类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 端口的数量 | 电源电流 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 无卤素 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 筛选水平 | 访问时间（最大） | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 内存IC类型 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 准备就绪/忙碌 | 引导模块 | 刷新周期 | 通用闪存接口 | I2C控制字节 | 顺序突发长度 | 交错突发长度 | 反向引脚排列 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | AT24C16C-SSPD-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 1997 | Automotive, AEC-Q100 | e4 | 活跃 | 3 (168 Hours) | 8 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.5V~5.5V | DUAL | 260 | 1 | 3V | 1.27mm | 40 | AT24C16C | 不合格 | 5.5V | 3/5V | 2.5V | 2-Wire, Serial | 16Kb 2K x 8 | 3mA | SYNCHRONOUS | 1MHz | 550ns | EEPROM | I2C | 8 | 5ms | 16 kb | 0.000004A | I2C | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE | 1010MMMR | 1.75mm | 4.925mm | 3.9mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png) | 24LC04B-E/SNG | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 小概要 | 1 | 512 | PLASTIC/EPOXY | SOP8,.25 | -40 °C | 40 | 125 °C | 有 | 24LC04B-E/SNG | 0.4 MHz | 512 words | SOP | RECTANGULAR | Microchip Technology Inc | 活跃 | MICROCHIP TECHNOLOGY INC | 5.08 | SOIC | YES | 5 | SOP, SOP8,.25 | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | EEPROMs | CMOS | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | 不合格 | 5.5 V | 3/5 V | AUTOMOTIVE | 2.5 V | SYNCHRONOUS | 0.003 mA | 512X8 | 1.75 mm | 8 | 0.000005 A | 4096 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 1010XXMR | NO | 4.9 mm | 3.9 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C009V-15AXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | 表面贴装 | 表面贴装 | 100-LQFP | 100 | Volatile | 0°C~70°C TA | Tray | 1997 | e3 | Obsolete | 3 (168 Hours) | 100 | Matte Tin (Sn) | 3V~3.6V | QUAD | 260 | 1 | 3.3V | 0.5mm | 15GHz | 30 | CY7C009 | 100 | 3.3V | 3.6V | 3V | 1Mb 128K x 8 | 2 | 185mA | SRAM | Parallel | 3-STATE | 8 | 15ns | 34b | 1 Mb | 0.00005A | 15 ns | COMMON | Asynchronous | 8b | 3V | 1.6mm | 14mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | BR93H46RFVM-2CTR | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | Automotive grade | 表面贴装 | 8-VSSOP, 8-MSOP (0.110, 2.80mm Width) | YES | 8 | Non-Volatile | -40°C~125°C TA | Cut Tape (CT) | 2012 | Automotive, AEC-Q100 | 活跃 | 1 (Unlimited) | 8 | 2.5V~5.5V | DUAL | 未说明 | 1 | 4V | 0.65mm | 未说明 | 不合格 | 5.5V | 3/5V | 2.5V | 1Kb 64 x 16 | SYNCHRONOUS | 2MHz | EEPROM | SPI | 64X16 | 16 | 4ms | 0.00001A | 1024 bit | SERIAL | MICROWIRE | 1000000 Write/Erase Cycles | 4ms | 100 | SOFTWARE | 0.9mm | 2.9mm | Unknown | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | RMLV0816BGSB-4S2#AA0 | Renesas Electronics America | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | Volatile | -40°C~85°C TA | Tray | 2015 | yes | 活跃 | 3 (168 Hours) | 2.4V~3.6V | 44 | 8Mb 512K x 16 | SRAM | Parallel | 45ns | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24LC01BH-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2008 | e3 | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 4.5V | 1.27mm | 40 | 24LC01BH | 8 | 5V | 2-Wire, I2C, Serial | 1Kb 128 x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 1 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010XXXR | 1.75mm | 4.9mm | 3.9mm | 无 | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 25LC160/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | 8-PDIP | Non-Volatile | 0°C~70°C TA | Tube | 活跃 | 1 (Unlimited) | 70°C | 0°C | 2.5V~5.5V | 2MHz | 25LC160 | 2.5V | SPI, Serial | 5.5V | 2.5V | 16Kb 2K x 8 | 5mA | 2MHz | 230 ns | EEPROM | SPI | 5ms | 16 kb | 2MHz | 3.68mm | 9.78mm | 6.6mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24LC16BH-I/MS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2008 | e3 | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 40 | 24LC16BH | 8 | 5V | 1.7V | I2C, Serial | 16Kb 2K x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 16 