类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 厂商 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 端口的数量 | 电源电流 | 操作模式 | 时钟频率 | 访问时间 | 内存格式 | 内存接口 | 建筑学 | 数据总线宽度 | 组织结构 | 输出特性 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 访问时间（最大） | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 内存IC类型 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 刷新周期 | 通用闪存接口 | I2C控制字节 | 顺序突发长度 | 交错突发长度 | 组织的记忆 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | CY7C0251AV-25AC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 100-LQFP | YES | Volatile | 0°C~70°C TA | Tray | 2003 | e0 | Obsolete | 3 (168 Hours) | 100 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.41 | 3V~3.6V | QUAD | 未说明 | 1 | 3.3V | 0.5mm | not_compliant | 25GHz | 未说明 | CY7C0251 | 100 | S-PQFP-G100 | 不合格 | 3.6V | 3.3V | 3V | 144Kb 8K x 18 | 2 | SRAM | Parallel | 8KX18 | 3-STATE | 18 | 25ns | 0.0005A | 147456 bit | 25 ns | COMMON | 2V | 1.6mm | 14mm | 14mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST39VF010-70-4I-B3KE | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 48-TFBGA | YES | 48 | Non-Volatile | -40°C~85°C TA | Tray | 2000 | SST39 MPF™ | e1 | yes | Obsolete | 2 (1 Year) | 48 | 3A991.B.1.A | 锡银铜 | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 260 | 1 | 3V | 0.8mm | 40 | SST39VF010 | 48 | 3.3V | 3.6V | 2.7V | 1Mb 128K x 8 | 20mA | 70ns | FLASH | Parallel | 8b | 128KX8 | 8 | 20μs | 17b | 1 Mb | 0.000015A | Asynchronous | 8b | 2.7V | YES | YES | YES | 32 | 4K | 1.2mm | 8mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png) | 28C64A-20/L | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | CHIP CARRIER | 8000 | PLASTIC/EPOXY | LDCC32,.5X.6 | 200 ns | 70 °C | 无 | 28C64A-20/L | 8192 words | 5 V | QCCJ | RECTANGULAR | Vishay Semiconductors | Obsolete | GENERAL SEMICONDUCTOR INC | 5.88 | YES | 32 | QCCJ, LDCC32,.5X.6 | e0 | Tin/Lead (Sn/Pb) | EEPROMs | CMOS | QUAD | J BEND | 1.27 mm | unknown | R-PQCC-J32 | 不合格 | 5 V | COMMERCIAL | 8KX8 | 8 | 65536 bit | PARALLEL | EEPROM | 1 ms | YES | NO | NO | YES | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PA28F008SA85 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5.0000 V | 4.5, 4.75 V | 无 | Symmetrical | Parallel | 1 MWords | 5.25, 5.5 V | 表面贴装 | Bulk | PA28F008 | Obsolete | Non-Volatile | Commercial grade | 表面贴装 | 44-PSOP | Intel | PSOP | 0 to 70 °C | - | FLASH | 4.5V ~ 5.5V | 44 | 8Mbit | 85 ns | FLASH | Parallel | Sectored | 85ns | 20 Bit | 8 Mbit | Commercial | 4.5, 5.5, 4.75, 5.25 V | 无 | 1M x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | IS43DR16128C-25DBL | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Commercial grade | 表面贴装 | 84-TFBGA | YES | Volatile | 0°C~85°C TC | Tray | 活跃 | 3 (168 Hours) | 84 | EAR99 | PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH | 1.7V~1.9V | BOTTOM | 1 | 1.8V | 0.8mm | R-PBGA-B84 | 不合格 | 1.9V | 1.8V | 1.7V | 2Gb 128M x 16 | 1 | SYNCHRONOUS | 400MHz | 400ns | DRAM | Parallel | 128MX16 | 3-STATE | 16 | 15ns | 0.03A | 2147483648 bit | COMMON | 8192 | 48 | 48 | 1.2mm | 12.5mm | 8mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 