类别是'接口 - 专用'
接口 - 专用 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 包装/外壳 | 表面安装 | 引脚数 | 包装 | 已出版 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 端口的数量 | uPs/uCs/外围ICs类型 | 时钟频率 | 电源电流-最大值 | 数据率 | 总线兼容性 | 最大数据传输率 | 驱动接口标准 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | RoHS状态 | 无铅 | |||
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.png) | TSI109-200CL | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | FCBGA | 1023 | 70°C | 1999 | e0 | no | Discontinued | 4 (72 Hours) | EAR99 | Tin/Lead (Sn63Pb37) | 8542.39.00.01 | BOTTOM | BALL | 225 | 1.2V | 1mm | 1.26V | COMMERCIAL | 1.14V | PCI | 33.33MHz | POWERPC 60X | 2.76mm | 33mm | 33mm | 2mm | 无 | 符合RoHS标准 | 含铅 | ||||||||||||||||||||||||
| 89H48H12AG2ZCBLGI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 1156 | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 85°C | -40°C | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 未说明 | 不合格 | 1.1V | 12.52.5/3.3V | INDUSTRIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | 5529mA | I2C; ISA; PCI; SMBUS; VGA | 48000 MBps | 2.82mm | 35mm | 35mm | 2.82mm | 符合RoHS标准 | 无铅 | ||||||||||||||||
| 89HPES16T4G2ZBBXG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Copper, Silver, Tin | 表面贴装 | 288 | Tape & Reel (TR) | 1999 | e1 | yes | 活跃 | 3 (168 Hours) | 288 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 未说明 | 288 | 不合格 | 1.1V | 12.53.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | 908mA | PCI; SMBUS | 16000 MBps | 1.7mm | 23mm | 23mm | 1.1mm | 符合RoHS标准 | 无铅 | ||||||||||||||||
| 89H22H16G2ZCBLG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Copper, Silver, Tin | 表面贴装 | FCBGA | 1156 | 125MHz | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 未说明 | 不合格 | 3.3V | 1.1V | COMMERCIAL | PCI Express | 16 | BUS CONTROLLER, PCI | 5455mA | 176 Gbps | I2C; ISA; PCI; SMBUS; VGA | 22000 MBps | 3.42mm | 35mm | 35mm | 2.82mm | 符合RoHS标准 | 无铅 | ||||||||||||||||
| 89HPES64H16ZABL | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | FCBGA | 1156 | 125MHz | Bulk | 1999 | e0 | no | 活跃 | 4 (72 Hours) | EAR99 | Tin/Lead (Sn/Pb) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 未说明 | 不合格 | 3.3V | 1.1V | COMMERCIAL | PCI Express | 16 | BUS CONTROLLER, PCI | 256 Gbps | PCI | 3.42mm | 35mm | 35mm | 2.82mm | Non-RoHS Compliant | 含铅 | |||||||||||||||
| 89H32NT8BG2ZCHLI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | FCBGA | 484 | 125MHz | 1999 | e0 | no | 活跃 | 4 (72 Hours) | 484 | EAR99 | Tin/Lead (Sn/Pb) | 85°C | -40°C | ALSO OPERATES AT 100 MHZ | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 未说明 | 484 | 不合格 | 3.3V | 1.1V | INDUSTRIAL | PCI Express | 8 | BUS CONTROLLER, PCI | 3400mA | 256 Gbps | I2C; ISA; VGA | 23mm | 23mm | 2.92mm | Non-RoHS Compliant | 含铅 | ||||||||||||||
| 89HPES24T6ZGBX | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | 420 | 1999 | e0 | no | 活跃 | 3 (168 Hours) | 420 | EAR99 | Tin/Lead (Sn63Pb37) | 70°C | 0°C | ALSO REQUIRES 3.3V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 20 | 420 | 不合格 | 1.1V | 3.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI | 1.7mm | 27mm | 27mm | 1.7mm | Non-RoHS Compliant | 含铅 | |||||||||||||||
| 89HPES24T3G2ZBBL8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | FCBGA | 676 | Tape & Reel (TR) | 1999 | e0 | no | 活跃 | 4 (72 Hours) | 676 | EAR99 | Tin/Lead (Sn/Pb) | 70°C | 0°C | HAVING 125MHZ INPUT REFERENCE CLOCK FREQUENCY. | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 未说明 | 676 | 1.1V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | SMBUS | 625 MBps | 3.22mm | 27mm | 27mm | 3.4mm | Non-RoHS Compliant | 含铅 | |||||||||||||||
