类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 质量 | 终端数量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 电压 | 界面 | 内存大小 | 工作电源电流 | 端口的数量 | 电源电流 | 操作模式 | 最大电源电流 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 无卤素 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 筛选水平 | 访问时间（最大） | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 内存IC类型 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 通用闪存接口 | I2C控制字节 | 反向引脚排列 | 产品类别 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 24LC024-E/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2005 | e3 | yes | 活跃 | 3 (168 Hours) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 1.27mm | 40 | 24LC024 | 8 | 5.5V | 3/5V | 2.5V | I2C, Serial | 2Kb 256 x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 2 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY62157ELL-45ZSXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | 44 | Volatile | -40°C~85°C TA | Tray | 2006 | MoBL® | e4 | yes | 活跃 | 3 (168 Hours) | 44 | Nickel/Palladium/Gold (Ni/Pd/Au) | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 0.8mm | 45GHz | 30 | CY62157 | 44 | 5V | 5V | 5V | 8Mb 512K x 16 | 1 | 25mA | 25mA | SRAM | Parallel | 3-STATE | 16 | 45ns | 19b | 8 Mb | 0.000008A | 45 ns | COMMON | Asynchronous | 16b | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png) | 93LC56B-I/MSG | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 1 | 128 | PLASTIC/EPOXY | TSSOP8,.19 | -40 °C | 40 | 85 °C | 有 | 93LC56B-I/MSG | 2 MHz | 128 words | 5 V | TSSOP | SQUARE | Microchip Technology Inc | 活跃 | MICROCHIP TECHNOLOGY INC | 5.2 | MSOP | YES | 8 | TSSOP, TSSOP8,.19 | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | EEPROMs | CMOS | DUAL | 鸥翼 | 260 | 1 | 0.65 mm | compliant | 8 | S-PDSO-G8 | 不合格 | 5.5 V | 3/5 V | INDUSTRIAL | 2.5 V | SYNCHRONOUS | 0.002 mA | 128X16 | 1.1 mm | 16 | 0.000001 A | 2048 bit | SERIAL | EEPROM | MICROWIRE | 1000000 Write/Erase Cycles | 6 ms | 200 | SOFTWARE | 8 | 3 mm | 3 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST25VF080B-50-4C-S2AF-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | YES | 8 | Non-Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2010 | SST25 | e4 | yes | 活跃 | 3 (168 Hours) | 8 | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.7V~3.6V | DUAL | 260 | 1 | 1.27mm | 40 | SST25VF080B | 3.3V | 3.6V | 2.7V | SPI, Serial | 8Mb 1M x 8 | 50MHz | 0.03mA | FLASH | SPI | 8b | 1 | 10μs | 1b | 8 Mb | 0.00002A | SPI | 100000 Write/Erase Cycles | 100 | HARDWARE/SOFTWARE | 2.16mm | 5.275mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24LC04BT-E/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 5 | EAR99 | Matte Tin (Sn) | 2.5V~5.5V | DUAL | 260 | 1 | 1.27mm | 40 | 24LC04B | 8 | 5.5V | 3/5V | 2.5V | I2C, Serial | 4Kb 256 x 8 x 2 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 4 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010XXMR | NO | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24LC64-I/SNG | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 400 kHz | + 85 C | 5.5 V | 0.019048 oz | - 40 C | 100 | 3 mA | 2.5 V | SMD/SMT | 2-Wire, I2C | 200 Year | Microchip | 微芯片技术 | Details | SOP, SOP8,.25 | 小概要 | 1 | 8000 | PLASTIC/EPOXY | SOP8,.25 | -40 °C | 40 | 85 °C | 有 | 24LC64-I/SNG | 0.4 MHz | 8192 words | 5 V | SOP | RECTANGULAR | 活跃 | MICROCHIP TECHNOLOGY INC | 1.31 | SOIC | EEPROM | SOIC-8 | YES | 8 | 有 | Tube | 24LC64 | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | Memory & Data Storage | CMOS | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | 不合格 | 2.5 V to 5.5 V | 5.5 V | 3/5 V | INDUSTRIAL | 2.5 V | Serial (I2C) | 64 kbit | 3 mA | SYNCHRONOUS | 3 mA | 900 ns | 8 k x 8 | 1.75 mm | 8 | 0.000001 A | 65536 bit | SERIAL | EEPROM | 2.5 V to 5.5 V | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 1010DDDR | EEPROM | 1.25 mm (Min) | 4.9 mm | 3.9 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S34ML01G200BHI000 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 63-VFBGA | 63 | Non-Volatile | -40°C~85°C TA | Tray | 2014 | ML-2 | 活跃 | 3 (168 Hours) | 63 | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 1 | 3.3V | 0.8mm | 3.3V | 3.6V | 2.7V | 1Gb 128M x 8 | 30mA | 25 ns | FLASH | Parallel | 8b | 128MX8 | 8 | 28b | 1 Gb | 0.00005A | Asynchronous | 8b | 3V | NO | NO | YES | 1K | 128K | 2kB | YES | 1mm | 11mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 25LC256XT-I/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2007 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 2.5V~5.5V | DUAL | 260 | 1 | 4.5V | 0.65mm | 40 | 25LC256 | 8 | 5V | SPI, Serial | 256Kb 32K x 8 | 6mA | 10MHz | 50 ns | EEPROM | SPI | 8 | 5ms | 256 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1.1mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT93C66B-XHM-B | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2010 | e4 | yes | 活跃 | 1 (Unlimited) | 8 | Nickel/Palladium/Gold (Ni/Pd/Au) | ALSO OPERATES WITH 1.7V-5.5V AND 2.5V-5.5V SUPPLY | 1.7V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | AT93C66B | 5.5V | 4.5V | Serial | 4Kb 512 x 8 256 x 16 | 2mA | 2MHz | EEPROM | SPI | 256X16 | 5ms | 4 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 5ms | 100 | SOFTWARE | 1.05mm | 4.5mm | 3.1mm | 无 | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT28C010E-15JU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 22 Weeks | Tin | 表面贴装 | 表面贴装 | 32-LCC (J-Lead) | 32 | Non-Volatile | -40°C~85°C TC | Tube | 1997 | e3 | yes | 活跃 | 2 (1 Year) | 32 | 4.5V~5.5V | QUAD | 245 | 1 | 5V | 1.27mm | 40 | AT28C010 | 不合格 | 5V | 5V | 1Mb 128K x 8 | 40mA | ASYNCHRONOUS | 150ns | EEPROM | Parallel | 128KX8 | 8 | 10ms | 1 Mb | 0.0002A | 5V | 10000 Write/Erase Cycles | 10ms | YES | YES | NO | 128words | 3.556mm | 13.97mm | 11.43mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 93C76AT-I/OT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | SOT-23-6 | 6 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2008 | e3 | yes | 活跃 | 1 (Unlimited) | 6 | Matte Tin (Sn) | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 0.95mm | 40 | 93C76A | 6 | 5V | 5V | Serial | 8Kb 1K x 8 | 3mA | 3MHz | 100 ns | EEPROM | SPI | 1KX8 | 8 | 2ms | 8 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 2ms | 200 | SOFTWARE | 1.45mm | 2.95mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST39VF1601-70-4I-EKE-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | YES | 48 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2000 | SST39 MPF™ | e3 | 活跃 | 3 (168 Hours) | 48 | Matte Tin (Sn) - annealed | 2.7V~3.6V | DUAL | 0.5mm | SST39VF1601 | 