类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 峰值回流焊温度(摄氏度) | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 工作电源电流 | 端口的数量 | 电源电流 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 筛选水平 | 访问时间(最大) | I/O类型 | 同步/异步 | 字长 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 输出启用 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 环境温度范围高 | 通用闪存接口 | I2C控制字节 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||
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![]() | CY7C1021CV33-10ZXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | 44 | Volatile | -40°C~85°C TA | Tray | 1996 | e4 | Obsolete | 3 (168 Hours) | 44 | Nickel/Palladium/Gold (Ni/Pd/Au) | 3V~3.6V | DUAL | 260 | 1 | 3.3V | 0.8mm | unknown | 10GHz | 20 | CY7C1021 | 44 | 不合格 | 3.3V | 3.63V | 2.97V | 1Mb 64K x 16 | 1 | 90mA | SRAM | Parallel | 3-STATE | 16 | 10ns | 16b | 1 Mb | 0.005A | COMMON | Asynchronous | 16b | 3V | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SST39VF6401B-70-4I-EKE-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | YES | 48 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2000 | SST39 MPF™ | e3 | 活跃 | 3 (168 Hours) | 48 | Matte Tin (Sn) - annealed | 2.7V~3.6V | DUAL | 0.5mm | SST39VF6401B | 3.3V | 64Mb 4M x 16 | 18mA | 70ns | FLASH | Parallel | 16b | 4MX16 | 16 | 10μs | 22b | 64 Mb | 0.00002A | Asynchronous | 16b | YES | YES | YES | 2K | 2K | BOTTOM | YES | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MX25L2006EM1I-12G | Macronix | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tube | 2009 | MX25xxx05/06 | 不用于新设计 | 3 (168 Hours) | 8 | 3A991.B.1.A | 2.7V~3.6V | DUAL | 未说明 | 1 | 3V | 1.27mm | 未说明 | 8 | R-PDSO-G8 | 不合格 | 3.6V | 3/3.3V | 2.7V | SPI, Serial | 2Mb 256K x 8 | SYNCHRONOUS | 86MHz | FLASH | SPI | 1MX2 | 2 | 50μs, 3ms | 2 Mb | 0.00001A | 2.7V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 1 | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S29GL032N90FFI010 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 64-LBGA | 64 | Non-Volatile | -40°C~85°C TA | Tray | 2003 | GL-N | e1 | 活跃 | 3 (168 Hours) | 64 | 3A991.B.1.A | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 260 | 1 | 3V | 1mm | 40 | 3.6V | 3/3.3V | 2.7V | 32Mb 4M x 8 2M x 16 | 50mA | FLASH | Parallel | 16b | 2MX16 | 16 | 90ns | 32 Mb | 0.000005A | 90 ns | Asynchronous | 3V | 8 | YES | YES | YES | 64 | 64K | 8/16words | YES | BOTTOM/TOP | YES | 1.4mm | 13mm | 无 | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
![]() | CY7C1620KV18-333BZXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 表面贴装 | 165-LBGA | 165 | Volatile | -40°C~85°C TA | Tray | 2003 | e1 | 活跃 | 3 (168 Hours) | 165 | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 1.7V~1.9V | BOTTOM | 260 | 1 | 1.8V | 40 | CY7C1620 | 165 | 1.8V | 144Mb 4M x 36 | 1 | 790mA | 333MHz | 450 ps | SRAM | Parallel | 4MX36 | 3-STATE | 36 | 22b | 144 Mb | COMMON | Synchronous | 36b | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M24C64-WBN6P | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tin | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | Non-Volatile | -40°C~85°C TA | Tube | e3 | Obsolete | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 1 | 5V | 2.54mm | M24C64 | 8 | 5.5V | 3/5V | 2.5V | 2-Wire, I2C, Serial | 64Kb 8K x 8 | 5mA | 1MHz | 450ns | EEPROM | I2C | 5ms | 64 kb | 0.000002A | I2C | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 1010DDDR | 3.3mm | 9.27mm | 6.35mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | BU9833GUL-WE2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 6-UFBGA, CSPBGA | 6 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2010 | yes | 活跃 | 1 (Unlimited) | 6 | EAR99 | 8542.32.00.51 | 1.7V~5.5V | BOTTOM | 未说明 | 1 | 2.5V | 0.5mm | 未说明 | BU9833 | 6 | 不合格 | 5.5V | 1.8/5V | 1.7V | 2-Wire, I2C, Serial | 2Kb 256 x 8 | SYNCHRONOUS | 400kHz | EEPROM | I2C | 8 | 5ms | 2 kb | 0.000002A | I2C | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 1010D00R | 0.55mm | 1.5mm | 1.27mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY14B104LA-ZS45XI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Gold, Tin | 表面贴装 | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | 44 | Non-Volatile | -40°C~85°C TA | Tray | 2011 | e4 | 活跃 | 3 (168 Hours) | 44 | 3A991.B.2.A | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.32.00.41 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 0.8mm | 30 | CY14B104 | 44 | 3V | 3.6V | 2.7V | 4Mb 512K x 8 | 52mA | NVSRAM | Parallel | 8b | 512KX8 | 8 | 45ns | 4 Mb | 0.005A | 45 ns | 8b | 1.194mm | 18.415mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 24AA02E48-E/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Automotive grade | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | Non-Volatile | -40°C~125°C TA | Tube | 2010 | e3 | 活跃 | 1 (Unlimited) | 8 | 100KHZ AVAILABLE @1.7V | 1.7V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 24AA02E48 | R-PDSO-G8 | 不合格 | 5.5V | 1.8/5V | 2.5V | 2-Wire, I2C, Serial | 2Kb 256 x 8 | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 256X8 | 8 | 5ms | 0.000005A | 2048 bit | TS 16949 | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | 1010XXXR | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY7C144-55JC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 68-LCC (J-Lead) | YES | 68 | Volatile | 0°C~70°C TA | 1996 | e0 | Obsolete | 3 (168 Hours) | 68 | EAR99 | Tin/Lead (Sn/Pb) | SEMAPHORE | 8542.32.00.41 | 4.5V~5.5V | QUAD | 220 | 1 | 5V | 1.27mm | not_compliant | 未说明 | CY7C144 | 68 | 不合格 | 5.5V | 5V | 4.5V | 64Kb 8K x 8 | 2 | 0.16mA | SRAM | Parallel | 8KX8 | 3-STATE | 8 | 55ns | 0.015A | 65536 bit | 55 ns | COMMON | 4.5V | YES | 5.08mm | 24.2316mm | 24.2316mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MX25L25645GMI-08G | Macronix | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | Non-Volatile | -40°C~85°C TA | Tube | MXSMIO™ | e3 | 活跃 | 3 (168 Hours) | Tin (Sn) | 2.7V~3.6V | 未说明 | 未说明 | 256Mb 32M x 8 | 120MHz | FLASH | SPI | 30μs, 750μs | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 25LC1024T-E/MF | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 8-VDFN Exposed Pad | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2008 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 200 YEARS OF DATA RETENTION; 1000000 ENDURANCE CYCLES/WORD | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 25LC1024 | 8 | 5.5V | 3/5V | 2.5V | SPI, Serial | 1Mb 128K x 8 | 10mA | 20MHz | 50 ns | EEPROM | SPI | 8 | 6ms | 1 Mb | 0.000001A | SPI | 100000 Write/Erase Cycles | 6ms | HARDWARE/SOFTWARE | 1mm | 6mm | 5mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY7C1021D-10ZSXIT | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | 44 | Volatile | -40°C~85°C TA | Tape & Reel (TR) | 1996 | e4 | yes | 活跃 | 3 (168 Hours) | 44 | Nickel/Palladium/Gold (Ni/Pd/Au) | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 0.8mm | 30 | CY7C1021 | 44 | 5V | 5V | 1Mb 64K x 16 | 1 | 80mA | SRAM | Parallel | 3-STATE | 16 | 10ns | 16b | 1 Mb | 0.003A | 100MHz | COMMON | Asynchronous | 16b | 2V | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | BQ4010YMA-150 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tin | 通孔 | 通孔 | 28-DIP Module (0.61, 15.49mm) | 28 | Non-Volatile | 0°C~70°C TA | Tube | no | Obsolete | 1 (Unlimited) | 28 | EAR99 | 8542.32.00.41 | 4.5V~5.5V | DUAL | 1 | 5V | 2.54mm | BQ4010 | 5V | 5V | 64Kb 8K x 8 | 50mA | 50mA | NVSRAM | Parallel | 8b | 8KX8 | 8 | 150ns | 64 kb | 0.004A | 150 ns | 8b | 9.53mm | 37.72mm | 无 | ROHS3 Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AT25256AN-10SU-1.8 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | 8-SOIC | Non-Volatile | -40°C~85°C TA | Tube | Obsolete | 1 (Unlimited) | 85°C | -40°C | 1.8V~5.5V | 20MHz | AT25256 | 5V | SPI, Serial | 5.5V | 1.8V | 256Kb 32K x 8 | 10mA | 20MHz | 80 ns | EEPROM | SPI | 5ms | 256 kb | 5MHz | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYDMX256A16-65BVXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 100-VFBGA | 100 | Volatile | -40°C~85°C TA | Tray | 2011 | e1 | Obsolete | 3 (168 Hours) | 100 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.8V~3.3V | BOTTOM | 260 | 1 | 1.8V | 0.5mm | 40 | CYDMX | 100 | 1.9V | 1.8/3V | 1.7V | 256Kb 16K x 16 | 2 | 70mA | SRAM | Parallel | 16KX16 | 3-STATE | 16 | 65ns | 14b | 256 kb | 0.000006A | 65 ns | COMMON | Asynchronous | 16b | 1mm | 6mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AT28HC256-12TU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | Military