类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 电压 | 界面 | 内存大小 | 端口的数量 | 电源电流 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 访问时间（最大） | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 准备就绪/忙碌 | 引导模块 | 环境温度范围高 | 通用闪存接口 | I2C控制字节 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||
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 | BR24G512FJ-3AGTE2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Industrial grade | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 1999 | 活跃 | 1 (Unlimited) | 8 | 1.7V~5.5V | DUAL | 未说明 | 1 | 2.5V | 1.27mm | 未说明 | BR24G512 | 5.5V | 1.7V | 2-Wire, I2C, Serial | 512Kb 64K x 8 | SYNCHRONOUS | 1MHz | EEPROM | I2C | 8 | 5ms | I2C | 5ms | 1.65mm | 4.9mm | 3.9mm | Unknown | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT25040B-MAHL-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 8-UFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 1997 | e4 | yes | 活跃 | 3 (168 Hours) | 8 | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~5.5V | DUAL | 260 | 1 | 5V | 0.5mm | 40 | AT25040 | 5.5V | 2/5V | SPI, Serial | 4Kb 512 x 8 | 10mA | 20MHz | 80 ns | EEPROM | SPI | 8 | 5ms | 4 kb | 5e-7A | SPI | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE/SOFTWARE | 0.6mm | 3mm | 2mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
| AT24C16D-MAHM-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1 Weeks | 表面贴装 | 8-UFDFN Exposed Pad | YES | Non-Volatile | -40°C~85°C TC | Tape & Reel (TR) | 1997 | e4 | yes | 活跃 | 3 (168 Hours) | 8 | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.7V~3.6V | DUAL | 260 | 1 | 1.8V | 0.5mm | 40 | AT24C16D | R-PDSO-N8 | 不合格 | 3.6V | 1.8/3.3V | 1.7V | 2-Wire, I2C, Serial | 16Kb 2K x 8 | SYNCHRONOUS | 1MHz | 450ns | EEPROM | I2C | 2KX8 | 8 | 5ms | 4e-7A | 16384 bit | I2C | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE | 1010MMMR | 0.6mm | 3mm | 2mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | M95640-DFMN6TP | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | Industrial grade | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | e4 | 活跃 | 1 (Unlimited) | 8 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | ALSO OPERATES 1.7 V SUPPLY AT 5MHZ | 1.7V~5.5V | DUAL | 1 | 5V | 1.27mm | M95640 | 8 | 5.5V | 4.5V | SPI, Serial | 64Kb 8K x 8 | 20MHz | 20 ns | EEPROM | SPI | 5ms | 64 kb | SPI | 5ms | 1.5mm | 5mm | 4mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24AA025UIDT-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Automotive grade | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2002 | e3 | 活跃 | 1 (Unlimited) | 8 | Matte Tin (Sn) - annealed | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 40 | 24AA025UID | 5.5V | 1.7V | 2-Wire, I2C, Serial | 2Kb 128 x 8 x 2 | 3mA | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 2 kb | TS 16949 | I2C | 5ms | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
| 93LC56AT/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2000 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS | 2.5V~5.5V | DUAL | 260 | 1 | 3V | 1.27mm | 40 | 93LC56A | 8 | 6V | 3/5V | 2.5V | 2-Wire, Serial | 2Kb 256 x 8 | 500μA | 2MHz | 6 ms | EEPROM | SPI | 8 | 2 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 200 | SOFTWARE | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||
 | 93AA46CT-I/MC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-VFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2008 | e3 | yes | 活跃 | 3 (168 Hours) | 8 | SMD/SMT | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 0.5mm | 40 | 93AA46C | 8 | 5V | Serial | 1Kb 128 x 8 64 x 16 | 2mA | 3MHz | 200 ns | EEPROM | SPI | 64X16 | 16 | 6ms | 1 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 6ms | 200 | SOFTWARE | 8 | 1mm | 3mm | 2mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||
| 25C160T-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2004 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | Matte Tin (Sn) | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 25C160 | 8 | 5V | 5V | SPI, Serial | 16Kb 2K x 8 | 5mA | 3MHz | 150 ns | EEPROM | SPI | 8 | 5ms | 16 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1.75mm | 4.9mm | 3.91mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