93LC46BT-E/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2005 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 3V | 0.65mm | 40 | 93LC46B | 8 | 5.5V | 3/5V | 2.5V | Serial | 1Kb 64 x 16 | 2mA | 2MHz | 250 ns | EEPROM | SPI | 64X16 | 16 | 6ms | 1 kb | 0.000005A | MICROWIRE | 1000000 Write/Erase Cycles | 6ms | 200 | SOFTWARE | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT28C256E-15DM/883-815 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 23 Weeks | Military grade | 通孔 | 28-CDIP (0.600, 15.24mm) | NO | Non-Volatile | -55°C~125°C TC | Tube | 1997 | 活跃 | 1 (Unlimited) | 28 | 自动写入 | 4.5V~5.5V | DUAL | 1 | 5V | 2.54mm | R-GDIP-T28 | 5.5V | 4.5V | 256Kb 32K x 8 | ASYNCHRONOUS | 150ns | EEPROM | Parallel | 32KX8 | 8 | 10ms | 262144 bit | MIL-STD-883 Class B | 5V | 10ms | 5.72mm | 37.215mm | 15.24mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24LC512-I/SMG | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | EEPROM | Tin | 表面贴装 | SOIC | 8 | 400kHz | Bulk | 2010 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 85°C | -40°C | DUAL | 鸥翼 | 260 | 1 | 4.5V | 1.27mm | 400kHz | 40 | 8 | 不合格 | 3/5V | INDUSTRIAL | 2-Wire, I2C, Serial | 5.5V | 2.5V | 64kB | 5mA | SYNCHRONOUS | 900 ns | 512 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 1.98mm | 5.38mm | 5.33mm | 无SVHC | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | IS25LP128-JMLE | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | YES | 16 | Non-Volatile | -40°C~105°C TA | Bulk | e3 | 活跃 | 3 (168 Hours) | 16 | 3A991.B.1.A | Tin (Sn) | 8542.32.00.51 | 2.3V~3.6V | DUAL | 1 | 3V | 1.27mm | 3.6V | 2.3V | SPI, Serial | 128Mb 16M x 8 | SYNCHRONOUS | 133MHz | FLASH | SPI - Quad I/O, QPI | 128MX1 | 3-STATE | 1 | 1ms | 0.000065A | 134217728 bit | 2.7V | 4-WIRE | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 1 | 2.65mm | 10.3mm | 7.5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | HN58X25256FPIAG#S0 | Renesas Electronics America | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | yes | 活跃 | 3 (168 Hours) | 8 | IT IS ALSO OPERATES IN 3MHZ CLOCK FREQUENCY AT 1.8V MIN SUPPLY | 1.8V~5.5V | DUAL | 1 | 3.6V | 1.27mm | 8 | R-PDSO-G8 | 5.5V | 2.5V | SPI, Serial | 256Kb 32K x 8 | SYNCHRONOUS | 5MHz | EEPROM | SPI | 32KX8 | 8 | 5ms | 262144 bit | SPI | 8ms | 1.73mm | 4.89mm | 3.9mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S25FL256SAGBHIS00 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 24-TBGA | 24 | Non-Volatile | -40°C~85°C TA | Tray | FL-S | 活跃 | 3 (168 Hours) | 2.7V~3.6V | SPI, Serial | 256Mb 32M x 8 | 133MHz | FLASH | SPI - Quad I/O | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1372D-167AXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 100-LQFP | 100 | Volatile | -40°C~85°C TA | Tray | 2011 | NoBL™ | e3 | yes | Obsolete | 3 (168 Hours) | 100 | Matte Tin (Sn) | 流水线结构 | 3.135V~3.6V | QUAD | 260 | 1 | 3.3V | 0.65mm | 20 | CY7C1372 | 100 | 3.3V | 3.6V | 3.135V | 18Mb 1M x 18 | 2 | 275mA | 167MHz | 3.4ns | SRAM | Parallel | 1MX18 | 3-STATE | 20b | 18 Mb | 0.07A | COMMON | Synchronous | 18b | 3.14V | 1.4mm | 20mm | 14mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1512AV18-200BZI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 165-LBGA | 165 | Volatile | -40°C~85°C TA | Tray | 2003 | e0 | Obsolete | 3 (168 Hours) | 165 | Tin/Lead (Sn/Pb) | 流水线结构 | 1.7V~1.9V | BOTTOM | 225 | 1 | 1.8V | 1mm | not_compliant | 30 | CY7C1512 | 165 | 不合格 | 1.8V | 1.9V | 1.7V | 72Mb 4M x 18 | 2 | 800mA | 200MHz | 450 ps | SRAM | Parallel | 4MX18 | 3-STATE | 18 | 21b | 72 Mb | SEPARATE | Synchronous | 18b | 1.7V | 1.4mm | 17mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CYD18S36V18-200BBAXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 256-LBGA | 256 | Volatile | -40°C~85°C TA | Tray | 2011 | e1 | Obsolete | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V | 1.42V~1.58V 1.7V~1.9V | BOTTOM | 260 | 1 | 1.5V | 1mm | 30 | CYD18S36 | 256 | 1.8V | 1.58V | 18Mb 512K x 36 | 2 | 860mA | 200MHz | 3.3ns | SRAM | Parallel | 3-STATE | 36 | 19b | 18 Mb | 0.35A | COMMON | Synchronous | 36b | 1.4V | 1.7mm | 17mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | W25Q80BVSNIG | Winbond Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2009 | SpiFlash® | Obsolete | 3 (168 Hours) | 8 | 3A991.B.1.B.1 | 2.7V~3.6V | DUAL | 1 | 3V | 1.27mm | 8 | 3.3V | 3.6V | 2.7V | SPI, Serial | 8Mb 1M x 8 | 18mA | 104MHz | 8.5 ns | FLASH | SPI | 1 | 3ms | 1b | 8 Mb | 0.000005A | Asynchronous | 8b | 2.7V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 1.75mm | 4.9mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | BR93A66RFVT-WME2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | YES | Non-Volatile | -40°C~105°C TA | Tape & Reel (TR) | Automotive, AEC-Q100 | 活跃 | 1 (Unlimited) | 8 | 2.5V~5.5V | DUAL | 未说明 | 1 | 4V | 0.65mm | 未说明 | R-PDSO-G8 | 不合格 | 5.5V | 3/5V | 2.5V | 4Kb 256 x 16 | SYNCHRONOUS | 2MHz | EEPROM | SPI | 256X16 | 16 | 5ms | 0.000002A | 4096 bit | SERIAL | 3-WIRE | 1000000 Write/Erase Cycles | 5ms | 40 | SOFTWARE | 1.2mm | 4.4mm | 3mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT25320B-XPDGV-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Automotive grade | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | Automotive, AEC-Q100 | 活跃 | 1 (Unlimited) | 2.5V~5.5V | 32Kb 4K x 8 | 5MHz | EEPROM | SPI | 5ms | SPI | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1012AV33-8BGC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 表面贴装 | 表面贴装 | 119-BGA | 119 | Volatile | 0°C~70°C TA | Tray | 2002 | e0 | no | Obsolete | 3 (168 Hours) | 119 | Tin/Lead (Sn/Pb) | AUTOMATIC POWER-DOWN | 3V~3.6V | BOTTOM | 220 | 1 | 3.3V | 20 | CY7C1012 | 119 | 3.3V | 3.6V | 3V | 12Mb 512K x 24 | 1 | 300mA | SRAM | Parallel | 3-STATE | 24 | 8ns | 19b | 12 Mb | 0.05A | 8 ns | COMMON | Asynchronous | 24b | 3V | 2.4mm | 22mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M29F160FT5AN6E2 | Micron Technology Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | Automotive grade | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | YES | 48 | Non-Volatile | -40°C~85°C TA | Tray | 2000 | e3 | yes | Obsolete | 3 (168 Hours) | 48 | EAR99 | 哑光锡 | TOP BOOT BLOCK | 8542.32.00.51 | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 