类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 端口的数量 | 电源电流 | 操作模式 | 最大电源电流 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 无卤素 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 筛选水平 | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 页面尺寸 | 环境温度范围高 | 刷新周期 | I2C控制字节 | 顺序突发长度 | 交错突发长度 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | CY7C09099V-12AC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 100-LQFP | YES | Volatile | 0°C~70°C TA | Tray | 2001 | e0 | Obsolete | 3 (168 Hours) | 100 | EAR99 | 锡铅 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | 8542.32.00.41 | 3V~3.6V | QUAD | 240 | 1 | 3.3V | 0.5mm | not_compliant | 30 | CY7C09099 | 100 | S-PQFP-G100 | 不合格 | 3.6V | 3.3V | 3V | 1Mb 128K x 8 | 2 | 50MHz | 0.205mA | 12ns | SRAM | Parallel | 128KX8 | 3-STATE | 8 | 0.00025A | 1048576 bit | COMMON | 3V | 1.6mm | 14mm | 14mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1441KV33-133AXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 100-LQFP | YES | Volatile | 0°C~70°C TA | Tray | 2004 | 活跃 | 3 (168 Hours) | 100 | 3A991 | 8542.32.00.41 | 3.135V~3.6V | QUAD | 1 | 3.3V | 0.65mm | R-PQFP-G100 | 3.6V | 3.135V | 36Mb 1M x 36 | 133MHz | 6.5ns | SRAM | Parallel | 1MX36 | 36 | 37748736 bit | 1.6mm | 20mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | W25Q16DWZPIG | Winbond Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 8-WDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2008 | SpiFlash® | Discontinued | 3 (168 Hours) | 8 | EAR99 | 1.65V~1.95V | DUAL | 1 | 1.8V | 1.27mm | 8 | 不合格 | 1.8V | 1.95V | 1.65V | SPI, Serial | 16Mb 2M x 8 | SYNCHRONOUS | 104MHz | 7 ns | FLASH | SPI - Quad I/O, QPI | 16MX1 | 1 | 40μs, 3ms | 16 Mb | 0.000005A | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 256B | 6mm | 5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | BR25L010FVT-WE2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2010 | e2 | yes | 不用于新设计 | 1 (Unlimited) | 8 | EAR99 | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 10 | BR25L010 | 8 | 5V | SPI, Serial | 1Kb 128 x 8 | 5MHz | EEPROM | SPI | 8 | 5ms | 1 kb | 0.000002A | SPI | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 1.25mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | 25LC320AXT-I/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) - annealed | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | 25LC320A | 8 | 5V | SPI, Serial | 32Kb 4K x 8 | 5mA | 10MHz | 160 ns | EEPROM | SPI | 8 | 5ms | 32 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | N25Q512A13GF840E | Micron Technology Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 8-VDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tray | 2005 | yes | Obsolete | 3 (168 Hours) | 8 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 1.27mm | 30 | N25Q512 | 3V | 2.7V | 512Mb 128M x 4 | 15mA | 108MHz | FLASH | SPI | 8 | 8ms, 5ms | 1b | 512 Mb | 0.0005A | SERIAL | Synchronous | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 85°C | 1mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CAT24C08WI-GT3 | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | Industrial grade | ACTIVE (Last Updated: 1 day ago) | Gold | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2006 | e4 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.7V~5.5V | DUAL | 260 | 1 | 3.3V | 1.27mm | 40 | CAT24C08 | 8 | 5V | 1.7V | 2-Wire, I2C, Serial | 8Kb 1K x 8 | 2mA | 400kHz | 900ns | EEPROM | I2C | 无卤素 | 5ms | 8 kb | 0.000001A | I2C | 5ms | 100 | HARDWARE | 1010DMMR | 1.5mm | 5mm | 4mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||
