5GHz | -40°C~85°C | Tape & Reel (TR) | e4 | yes | 活跃 | 2 (1 Year) | 32 | Fanout Buffer (Distribution), Multiplexer | LVECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.8V; ALSO OPERATES AT 3.3 V SUPPLY | TR | 2.375V~3.8V | QUAD | 260 | 1 | 2.5V | CDCLVP111 | LVPECL | 32 | 10 | 3.8V | +-2.5/+-3.3V | 2.375V | 1 | 380mA | 350 ps | 350 ps | 111 | CML, LVDS, LVPECL, SSTL | 2:10 | 0.005 A | Yes/Yes | 0.35 ns | 85mA | 3500 MHz | 0.03 ns | 1mm | 5mm | 5mm | 900μm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||
.png) | SY58021UMI | Micrel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CDCL1810RGZTG4 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 5 days ago) | Gold | 表面贴装 | 表面贴装 | 48-VFQFN Exposed Pad | 48 | 138.005479mg | -40°C~85°C | Tape & Reel (TR) | e4 | yes | 活跃 | 3 (168 Hours) | 48 | Fanout Buffer (Distribution), Divider | TR | 1.7V~1.9V | QUAD | 260 | 1 | 1.8V | 0.5mm | 650MHz | CDCL1810 | CML | 48 | 10 | 1.8V | 1 | 212mA | 3 ns | 3 ns | LVDS | 1:10 | 0.008 A | Yes/Yes | 0.064 ns | 1mm | 7mm | 7mm | 900μm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||
| SY58022UMG-TR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 16-VFQFN Exposed Pad, 16-MLF® | 16 | 5.5GHz | -40°C~85°C | Tape & Reel (TR) | 2000 | Precision Edge® | e4 | 活跃 | 2 (1 Year) | 16 | Fanout Buffer (Distribution), Translator | Nickel/Palladium/Gold (Ni/Pd/Au) | CAN ALSO OPERATE WITH 3.3V SUPPLY | 2.375V~3.6V | QUAD | 无铅 | 260 | 1 | 2.5V | 0.5mm | 40 | SY58022 | LVPECL | 8 | 不合格 | 2.625V | 2.375V | 1 | 280 ps | 280 ps | CML, LVDS, LVPECL | 1:4 | Yes/Yes | 5500 MHz | 0.9mm | 3mm | 3mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||
 | 8SLVP1212ANLGI/W | Renesas Electronics America Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 40-VFQFN Exposed Pad | 2GHz | -40°C~85°C | Cut Tape (CT) | 活跃 | 3 (168 Hours) | Fanout Buffer (Distribution), Multiplexer | 2.375V~3.465V | LVPECL | 1 | CML, LVCMOS, LVDS, LVPECL | 2:12 | Yes/Yes | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SI53361-B-GMR | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 16-VFQFN Exposed Pad | 200MHz | -40°C~85°C | Tape & Reel (TR) | 活跃 | 2 (1 Year) | Fanout Buffer (Distribution), Multiplexer | 1.71V~3.63V | 1 | LVCMOS | 2:8 | No/No | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PL123-09NSI-R | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 16-SOIC (0.154, 3.90mm Width) | 16 | 134MHz | -40°C~85°C | Tape & Reel (TR) | 2012 | e3 | 活跃 | 1 (Unlimited) | 16 | Fanout Buffer (Distribution) | Matte Tin (Sn) - annealed | 1.62V~3.63V | DUAL | 鸥翼 | 260 | 1 | 1.8V | 40 | PL123 | 9 | 3.63V | 1 | 9.2 ns | 32mA | Clock | 1:9 | No/No | 0.25 ns | 60 % | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC10H641FNR2G | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 28-LCC (J-Lead) | 28 | 65MHz | 0°C~85°C | Tape & Reel (TR) | 2006 | e3 | yes | Obsolete | 3 (168 Hours) | 28 | EAR99 | Fanout Buffer (Distribution) | Tin (Sn) | 4.75V~5.25V | QUAD | J BEND | 260 | 1 | 5V | 40 | MC10H641 | TTL | 28 | 5V | 5V | 1 | 6.27 ns | 7 ns | 10H | Translator | 4.19V | 无卤素 | PECL | 1:9 | 0.024 A | Yes/Yes | 6.4 ns | -15mA | 24mA | 65 MHz | 0.35 ns | 4.57mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||||
