类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 制造商包装标识符 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 工作电源电流 | 端口的数量 | 电源电流 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 筛选水平 | 访问时间（最大） | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 输出启用 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 环境温度范围高 | 通用闪存接口 | I2C控制字节 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||
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 | S25FL128SAGMFI000 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | Tin | 表面贴装 | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | 16 | 16-SOIC | Non-Volatile | -40°C~85°C TA | Tray | 2013 | FL-S | 活跃 | 3 (168 Hours) | 85°C | -40°C | 2.7V~3.6V | 133MHz | SPI, Serial | 3.6V | 2.7V | 128Mb 16M x 8 | 75mA | 133MHz | 8 ns | FLASH | SPI - Quad I/O | 8b | 1b | 128 Mb | 133MHz | Synchronous | 1b | 2.55mm | 10.3mm | 7.5mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S25FL256SAGNFI001 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | Tin | 表面贴装 | 表面贴装 | 8-WDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2013 | FL-S | 活跃 | 3 (168 Hours) | 8 | 3A991.B.1.A | IT ALSO CONFIGURED AS 256M X 1 | 2.7V~3.6V | DUAL | 1 | 3V | 1.27mm | 3.6V | 3/3.3V | 2.7V | SPI | 256Mb 32M x 8 | 75mA | 133MHz | 8 ns | FLASH | SPI - Quad I/O | 8b | 64MX4 | 4 | 1b | 256 Mb | 0.0001A | SERIAL | Synchronous | 1b | 3V | SPI | 100000 Write/Erase Cycles | 500ms | 20 | HARDWARE/SOFTWARE | 2 | 85°C | 800μm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT24C1024BW-SH25-B | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | 8 | 8-SOIC | Non-Volatile | -40°C~85°C TA | Tube | 1997 | Obsolete | 1 (Unlimited) | SMD/SMT | 85°C | -40°C | 2.5V~5.5V | 1MHz | AT24C1024 | 2-Wire, I2C, Serial | 5.5V | 2.5V | 1Mb 128K x 8 | 3mA | 1MHz | 550ns | EEPROM | I2C | 5ms | 1 Mb | 1MHz | 1.91mm | 5.35mm | 5.4mm | 无 | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT93C46DY6-YH-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Gold, Tin | 表面贴装 | 表面贴装 | 8-UFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 1997 | e4 | yes | 活跃 | 3 (168 Hours) | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~5.5V | 260 | 40 | AT93C46 | 5V | Serial | 1Kb 128 x 8 64 x 16 | 2mA | 2MHz | EEPROM | SPI | 5ms | 1 kb | MICROWIRE | 1000000 Write/Erase Cycles | 100 | SOFTWARE | 660μm | 2mm | 1.5mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M34E02-FDW6TP | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | e4 | 活跃 | 1 (Unlimited) | 8 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.7V~5.5V | DUAL | 1 | 1.8V | 0.65mm | M34E02 | 3.6V | 5.5V | 1.7V | 2-Wire, I2C, Serial | 2Kb 256 x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 2 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE/SOFTWARE | 1010DDDR | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24C02CT/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Gold | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2008 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | 24C02C | 8 | 5V | 5V | I2C, Serial | 2Kb 256 x 8 | 3mA | 400kHz | 3500ns | EEPROM | I2C | 8 | 1.5ms | 2 kb | 0.00005A | I2C | 1000000 Write/Erase Cycles | 1ms | 200 | HARDWARE | 1010DDDR | 1.1mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST39VF3202B-70-4C-EKE | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | YES | 48 | Non-Volatile | 0°C~70°C TA | Tray | 2000 | SST39 MPF™ | e3 | yes | 活跃 | 3 (168 Hours) | 48 | 3A991.B.1.A | Matte Tin (Sn) - annealed | TOP BOOT BLOCK | 8542.32.00.51 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 0.5mm | 40 | SST39VF3202 | 48 | 3.3V | 3.6V | 2.7V | 32Mb 2M x 16 | 15mA | 70ns | FLASH | Parallel | 16b | 2MX16 | 16 | 10μs | 21b | 32 Mb | 0.00002A | Asynchronous | 16b | 2.7V | YES | YES | YES | 1K | 2K | TOP | YES | 1.2mm | 18.4mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