| BR93G66FVT-3GE2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | YES | Non-Volatile | -40°C~85°C TA | Cut Tape (CT) | 活跃 | 1 (Unlimited) | 8 | ALSO OPERATES AT 1.7V WITH 1MHZ AND 2.5V AT 2MHZ | 1.7V~5.5V | DUAL | 未说明 | 1 | 5V | 0.65mm | 未说明 | R-PDSO-G8 | 5.5V | 4.5V | 4Kb 256 x 16 | SYNCHRONOUS | 3MHz | EEPROM | SPI | 256X16 | 16 | 5ms | 4096 bit | SERIAL | 3-WIRE | 5ms | 8 | 1.2mm | 4.4mm | 3mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 11LC161T-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | 8-SOIC | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2009 | 活跃 | 1 (Unlimited) | 85°C | -40°C | 2.5V~5.5V | 100kHz | 11LC161 | Serial | 5.5V | 2.5V | 16Kb 2K x 8 | 5mA | 100kHz | EEPROM | 单线 | 5ms | 16 kb | 100kHz | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 34AA04-E/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Automotive grade | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2016 | e3 | 活跃 | 1 (Unlimited) | 8 | 1.7V~3.6V | DUAL | 260 | 1 | 2.2V | 1.27mm | 40 | 34AA04 | 3.6V | 1.7V | 2-Wire, I2C, Serial | 4Kb 256 x 8 x 2 | SYNCHRONOUS | 1MHz | 350ns | EEPROM | I2C | 8 | 5ms | 4096 bit | TS 16949 | I2C | 5ms | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 25AA256-E/MF | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 表面贴装 | 表面贴装 | 8-VDFN Exposed Pad | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2013 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 40 | 25AA256 | 8 | 不合格 | 5.5V | 2/5V | SPI, Serial | 256Kb 32K x 8 | 6mA | SYNCHRONOUS | 10MHz | 50 ns | EEPROM | SPI | 8 | 5ms | 256 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1mm | 5.99mm | 4.92mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
 | AT49BV163D-70CU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 48-TFBGA, CSPBGA | 48 | 48-CBGA (6x8) | Non-Volatile | -40°C~85°C TC | Tray | 1997 | Obsolete | 3 (168 Hours) | 85°C | -40°C | 2.65V~3.6V | 70GHz | AT49BV163 | Parallel | 3.6V | 2.65V | 16Mb 2M x 8 1M x 16 | 70ns | FLASH | Parallel | 16b | 120μs | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | IS61NLP102418-200TQLI | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 100-LQFP | YES | 100 | Volatile | -40°C~85°C TA | Tray | e3 | yes | Obsolete | 2 (1 Year) | 100 | Matte Tin (Sn) - annealed | 流水线结构 | 3.135V~3.465V | QUAD | 260 | 1 | 3.3V | 0.65mm | 40 | 100 | 3.3V | 3.465V | 3.135V | 18Mb 1M x 18 | 2 | 475mA | 200MHz | 3.1ns | SRAM | Parallel | 1MX18 | 3-STATE | 18 | 20b | 18 Mb | 0.075A | COMMON | Synchronous | 18b | 3.14V | 1.6mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | BR25H020F-2LBH2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 表面贴装 | 8-SOIC (0.173, 4.40mm Width) | YES | Non-Volatile | -40°C~125°C TA | Cut Tape (CT) | 活跃 | 1 (Unlimited) | 8 | 2.5V~5.5V | DUAL | 未说明 | 1 | 5V | 1.27mm | 未说明 | R-PDSO-G8 | 5.5V | 2.5V | 2Kb 256 x 8 | SYNCHRONOUS | 10MHz | EEPROM | SPI | 256X8 | 8 | 4ms | 2048 bit | SERIAL | SPI | 4ms | 1.71mm | 5mm | 4.4mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CAT24C44LI | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tin | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2006 | e3 | Obsolete | 1 (Unlimited) | 8 | EAR99 | 4.5V~5.5V | DUAL | 未说明 | 1 | 5V | 2.54mm | unknown | 未说明 | CAT24C44 | 8 | 不合格 | 5V | 5V | 7V | Serial | 256b 16 x 16 | 3mA | SYNCHRONOUS | 1MHz | 1.5 μs | NVSRAM | SPI | 16b | 16X16 | 16 | 256 b | 0.00003A | 16b | 5.33mm | 9.27mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | BR24G08FVM-3GTTR | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Tin | 表面贴装 | 表面贴装 | 8-VSSOP, 8-MSOP (0.110, 2.80mm Width) | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2013 | 活跃 | 1 (Unlimited) | 8 | 1.6V~5.5V | DUAL | 未说明 | 1 | 2.5V | 0.65mm | 未说明 | BR24G08 | R-PDSO-G8 | 5.5V | 1.6V | 2-Wire, I2C, Serial | 8Kb 1K x 8 | SYNCHRONOUS | 400kHz | 900 ns | EEPROM | I2C | 8KX1 | 1 | 5ms | 8 kb | I2C | 5ms | 0.9mm | 2.9mm | 2.8mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MX25L25735FZ2I-10G | Macronix | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 8-WDFN Exposed Pad | YES | Non-Volatile | -40°C~85°C TA | Tray | MX25xxx35/36 - MXSMIO™ | 活跃 | 3 (168 Hours) | 8 | CAN BE ORGNISED AS 256 MBIT X 1 | 2.7V~3.6V | DUAL | 未说明 | 1 | 3V | 1.27mm | 未说明 | 8 | R-PDSO-N8 | 不合格 | 3.6V | 3/3.3V | 2.7V | SPI, Serial | 256Mb 32M x 8 | SYNCHRONOUS | 104MHz | FLASH | SPI | 64MX4 | 4 | 30μs, 1.5ms | 0.00002A | 268435456 bit | 3V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 2 | 0.8mm | 8mm | 6mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||