| SI53327-B-GM | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 24-VFQFN Exposed Pad | 1.25GHz | -40°C~85°C | Tray | 2016 | yes | 活跃 | 2 (1 Year) | Fanout Buffer (Distribution), Multiplexer | 2.38V~3.63V | compliant | LVPECL | 1 | CML, HCSL, LVCMOS, LVDS, LVPECL | 2:6 | Yes/Yes | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 5PB1104CMGK | Renesas Electronics America Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 8-UFDFN | 200MHz | -40°C~85°C | Strip | 活跃 | 1 (Unlimited) | Fanout Buffer (Distribution) | 1.71V~3.465V | 1 | LVCMOS | 1:4 | No/No | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LMH2180SDX/NOPB | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 8-WFDFN Exposed Pad | 8 | 75MHz | -40°C~85°C | Tape & Reel (TR) | no | Obsolete | 1 (Unlimited) | 8 | EAR99 | Fanout Buffer (Distribution) | 2.4V~5V | DUAL | 260 | 2 | 2.7V | 0.5mm | LMH2180 | 8 | 5V | 2 | 1 | 65mA | Clock | 2:2 | No/No | 2 | 3mm | 3mm | 无 | ROHS3 Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| 2309NZ-1HDCGI | Renesas Electronics America Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 16-SOIC (0.154, 3.90mm Width) | 16-SOIC | 133.33MHz | -40°C~85°C | Tube | 活跃 | 3 (168 Hours) | Fanout Buffer (Distribution) | 3V~3.6V | IDT2309-1 | LVTTL | 1 | LVTTL | 1:9 | No/No | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PL130-09SI | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | 1MHz | -40°C~85°C | Tube | 2000 | e3 | Obsolete | 3 (168 Hours) | 8 | Buffer/Driver | Matte Tin (Sn) - annealed | IT ALSO OPERATES AT 3.3V | 2.25V~3.63V | DUAL | 鸥翼 | 1 | 2.5V | PL130 | LVDS | 3.63V | 2.25V | 1 | CMOS, LVDS, PECL, Sine Wave, TTL | 1:1 | No/Yes | 3.9mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PL133-97QC-R | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 16-WFQFN Exposed Pad | 150MHz | 0°C~70°C | Tape & Reel (TR) | 2014 | Discontinued | 3 (168 Hours) | 16 | Fanout Buffer (Distribution) | 2.25V~3.63V | QUAD | 无铅 | 1 | 2.5V | 0.5mm | PL133 | 3.63V | 2.25V | 1 | 3-STATE | LVCMOS | 1:9 | No/No | 9.2 ns | 0.25 ns | 9 | 0.8mm | 3mm | 3mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 83026BMI-01LFT | Renesas Electronics America Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8-SOIC | 350MHz | -40°C~85°C | Tape & Reel (TR) | 活跃 | 1 (Unlimited) | Fanout Buffer (Distribution) | 3.135V~3.465V | ICS83026-01 | LVCMOS, LVTTL | 1 | HCSL, LVDS, LVHSTL, LVPECL, SSTL | 1:2 | Yes/No | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SY89858UMG-TR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad, 32-MLF® | 32 | -40°C~85°C | Tape & Reel (TR) | 2000 | Precision Edge® | e4 | 活跃 | 3 (168 Hours) | 32 | Fanout Buffer (Distribution) | Nickel/Palladium/Gold (Ni/Pd/Au) | CAN ALSO OPERATE WITH 3.3V SUPPLY | 2.375V~3.6V | QUAD | 260 | 1 | 2.5V | 0.5mm | 3GHz | 40 | SY89858 | LVPECL | 16 | 2.625V | 2.375V | 1 | 380 ps | 380 ps | CML, LVDS, PECL | 1:8 | Yes/Yes | 2000 MHz | 0.03 ns | 0.9mm | 5mm | 5mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 |