类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 最大功率耗散 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 端口的数量 | 电源电流 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 访问时间(最大) | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 内存IC类型 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 刷新周期 | 通用闪存接口 | I2C控制字节 | 顺序突发长度 | 交错突发长度 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | 25AA128-I/MF | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-VDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2011 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 40 | 25AA128 | 8 | 5V | SPI, Serial | 128Kb 16K x 8 | 5mA | 10MHz | 50 ns | EEPROM | SPI | 5ms | 128 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 840μm | 5mm | 6mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 93LC66AT-E/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2005 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 3V | 0.65mm | 40 | 93LC66A | 8 | 5.5V | 3/5V | 2.5V | Serial | 4Kb 512 x 8 | 2mA | 2MHz | 250 ns | EEPROM | SPI | 8 | 6ms | 4 kb | 0.000005A | MICROWIRE | 1000000 Write/Erase Cycles | 6ms | 200 | SOFTWARE | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | IS61WV51216EDBLL-10BLI | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Industrial grade | 表面贴装 | 48-TFBGA | YES | 48 | Volatile | -40°C~85°C TA | Tray | 活跃 | 3 (168 Hours) | 48 | 2.4V~3.6V | BOTTOM | 1 | 3V | 0.75mm | 不合格 | 3V | 3.6V | 2.4V | 8Mb 512K x 16 | 1 | SRAM | Parallel | 3-STATE | 16 | 10ns | 19b | 8 Mb | COMMON | 2V | 8mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 24FC512T-I/ST14 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 14-TSSOP (0.173, 4.40mm Width) | 14 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2010 | e3 | yes | 活跃 | 1 (Unlimited) | 14 | EAR99 | 8542.32.00.51 | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 40 | 24FC512 | 14 | 5.5V | 2/5V | 1.7V | I2C, Serial | 512Kb 64K x 8 | 5mA | 1MHz | 400ns | EEPROM | I2C | 64KX8 | 8 | 5ms | 512 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 1.2mm | 5mm | 4.4mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AT49F001ANT-55JI | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 32-LCC (J-Lead) | 32 | 32-PLCC (13.97x11.43) | Non-Volatile | -40°C~85°C TC | Tube | 1997 | Obsolete | 2 (1 Year) | 85°C | -40°C | 4.5V~5.5V | 55GHz | AT49F001 | 5V | Parallel | 5.5V | 4.5V | 1Mb 128K x 8 | 30mA | 55ns | FLASH | Parallel | 50μs | 17b | 1 Mb | Asynchronous | 8b | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AT25QL128A-UUE-T | Adesto Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 21-UFBGA, WLCSP | YES | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2016 | 活跃 | 1 (Unlimited) | 21 | 1.7V~2V | BOTTOM | 1 | 1.8V | 0.5mm | R-PBGA-B21 | 2V | 1.7V | 128Mb 16M x 8 | SYNCHRONOUS | 104MHz | FLASH | SPI - Quad I/O, QPI | 128MX1 | 1 | 150μs, 5ms | 134217728 bit | SERIAL | 1.8V | 0.52mm | 3.275mm | 3.007mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S29GL256P11FFIV23 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 表面贴装 | 64-LBGA | 64 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2017 | GL-P | e1 | 活跃 | 3 (168 Hours) | 64 | 3A991.B.1.A | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.32.00.51 | 1.65V~3.6V | BOTTOM | 260 | 1 | 3V | 1mm | 40 | 3.6V | 1.8/3.33/3.3V | 2.7V | 256Mb 32M x 8 | 110mA | FLASH | Parallel | 8b | 256MX1 | 1 | 110ns | 256 Mb | 0.000005A | 110 ns | Asynchronous | 3V | 8 | YES | YES | YES | 256 | 128K | 8/16words | YES | YES | 1.4mm | 13mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY7C1366C-166BGC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 119-BGA | 119 | Volatile | 0°C~70°C TA | Tray | 2004 | e0 | no | Obsolete | 3 (168 Hours) | 119 | 3A991.B.2.A | Tin/Lead (Sn/Pb) | 流水线结构 | 3.135V~3.6V | BOTTOM | 220 | 1 | 3.3V | 1.27mm | CY7C1366 | 119 | 3.3V | 3.6V | 3.135V | 9Mb 256K x 36 | 4 | 180mA | 166MHz | 3.5ns | SRAM | Parallel | 256KX36 | 3-STATE | 36 | 18b | 9 Mb | 0.03A | COMMON | Synchronous | 36b | 22mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY14B512I-SFXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | 16 | Non-Volatile | -40°C~85°C TA | Tube | 2008 | e3 | 最后一次购买 | 3 (168 Hours) | 16 | EAR99 | Matte Tin (Sn) | 8542.32.00.41 | 1W | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 1.27mm | 40 | CY14B512 | 16 | 不合格 | 3V | 3.6V | 2.7V | 2-Wire, I2C, Serial | 512Kb 64K x 8 | 1mA | SYNCHRONOUS | 3.4MHz | 900 ns | NVSRAM | I2C | 8b | 64KX8 | 8 | 512 kb | 0.00025A | 8b | 2.667mm | 10.2865mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY7C1371D-133BGCT | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 119-BGA | 119 | Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2004 | NoBL™ | e0 | no | Obsolete | 3 (168 Hours) | 119 | 3A991.B.2.A | Tin/Lead (Sn/Pb) | FLOW-THROUGH ARCHITECTURE | 3.135V~3.6V | BOTTOM | 220 | 1 | 3.3V | 1.27mm | CY7C1371 | 3.3V | 3.6V | 3.135V | 18Mb 512K x 36 | 4 | 210mA | 133MHz | 6.5ns | SRAM | Parallel | 512KX36 | 3-STATE | 36 | 19b | 18 Mb | 0.07A | COMMON | Synchronous | 36b | 22mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | STK15C88-NF25 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 28-SOIC (0.295, 7.50mm Width) | 28 | Non-Volatile | 0°C~70°C TA | Tube | 2008 | e3 | Obsolete | 3 (168 Hours) | 28 | EAR99 | Matte Tin (Sn) | 8542.32.00.41 | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | unknown | 未说明 | STK15C88 | 28 | 不合格 | 5V | 5V | 256Kb 32K x 8 | 97mA | ASYNCHRONOUS | NVSRAM | Parallel | 8b | 32KX8 | 8 | 25ns | 256 kb | 0.0015A | 25 ns | 8b | 2.67mm | 17.905mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | IS61LV12816L-10BI | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 48-TFBGA | YES | 48 | Volatile | -40°C~85°C TA | Tray | e0 | no | 活跃 | 2 (1 Year) | 48 | Tin/Lead (Sn/Pb) | 3.135V~3.6V | BOTTOM | 240 | 1 | 3.3V | 0.75mm | 10 | 48 | 3.3V | 3.63V | 2.97V | 2Mb 128K x 16 | 1 | SRAM | Parallel | 3-STATE | 16 | 10ns | 17b | 2 Mb | 0.004A | COMMON | 2V | 8mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | IS43DR16128B-25EBLI | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 84-TFBGA | YES | 84 | Volatile | -40°C~85°C TA | Tray | 活跃 | 3 (168 Hours) | 84 | EAR99 | AUTO/SELF REFRESH | 8542.32.00.36 | 1.7V~1.9V | BOTTOM | 1 | 1.8V | 0.8mm | 不合格 | 1.8V | 1.9V | 1.7V | 2Gb 128M x 16 | 1 | SYNCHRONOUS | 400MHz | 400ps | DRAM | Parallel | 128MX16 | 3-STATE | 16 | 15ns | 14b | 2 Gb | 0.03A | COMMON | 8192 | 48 | 48 | 1.2mm | 13.5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S34ML01G200TFI003 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | Tin | 表面贴装 | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | 48 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2015 | ML-2 | e3 | Discontinued | 3 (168 Hours) | 48 | 8542.32.00.51 | 2.7V~3.6V | DUAL | 1 | 3.3V | 0.5mm | 3V | 3.6V | 2.7V | 1Gb 128M x 8 | 30mA | FLASH | Parallel | 8b | 128MX8 | 8 | 25ns | 28b | 1 Gb | 0.00005A | 25 ns | Asynchronous | 8b | 3V | NO | NO | YES | 1K | 128K | 2kB | YES | 1.2mm | 18.4mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY7C008V-25AXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 100-LQFP | 100 | Volatile | 0°C~70°C TA | Tray | 1997 | e3 | Obsolete | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | 3V~3.6V | QUAD | 1 | 3.3V | 0.5mm | unknown | 25GHz | CY7C008 | 100 | 不合格 | 3.3V | 3.6V | 3V | 512Kb 64K x 8 | 2 | 165mA | SRAM | Parallel | 64KX8 | 3-STATE | 8 | 25ns | 32b | 512 kb | 0.00005A | COMMON | Asynchronous | 8b | 3V | 1.6mm | 14mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 25AA160D-I/MS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2004 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.8V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | 25AA160D | 8 | 5V | SPI, Serial | 16Kb 2K x 8 | 5mA | 10MHz | 160 ns | EEPROM | SPI | 8 | 5ms | 16 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1.1mm | 3mm | 3mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AT93C56-10SI-1.8 | Atmel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8161Z36BGT-150 