| 25AA128T-I/MF | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-VDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2011 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 40 | 25AA128 | 8 | 5V | SPI, Serial | 128Kb 16K x 8 | 5mA | 10MHz | 50 ns | EEPROM | SPI | 8 | 5ms | 128 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1mm | 5.99mm | 4.92mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | AT45DB641E-MWHN2B-T | Adesto Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Gold | 表面贴装 | 表面贴装 | 8-VDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TC | Tape & Reel (TR) | 2012 | e4 | yes | 活跃 | 3 (168 Hours) | 8 | 1.7V~3.6V | DUAL | 260 | 1 | 2.3V | 1.27mm | 未说明 | 8 | 3.6V | 1.7V | SPI, Serial | 64Mb 256Bytes x 32K pages | SYNCHRONOUS | 22mA | 85MHz | 7 ns | FLASH | SPI | 8b | 64MX1 | 1 | 8μs, 5ms | 64 Mb | 1mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1512AV18-200BZXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 165-LBGA | 165 | Volatile | 0°C~70°C TA | Tray | 2003 | e1 | Obsolete | 3 (168 Hours) | 165 | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 1.7V~1.9V | BOTTOM | 260 | 1 | 1.8V | 1mm | unknown | 20 | CY7C1512 | 165 | 不合格 | 1.8V | 1.9V | 1.7V | 72Mb 4M x 18 | 2 | 800mA | 200MHz | 450 ps | SRAM | Parallel | 4MX18 | 3-STATE | 18 | 21b | 72 Mb | SEPARATE | Synchronous | 18b | 1.7V | 1.4mm | 17mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
| 93LC46AT/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2001 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS | 2.5V~5.5V | DUAL | 260 | 1 | 2.7V | 0.635mm | 40 | 93LC46A | 8 | 5.5V | 6V | 3/5V | 2.5V | 2-Wire, Serial | 1Kb 128 x 8 | 2mA | 2MHz | 6 ms | EEPROM | SPI | 8 | 1 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 200 | SOFTWARE | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||
 | MX30LF2G28AB-TI | Macronix | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 48-TFSOP (0.488, 12.40mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tray | 2014 | MX30LF | 不用于新设计 | 3 (168 Hours) | 48 | 3A991.B.1.A | 8542.32.00.51 | 2.7V~3.6V | DUAL | 未说明 | 1 | 3V | 0.5mm | 未说明 | R-PDSO-G48 | 3.6V | 2.7V | 2Gb 256M x 8 | ASYNCHRONOUS | FLASH | Parallel | 256MX8 | 8 | 20ns | 2147483648 bit | 2.7V | 1.2mm | 18.4mm | 12mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST26WF016BAT-104I/MF | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Automotive grade | 表面贴装 | 8-WDFN Exposed Pad | YES | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2014 | SST26 SQI® | e3 | 活跃 | 3 (168 Hours) | 8 | Matte Tin (Sn) - annealed | 1.65V~1.95V | DUAL | 未说明 | 1 | 1.8V | 1.27mm | 未说明 | SST26WF016 | 1.8V | 1.95V | 1.65V | SPI, Serial | 16Mb 2M x 8 | SYNCHRONOUS | 104MHz | FLASH | SPI - Quad I/O | 16MX1 | 1 | 1.5ms | 16 Mb | TS 16949 | 256B | 6mm | 5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | IS42S32800G-6BLI | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Industrial grade | 表面贴装 | 90-TFBGA | YES | 90 | Volatile | -40°C~85°C TA | Tray | 活跃 | 3 (168 Hours) | 90 | EAR99 | AUTO/SELF REFRESH | 8542.32.00.24 | 3V~3.6V | BOTTOM | 1 | 3.3V | 0.8mm | 90 | 不合格 | 3.6V | 3.3V | 3V | 256Mb 8M x 32 | 1 | SYNCHRONOUS | 166MHz | 5.4ns | DRAM | Parallel | 32b | 8MX32 | 3-STATE | 32 | 0.003A | 268435456 bit | COMMON | 4096 | 1248FP | 1248 | 1.2mm | 13mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | S34ML02G100TFA000 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Automotive grade | Tin | 表面贴装 | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | 48 | Non-Volatile | -40°C~85°C TA | Tray | 2006 | ML-1 | e3 | Discontinued | 3 (168 Hours) | 48 | 8542.32.00.51 | 2.7V~3.6V | DUAL | 未说明 | 1 | 3.3V | 0.5mm | 未说明 | 3V | 3.6V | 2.7V | 2Gb 256M x 8 | ASYNCHRONOUS | 25 ns | FLASH | Parallel | 8b | 256MX8 | 8 | 29b | 2 Gb | AEC-Q100 | 3V | 2kB | 1.2mm | 18.4mm | ROHS3 Compliant |