 | CY62128EV30LL-45ZXIT | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 32-TFSOP (0.465, 11.80mm Width) | 32 | Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2003 | MoBL® | e3 | yes | 活跃 | 3 (168 Hours) | 32 | EAR99 | Matte Tin (Sn) | 2.2V~3.6V | DUAL | 260 | 1 | 3V | 0.5mm | 45GHz | 30 | CY62128 | 3V | 3.6V | 2.2V | 1Mb 128K x 8 | 1 | 16mA | SRAM | Parallel | 3-STATE | 8 | 45ns | 17b | 1 Mb | 0.000003A | 45 ns | COMMON | Asynchronous | 8b | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||
 | CY14V101LA-BA45XI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 48-TFBGA | 48 | Non-Volatile | -40°C~85°C TA | Tray | 2009 | e1 | 活跃 | 3 (168 Hours) | 48 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.32.00.41 | 2.7V~3.6V | BOTTOM | 260 | 1 | 3.3V | 0.75mm | 30 | CY14V101 | 48 | 3.3V | 3.6V | 3V | 1Mb 128K x 8 | 52mA | NVSRAM | Parallel | 8b | 128KX8 | 8 | 45ns | 1 Mb | 0.008A | 45 ns | 8b | 1.2mm | 10mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
| BR24G128FJ-3GTE2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 1999 | 活跃 | 1 (Unlimited) | 8 | SEATED HT-CALCULATED | 1.6V~5.5V | DUAL | 未说明 | 1 | 2.5V | 1.27mm | 未说明 | BR24G128 | 不合格 | 5.5V | 1.6V | 2-Wire, I2C, Serial | 128Kb 16K x 8 | SYNCHRONOUS | 400kHz | EEPROM | I2C | 8 | 5ms | 0.000002A | 131072 bit | I2C | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 1010DDDR | 1.65mm | 4.9mm | 3.9mm | Unknown | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
| 24C02CT/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Gold | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2005 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 24C02C | 8 | 5V | 5V | I2C, Serial | 2Kb 256 x 8 | 3mA | 400kHz | 3500ns | EEPROM | I2C | 8 | 1.5ms | 2 kb | 0.00005A | I2C | 1000000 Write/Erase Cycles | 1ms | 200 | HARDWARE | 1010DDDR | 1.75mm | 4.9mm | 3.91mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||
 | M95M01-DWDW3TP/K | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | Automotive grade | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | YES | 8 | Non-Volatile | -40°C~125°C TA | Cut Tape (CT) | Automotive, AEC-Q100 | e4 | 活跃 | 1 (Unlimited) | 8 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.5V~5.5V | DUAL | 1 | 0.65mm | M95M01 | 5.5V | 3/5V | 2.5V | SPI, Serial | 1Mb 128K x 8 | 16MHz | 25 ns | EEPROM | SPI | 8 | 4ms | 1 Mb | 0.000002A | SPI | 4000000 Write/Erase Cycles | 4ms | 40 | HARDWARE/SOFTWARE | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
 | W25Q128FVFIG | Winbond Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | 16 | Non-Volatile | -40°C~85°C TA | Tube | 2012 | SpiFlash® | e3 | Discontinued | 3 (168 Hours) | 16 | 3A991.B.1.A | Matte Tin (Sn) | 8542.32.00.51 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 1.27mm | 16 | 3.6V | 3/3.3V | 2.7V | SPI | 128Mb 16M x 8 | 20mA | 104MHz | 7 ns | FLASH | SPI - Quad I/O, QPI | 128MX1 | 1 | 50μs, 3ms | 24b | 128 Mb | 0.00002A | SERIAL | Synchronous | 8b | 3V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 85°C | 2.64mm | 10.31mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||
 | SST25VF040B-50-4C-S2AF-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3 Weeks | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | YES | 8 | Non-Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2010 | SST25 | e4 | 活跃 | 3 (168 Hours) | 8 | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.7V~3.6V | DUAL | 1 | 1.27mm | SST25VF040B | 3.3V | 3.6V | 2.7V | SPI, Serial | 4Mb 512K x 8 | 50MHz | 0.03mA | FLASH | SPI | 4MX1 | 1 | 10μs | 1b | 4 Mb | 0.00002A | 2.7V | SPI | 100000 Write/Erase Cycles | 100 | HARDWARE/SOFTWARE | 2.16mm | 5.275mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
| AT24C08D-XHM-B | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Gold | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TC | Bulk | 1997 | e4 | yes | 活跃 | 3 (168 Hours) | 8 | 1.7V~3.6V | DUAL | 260 | 1 | 1.8V | 0.65mm | 40 | AT24C08 | 3.6V | 1.7V | 2-Wire, I2C, Serial | 8Kb 1K x 8 | SYNCHRONOUS | 1MHz | 4.5μs | EEPROM | I2C | 5ms | 8 kb | I2C | 5ms | 1.05mm | 4.5mm | 3.1mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| 93LC86BT-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2008 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 3V | 1.27mm | 40 | 93LC86B | 8 | 5V | Serial | 16Kb 1K x 16 | 3mA | 3MHz | 100 ns | EEPROM | SPI | 1KX16 | 16 | 5ms | 16 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 6ms | 200 | SOFTWARE | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||