| 89HPES16T4G2ZBBXG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Copper, Silver, Tin | 表面贴装 | 288 | 1999 | e1 | yes | 活跃 | 3 (168 Hours) | 288 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 30 | 288 | 不合格 | 1.1V | 12.53.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | 908mA | PCI | 1.7mm | 23mm | 23mm | 1.1mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||
| TSI148-133CL | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | BGA | YES | 456 | 70°C | Bulk | 1999 | e0 | no | Discontinued | 3 (168 Hours) | 456 | EAR99 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 3.3V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 225 | 1.8V | 1mm | 456 | 1.95V | COMMERCIAL | 1.65V | BUS CONTROLLER, VME | 133MHz | PCI | IEEE 1149.1 | 2.36mm | 27mm | 27mm | 2.65mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||
| 89H32NT8BG2ZCHLG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 484 | 125MHz | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | 484 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | ALSO OPERATES AT 100 MHZ | BOTTOM | BALL | 250 | 1V | 1mm | 未说明 | 484 | 不合格 | 3.3V | 1.1V | COMMERCIAL | PCI Express | 8 | BUS CONTROLLER, PCI | 3400mA | 256 Gbps | I2C; ISA; VGA | 23mm | 23mm | 2.92mm | 符合RoHS标准 | 无铅 | |||||||||||||||
| 89HPES32H8ZAALI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | FCBGA | 900 | 125MHz | Bulk | 1999 | e0 | no | 活跃 | 4 (72 Hours) | 900 | EAR99 | Tin/Lead (Sn/Pb) | 85°C | -40°C | BOTTOM | BALL | 225 | 1V | not_compliant | 未说明 | 900 | 不合格 | 3.3V | 1.1V | INDUSTRIAL | PCI Express | 8 | BUS CONTROLLER, PCI | 128 Gbps | PCI | 3.42mm | 31mm | 31mm | 2.82mm | Non-RoHS Compliant | 含铅 | |||||||||||||||
| 89H64H16G3ZABL | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Lead, Tin | YES | 1156 | 70°C | 1999 | e0 | no | Discontinued | 4 (72 Hours) | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 未说明 | 1.1V | COMMERCIAL | 0.95V | PCI Express | BUS CONTROLLER, PCI | ISA; SMBUS; VGA | 128000 MBps | 3.42mm | 35mm | 35mm | 2.82mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||
| 89H24NT24G2ZCHLI8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | FCBGA | 324 | 125MHz | 1999 | e0 | no | 活跃 | 4 (72 Hours) | 324 | EAR99 | Tin/Lead (Sn/Pb) | 85°C | -40°C | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 20 | 324 | 3.3V | 1.1V | INDUSTRIAL | PCI Express | 24 | BUS CONTROLLER, PCI | 192 Gbps | I2C; ISA; PCI; SMBUS; VGA | 2.88mm | 19mm | 19mm | 3.02mm | Non-RoHS Compliant | 含铅 | |||||||||||||||
| 89HPES16T4G2ZABXG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 288 | 1999 | e1 | yes | 活跃 | 3 (168 Hours) | 288 | EAR99 | 锡银铜 | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 30 | 288 | 不合格 | 1.1V | 1.22.53.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI | 1.7mm | 23mm | 23mm | 1.1mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||
| 89H32NT8BG2ZCHLG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 484 | 125MHz | 1999 | yes | 活跃 | 70°C | 0°C | 484 | 3.3V | PCI Express | 8 | BUS CONTROLLER, PCI | 256 Gbps | 2.92mm | 23mm | 23mm | 2.92mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||
| 89HPES48T12ZABL | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | FCBGA | 1156 | 70°C | 1999 | e0 | no | 活跃 | 4 (72 Hours) | EAR99 | Tin/Lead (Sn/Pb) | ALSO REQUIRES 3.3V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 未说明 | 不合格 | 1.1V | 13.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | 2635mA | PCI | 2.82mm | 35mm | 35mm | 2.82mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||
| 89HPES12T3G2ZABC | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | BGA | 324 | 1999 | e0 | no | 活跃 | 3 (168 Hours) | 324 | EAR99 | Tin/Lead (Sn63Pb37) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 未说明 | 324 | 不合格 | 1.1V | 3.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI | 1.4mm | 19mm | 19mm | 1.4mm | Non-RoHS Compliant | 含铅 | |||||||||||||||
| 89HPES24T6ZGBXG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 420 | 1999 | e1 | yes | 活跃 | 3 (168 Hours) | 420 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | ALSO REQUIRES 3.3V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 30 | 420 | 不合格 | 1.1V | 3.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI | 27mm | 27mm | 1.7mm | 符合RoHS标准 | 无铅 | |||||||||||||||||
| TSI108-200CLY | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | FCBGA | 1023 | 70°C | 1999 | e1 | no | 活跃 | 4 (72 Hours) | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 1.26V | COMMERCIAL | 1.14V | PCI | 33.33MHz | POWERPC 60X | 2.76mm | 33mm | 33mm | 2mm | 无 | 符合RoHS标准 | 含铅 | |||||||||||||||||||||||
| 89H48H12G3ZAHLGI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | -40°C | 表面贴装 | FCBGA | 676 | 85°C | 1999 | e1 | yes | Discontinued | 4 (72 Hours) | 676 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1V | 1mm | 未说明 | 676 | 1.1V | INDUSTRIAL | 0.95V | PCI Express | BUS CONTROLLER, PCI | ISA; SMBUS; VGA | 96000 MBps | 2.9mm | 27mm | 27mm | 3.2mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||
| 89HPES16H16ZABL | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | FCBGA | 484 | 125MHz | 1999 | e0 | no | 活跃 | 3 (168 Hours) | 484 | EAR99 | Tin/Lead (Sn63Pb37) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 20 | 484 | 不合格 | 3.3V | 1.1V | COMMERCIAL | PCI Express | 16 | BUS CONTROLLER, PCI | 64 Gbps | PCI | 3.32mm | 23mm | 23mm | 3.34mm | Non-RoHS Compliant | 含铅 | ||||||||||||||
| 89HPES12T3G2ZBBCI8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | -40°C | Lead, Tin | 表面贴装 | BGA | 324 | 85°C | Tape & Reel (TR) | 1999 | e0 | no | 活跃 | 3 (168 Hours) | 324 | EAR99 | Tin/Lead (Sn63Pb37) | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 未说明 | 324 | 不合格 | 1.1V | 12.53.3V | INDUSTRIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI; SMBUS | 12000 MBps | 1.4mm | 19mm | 19mm | 1.4mm | Non-RoHS Compliant | 含铅 | |||||||||||||
| 89H32NT24BG2ZCHLI8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | FCBGA | 484 | 125MHz | 2009 | e0 | no | 活跃 | 4 (72 Hours) | 484 | EAR99 | Tin/Lead (Sn/Pb) | 85°C | -40°C | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 20 | 484 | 不合格 | 3.3V | 1.1V | INDUSTRIAL | PCI Express | 24 | BUS CONTROLLER, PCI | 3400mA | 256 Gbps | I2C; ISA; PCI; SMBUS; VGA | 32000 MBps | 23mm | 23mm | 2.92mm | Non-RoHS Compliant | 含铅 | |||||||||||||
| 89HPES24N3A1ZCBX8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Lead, Tin | 表面贴装 | BGA | 420 | Tape & Reel (TR) | 1999 | e0 | 3 (168 Hours) | 420 | EAR99 | Tin/Lead (Sn63Pb37) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 3.3V | 1mm | not_compliant | 不合格 | 3.3V | COMMERCIAL | PCI Express | Non-RoHS Compliant |