类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 终端数量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 端口的数量 | 电源电流 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 筛选水平 | 访问时间（最大） | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 内存IC类型 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 环境温度范围高 | 通用闪存接口 | I2C控制字节 | 反向引脚排列 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||||||||||||||||||||||||
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 | 93C86C-E/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2012 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 93C86C | 8 | 5V | 5V | Serial | 16Kb 2K x 8 1K x 16 | 3mA | 3MHz | 100 ns | EEPROM | SPI | 1KX16 | 16 | 2ms | 16 kb | 0.000005A | MICROWIRE | 1000000 Write/Erase Cycles | 6ms | 200 | HARDWARE/SOFTWARE | 8 | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST38VF6401B-70I/TV | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Industrial grade | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | YES | 48 | Non-Volatile | -40°C~85°C TA | Tray | 2013 | SST38 | e3 | 活跃 | 3 (168 Hours) | 48 | Matte Tin (Sn) - annealed | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 0.5mm | 40 | SST38VF6401 | 3.3V | 3.6V | 2.7V | 64Mb 4M x 16 | 0.05mA | 70ns | FLASH | Parallel | 4MX16 | 16 | 10μs | 22b | 64 Mb | 0.00004A | 2.7V | YES | YES | NO | 128 | 32K | 16B | YES | BOTTOM | YES | 1.2mm | 18.4mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MX29LV160DTTI-70G | Macronix | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tray | 2009 | MX29LV | 活跃 | 3 (168 Hours) | 48 | EAR99 | TOP BOOT BLOCK | 8542.32.00.51 | 2.7V~3.6V | DUAL | 未说明 | 1 | 3V | 0.5mm | unknown | 未说明 | 48 | R-PDSO-G48 | 不合格 | 3.6V | 3/3.3V | 2.7V | 16Mb 2M x 8 | ASYNCHRONOUS | FLASH | Parallel | 1MX16 | 16 | 70ns | 16 Mb | 0.000015A | 70 ns | 3V | 8 | YES | YES | YES | 12131 | 16K8K32K64K | YES | TOP | YES | 1.2mm | 18.4mm | 12mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MX25L3233FM2I-08G | Macronix | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tube | MXSMIO™ | e3 | 活跃 | 3 (168 Hours) | 8 | Tin (Sn) | ALSO IT CAN BE CONFIGURED AS 32M X 1 BIT | 2.65V~3.6V | DUAL | 未说明 | 1 | 3V | 1.27mm | 未说明 | R-PDSO-G8 | 3.6V | 2.65V | 32Mb 8M x 4 | SYNCHRONOUS | 133MHz | FLASH | SPI - Quad I/O | 8MX4 | 4 | 50μs, 1.2ms | 33554432 bit | SERIAL | 3V | 2 | 2.16mm | 5.28mm | 5.23mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24LC024-E/MC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-VFDFN Exposed Pad | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2005 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 0.5mm | 40 | 24LC024 | 8 | 5V | I2C, Serial | 2Kb 256 x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 2 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 1mm | 3mm | 2mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT25080A-10TU-2.7 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | 8-TSSOP | Non-Volatile | -40°C~85°C TA | Tube | Obsolete | 1 (Unlimited) | 85°C | -40°C | 2.7V~5.5V | 20MHz | AT25080 | 5V | SPI, Serial | 5.5V | 2.7V | 8Kb 1K x 8 | 10mA | 20MHz | 40 ns | EEPROM | SPI | 5ms | 8 kb | 10MHz | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S29GL064N90TFI020 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Tin | 表面贴装 | 表面贴装 | 56-TFSOP (0.724, 18.40mm Width) | 56 | Non-Volatile | -40°C~85°C TA | Tray | 2008 | GL-N | e3 | 活跃 | 3 (168 Hours) | 56 | 8542.32.00.51 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 0.5mm | 30 | 3.6V | 3/3.3V | 2.7V | 64Mb 8M x 8 4M x 16 | 50mA | FLASH | Parallel | 16b | 4MX16 | 16 | 90ns | 64 Mb | 0.000005A | 90 ns | Asynchronous | 3V | 8 | YES | YES | YES | 128 | 64K | 8/16words | YES | BOTTOM/TOP | YES | 1.2mm | 18.4mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY62138FV30LL-45ZXIT | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 32-TFSOP (0.724, 18.40mm Width) | 32 | Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2003 | MoBL® | e3 | yes | 活跃 | 3 (168 Hours) | 32 | Matte Tin (Sn) | 2.2V~3.6V | DUAL | 260 | 1 | 3V | 0.5mm | 30 | CY62138 | 3V | 3.6V | 2.2V | 2Mb 256K x 8 | 1 | 18mA | SRAM | Parallel | 256KX8 | 3-STATE | 8 | 45ns | 18b | 2 Mb | 0.000004A | 45 ns | COMMON | Asynchronous | 8b | 无 | ROHS3 Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png) | 24AA02T-I/SNG | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | 小概要 | 1 | 256 | PLASTIC/EPOXY | SOP8,.25 | -40 °C | 40 | 85 °C | 有 | 24AA02T-I/SNG | 0.1 MHz | 256 words | 2.5 V | SOP | RECTANGULAR | Microchip Technology Inc | 活跃 | MICROCHIP TECHNOLOGY INC | 5.2 | SOIC | YES | 8 | Compliant | Tape & Reel (TR) | e3 | 有 | EAR99 | Matte Tin (Sn) | 85 °C | -40 °C | 8542.32.00.51 | EEPROMs | CMOS | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | 400 kHz | 8 | R-PDSO-G8 | 不合格 | 5.5 V | 2/5 V | INDUSTRIAL | 1.7 V | I2C, Serial | 5.5 V | 1.8 V | 256 B | SYNCHRONOUS | 0.003 mA | 900 ns | 256X8 | 1.75 mm | 8 | 2 kb | 0.000001 A | 2048 bit | 400 kHz | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 1010XXXR | 4.9 mm | 3.9 mm | 无 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | BR24G02FVT-3GE2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | Industrial grade | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2013 | 活跃 | 1 (Unlimited) | 8 | 1.6V~5.5V | DUAL | 未说明 | 1 | 2.5V | 0.65mm | 未说明 | BR24G02 | 5.5V | 1.6V | 2-Wire, I2C, Serial | 2Kb 256 x 8 | SYNCHRONOUS | 400kHz | 900 ns | EEPROM | I2C | 8 | 5ms | 2 kb | I2C | 5ms | 1.2mm | 4.4mm | 3mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST39LF040-55-4C-WHE | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1 Weeks | 表面贴装 | 表面贴装 | 32-TFSOP (0.488, 12.40mm Width) | 32 | Non-Volatile | 0°C~70°C TA | Tray | 2010 | SST39 MPF™ | e3 | yes | 活跃 | 3 (168 Hours) | 32 | 3A991.B.1.A | Matte Tin (Sn) - annealed | 3V~3.6V | DUAL | 260 | 1 | 3.3V | 0.5mm | 40 | SST39LF040 | 32 | 3.3V | 3.6V | 3V | 4Mb 512K x 8 | 20mA | 55ns | FLASH | Parallel | 8b | 512KX8 | 8 | 20μs | 19b | 4 Mb | 0.000015A | Asynchronous | 8b | 3V | YES | YES | YES | 128 | 4K | 1.2mm | 12.4mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1320KV18-250BZXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 表面贴装 | 165-LBGA | 165 | Volatile | 0°C~70°C TA | Tray | 2003 | e1 | 活跃 | 3 (168 Hours) | 165 | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 1.7V~1.9V | BOTTOM | 260 | 1 | 1.8V | 30 | CY7C1320 | 165 | 1.8V | 18Mb 512K x 36 | 1 | 460mA | 250MHz | 450 ps | SRAM | Parallel | 3-STATE | 36 | 19b | 18 Mb | 0.25A | COMMON | Synchronous | 36b | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24AA01T-I/MS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 21 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.7V~5.5V | DUAL | 260 | 1 | 0.65mm | 40 | 24AA01 | 8 | 5.5V | 2/5V | 1.7V | I2C, Serial | 1Kb 128 x 8 | 3mA | 400kHz | 3500ns | EEPROM | I2C | 8 | 5ms | 1 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010XXXR | NO | 1.1mm | 3mm | 3mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 93LC46C-I/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 2.5V~5.5V | DUAL | 260 | 1 | 3V | 0.65mm | 40 | 93LC46C | 8 | 5.5V | 3/5V | 2.5V | Serial | 1Kb 128 x 8 64 x 16 | 2mA | 3MHz | 200 ns | EEPROM | SPI | 64X16 | 16 | 6ms | 1 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 6ms | 200 | SOFTWARE | 8 | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | FM24W256-G | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | 540.001716mg | Non-Volatile | -40°C~85°C TA | Tube | 2008 | F-RAM™ | e3 | 活跃 | 3 (168 Hours) | 8 | EAR99 | 2.7V~5.5V | DUAL | 260 | 1 | 3.3V | 1.27mm | 30 | FM24W256 | 8 | 3.3V | 5.5V | 3/5V | 2.7V | 2-Wire, I2C | 256Kb 32K x 8 | 400μA | 1MHz | 550ns | FRAM | I2C | 8b | 256 kb | 0.00003A | 8b | 85°C | 1.727mm | 4.98mm | 3.987mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MX25R1635FM1IL0 | Macronix | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tube | MXSMIO™ | 活跃 | 3 (168 Hours) | 8 | IT IS ALSO CONFIGURED AS 16M X 1 | 1.65V~3.6V | DUAL | 未说明 | 1 | 1.8V | 1.27mm | 未说明 | R-PDSO-G8 | 3.6V | 1.65V | SPI, Serial | 16Mb 2M x 8 | SYNCHRONOUS | 33MHz | FLASH | SPI | 4MX4 | 4 | 100μs, 10ms | 16777216 bit | 3V | 2 | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24LC024H-E/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2008 | e3 | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 4.5V | 1.27mm | 40 | 24LC024H | 8 | 5V | I2C, Serial | 2Kb 256 x 8 | 3mA | 1MHz | 400ns | EEPROM | I2C | 8 | 5ms | 2 kb | I2C | 5ms | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT25DF321A-MH-T | Adesto Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 8-UDFN Exposed Pad | YES | 8 | Non-Volatile | -40°C~85°C TC | Tape & Reel (TR) | 1997 | e4 | 不用于新设计 | 1 (Unlimited) | 8 | 3A991.B.1.A | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 1.27mm | 8 | 3.3V | 3.6V | 2.7V | Serial | 32Mb 256Bytes x 16384 pages | 20mA | 100MHz | 5 ns | FLASH | SPI | 8b | 8 | 7μs, 3ms | 1b | 32 Mb | 0.00001A | Synchronous | 8b | 2.7V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 256B | 0.6mm | 6mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24AA00T/OT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | SC-74A, SOT-753 | 5 | Non-Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2005 | e3 | yes | 活跃 | 1 (Unlimited) | 5 | EAR99 | 2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 40 | 24AA00 | 5 | 1.8V | 2-Wire, I2C, Serial | 128b 16 x 8 | 3mA | 400kHz | 3500ns | EEPROM | I2C | 16X8 | 8 | 4ms | 128 b | 0.000001A | I2C | 1000000 Write/Erase Cycles | 4ms | 200 | 1010XXXR | 1.63mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 25AA040AT-I/MC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 2 Weeks | 表面贴装 | 表面贴装 | 8-VFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | DATA RETENTION > 200 YEARS; 1,000,000 ERASE/WRITE CYCLES | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 0.5mm | 40 | 25AA040A | 8 | 5V | SPI, Serial | 4Kb 512 x 8 | 5mA | 10MHz | 50 ns | EEPROM | SPI | 8 | 5ms | 4 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1mm | 3mm | 2mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 23LC512T-I/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | Automotive grade | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | YES | Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2010 | e3 | 活跃 | 1 (Unlimited) | 8 | Matte Tin (Sn) - annealed | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | 23LC512 | R-PDSO-G8 | 不合格 | 5.5V | 3/5V | 2.5V | SPI, Serial | 512Kb 64K x 8 | 1, (3 LINE) | SYNCHRONOUS | 20MHz | SRAM | SPI - Quad I/O | 64KX8 | 8 | 0.000004A | 524288 bit | TS 16949 | SEPARATE | 2.5V | 1.2mm | 4.4mm | 3mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY14B101PA-SFXIT | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | 16 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2008 | e3 | 活跃 | 3 (168 Hours) | 16 | EAR99 | Matte Tin (Sn) | 8542.32.00.41 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 1.27mm | 40 | 16 | 不合格 | 3.3V | 3.6V | 2.7V | SPI, Serial | 1Mb 128K x 8 | 3mA | SYNCHRONOUS | 40MHz | 15 ns | NVSRAM | SPI | 8b | 128KX8 | 8 | 1 Mb | 0.00025A | 8b | 2.667mm | 10.2865mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SST25WF040-40-5I-SAF | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2005 | SST25 | e4 | yes | Obsolete | 3 (168 Hours) | 8 | 3A991.B.1.A | 镍钯金 | 1.65V~1.95V | DUAL | 260 | 1 | 1.8V | 1.27mm | 40 | SST25WF040 | 8 | 1.8V | 1.95V | 1.65V | SPI, Serial | 4Mb 512K x 8 | 10mA | 40MHz | 40 ns | FLASH | SPI | 8b | 8 | 60μs | 1b | 4 Mb | Synchronous | 8b | SPI | 100000 Write/Erase Cycles | 100 | HARDWARE/SOFTWARE | 1.75mm | 4.9mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 47C04-I/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tube | 2018 | e3 | 活跃 | 1 (Unlimited) | 8 | Matte Tin (Sn) - annealed | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | 47C04 | R-PDSO-G8 | 5.5V | 4.5V | 4Kb 512 x 8 | SYNCHRONOUS | 1MHz | 400ns | EERAM | I2C | 512X8 | 8 | 1ms | 4096 bit | 1.2mm | 4.4mm | 3mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | TC58NVG2S0HTA00 | Kioxia America, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | YES | Non-Volatile | 0°C~70°C TA | Tray | 活跃 | 3 (168 Hours) | 48 | 2.7V~3.6V | DUAL | 1 | 3.3V | 0.5mm | R-PDSO-G48 | 3.6V | 2.7V | 4Gb 512M x 8 | ASYNCHRONOUS | FLASH | Parallel | 512MX8 | 8 | 25ns | 4294967296 bit | 3.3V | 1.2mm | 18.4mm | 12mm | 符合RoHS标准 |