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FLATPACK, LOW PROFILE | 3 | 512000 | PLASTIC/EPOXY | 未说明 | 7.5 ns | 70 °C | 有 | GS8161Z36BGT-150 | 524288 words | 2.5 V | LQFP | RECTANGULAR | GSI技术 | Obsolete | GSI TECHNOLOGY | 8.38 | QFP | YES | 100 | ROHS COMPLIANT, TQFP-100 | 有 | 3A991.B.2.B | Pure Matte Tin (Sn) | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | 100 | R-PQFP-G100 | 不合格 | 2.7 V | COMMERCIAL | 2.3 V | SYNCHRONOUS | 512KX36 | 1.6 mm | 36 | 18874368 bit | PARALLEL | ZBT SRAM | 20 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 25AA512T-I/MF | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 8-VDFN Exposed Pad | 8 | 8-DFN-S (6x5) | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2010 | 活跃 | 1 (Unlimited) | 85°C | -40°C | 1.8V~5.5V | 20MHz | 25AA512 | SPI, Serial | 5.5V | 1.8V | 512Kb 64K x 8 | 7mA | 20MHz | 250 ns | EEPROM | SPI | 5ms | 512 kb | 20MHz | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AT25DF011-MAHN-T | Adesto Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Gold | 表面贴装 | 表面贴装 | 8-UFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TC | Tape & Reel (TR) | 2013 | e3 | 活跃 | 1 (Unlimited) | 8 | Matte Tin (Sn) | 1.65V~3.6V | QUAD | 未说明 | 1 | 1.8V | 0.5mm | 未说明 | 3.6V | 1.7V | SPI, Serial | 1Mb 128K x 8 | SYNCHRONOUS | 104MHz | 8 ns | FLASH | SPI | 1MX1 | 1 | 8μs, 3.5ms | 1 Mb | 256B | 0.6mm | 3mm | 2mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MT48H8M16LFB4-10 | Micron Technology Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 54-VFBGA | 54 | Volatile | 0°C~70°C TA | Box | 2005 | e1 | yes | Discontinued | 2 (1 Year) | 54 | EAR99 | 锡银铜 | AUTO/SELF REFRESH | 1.7V~1.9V | BOTTOM | 260 | 1 | 1.8V | 0.8mm | 30 | MT48H8M16 | 54 | 1.8V | 1.9V | 1.7V | 128Mb 8M x 16 | 1 | 50mA | 104MHz | 7ns | DRAM | Parallel | 16b | 8MX16 | 3-STATE | 16 | 15ns | 14b | 128 Mb | 0.00001A | COMMON | 4096 | 1248FP | 1248 | 1mm | 8mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY7C1312BV18-200BZC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 165-LBGA | 165 | Volatile | 0°C~70°C TA | Tray | 2003 | e0 | Obsolete | 3 (168 Hours) | 165 | Tin/Lead (Sn/Pb) | 流水线结构 | 1.7V~1.9V | BOTTOM | 220 | 1 | 1.8V | 1mm | not_compliant | 未说明 | CY7C1312 | 165 | 不合格 | 1.8V | 1.9V | 1.7V | 18Mb 1M x 18 | 2 | 675mA | 200MHz | 450 ps | SRAM | Parallel | 1MX18 | 3-STATE | 18 | 19b | 18 Mb | SEPARATE | Synchronous | 18b | 1.7V | 1.4mm | 15mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | BR25H040FJ-2CE2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | Automotive grade | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | -40°C~125°C TA | Cut Tape (CT) | 2013 | Automotive, AEC-Q100 | 活跃 | 1 (Unlimited) | 8 | ALSO OPERATES AT 2.5V WITH 5MHZ AND SEATED HT-CALCULATED | 2.5V~5.5V | DUAL | 未说明 | 1 | 5V | 1.27mm | 未说明 | 不合格 | 5.5V | 3/5V | 4.5V | 4Kb 512 x 8 | SYNCHRONOUS | 10MHz | EEPROM | SPI | 8 | 4ms | 0.00001A | 4096 bit | SERIAL | SPI | 1000000 Write/Erase Cycles | 4ms | 100 | HARDWARE/SOFTWARE | 1.65mm | 4.9mm | 3.9mm | Unknown | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | IS43R16800E-5TLI | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 66-TSSOP (0.400, 10.16mm Width) | YES | 66 | Volatile | -40°C~85°C TA | Tray | 活跃 | 3 (168 Hours) | 66 | AUTO/SELF REFRESH | 2.3V~2.7V | DUAL | 1 | 2.5V | 0.65mm | 不合格 | 2.7V | 2.5V | 2.3V | 128Mb 8M x 16 | 1 | SYNCHRONOUS | 200MHz | 700ps | DRAM | Parallel | 16b | 8MX16 | 3-STATE | 16 | 15ns | 0.003A | 134217728 bit | COMMON | 4096 | 248 | 248 | 1.2mm | 22.22mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S25FL132K0XMFV010 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | 8 | Non-Volatile | -40°C~105°C TA | Tray | 2007 | FL1-K | e3 | Obsolete | 3 (168 Hours) | 8 | ALSO CONFIGURABLE AS 32M X 1 | 2.7V~3.6V | DUAL | 未说明 | 1 | 3V | 1.27mm | 未说明 | 不合格 | 3V | 3.6V | 2.7V | SPI, Serial | 32Mb 4M x 8 | SYNCHRONOUS | 108MHz | 0.025mA | 7 ns | FLASH | SPI - Quad I/O | 4 | 3ms | 24b | 32 Mb | 0.000005A | 3V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 2 | 256B | 2.159mm | ROHS3 Compliant |