3.3V | 16Mb 1M x 16 | 18mA | 70ns | FLASH | Parallel | 16b | 1MX16 | 16 | 10μs | 20b | 16 Mb | 0.00002A | Asynchronous | 16b | YES | YES | YES | 512 | 2K | BOTTOM | YES | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 93AA56A-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2004 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.8V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 93AA56A | 8 | 5.5V | 2/5V | Serial | 2Kb 256 x 8 | 2mA | 2MHz | 250 ns | EEPROM | SPI | 6ms | 2 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 6ms | 200 | SOFTWARE | 1.5mm | 4.9mm | 3.9mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M34E04-FMC9TG | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | ACTIVE (Last Updated: 7 months ago) | Gold | 表面贴装 | 表面贴装 | 8-UFDFN Exposed Pad | 8 | Non-Volatile | 0°C~95°C TA | Tape & Reel (TR) | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.7V~3.6V | DUAL | 1 | 2.2V | 0.5mm | M34E04 | 3.6V | 1.7V | 2-Wire, I2C, Serial | 4Kb 512 x 8 | 1mA | 1MHz | 350 ns | EEPROM | I2C | 8 | 5ms | 4 kb | 3V | 5ms | 0.6mm | 3mm | 2mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT24CS02-STUM-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | SOT-23-5 Thin, TSOT-23-5 | 5 | Non-Volatile | -40°C~85°C TA | Cut Tape (CT) | 2005 | yes | 活跃 | 1 (Unlimited) | 1.7V~5.5V | AT24CS02 | 2-Wire, I2C, Serial | 2Kb 256 x 8 | 3mA | 1MHz | 550ns | EEPROM | I2C | 5ms | 2 kb | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CAT25256HU4I-GT3 | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Industrial grade | ACTIVE (Last Updated: 12 hours ago) | Gold | 表面贴装 | 表面贴装 | 8-UFDFN Exposed Pad | 8 | 9.49709mg | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2008 | e4 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 100 YEAR DATA RETENTION | 1.8V~5.5V | DUAL | 未说明 | 1 | 5V | 0.5mm | 未说明 | 8 | 不合格 | 5.5V | 2/5V | SPI, Serial | 256Kb 32K x 8 | SYNCHRONOUS | 4mA | 10MHz | 40 ns | EEPROM | SPI | 无卤素 | 8 | 5ms | 256 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE/SOFTWARE | 0.55mm | 3mm | 2mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST39LF800A-55-4C-B3KE | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 48-TFBGA | YES | 48 | Non-Volatile | 0°C~70°C TA | Tray | 2000 | SST39 MPF™ | e1 | yes | 活跃 | 3 (168 Hours) | 48 | 3A991.B.1.A | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.32.00.51 | 3V~3.6V | BOTTOM | 260 | 1 | 3.3V | 40 | SST39LF800A | 48 | 3.3V | 3.6V | 3V | 8Mb 512K x 16 | 30mA | 30mA | 55ns | FLASH | Parallel | 16b | 512KX16 | 20μs | 19b | 8 Mb | 0.00002A | Asynchronous | 16b | 3V | YES | YES | YES | 256 | 2K | YES | 750μm | 8mm | 6mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT24CS02-MAHM-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 8-UFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Cut Tape (CT) | 2005 | yes | 活跃 | 3 (168 Hours) | 1.7V~5.5V | AT24CS02 | 2-Wire, I2C, Serial | 2Kb 256 x 8 | 3mA | 1MHz | 550ns | EEPROM | I2C | 5ms | 2 kb | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C185-20PXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 通孔 | 28-DIP (0.300, 7.62mm) | 28 | 4.190003g | Volatile | 0°C~70°C TA | Tube | 1996 | e4 | yes | Obsolete | 3 (168 Hours) | 28 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 4.5V~5.5V | DUAL | 1 | 5V | 2.54mm | CY7C185 | 28 | 5V | 5V | 64Kb 8K x 8 | 1 | 110mA | 110mA | SRAM | Parallel | 8KX8 | 3-STATE | 20ns | 13b | 64 kb | 20 ns | COMMON | Asynchronous | 8b | 3.55mm | 36.19mm | 7.11mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | IS62WV5128BLL-55HLI | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Industrial grade | 表面贴装 | 表面贴装 | 32-TFSOP (0.465, 11.80mm Width) | 32 | Volatile | -40°C~85°C TA | Tray | e3 | yes | 活跃 | 3 (168 Hours) | 32 | Matte Tin (Sn) - annealed | 2.5V~3.6V | DUAL | 260 | 1 | 2.8V | 0.5mm | 40 | 32 | 3.3V | 3.6V | 2.5V | 4Mb 512K x 8 | 1 | 45mA | SRAM | Parallel | 3-STATE | 55ns | 19b | 4 Mb | 18MHz | 55 ns | COMMON | Asynchronous | 8b | 1.05mm | 11.9mm | 8.1mm | 无 | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | FM25CL64B-GATR | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Automotive grade | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2008 | F-RAM™ | e4 | Obsolete | 3 (168 Hours) | 8 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 3V~3.6V | DUAL | 260 | 1 | 3.3V | 1.27mm | 30 | FM25CL64 | 8 | 3.3V | 3.6V | 3V | SPI, Serial | 64Kb 8K x 8 | 3mA | 16MHz | 25 ns | FRAM | SPI | 8b | 8 | 64 kb | 0.000006A | AEC-Q100 | 8b | 1.75mm | 4.9mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | W25Q64FWSSIQ | Winbond Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tube | 2016 | SpiFlash® | 活跃 | 3 (168 Hours) | 8 | 1.65V~1.95V | DUAL | 未说明 | 1 | 1.8V | 1.27mm | 未说明 | S-PDSO-G8 | 1.95V | 1.65V | SPI, Serial | 64Mb 8M x 8 | SYNCHRONOUS | 104MHz | FLASH | SPI | 64MX1 | 1 | 5ms | 67108864 bit | 1.8V | 2.16mm | 5.28mm | 5.28mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LE2464CXATBG | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | Industrial grade | ACTIVE (Last Updated: 1 day ago) | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 6-XFBGA, WLCSP | 6 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2006 | e1 | yes | 活跃 | 1 (Unlimited) | 6 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.7V~3.6V | BOTTOM | 1 | 2.5V | 0.4mm | 6 | 1.7V | 2-Wire, I2C, Serial | 64Kb 8K x 8 | 400kHz | 900ns | EEPROM | I2C | 8KX8 | 8 | 5ms | 64 kb | I2C | 5ms | 0.33mm | 1.2mm | 0.8mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST49LF016C-33-4C-WHE | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 32-TFSOP (0.488, 12.40mm Width) | YES | 32 | Non-Volatile | 0°C~85°C TA | Tray | 2000 | SST49 | e3 | yes | Obsolete | 3 (168 Hours) | 32 | EAR99 | 哑光锡 | 3V~3.6V | DUAL | 260 | 1 | 3.3V | 0.5mm | 40 | SST49LF016C | 32 | 3.3V | 3.6V | 3V | Parallel, SPI, Serial | 16Mb 2M x 8 | 18mA | 18mA | 33MHz | 11 ns | FLASH | Parallel | 8b | 2MX8 | 10μs | 4b | 16 Mb | 0.0001A | Synchronous | 8b | 3V | NO | NO | 12131 | 128B | YES | TOP | 1.05mm | 12.5mm | 8.1mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 25AA256-E/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | Non-Volatile | -40°C~125°C TA | Tube | 2013 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 8542.32.00.51 | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 40 | 25AA256 | 8 | R-PDSO-G8 | 不合格 | 5.5V | 2/5V | 1.8V | SPI, Serial | 256Kb 32K x 8 | SYNCHRONOUS | 10MHz | 50 ns | EEPROM | SPI | 32KX8 | 8 | 5ms | 0.000001A | 262144 bit | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant |