类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 端口的数量 | 电源电流 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 无卤素 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 访问时间（最大） | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 内存IC类型 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 环境温度范围高 | 通用闪存接口 | I2C控制字节 | 反向引脚排列 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||||||||||||||||||||||
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 | SST25VF040B-50-4I-QAF-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 8-WDFN Exposed Pad | YES | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 1998 | SST25 | e4 | 活跃 | 3 (168 Hours) | 8 | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.7V~3.6V | DUAL | 1 | 1.27mm | SST25VF040B | 3.3V | 3.6V | 2.7V | SPI, Serial | 4Mb 512K x 8 | 50MHz | 0.03mA | FLASH | SPI | 8b | 4MX1 | 1 | 10μs | 1b | 4 Mb | 0.00002A | 2.7V | SPI | 100000 Write/Erase Cycles | 100 | HARDWARE/SOFTWARE | 6mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1412KV18-250BZXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 表面贴装 | 165-LBGA | 165 | Volatile | 0°C~70°C TA | Tray | 2003 | e1 | 活跃 | 3 (168 Hours) | 165 | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 1.7V~1.9V | BOTTOM | 260 | 1 | 1.8V | 1mm | 30 | CY7C1412 | 165 | 1.8V | 1.9V | 1.7V | 36Mb 2M x 18 | 2 | 610mA | 250MHz | 450 ps | SRAM | Parallel | 3-STATE | 18 | 40b | 36 Mb | SEPARATE | Synchronous | 18b | 1.7V | 1.4mm | 15mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT24CS04-SSHM-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Gold | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2005 | e4 | yes | 活跃 | 1 (Unlimited) | 8 | 1.7V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | AT24CS04 | 5.5V | 1.7V | 2-Wire, I2C, Serial | 4Kb 512 x 8 | 3mA | 1MHz | 550ns | EEPROM | I2C | 8 | 5ms | 4 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE | 1010DDMR | 1.75mm | 4.925mm | 3.9mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 23K640T-E/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2010 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) - annealed | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 0.65mm | 40 | 23K640 | 8 | 不合格 | 3.3V | 3.6V | 2.7V | SPI, Serial | 64Kb 8K x 8 | 1 | 10mA | 20MHz | 32 ns | SRAM | SPI | 3-STATE | 8 | 1b | 64 kb | SEPARATE | Synchronous | 8b | 2.7V | 4.4mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MT29F4G08ABBDAH4-IT:D | Micron Technology Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | Industrial grade | 表面贴装 | 表面贴装 | 63-VFBGA | 63 | Non-Volatile | -40°C~85°C TA | Tray | 2011 | yes | 活跃 | 3 (168 Hours) | 63 | 1.7V~1.95V | BOTTOM | 260 | 1 | 1.8V | 0.8mm | 30 | MT29F4G08 | 1.8V | 1.95V | 1.7V | 4Gb 512M x 8 | 20mA | 25 ns | FLASH | Parallel | 512MX8 | 8 | 1b | 4 Gb | 0.00005A | Asynchronous | 8b | NO | NO | YES | 4K | 128K | 2kB | YES | 1mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M29DW323DT70N6E | Micron Technology Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | YES | 48 | Non-Volatile | -40°C~85°C TA | Tray | 2004 | e3 | yes | Obsolete | 3 (168 Hours) | 48 | SMD/SMT | 3A991.B.1.A | 哑光锡 | TOP BOOT BLOCK | 8542.32.00.51 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 0.5mm | 30 | M29DW323 | 48 | 3/3.3V | 2.7V | 32Mb 4M x 8 2M x 16 | 10mA | FLASH | Parallel | 2MX16 | 16 | 70ns | 32 Mb | 0.0001A | 70 ns | Asynchronous | 8 | YES | YES | YES | 863 | 8K64K | YES | TOP | YES | 1.2mm | 18.4mm | 12mm | 无 | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S29GL032N11TFIV20 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 56-TFSOP (0.724, 18.40mm Width) | 56 | Non-Volatile | -40°C~85°C TA | Tray | 2003 | GL-N | e3 | 活跃 | 3 (168 Hours) | 56 | 3A991.B.1.A | 哑光锡 | 8542.32.00.51 | 1.65V~3.6V | DUAL | 260 | 1 | 3V | 0.5mm | 40 | 3.6V | 1.8/3.33/3.3V | 2.7V | 32Mb 4M x 8 2M x 16 | 50mA | FLASH | Parallel | 16b | 2MX16 | 16 | 110ns | 32 Mb | 0.000005A | 110 ns | Asynchronous | 3V | 8 | YES | YES | YES | 64 | 64K | 8/16words | YES | BOTTOM/TOP | YES | 1.2mm | 18.4mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24LC16BHT-E/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 17 Weeks | Gold | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2007 | e3 | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 2.5V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 40 | 24LC16BH | 8 | 不合格 | 5V | 1.7V | I2C, Serial | 16Kb 2K x 8 | 3mA | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 16 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010MMMR | 1.2mm | 4.4mm | 3mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 93AA66C-I/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2008 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.8V~5.5V | DUAL | 1 | 2.5V | 2.54mm | 93AA66C | 8 | 5.5V | 2/5V | Serial | 4Kb 512 x 8 256 x 16 | 2mA | 3MHz | 200 ns | EEPROM | SPI | 256X16 | 6ms | 4 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 6ms | 200 | SOFTWARE | 3.3mm | 9.27mm | 6.35mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 23K640-E/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Volatile | -40°C~125°C TA | Tube | 2011 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) - annealed | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 40 | 23K640 | 8 | 3.3V | 3.6V | 2.7V | SPI, Serial | 64Kb 8K x 8 | 1 | 10mA | 20MHz | 25 ns | SRAM | SPI | 3-STATE | 8 | 1b | 64 kb | SEPARATE | Synchronous | 8b | 2.7V | 4.9mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png) | 93AA66C-I/SNG | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY62256LL-70SNXCT | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 28-SOIC (0.295, 7.50mm Width) | 28 | 28-SOIC | Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2005 | MoBL® | Obsolete | 1 (Unlimited) | 70°C | 0°C | 4.5V~5.5V | 70GHz | CY62256 | 5V | Parallel | 5.5V | 4.5V | 256Kb 32K x 8 | 1 | 50mA | 70ns | SRAM | Parallel | 70ns | 15b | 256 kb | Asynchronous | 8b | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24LC08B/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | 0°C~70°C TA | Tube | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 3V | 0.65mm | 40 | 24LC08B | 8 | 5.5V | 3/5V | 2.5V | I2C, Serial | 8Kb 256 x 8 x 4 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 8 kb | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010XMMR | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | W25Q16FWSSIQ | Winbond Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tube | 2016 | SpiFlash® | 最后一次购买 | 3 (168 Hours) | 8 | 1.65V~1.95V | DUAL | 未说明 | 1 | 1.8V | 1.27mm | 未说明 | S-PDSO-G8 | 1.95V | 1.65V | SPI, Serial | 16Mb 2M x 8 | SYNCHRONOUS | 104MHz | FLASH | SPI - Quad I/O, QPI | 16MX1 | 1 | 60μs, 3ms | 16777216 bit | 1.8V | 2.16mm | 5.28mm | 5.28mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 93AA66/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 28 Weeks | Tin | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | 0°C~70°C TA | Tube | 2004 | e3 | yes | 活跃 | 3 (168 Hours) | 8 | EAR99 | 100K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS | 1.8V~5.5V | DUAL | 260 | 1 | 3V | 1.27mm | 40 | 93AA66 | 8 | 1.8V | 5.5V | 2/5V | Serial | 4Kb 512 x 8 256 x 16 | 3mA | 2MHz | EEPROM | SPI | 256X16 | 3-STATE | 16 | 10ms | 4 kb | 0.00003A | MICROWIRE | 10000000 Write/Erase Cycles | 10ms | 200 | SOFTWARE | 8 | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 25LC320T/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2004 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 1M ENDURANCE CYCLE; 200 YEARS DATA RETENTION | 2.5V~5.5V | DUAL | 260 | 1 | 1.27mm | 40 | 25LC320 | 8 | 5.5V | 3/5V | 2.5V | SPI, Serial | 32Kb 4K x 8 | 5mA | 2MHz | 230 ns | EEPROM | SPI | 8 | 5ms | 32 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PC28F128P30TF65A | Micron Technology Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 表面贴装 | 64-TBGA | YES | 64 | Non-Volatile | -40°C~85°C TA | Tray | 2009 | StrataFlash™ | e1 | yes | Obsolete | 3 (168 Hours) | 64 | 3A991.B.1.A | 锡银铜 | 8542.32.00.51 | 1.7V~2V | BOTTOM | 260 | 1 | 1.8V | 1mm | 30 | 28F128P30 | 64 | 1.8V | 1.81.8/3.3V | 1.7V | Parallel, Serial | 128Mb 8M x 16 | 28mA | 52MHz | FLASH | Parallel | 8MX16 | 16 | 65ns | 23b | 128 Mb | 