类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 制造商包装标识符 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 最大功率耗散 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 端口的数量 | 电源电流 | 内存大小 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 内存宽度 | 定时器/计数器的数量 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 核心架构 | 最高频率 | 访问时间（最大） | 并行/串行 | I/O类型 | 可编程I/O数 | 同步/异步 | 字长 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 环境温度范围高 | 通用闪存接口 | I2C控制字节 | 反向引脚排列 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||
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 | MX25L25635FMI-10G | Macronix | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | YES | 16 | Non-Volatile | -40°C~85°C TA | Tube | 2009 | MX25xxx35/36 - MXSMIO™ | e3 | 不用于新设计 | 3 (168 Hours) | 16 | Tin (Sn) | IT ALSO CONFIGURED AS 256M X 1 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 1.27mm | unknown | 40 | 不合格 | 3.6V | 3/3.3V | 2.7V | SPI, Serial | 256Mb 32M x 8 | SYNCHRONOUS | 104MHz | FLASH | SPI | 64MX4 | 4 | 30μs, 3ms | 256 Mb | 0.00002A | 3V | SPI | 100000 Write/Erase Cycles | 10 | HARDWARE/SOFTWARE | 2 | 2.65mm | 10.3mm | 7.52mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M29W640FB70N6E | Micron Technology Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | YES | 48 | Non-Volatile | -40°C~85°C TA | Tray | 2006 | e3 | yes | Obsolete | 3 (168 Hours) | 48 | 3A991.B.1.A | Matte Tin (Sn) | 底部启动区块 | 8542.32.00.51 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 0.5mm | 30 | M29W640 | 48 | 不合格 | 3.6V | 3/3.3V | 2.7V | 64Mb 8M x 8 4M x 16 | ASYNCHRONOUS | FLASH | Parallel | 4MX16 | 16 | 70ns | 0.0001A | 67108864 bit | 70 ns | 3V | 8 | YES | YES | YES | 8127 | 8K64K | 4/8words | YES | BOTTOM | YES | 1.2mm | 18.4mm | 12mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT24CSW040-UUM0B-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 4-XFBGA, WLCSP | 4-WLCSP | Non-Volatile | -40°C~85°C TC | Tape & Reel (TR) | 2016 | 活跃 | 1 (Unlimited) | 1.7V~3.6V | 4Kb 512 x 8 | 1MHz | 450ns | EEPROM | I2C | 5ms | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MX25V8006EM1I-13G | Macronix | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | Non-Volatile | -40°C~85°C TA | Tube | 2010 | MX25xxx05/06 | 不用于新设计 | 3 (168 Hours) | 8 | 3A991.B.1.B.1 | 8542.32.00.51 | 2.35V~3.6V | DUAL | 未说明 | 1 | 2.5V | 1.27mm | 未说明 | 8 | R-PDSO-G8 | 不合格 | 3.6V | 2.5/3.3V | 2.35V | 12mA | 8Mb 1M x 8 | SYNCHRONOUS | 75MHz | 9 μs | FLASH | SPI | 4MX2 | 2 | 300μs, 5ms | 8 Mb | 0.00001A | SERIAL | 3V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 1 | 85°C | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 25LC160B-E/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 有 | 96B | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2007 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 1W | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | 25LC160B | 8 | 5.5V | 3/5V | 2.5V | SPI, Serial | 6mA | 16Kb 2K x 8 | 10MHz | 100 ns | EEPROM | SPI | 8b | 8 | 1 | 5ms | 16 kb | 0.000005A | PIC | 13 | SPI | 5ms | 200 | HARDWARE/SOFTWARE | 4.4mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M24256-DRDW3TP/K | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | Automotive grade | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Cut Tape (CT) | Automotive, AEC-Q100 | e4 | 活跃 | 1 (Unlimited) | 8 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~5.5V | DUAL | 1 | 2.5V | 0.65mm | M24256 | 5.5V | 2/5V | 2-Wire, I2C, Serial | 2mA | 256Kb 32K x 8 | 1MHz | 450ns | EEPROM | I2C | 8 | 5ms | 256 kb | 0.00001A | I2C | 4000000 Write/Erase Cycles | 4ms | 40 | HARDWARE | 1010DDDR | 1.2mm | 3mm | 3mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST38VF6403-90-5I-B3KE | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 19 Weeks | 表面贴装 | 48-TFBGA | YES | 48 | Non-Volatile | -40°C~85°C TA | Tray | 2000 | SST38 | e1 | yes | 活跃 | 2 (1 Year) | 48 | 3A991.B.1.A | Tin/Silver/Copper (Sn/Ag/Cu) | 底部启动区块 | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 260 | 1 | 3V | 0.8mm | 40 | SST38VF6403 | 48 | 3.3V | 3.6V | 2.7V | 18mA | 64Mb 4M x 16 | 90ns | FLASH | Parallel | 16b | 4MX16 | 16 | 10μs | 22b | 64 Mb | 0.00003A | Asynchronous | 16b | 2.7V | YES | YES | YES | 1K | 4K | 4words | YES | BOTTOM | YES | 1.2mm | 8mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||
 | BR24T32F-WE2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2013 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | Matte Tin (Sn) | 1.6V~5.5V | DUAL | 225 | 1 | 2.5V | 1.27mm | 未说明 | BR24T32 | 不合格 | 5.5V | 1.6V | 2-Wire, I2C, Serial | 32Kb 4K x 8 | SYNCHRONOUS | 400kHz | 900 ns | EEPROM | I2C | 8 | 5ms | 32 kb | 0.000002A | I2C | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 1010DDDR | 1.71mm | 5mm | 4.4mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CAV93C86VE-GT3 | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Automotive grade | ACTIVE (Last Updated: 1 day ago) | Gold | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2008 | Automotive, AEC-Q100 | e4 | yes | 活跃 | 1 (Unlimited) | 8 | 2.5V~5.5V | DUAL | 未说明 | 1 | 5V | 1.27mm | 未说明 | 8 | 5.5V | 2.5V | Serial | 16Kb 2K x 8 1K x 16 | SYNCHRONOUS | 2MHz | 250 ns | EEPROM | SPI | 1KX16 | 16 | 16 kb | MICROWIRE | 8 | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24LC01BT-E/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2007 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 0.65mm | 40 | 24LC01B | 8 | 5.5V | 3/5V | 2.5V | I2C, Serial | 3mA | 1Kb 128 x 8 | 400kHz | 3500ns | EEPROM | I2C | 8 | 5ms | 1 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010XXXR | NO | 1.2mm | 3mm | 4.4mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S29GL128P90FFIR20 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 64-LBGA | 64 | Non-Volatile | -40°C~85°C TA | Tray | 2012 | GL-P | e1 | 活跃 | 3 (168 Hours) | 64 | 3A991.B.1.A | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 260 | 1 | 3.3V | 1mm | 40 | 3.6V | 3.3V | 3V | 110mA | 128Mb 16M x 8 | FLASH | Parallel | 8b | 128MX1 | 1 | 90ns | 128 Mb | 0.000005A | 90 ns | Asynchronous | 3V | 8 | YES | YES | YES | 128 | 128K | 8/16words | YES | YES | 1.4mm | 13mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | IS43TR16256A-125KBLI | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 96-TFBGA | 96 | Volatile | -40°C~95°C TC | Tray | 活跃 | 3 (168 Hours) | 96 | PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH | 1.425V~1.575V | BOTTOM | 1 | 1.5V | 0.8mm | 1.5V | 1.575V | 1.425V | 1 | 230mA | 4Gb 256M x 16 | SYNCHRONOUS | 800MHz | 20ns | DRAM | Parallel | 16b | 256MX16 | 16 | 15ns | 18b | 4 Gb | 1.2mm | 13mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 93C66A-E/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2004 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 4.5V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 40 | 93C66A | 8 | 5V | 5V | Serial | 2mA | 4Kb 512 x 8 | 2MHz | 250 ns | EEPROM | SPI | 8 | 2ms | 4 kb | 0.000005A | MICROWIRE | 1000000 Write/Erase Cycles | 2ms | 200 | SOFTWARE | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1041G30-10ZSXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | YES | Volatile | -40°C~85°C TA | Tray | 2012 | e3 | 活跃 | 3 (168 Hours) | 44 | 3A991.B.2.A | Matte Tin (Sn) | 8542.32.00.41 | 2.2V~3.6V | DUAL | 260 | 1 | 3V | 0.8mm | 30 | CY7C1041 | R-PDSO-G44 | 不合格 | 3.6V | 2.5/3.3V | 2.2V | 4Mb 256K x 16 | 0.045mA | SRAM | Parallel | 256KX16 | 3-STATE | 16 | 10ns | 0.008A | 4194304 bit | 10 ns | COMMON | 1V | 1.194mm | 18.415mm | 10.16mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S29GL256P90TFIR10 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | Tin | 表面贴装 | 表面贴装 | 56-TFSOP (0.724, 18.40mm Width) | 56 | Non-Volatile | -40°C~85°C TA | Tray | 2012 | GL-P | e3 | 活跃 | 3 (168 Hours) | 56 | 3A991.B.1.A | 8542.32.00.51 | 2.7V~3.6V | DUAL | 260 | 1 | 3.3V | 0.5mm | 40 | 3.6V | 3.3V | 3V | 110mA | 256Mb 32M x 8 | FLASH | Parallel | 8b | 1 | 90ns | 256 Mb | 0.000005A | 90 ns | Asynchronous | 3V | 8 | YES | YES | YES | 256 | 128K | 8/16words | YES | YES | 1.2mm | 18.4mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | IS25LP016D-JBLE-TR | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | YES | Non-Volatile | -40°C~105°C TA | Tape & Reel (TR) | yes | 活跃 | 3 (168 Hours) | 8 | 2.3V~3.6V | DUAL | 未说明 | 1 | 3V | 1.27mm | 未说明 | S-PDSO-G8 | 3.6V | 2.3V | 16Mb 2M x 8 | SYNCHRONOUS | 133MHz | FLASH | SPI - Quad I/O, QPI, DTR | 2MX8 | 8 | 800μs | 16777216 bit | SERIAL | 3V | 1 | 2.16mm | 5.28mm | 5.28mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S25FL512SAGBHIC10 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 表面贴装 | 24-TBGA | 24 | S25FL512SAGBHIC10 | Non-Volatile | -40°C~85°C TA | Tray | 2013 | FL-S | 活跃 | 3 (168 Hours) | 24 | IT ALSO HAVE MEMORY WIDTH X1 | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 1 | 3V | 1mm | 3.6V | 3/3.3V | 2.7V | SPI | 75mA | 512Mb 64M x 8 | 133MHz | 8 ns | FLASH | SPI - Quad I/O | 8b | 64MX8 | 8 | 32b | 512 Mb | 0.0001A | SERIAL | Asynchronous | 3V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 1 | 512B | 85°C | 1.2mm | 8mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24VL024HT/MNY | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Gold | 表面贴装 | 表面贴装 | 8-WFDFN Exposed Pad | 8 | Non-Volatile | -20°C~85°C TA | Tape & Reel (TR) | 2008 | e4 | 活跃 | 1 (Unlimited) | 8 | SMD/SMT | EAR99 | 1.5V~3.6V | DUAL | 260 | 1 | 1.8V | 0.5mm | 40 | 24VL024H | 8 | 3.3V | 3.6V | 1.5V | 2-Wire, I2C, Serial | 3mA | 2Kb 256 x 8 | 400kHz | 900ns | EEPROM | I2C | 5ms | 2 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 750μm | 2mm | 3mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 11LC040-I/MS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | 11LC040 | 8 | 5V | Serial | 5mA | 4Kb 512 x 8 | 100kHz | 5 ms | EEPROM | 单线 | 8 | 4 kb | 0.000005A | 1-WIRE | 1000000 Write/Erase Cycles | 10ms | 200 | SOFTWARE | 1.1mm | 3mm | 3mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 25LC320A-I/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2007 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | 哑光锡 | 2.5V~5.5V | DUAL | 225 | 0.635mm | 25LC320A | 5V | SPI, Serial | 5mA | 32Kb 4K x 8 | 10MHz | 50 ns | EEPROM | SPI | 5ms | 32 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 200 | HARDWARE/SOFTWARE | 1mm | 3mm | 4.4mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| BR24G256F-3GTE2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2016 | 活跃 | 1 (Unlimited) | 8 | SEATED HT-CALCULATED | 1.6V~5.5V | DUAL | 未说明 | 1 | 1.27mm | 未说明 | BR24G256 | 5.5V | 1.6V | 2-Wire, I2C, Serial | 256Kb 32K x 8 | SYNCHRONOUS | 400kHz | 900 ns | EEPROM | I2C | 8 | 5ms | 256 kb | I2C | 5ms | 1.71mm | 5mm | 4.4mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1345G-100AXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 100-LQFP | 100 | Volatile | 0°C~70°C TA | Tray | 2002 | e3 | yes | 活跃 | 3 (168 Hours) | 100 | 3A991.B.2.A | Matte Tin (Sn) | FLOW-THROUGH ARCHITECTURE | 3.15V~3.6V | QUAD | 260 | 1 | 3.3V | 0.65mm | 20 | CY7C1345 | 100 | 3.3V | 3.6V | 3.135V | 4 | 205mA | 4.5Mb 128K x 36 | 100MHz | 8ns | SRAM | Parallel | 128KX36 | 3-STATE | 36 | 17b | 4 Mb | COMMON | Synchronous | 36b | 1.6mm | 20mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | BU9882FV-WE2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Copper, Tin | 表面贴装 | LSSOP | 14 | EEPROM | Tape & Reel (TR) | 2005 | yes | 活跃 | 1 (Unlimited) | 14 | EAR99 | 85°C | -40°C | 8542.32.00.51 | DUAL | 鸥翼 | 未说明 | 1 | 4V | 0.65mm | 400kHz | 未说明 | 14 | 不合格 | 5V | INDUSTRIAL | 2-Wire, I2C, Serial | 5.5V | 2.5V | 2 | 256B | SYNCHRONOUS | 256X8 | 8 | 2 kb | 0.000005A | I2C | 10ms | 1.25mm | 5mm | 4.4mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AT24C512B-TH-B | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | 8-TSSOP | Non-Volatile | -40°C~85°C TA | Tube | 1997 | Obsolete | 1 (Unlimited) | 85°C | -40°C | 1.8V~3.6V | 400kHz | AT24C512 | 2-Wire, I2C, Serial | 3.6V | 1.8V | 3mA | 512Kb 64K x 8 | 1MHz | 900ns | EEPROM | I2C | 5ms | 512 kb | 400kHz | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M24C02-FMH6TG | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 5-UFDFN | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 活跃 | 1 (Unlimited) | 1.7V~5.5V | 未说明 | 未说明 | M24C02 | 2Kb 256 x 8 | 400kHz | 900ns | EEPROM | I2C | 5ms | I2C | Non-RoHS Compliant |