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010MMMR | 1.1mm | 3mm | 3mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | IS43DR16128C-25DBLI | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Industrial grade | 表面贴装 | 84-TFBGA | YES | Volatile | -40°C~85°C TA | Tray | 活跃 | 3 (168 Hours) | 84 | EAR99 | PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH | 1.7V~1.9V | BOTTOM | 1 | 1.8V | 0.8mm | R-PBGA-B84 | 不合格 | 1.9V | 1.8V | 1.7V | 2Gb 128M x 16 | 1 | SYNCHRONOUS | 400MHz | 400ns | DRAM | Parallel | 128MX16 | 3-STATE | 16 | 15ns | 0.03A | 2147483648 bit | COMMON | 8192 | 48 | 48 | 1.2mm | 12.5mm | 8mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24AA1026-I/SM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | Tin | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | YES | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2011 | e3 | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.7V~5.5V | DUAL | 260 | 1 | 1.27mm | 40 | 24AA1026 | 8 | 不合格 | 5.5V | 1.7V | I2C, Serial | 1Mb 128K x 8 | 5mA | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 5ms | 1 Mb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDMR | NO | 1.98mm | 5.26mm | 5.25mm | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 93AA66CT-I/MNY | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Gold | 表面贴装 | 表面贴装 | 8-WFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2011 | e4 | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.8V~5.5V | DUAL | 260 | 1 | 5V | 0.5mm | 40 | 93AA66C | 8 | 5.5V | Serial | 4Kb 512 x 8 256 x 16 | 2mA | SYNCHRONOUS | 3MHz | 200 ns | EEPROM | SPI | 256X16 | 16 | 6ms | 4 kb | MICROWIRE | 6ms | 8 | 3mm | 2mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24AA025-I/MS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2008 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 40 | 24AA025 | 8 | 不合格 | 2.5V | 5.5V | 2/5V | 1.7V | I2C, Serial | 2Kb 256 x 8 | 3mA | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 2 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | 1010DDDR | 1.1mm | 3mm | 3mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1414KV18-250BZC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 表面贴装 | 165-LBGA | 165 | Volatile | 0°C~70°C TA | Tray | 2003 | e0 | 活跃 | 3 (168 Hours) | 165 | Tin/Lead (Sn/Pb) | 流水线结构 | 1.7V~1.9V | BOTTOM | 235 | 1 | 1.8V | 1mm | 20 | CY7C1414 | 165 | 1.8V | 1.9V | 1.7V | 36Mb 1M x 36 | 2 | 730mA | 250MHz | 450 ps | SRAM | Parallel | 1MX36 | 3-STATE | 36 | 19b | 36 Mb | SEPARATE | Synchronous | 36b | 1.7V | 1.4mm | 15mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT49BV163D-70TU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | Non-Volatile | -40°C~85°C TC | Tray | 1997 | Obsolete | 3 (168 Hours) | 2.65V~3.6V | AT49BV163 | 16Mb 2M x 8 1M x 16 | 70ns | FLASH | Parallel | 120μs | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M29DW323DB70N6E | Micron Technology Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tin | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | YES | 48 | Non-Volatile | -40°C~85°C TA | Tray | 2004 | e3 | yes | Obsolete | 3 (168 Hours) | 48 | SMD/SMT | 3A991.B.1.A | 底部启动区块 | 8542.32.00.51 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 0.5mm | 30 | M29DW323 | 48 | 3/3.3V | 2.7V | 32Mb 4M x 8 2M x 16 | 10mA | FLASH | Parallel | 2MX16 | 16 | 70ns | 32 Mb | 0.0001A | 70 ns | Asynchronous | 8 | YES | YES | YES | 863 | 8K64K | YES | BOTTOM | YES | 1.2mm | 18.4mm | 12mm | 无 | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT27C1024-70JU-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 2 Weeks | 表面贴装 | 表面贴装 | 44-LCC (J-Lead) | 44 | Non-Volatile | -40°C~85°C TC | Tape & Reel (TR) | 1997 | e3 | 活跃 | 2 (1 Year) | 44 | Matte Tin (Sn) - annealed | 4.5V~5.5V | QUAD | 未说明 | 1 | 5V | 1.27mm | 未说明 | 5V | 1Mb 64K x 16 | 30mA | ASYNCHRONOUS | 70ns | EPROM | Parallel | 64KX16 | 16 | 1048576 bit | 4.572mm | 16.586mm | 16.586mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CAV24C32YE-GT3 | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Automotive grade | ACTIVE (Last Updated: 2 days ago) | Gold | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2008 | Automotive, AEC-Q100 | e4 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 未说明 | 1 | 3.3V | 0.65mm | 未说明 | CAV24C32 | 8 | 5V | 2-Wire, I2C, Serial | 32Kb 4K x 8 | 2mA | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 无卤素 | 5ms | 32 kb | I2C | 5ms | 1.05mm | 4.5mm | 3.1mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT24MAC402-MAHM-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3 Weeks | 表面贴装 | 表面贴装 | 8-UFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Cut Tape (CT) | 2008 | e4 | yes | 活跃 | 1 (Unlimited) | 8 | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 0.5mm | 40 | AT24MAC402 | 5.5V | 1.7V | 2-Wire, I2C, Serial | 2Kb 256 x 8 | 3mA | 1MHz | 550ns | EEPROM | I2C | 8 | 5ms | 2 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE/SOFTWARE | 1010DDDR | 0.6mm | 3mm | 2mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST25VF016B-50-4C-QAF-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Automotive grade | 表面贴装 | 表面贴装 | 8-WDFN Exposed Pad | 8 | Non-Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2010 | SST25 | 活跃 | 3 (168 Hours) | 8 | 2.7V~3.6V | DUAL | 1 | 1.27mm | SST25VF016B | 3.3V | 3.6V | 2.7V | SPI, Serial | 16Mb 2M x 8 | 15mA | 50MHz | 8 ns | FLASH | SPI | 8b | 64MX1 | 1 | 10μs | 1b | 16 Mb | 0.00002A | TS 16949 | Synchronous | 8b | 2.7V | SPI | 100000 Write/Erase Cycles | 100 | HARDWARE/SOFTWARE | 6mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 25LC160DT-E/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) - annealed | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 25LC160D | 8 | 5V | SPI, Serial | 16Kb 2K x 8 | 5mA | 10MHz | 100 ns | EEPROM | SPI | 8 | 5ms | 16 kb | 0.000005A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 34LC02-I/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Tin | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2011 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.2V~5.5V | DUAL | NOT APPLICABLE | 1 | 2.5V | 1.27mm | NOT APPLICABLE | 34LC02 | 8 | 不合格 | 5V | 2.2V | I2C, Serial | 2Kb 256 x 8 | 3mA | SYNCHRONOUS | 1MHz | 400ns | EEPROM | I2C | 5ms | 2 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1010DDDR | 4.953mm | 10.16mm | 7.112mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M24128-BFMH6TG | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 5-UFDFN | YES | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 活跃 | 1 (Unlimited) | 5 | EAR99 | 1.7V~5.5V | BOTTOM | 未说明 | 1 | 未说明 | M24128 | R-XBCC-B5 | 不合格 | 5.5V | 1.8/5V | 1.7V | 128Kb 16K x 8 | SYNCHRONOUS | 1MHz | 450ns | EEPROM | I2C | 16KX8 | 8 | 5ms | 0.000001A | 131072 bit | SERIAL | I2C | 4000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 0.6mm | 1.7mm | 1.4mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24VL025/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | Non-Volatile | -20°C~85°C TA | Tube | 2009 | e3 | yes | 活跃 | 不适用 | 8 | EAR99 | 1.5V~3.6V | DUAL | 1 | 1.8V | 2.54mm | 24VL025 | 8 | 不合格 | 3.3V | 3.6V | 1.5V | 2-Wire, Serial | 2Kb 256 x 8 | 3mA | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 2 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | SOFTWARE | 1010DDDR | 5.334mm | 9.27mm | 7.62mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24LC16BH-E/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 17 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2008 | e3 | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 40 | 24LC16BH | 8 | 不合格 | 5V | 1.7V | I2C, Serial | 16Kb 2K x 8 | 3mA | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 16 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010MMMR | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 25LC640X-I/STG | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 | Compliant | Bulk | 85 °C | -40 °C | SPI, Serial | 5.5 V | 2.5 V | 8 kB | 230 ns | 64 kb | 2 MHz | 无 | 无铅 |