0.5mm | 30 | M29F160 | 48 | 5V | 5V | 4.5V | 16Mb 2M x 8 1M x 16 | 20mA | FLASH | Parallel | 1MX16 | 16 | 55ns | 16 Mb | 0.00012A | AEC-Q100 | 55 ns | Asynchronous | 8 | YES | YES | YES | 12131 | 16K8K32K64K | YES | TOP | YES | 1.2mm | 18.4mm | 12mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1059DV33-10ZSXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | 44 | Volatile | -40°C~85°C TA | Tray | 2002 | e3 | yes | 活跃 | 3 (168 Hours) | 44 | Matte Tin (Sn) | 3V~3.6V | DUAL | 260 | 1 | 3.3V | 0.8mm | 10GHz | 30 | CY7C1059 | 44 | 3.3V | 3.6V | 3V | 8Mb 1M x 8 | 1 | 110mA | SRAM | Parallel | 3-STATE | 10ns | 20b | 8 Mb | 0.02A | COMMON | Asynchronous | 8b | 2V | 1.194mm | 18.52mm | 11.938mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S25FL129P0XMFI003 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | 16 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | FL-P | e3 | Obsolete | 3 (168 Hours) | 16 | 3A991.B.1.A | Matte Tin (Sn) | 8542.32.00.51 | 2.7V~3.6V | DUAL | 1 | 3V | 1.27mm | 3.6V | 3/3.3V | 2.7V | SPI, Serial | 128Mb 16M x 8 | 38mA | 104MHz | 1.5 ms | FLASH | SPI - Quad I/O | 8b | 128MX1 | 1 | 5μs, 3ms | 1b | 128 Mb | 0.00001A | Synchronous | 1b | 3V | SPI | 100000 Write/Erase Cycles | 50ms | 20 | HARDWARE/SOFTWARE | 256B | 2.65mm | 10.3mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M24C04-FMH6TG | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | ACTIVE (Last Updated: 2 weeks ago) | 表面贴装 | 5-UFDFN | YES | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 活跃 | 1 (Unlimited) | 5 | 1.7V~5.5V | DUAL | 未说明 | 1 | 2.5V | 0.4mm | compliant | 未说明 | M24C04 | R-PDSO-N5 | 5.5V | 1.7V | 4Kb 512 x 8 | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 512X8 | 8 | 5ms | 4096 bit | SERIAL | I2C | 5ms | 0.6mm | 1.7mm | 1.4mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24LC512-E/ST14 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 14-TSSOP (0.173, 4.40mm Width) | 14 | Non-Volatile | -40°C~125°C TA | Tube | 2010 | e3 | yes | 活跃 | 1 (Unlimited) | 14 | EAR99 | 8542.32.00.51 | 2.5V~5.5V | DUAL | 260 | 1 | 4.5V | 0.65mm | 40 | 24LC512 | 14 | 5.5V | 3/5V | 2.5V | I2C, Serial | 512Kb 64K x 8 | 5mA | 400kHz | 900ns | EEPROM | I2C | 64KX8 | 8 | 5ms | 512 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 1.2mm | 5mm | 4.4mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24FC64T-I/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2007 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 40 | 24FC64 | 8 | 5.5V | 2/5V | 1.7V | I2C, Serial | 64Kb 8K x 8 | 3mA | 1MHz | 400ns | EEPROM | I2C | 8 | 5ms | 64 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AS4C32M16D1A-5TCN | Alliance Memory, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Commercial grade | 表面贴装 | 66-TSSOP (0.400, 10.16mm Width) | YES | Volatile | 0°C~70°C TA | Tray | 2015 | 活跃 | 3 (168 Hours) | 66 | EAR99 | AUTO/SELF REFRESH | 2.3V~2.7V | DUAL | 未说明 | 1 | 2.5V | 0.65mm | 未说明 | R-PDSO-G66 | 2.7V | 2.3V | 512Mb 32M x 16 | 1 | SYNCHRONOUS | 200MHz | 700ps | DRAM | Parallel | 32MX16 | 16 | 15ns | 536870912 bit | 1.2mm | 22.22mm | 10.16mm | ROHS3 Compliant | 无铅 |