 | 25LC160BT-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2007 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 25LC160B | 8 | 5.5V | 3/5V | 2.5V | SPI, Serial | 16Kb 2K x 8 | 6mA | 10MHz | 100 ns | EEPROM | SPI | 8 | 5ms | 16 kb | 0.000005A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 93AA56A-I/MS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | SMD/SMT | EAR99 | 1.8V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | 93AA56A | 8 | 5.5V | 2/5V | Serial | 2Kb 256 x 8 | 2mA | 2MHz | 250 ns | EEPROM | SPI | 6ms | 2 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 6ms | 200 | SOFTWARE | 950μm | 3mm | 3mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT28C256-25DM/883 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 23 Weeks | Military grade | 通孔 | 通孔 | 28-CDIP (0.600, 15.24mm) | 28 | Non-Volatile | -55°C~125°C TC | Tube | 活跃 | 1 (Unlimited) | 28 | 4.5V~5.5V | DUAL | 1 | 5V | 2.54mm | 250GHz | AT28C256 | 5V | Parallel, SPI | 256Kb 32K x 8 | 50mA | 250ns | EEPROM | Parallel | 32KX8 | 8 | 10ms | 256 kb | MIL-STD-883 Class C | 5V | 10ms | 5.72mm | 37.215mm | 15.24mm | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 93C56B-E/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2003 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | 1000K ERASE/WRITE CYCLES; DATA RETENTION > 200 YEARS | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 93C56B | 8 | 5V | 5V | Serial | 2Kb 128 x 16 | 2mA | 2MHz | 250 ns | EEPROM | SPI | 16 | 2ms | 2 kb | 0.000005A | MICROWIRE | 1000000 Write/Erase Cycles | 2ms | 200 | SOFTWARE | 8 | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24LC32AT-E/MNY | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Gold | 表面贴装 | 表面贴装 | 8-WFDFN Exposed Pad | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2010 | e4 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 0.5mm | 40 | 24LC32A | 8 | 5V | I2C, Serial | 32Kb 4K x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 32 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 3mm | 2mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 93LC86C-E/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2008 | e3 | yes | 活跃 | 3 (168 Hours) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 3V | 1.27mm | 40 | 93LC86C | 8 | 5.5V | 3/5V | 2.5V | Serial | 16Kb 2K x 8 1K x 16 | 3mA | 3MHz | 100 ns | EEPROM | SPI | 1KX16 | 16 | 5ms | 16 kb | 0.000005A | MICROWIRE | 1000000 Write/Erase Cycles | 6ms | 200 | HARDWARE/SOFTWARE | 8 | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | BR24L04FVM-WTR | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Tin | 表面贴装 | 表面贴装 | 8-VSSOP, 8-MSOP (0.110, 2.80mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2005 | e2 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 10 | BR24L04 | 8 | 5V | 2-Wire, I2C, Serial | 4Kb 512 x 8 | 2mA | 400kHz | 900 ns | EEPROM | I2C | 5ms | 4 kb | 0.000002A | I2C | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 1010DDMR | 750μm | 2.9mm | 2.8mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 93LC86T/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2004 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~6.0V | DUAL | 260 | 1 | 3V | 1.27mm | 40 | 93LC86 | 8 | 6V | 3/5V | 2.5V | Serial | 16Kb 2K x 8 1K x 16 | 3mA | 3MHz | 3 μs | EEPROM | SPI | 1KX16 | 16 | 5ms | 16 kb | 0.00003A | MICROWIRE | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 8 | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| 23LCV1024T-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2012 | e3 | 活跃 | 1 (Unlimited) | 8 | Matte Tin (Sn) - annealed | 2.5V~5.5V | 260 | 1 | 1.27mm | 40 | 23LCV1024 | R-PDSO-G8 | 不合格 | 5.5V | 3/5V | 2.5V | SPI, Serial | 1Mb 128K x 8 | 1, (3 LINE) | SYNCHRONOUS | 20MHz | NVSRAM | SPI - Dual I/O | 128KX8 | 3-STATE | 8 | 0.00001A | 1048576 bit | SEPARATE | 2.5V | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AT25040B-XHL-B | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 1997 | e4 | yes | 活跃 | 3 (168 Hours) | 8 | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | AT25040 | 5.5V | 2/5V | SPI, Serial | 4Kb 512 x 8 | 10mA | 20MHz | 80 ns | EEPROM | SPI | 5ms | 4 kb | 5e-7A | SPI | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE/SOFTWARE | 1.5mm | 3.1mm | 4.5mm | 无 | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | BR24T64FJ-WE2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2013 