 | S25FL256SAGNFI003 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 表面贴装 | 8-WDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2015 | FL-S | 活跃 | 3 (168 Hours) | 8 | IT ALSO CONFIGURED AS 256M X 1 | 2.7V~3.6V | DUAL | 1 | 3V | 1.27mm | 3.6V | 3/3.3V | 2.7V | SPI | 256Mb 32M x 8 | 90mA | 133MHz | 8 ns | FLASH | SPI - Quad I/O | 8b | 64MX4 | 4 | 1b | 256 Mb | 0.0001A | SERIAL | Synchronous | 1b | 3V | SPI | 100000 Write/Erase Cycles | 500ms | 20 | HARDWARE/SOFTWARE | 2 | 85°C | 800μm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | R1LP0108ESA-5SI#B1 | Renesas Electronics America | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | Industrial grade | 表面贴装 | 32-TFSOP (0.465, 11.80mm Width) | YES | Volatile | -40°C~85°C TA | Tube | 2013 | yes | 活跃 | 3 (168 Hours) | 32 | 4.5V~5.5V | DUAL | 1 | 5V | 32 | R-PDSO-G32 | 5.5V | 4.5V | 1Mb 128K x 8 | ASYNCHRONOUS | SRAM | Parallel | 128KX8 | 8 | 55ns | 1048576 bit | 55 ns | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24LC515T-I/SM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2005 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 1 | 4.5V | 1.27mm | 24LC515 | 8 | 5.5V | 3/5V | 2.5V | I2C, Serial | 512Kb 64K x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 512 kb | 0.000005A | I2C | 100000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010MDDR | 2.03mm | 5.245mm | 5.23mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||
 | M29W160ET70N6E | Micron Technology Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Gold, Tin | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | YES | 48 | Non-Volatile | -40°C~85°C TA | Tray | e3 | yes | Obsolete | 3 (168 Hours) | 48 | SMD/SMT | EAR99 | 哑光锡 | TOP BOOT BLOCK | 8542.32.00.51 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 0.5mm | 30 | M29W160 | 48 | 3/3.3V | 2.7V | 16Mb 2M x 8 1M x 16 | 10mA | FLASH | Parallel | 1MX16 | 16 | 70ns | 16 Mb | 0.0001A | 70 ns | Asynchronous | 8 | YES | YES | YES | 12131 | 16K8K32K64K | YES | TOP | YES | 1.2mm | 18.4mm | 12mm | 无 | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||
 | 25LC640A-E/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2013 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | 25LC640A | 8 | 5V | SPI, Serial | 64Kb 8K x 8 | 5mA | 10MHz | 100 ns | EEPROM | SPI | 8 | 5ms | 64 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
 | M24M01-DFCS6TP/K | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 8-UFBGA, WLCSP | YES | 8 | Non-Volatile | -40°C~85°C TA | Cut Tape (CT) | e1 | 活跃 | 1 (Unlimited) | 8 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.7V~5.5V | BOTTOM | 1 | 2.5V | 0.5mm | M24M01 | 5.5V | 1.7V | I2C, Serial | 1Mb 128K x 8 | 1MHz | 500ns | EEPROM | I2C | 8 | 5ms | 1 Mb | I2C | 5ms | 2.56mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M24C32-RMB6TG | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Automotive grade | 表面贴装 | 表面贴装 | 8-UFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | e4 | Obsolete | 1 (Unlimited) | 8 | SMD/SMT | EAR99 | 镍钯金 | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 0.5mm | unknown | 30 | M24C32 | 8 | 不合格 | 5V | 2-Wire, I2C, Serial | 32Kb 4K x 8 | 3mA | SYNCHRONOUS | 1MHz | 450ns | EEPROM | I2C | 5ms | 32 kb | 2e-7A | AEC-Q100 | I2C | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 1010DDDR | 530μm | 2mm | 3mm | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||
| M95M01-RDW6TP | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | Industrial grade | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | e4 | 活跃 | 1 (Unlimited) | 8 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~5.5V | DUAL | 1 | 2.5V | 0.65mm | M95M01 | 5.5V | 2/5V | SPI, Serial | 1Mb 128K x 8 | 5mA | 16MHz | 25 ns | EEPROM | SPI | 8 | 5ms | 1 Mb | 0.000001A | SPI | 4000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | 无铅 |