grade | Tin | 表面贴装 | 表面贴装 | 28-TSSOP (0.465, 11.80mm Width) | 28 | Non-Volatile | -40°C~85°C TC | Tray | 1997 | e3 | yes | 活跃 | 3 (168 Hours) | 28 | 自动写入 | 4.5V~5.5V | DUAL | 1 | 5V | 0.55mm | 5MHz | AT28HC256 | 5V | 5V | 256Kb 32K x 8 | 80mA | 120ns | EEPROM | Parallel | 32KX8 | 3-STATE | 8 | 10ms | 256 kb | 0.0003A | MIL-STD-883 | 5V | 10000 Write/Erase Cycles | 10ms | YES | YES | NO | 64words | 1.2mm | 11.8mm | 8mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 24AA64/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | Non-Volatile | 0°C~70°C TA | Tube | 2007 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED | 1.7V~5.5V | DUAL | 1 | 2.5V | 2.54mm | 24AA64 | 8 | 5.5V | 2/5V | I2C, Serial | 64Kb 8K x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 64 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 93LC86A-E/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2008 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 2.5V~5.5V | DUAL | 260 | 1 | 3V | 1.27mm | 40 | 93LC86A | 8 | 5V | Serial | 16Kb 2K x 8 | 3mA | 3MHz | 100 ns | EEPROM | SPI | 8 | 5ms | 16 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 6ms | 200 | SOFTWARE | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | FM24CL64B-DGTR | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-WDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2008 | F-RAM™ | e3 | 活跃 | 3 (168 Hours) | 8 | EAR99 | Tin (Sn) | 2.7V~3.6V | DUAL | 260 | 1 | 3.3V | 0.95mm | 30 | FM24CL64 | 8 | 不合格 | 3.6V | 3.65V | 3/3.3V | 2.7V | 2-Wire, I2C | 64Kb 8K x 8 | 300μA | SYNCHRONOUS | 1MHz | 550ns | FRAM | I2C | 8b | 8 | 64 kb | 0.000006A | 8b | 85°C | 800μm | 4.5mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SST39SF020A-55-4I-WHE | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 32-TFSOP (0.488, 12.40mm Width) | YES | 32 | Non-Volatile | -40°C~85°C TA | Tray | 2000 | SST39 MPF™ | e3 | 活跃 | 2 (1 Year) | 32 | 3A991.B.1.A | Matte Tin (Sn) | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 0.5mm | 40 | SST39SF020A | 32 | 5V | 2Mb 256K x 8 | 25mA | ASYNC-LATCHED | 55ns | FLASH | Parallel | 8b | 256KX8 | 8 | 20μs | 18b | 2 Mb | Asynchronous | 8b | 5V | 1.2mm | 12.4mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MX25L6406EMI-12G | Macronix | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tube | 2010 | MX25xxx05/06 | 不用于新设计 | 3 (168 Hours) | 16 | 3A991.B.1.A | 8542.32.00.51 | 2.7V~3.6V | DUAL | 未说明 | 1 | 3V | 1.27mm | 未说明 | 16 | R-PDSO-G16 | 不合格 | 3.6V | 3/3.3V | 2.7V | SPI, Serial | 64Mb 8M x 8 | SYNCHRONOUS | 86MHz | FLASH | SPI | 32MX2 | 2 | 300μs, 5ms | 64 Mb | 0.00002A | 3V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 1 | 2.65mm | 10.3mm | 7.52mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | W25Q128FWPIG | Winbond Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 8-WDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2016 | SpiFlash® | 活跃 | 3 (168 Hours) | 8 | 1.65V~1.95V | DUAL | 1 | 1.8V | 1.27mm | 8 | 不合格 | 1.8V | 1.95V | 1.7V | SPI, Serial | 128Mb 16M x 8 | SYNCHRONOUS | 104MHz | 6 ns | FLASH | SPI - Quad I/O, QPI | 1 | 60μs, 5ms | 128 Mb | 0.00002A | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 256B | 6mm | 5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AT27C256R-45JU-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 32-LCC (J-Lead) | YES | Non-Volatile | -40°C~85°C TC | Tape & Reel (TR) | e3 | 活跃 | 3 (168 Hours) | 32 | 哑光锡 | 4.5V~5.5V | QUAD | 未说明 | 1 | 5V | 1.27mm | 未说明 | R-PQCC-J32 | 5.5V | 4.5V | 256Kb 32K x 8 | ASYNCHRONOUS | 45ns | EPROM | Parallel | 32KX8 | 8 | 262144 bit | 3.556mm | 13.97mm | 11.43mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | BU9889GUL-WE2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 表面贴装 | 6-UFBGA, CSPBGA | 6 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2012 | yes | 活跃 | 1 (Unlimited) | 6 | EAR99 | 8542.32.00.51 | 1.7V~5.5V | BOTTOM | 未说明 | 1 | 2.5V | 0.5mm | 未说明 | BU9889 | 6 | 不合格 | 5.5V | 1.8/5V | 1.7V | 2-Wire, I2C, Serial | 8Kb 1K x 8 | SYNCHRONOUS | 400kHz | EEPROM | I2C | 1KX8 | 8 | 5ms | 8 kb | 0.000002A | I2C | 100000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 1010DMMR | 0.55mm | 1mm | ROHS3 Compliant | 无铅 |