类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 端口的数量 | 电源电流 | 操作模式 | 最大电源电流 | 时钟频率 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 访问时间（最大） | I/O类型 | 同步/异步 | 字长 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 输出启用 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 刷新周期 | 通用闪存接口 | I2C控制字节 | 顺序突发长度 | 交错突发长度 | 反向引脚排列 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||
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 | SST39WF400B-70-4C-MAQE-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 48-WFBGA | 48 | Non-Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2010 | SST39 MPF™ | 活跃 | 3 (168 Hours) | 48 | 1.65V~1.95V | BOTTOM | 1.8V | 0.5mm | SST39WF400B | 1.8V | 4Mb 256K x 16 | 15mA | 70ns | FLASH | Parallel | 16b | 256KX16 | 16 | 40μs | 18b | 4 Mb | 0.00004A | Asynchronous | 16b | YES | YES | YES | 128 | 2K | YES | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MX25U4033EZUI-12G | Macronix | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 8-UDFN Exposed Pad | YES | Non-Volatile | -40°C~85°C TA | Tray | 2008 | MXSMIO™ | e3 | 不用于新设计 | 3 (168 Hours) | 8 | MATTE TIN (800) | CAN BE ORGANISED AS 4 MBIT X 1 | 1.65V~2V | DUAL | 260 | 1 | 1.8V | 0.8mm | 40 | 8 | S-PDSO-N8 | 不合格 | 2V | 1.8V | 1.65V | SPI, Serial | 4Mb 512K x 8 | SYNCHRONOUS | 80MHz | FLASH | SPI | 1MX4 | 4 | 30μs, 3ms | 0.000008A | 4194304 bit | 1.8V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 2 | 0.6mm | 4mm | 4mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 93AA76C-I/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2004 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 40 | 93AA76C | 8 | 5.5V | 2/5V | Serial | 8Kb 1K x 8 512 x 16 | 3mA | 3MHz | 100 ns | EEPROM | SPI | 512X16 | 5ms | 8 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1.05mm | 4.5mm | 3.1mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | IS63LV1024L-10T | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 32-SOIC (0.400, 10.16mm Width) | YES | Volatile | 0°C~70°C TA | Tray | e0 | no | Discontinued | 2 (1 Year) | 32 | 3A991.B.2.B | Tin/Lead (Sn/Pb) | 8542.32.00.41 | 3V~3.6V | DUAL | 未说明 | 1 | 3.3V | 1.27mm | 未说明 | 32 | R-PDSO-G32 | 不合格 | 3.6V | 3.3V | 3V | 1Mb 128K x 8 | SRAM | Parallel | 128KX8 | 3-STATE | 8 | 10ns | 0.0015A | 1048576 bit | 10 ns | COMMON | 2V | 1.2mm | 20.95mm | 10.16mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MX25U1635EZUI-10G | Macronix | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-UDFN Exposed Pad | YES | Non-Volatile | -40°C~85°C TA | Tray | 2017 | MX25xxx35/36 - MXSMIO™ | 不用于新设计 | 3 (168 Hours) | 8 | EAR99 | ALSO CONFIGURABLE AS 16M X 1 | 8542.32.00.51 | 1.65V~2V | DUAL | 未说明 | 1 | 1.8V | 0.8mm | 未说明 | 8 | S-PDSO-N8 | 不合格 | 2V | 2V | 1.8V | 1.65V | SPI, Serial | 16Mb 2M x 8 | SYNCHRONOUS | 104MHz | FLASH | SPI | 4MX4 | 4 | 30μs, 3ms | 16 Mb | 0.00002A | 1.8V | SPI | 100000 Write/Erase Cycles | 10 | HARDWARE/SOFTWARE | 2 | 0.6mm | 4mm | 4mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | BR24A04FJ-WME2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Automotive grade | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | -40°C~105°C TA | Cut Tape (CT) | 2013 | Automotive, AEC-Q100 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 未说明 | 1 | 1.27mm | 未说明 | 8 | 不合格 | 5.5V | 3/5V | 2.5V | 2-Wire, I2C, Serial | 4Kb 512 x 8 | SYNCHRONOUS | 400kHz | EEPROM | I2C | 8 | 5ms | 0.000002A | I2C | 100000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 1010DDMR | 1.775mm | 4.9mm | 3.9mm | Unknown | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | IDT7164S20Y | Renesas Electronics America Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 28-BSOJ (0.300, 7.62mm Width) | 28-SOJ | Volatile | 0°C~70°C TA | Tube | Obsolete | 3 (168 Hours) | 4.5V~5.5V | IDT7164 | 64Kb 8K x 8 | 20ns | SRAM | Parallel | 20ns | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M29W400DB70N6E | Micron Technology Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Gold, Tin | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | YES | 48 | Non-Volatile | -40°C~85°C TA | Tray | 2007 | e3 | yes | Obsolete | 3 (168 Hours) | 48 | SMD/SMT | EAR99 | 哑光锡 | 底部启动区块 | 8542.32.00.51 | 2.7V~3.6V | DUAL | 260 | 1 | 3.3V | 0.5mm | 30 | M29W400 | 48 | 3/3.3V | 2.7V | 4Mb 512K x 8 256K x 16 | 10mA | FLASH | Parallel | 256KX16 | 16 | 70ns | 4 Mb | 0.0001A | 70 ns | Asynchronous | 8 | YES | YES | YES | 1217 | 16K8K32K64K | YES | BOTTOM | 1.2mm | 18.4mm | 12mm | 无 | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