0.000055A | 65 ns | Asynchronous | 16b | NO | NO | 4127 | 8words | TOP | 1.2mm | 13mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CAT24AA16TDI-GT3 | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 45 Weeks | Industrial grade | ACTIVE (Last Updated: 4 days ago) | Gold | 表面贴装 | 表面贴装 | SOT-23-5 Thin, TSOT-23-5 | 5 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2008 | e4 | yes | 活跃 | 1 (Unlimited) | 5 | EAR99 | 1.7V~5.5V | DUAL | 260 | 1 | 3.3V | 40 | CAT24AA | 5 | 不合格 | 5V | 1.7V | 2-Wire, I2C, Serial | 16Kb 2K x 8 | 1mA | SYNCHRONOUS | 1MHz | 400ns | EEPROM | I2C | 2KX8 | 无卤素 | 5ms | 16 kb | I2C | 900μm | 2.9mm | 1.6mm | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24AA256-I/PG | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | DIP, DIP8,.3 | IN-LINE | 32000 | PLASTIC/EPOXY | DIP8,.3 | -40 °C | 未说明 | 85 °C | 有 | 24AA256-I/PG | 0.4 MHz | 32768 words | DIP | RECTANGULAR | Microchip Technology Inc | Obsolete | MICROCHIP TECHNOLOGY INC | 5.41 | DIP | NO | 8 | Compliant | Bulk | e3 | 有 | EAR99 | Matte Tin (Sn) | 85 °C | -40 °C | 8542.32.00.51 | EEPROMs | CMOS | DUAL | THROUGH-HOLE | 未说明 | 1 | 2.54 mm | compliant | 400 kHz | 8 | R-PDIP-T8 | 不合格 | 5.5 V | 2/5 V | INDUSTRIAL | 1.7 V | I2C | 5.5 V | 1.8 V | 32 kB | SYNCHRONOUS | 0.003 mA | 900 ns | 32KX8 | 5.334 mm | 8 | 0.000001 A | 262144 bit | 400 kHz | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 1010DDDR | NO | 9.271 mm | 7.62 mm | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | W29N02GVSIAA | Winbond Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | 48 | Non-Volatile | -40°C~85°C TA | Tray | 2011 | e3 | 活跃 | 3 (168 Hours) | 48 | 3A991.B.1.A | Tin (Sn) | 8542.32.00.51 | 2.7V~3.6V | DUAL | 未说明 | 1 | 3.3V | 0.5mm | 未说明 | 3V | 3.6V | 2.7V | 2Gb 256M x 8 | ASYNCHRONOUS | FLASH | Parallel | 2GX1 | 1 | 25ns | 2 Gb | 256B | 85°C | 1.2mm | 18.4mm | 12mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 93C66C-I/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2007 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 4.5V~5.5V | DUAL | 1 | 2.5V | 2.54mm | 93C66C | 8 | 5V | 5V | Serial | 4Kb 512 x 8 256 x 16 | 2mA | 3MHz | 200 ns | EEPROM | SPI | 256X16 | 2ms | 4 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 2ms | 200 | SOFTWARE | 4.953mm | 10.16mm | 7.112mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AT25256AN-10SU-2.7 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Gold, Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | 8-SOIC | Non-Volatile | -40°C~85°C TA | Tube | Obsolete | 1 (Unlimited) | 85°C | -40°C | 2.7V~5.5V | 20MHz | AT25256 | 5V | SPI, Serial | 5.5V | 2.7V | 256Kb 32K x 8 | 10mA | 20MHz | 40 ns | EEPROM | SPI | 5ms | 256 kb | 10MHz | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AT93C56A-10PU-2.7 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | 8-PDIP | Non-Volatile | -40°C~85°C TA | Tube | Obsolete | 不适用 | 85°C | -40°C | 2.7V~5.5V | 2MHz | AT93C56A | 5V | 5V | Serial | 5.5V | 2.7V | 2Kb 256 x 8 128 x 16 | 2mA | 2MHz | 2 μs | EEPROM | SPI | 10ms | 2 kb | 2MHz | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1470V25-200AXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 100-LQFP | 100 | Volatile | 0°C~70°C TA | Tray | 2004 | NoBL™ | e3 | yes | 活跃 | 3 (168 Hours) | 100 | 3A991.B.2.A | Matte Tin (Sn) | 流水线结构 | 2.375V~2.625V | QUAD | 260 | 1 | 2.5V | 0.65mm | 20 | CY7C1470 | 100 | 2.5V | 2.625V | 2.375V | 72Mb 2M x 36 | 4 | 450mA | 200MHz | 3ns | SRAM | Parallel | 2MX36 | 3-STATE | 36 | 21b | 72 Mb | COMMON | Synchronous | 36b | 2.38V | 1.6mm | 20mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1399BN-15ZXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 表面贴装 | 表面贴装 | 28-TSSOP (0.465, 11.80mm Width) | 28 | Volatile | -40°C~85°C TA | Tray | 2010 | e4 | yes | 最后一次购买 | 3 (168 Hours) | 28 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 3V~3.6V | DUAL | 260 | 1 | 3.3V | 0.55mm | 15GHz | 20 | CY7C1399 | 28 | 3.3V | 3.6V | 3V | 256Kb 32K x 8 | 1 | 50mA | SRAM | Parallel | 32KX8 | 3-STATE | 8 | 15ns | 15b | 256 kb | 0.0005A | COMMON | Asynchronous | 8b | 3V | 无 | 无SVHC | ROHS3 Compliant | 无铅 |