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | Matte Tin (Sn) | 1.6V~5.5V | DUAL | 225 | 1 | 2.5V | 1.27mm | 未说明 | BR24T64 | 不合格 | 5.5V | 1.6V | 2-Wire, I2C, Serial | 64Kb 8K x 8 | SYNCHRONOUS | 400kHz | 900 ns | EEPROM | I2C | 8 | 5ms | 64 kb | 0.000002A | I2C | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 1010DDDR | 1.65mm | 4.9mm | 3.9mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M48Z58Y-70MH1F | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 26 Weeks | Commercial grade | 表面贴装 | 表面贴装 | 28-SOP (0.350, 8.89mm Width) with SNAPHAT Sockets | 28 | Non-Volatile | 0°C~70°C TA | Tape & Reel (TR) | e3 | 活跃 | 3 (168 Hours) | 28 | EAR99 | Tin (Sn) | 8542.32.00.41 | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 70GHz | 30 | M48Z58 | 28 | 5V | 5V | 64Kb 8K x 8 | 50mA | NVSRAM | Parallel | 8b | 8KX8 | 8 | 70ns | 64 kb | 0.003A | 70 ns | 8b | 3.05mm | 18.1mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1303BV25-167BZC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 165-LBGA | 165 | Volatile | 0°C~70°C TA | Tray | 2004 | e0 | no | Obsolete | 3 (168 Hours) | 165 | Tin/Lead (Sn/Pb) | 流水线结构 | 2.4V~2.6V | BOTTOM | 220 | 1 | 2.5V | 1mm | CY7C1303 | 165 | 2.5V | 18Mb 1M x 18 | 2 | 500mA | 167MHz | 2.5 ns | SRAM | Parallel | 1MX18 | 3-STATE | 18 | 19b | 18 Mb | SEPARATE | Synchronous | 18b | 1.4mm | 15mm | 无 | Non-RoHS Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 93LC66B/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | 0°C~70°C TA | Tube | 2000 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS | 2.5V~5.5V | DUAL | 260 | 1 | 3V | 0.65mm | 40 | 93LC66B | 8 | 5.5V | 6V | 3/5V | 2.5V | 2-Wire, Serial | 4Kb 256 x 16 | 1.5mA | 2MHz | 6 ms | EEPROM | SPI | 256X16 | 16 | 4 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 200 | SOFTWARE | 1.1mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PC28F00AM29EWHA | Micron Technology Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 64-LBGA | YES | 64 | Non-Volatile | -40°C~85°C TA | Tray | 2012 | e1 | yes | Obsolete | 3 (168 Hours) | 64 | 3A991.B.1.A | 锡银铜 | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 260 | 1 | 3V | 30 | 28F00AM29EW | 64 | 3/3.3V | 2.7V | 1Gb 128M x 8 64M x 16 | 31mA | FLASH | Parallel | 100ns | 1 Gb | 0.00024A | 100 ns | Asynchronous | YES | YES | YES | 1K | 128K | 16/32words | YES | YES | 1.4mm | 11mm | 13mm | 无 | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST39SF010A-55-4I-NHE-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 32-LCC (J-Lead) | 32 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2010 | SST39 MPF™ | e3 | 活跃 | 3 (168 Hours) | 32 | Matte Tin (Sn) | 4.5V~5.5V | QUAD | 245 | 1 | 5V | 1.27mm | 40 | SST39SF010A | 不合格 | 5V | 5V | 1Mb 128K x 8 | 25mA | 55ns | FLASH | Parallel | 8b | 128KX8 | 8 | 20μs | 17b | 1 Mb | 0.0001A | Asynchronous | 8b | 5V | YES | YES | YES | 32 | 4K | 3.556mm | 13.97mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M48Z35Y-70PC1 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 25 Weeks | Commercial grade | ACTIVE (Last Updated: 7 months ago) | 通孔 | 通孔 | 28-DIP Module (0.600, 15.24mm) | 28 | 电池 CAPHAT | Non-Volatile | 0°C~70°C TA | Tube | e3 | 活跃 | 1 (Unlimited) | 28 | EAR99 | Matte Tin (Sn) | 8542.32.00.41 | 4.5V~5.5V | DUAL | 1 | 5V | 2.54mm | 70GHz | M48Z35 | 28 | 5V | 5V | 256Kb 32K x 8 | 50mA | 1 | 50mA | NVSRAM | Parallel | 8b | 32KX8 | 3-STATE | 70ns | 256 kb | 0.003A | 70 ns | 8b | YES | 8.89mm | 39.88mm | 18.34mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST26VF064B-104I/SO | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Tin | 表面贴装 | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | 16 | Non-Volatile | -40°C~85°C TA | Tube | 2013 | SST26 SQI® | e3 | 活跃 | 1 (Unlimited) | 16 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 1.27mm | 40 | SST26VF064 | 不合格 | 3.3V | 3.6V | 2.7V | SPI, Serial | 64Mb 8M x 8 | SYNCHRONOUS | 104MHz | 0.025mA | 8 ns | FLASH | SPI - Quad I/O | 64MX1 | 1.5ms | 64 Mb | 0.000045A | 3V | SPI | 100000 Write/Erase Cycles | 100 | HARDWARE/SOFTWARE | 256B | BOTTOM/TOP | 2.05mm | 10.3mm | 7.5mm | ROHS3 Compliant |