 | 24LC256-I/PG | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | EEPROM | Tin | 通孔 | PDIP | 8 | 400kHz | Bulk | 2004 | e3 | yes | 活跃 | 8 | EAR99 | 85°C | -40°C | DUAL | 1 | 2.54mm | 400kHz | 8 | 3/5V | INDUSTRIAL | I2C, Serial | 5.5V | 2.5V | 32kB | 3mA | 900 ns | 8 | 256 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | NO | 5.334mm | 9.271mm | 7.62mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LH5164AHN-10L | Sharp Microelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 28-SOP | 28 | Volatile | -40°C~85°C TA | Tube | 1997 | Obsolete | 4 (72 Hours) | 28 | 4.5V~5.5V | DUAL | 225 | 1 | 5V | unknown | 未说明 | 不合格 | 5V | 64Kb 8K x 8 | 1 | 50mA | SRAM | Parallel | 8KX8 | 3-STATE | 8 | 100ns | 13b | 64 kb | Asynchronous | 8b | 2V | YES | 2.6mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 93LC56X/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 28 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | 0°C~70°C TA | Tube | 2003 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 100K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 93LC56 | 8 | 6V | 3/5V | 2V | 2-Wire, Serial | 2Kb 256 x 8 128 x 16 | 3mA | 2MHz | 6 ms | EEPROM | SPI | 3-STATE | 8 | 10ms | 2 kb | 0.00003A | MICROWIRE | 10000000 Write/Erase Cycles | 10ms | 200 | SOFTWARE | 16 | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | M28W160ECT70ZB6E | Micron Technology Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 46-TFBGA | YES | 46 | Non-Volatile | -40°C~85°C TA | Tray | 2004 | e1 | yes | Obsolete | 3 (168 Hours) | 46 | EAR99 | 锡银铜 | TOP BOOT BLOCK | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 260 | 1 | 3V | 0.75mm | 30 | M28W160 | 46 | 3/3.3V | 2.7V | 16Mb 1M x 16 | 18mA | FLASH | Parallel | 1MX16 | 16 | 70ns | 20b | 16 Mb | 0.000005A | 70 ns | Asynchronous | 16b | NO | NO | YES | 831 | 4K32K | TOP | YES | 1.2mm | 6.39mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | M93C56-MN6TP | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | e4 | yes | Obsolete | 3 (168 Hours) | 8 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 30 | M93C56 | 8 | 不合格 | 5V | 5V | Serial | 2Kb 256 x 8 128 x 16 | 2mA | SYNCHRONOUS | 2MHz | 200 ns | EEPROM | SPI | 16 | 5ms | 2 kb | 0.000015A | MICROWIRE | 1000000 Write/Erase Cycles | 5ms | 40 | SOFTWARE | 8 | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST26VF064B-104V/MF | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 8-WDFN Exposed Pad | YES | 8 | Non-Volatile | -40°C~105°C TA | Tube | SST26 SQI® | e3 | 活跃 | 3 (168 Hours) | 8 | Matte Tin (Sn) - annealed | 2.7V~3.6V | DUAL | 1 | 3V | 1.27mm | SST26VF064 | 3.6V | 2.7V | SPI, Serial | 64Mb 8M x 8 | SYNCHRONOUS | 104MHz | FLASH | SPI - Quad I/O | 64MX1 | 1 | 1.5ms | 64 Mb | 3V | 256B | 6mm | 5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT25512Y7-YH-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | 表面贴装 | 8-UDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2005 | e4 | yes | 活跃 | 3 (168 Hours) | 8 | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~5.5V | DUAL | 1 | 2.7V | 1.27mm | AT25512 | 不合格 | 3.3V | 3.6V | 2/5V | SPI, Serial | 512Kb 64K x 8 | 7mA | SYNCHRONOUS | 20MHz | 80 ns | EEPROM | SPI | 8 | 5ms | 512 kb | 0.000003A | SPI | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE/SOFTWARE | 0.6mm | 6mm | 4.9mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1041GE30-10ZSXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | YES | Volatile | -40°C~85°C TA | Tray | 2012 | 活跃 | 3 (168 Hours) | 44 | 3A991.B.2.A | 8542.32.00.41 | 3V~3.6V | DUAL | 1 | 3V | 0.8mm | CY7C1041 | R-PDSO-G44 | 不合格 | 3.6V | 2.5/3.3V | 2.2V | 4Mb 256K x 16 | SRAM | Parallel | 256KX16 | 3-STATE | 16 | 10ns | 4194304 bit | 10 ns | COMMON | 1V | 1.194mm | 18.415mm | 10.16mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | IS42S16800F-7TL | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Commercial grade | 表面贴装 | 表面贴装 | 54-TSOP (0.400, 10.16mm Width) | 54 | Volatile | 0°C~70°C TA | Tray | e3 | yes | 活跃 | 3 (168 Hours) | 54 | EAR99 | Matte Tin (Sn) | AUTO/SELF REFRESH | 3V~3.6V | DUAL | 260 | 1 | 3.3V | 0.8mm | 10 | 54 | 不合格 | 3.3V | 3.6V | 3V | 128Mb 8M x 16 | 1 | 100mA | SYNCHRONOUS | 143MHz | 5.4ns | DRAM | Parallel | 16b | 8MX16 | 3-STATE | 14b | 128 Mb | 0.002A | COMMON | 4096 | 1.05mm | 22.42mm | 10.29mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | W25Q80EWSNIG | Winbond Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tube | 2016 | SpiFlash® | 活跃 | 3 (168 Hours) | 8 | 1.65V~1.95V | DUAL | 1 | 1.8V | 1.27mm | R-PDSO-G8 | 不合格 | 1.95V | 1.8V | 1.65V | SPI, Serial | 8Mb 1M x 8 | SYNCHRONOUS | 104MHz | FLASH | SPI | 8MX1 | 1 | 800μs | 0.0000075A | 8388608 bit | 1.8V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 1.75mm | 4.85mm | 3.9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 34AA02-E/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2011 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 40 | 34AA02 | 8 | 不合格 | 5V | 1.7V | I2C, Serial | 2Kb 256 x 8 | 3mA | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 5ms | 2 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1010DDDR | 1.05mm | 4.5mm | 3.1mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | BR25L160FVT-WE2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2005 | e2 | yes | 不用于新设计 | 1 (Unlimited) | 8 | EAR99 | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 10 | BR25L160 | 8 | 5V | SPI, Serial | 16Kb 2K x 8 | 3mA | 5MHz | 70 ns | EEPROM | SPI | 8 | 5ms | 16 kb | 0.000002A | SPI | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE/SOFTWARE | 1.25mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MX25L25645GZNI-08G | Macronix | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 8-WDFN Exposed Pad | Non-Volatile | -40°C~85°C TA | Tray | 2017 | MXSMIO™ | 活跃 | 3 (168 Hours) | 2.7V~3.6V | 未说明 | 未说明 | 256Mb 32M x 8 | 120MHz | FLASH | SPI | 30μs, 750μs | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IS42S16160G-6TL | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 54-TSOP (0.400, 10.16mm Width) | 54 | Volatile | 0°C~70°C TA | Tray | 活跃 | 3 (168 Hours) | 54 | EAR99 | AUTO/SELF REFRESH | 3V~3.6V | DUAL | 未说明 | 1 | 3.3V | 0.8mm | 未说明 | 54 | 不合格 | 3.3V | 3.6V | 3V | 256Mb 16M x 16 | 1 | 160mA | SYNCHRONOUS | 160mA | 166MHz | 5.4ns | DRAM | Parallel | 16b | 16MX16 | 3-STATE | 16 | 15b | 256 Mb | 0.004A | COMMON | 8192 | 1248FP | 1248 | 1.2mm | 22.22mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C144E-55AXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1 Weeks | 表面贴装 | 表面贴装 | 64-LQFP | 64 | Volatile | 0°C~70°C TA | Tray | 1996 | e4 | yes | Obsolete | 3 (168 Hours) | 64 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 4.5V~5.5V | QUAD | 260 | 1 | 5V | 0.8mm | 30 | 64 | 5V | 5V | 64Kb 8K x 8 | 2 | 275mA | SRAM | Parallel | 8KX8 | 3-STATE | 8 | 55ns | 26b | 64 kb | 0.0005A | 55 ns | COMMON | Asynchronous | 8b | 1.6mm | 14mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C194BN-15PC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 通孔 | 24-DIP (0.300, 7.62mm) | 24 | Volatile | 0°C~70°C TA | Tube | 2003 | e0 | no | Obsolete | 1 (Unlimited) | 24 | EAR99 | Tin/Lead (Sn/Pb) | 4.5V~5.5V | DUAL | 1 | 5V | 2.54mm | CY7C194 | 24 | 5V | 5V | 256Kb 64K x 4 | 1 | 80mA | SRAM | Parallel | 64KX4 | 3-STATE | 4 | 15ns | 16b | 256 kb | COMMON | Asynchronous | 4b | 4.826mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S25FL064P0XBHI020 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 表面贴装 | 表面贴装 | 24-TBGA | 24 | Non-Volatile | -40°C~85°C TA | Tray | 2013 | FL-P | Obsolete | 3 (168 Hours) | 24 | 3A991.B.1.A | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 1 | 3V | 1.2mm | 3.6V | 3/3.3V | 2.7V | SPI, Serial | 64Mb 8M x 8 | 26mA | 104MHz | 8 ns | FLASH | SPI - Quad I/O | 8b | 64MX1 | 1 | 5μs, 3ms | 1b | 64 Mb | 0.00001A | Synchronous | 1b | 3V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 256B | 1mm | 8mm | 无 | 无SVHC | ROHS3 Compliant |