类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 内存大小 | 工作电源电流 | 端口的数量 | 电源电流 | 操作模式 | 最大电源电流 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 访问时间（最大） | 并行/串行 | 输入电容 | I/O类型 | 同步/异步 | 字长 | 内存IC类型 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 刷新周期 | 通用闪存接口 | I2C控制字节 | 顺序突发长度 | 交错突发长度 | 反向引脚排列 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||||||||||||||||||||||
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 | IS61LV6416-10TLI | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | 44 | Volatile | -40°C~85°C TA | Tray | e3 | yes | 活跃 | 2 (1 Year) | 44 | SMD/SMT | Matte Tin (Sn) - annealed | 3.135V~3.6V | DUAL | 260 | 1 | 3.3V | 0.8mm | 40 | 44 | 3.3V | 3.63V | 1Mb 64K x 16 | 1 | 130mA | SRAM | Parallel | 3-STATE | 16 | 10ns | 16b | 1 Mb | COMMON | Asynchronous | 16b | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1460AV25-200BZI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 165-LBGA | 165 | Volatile | -40°C~85°C TA | Tray | 2004 | NoBL™ | e0 | no | Obsolete | 3 (168 Hours) | 165 | 3A991.B.2.A | Tin/Lead (Sn/Pb) | 流水线结构 | 2.375V~2.625V | BOTTOM | 220 | 1 | 2.5V | 1mm | CY7C1460 | 165 | 2.5V | 2.625V | 2.375V | 36Mb 1M x 36 | 4 | 385mA | 200MHz | 3.2ns | SRAM | Parallel | 1MX36 | 3-STATE | 36 | 20b | 36 Mb | 0.12A | COMMON | Synchronous | 36b | 2.38V | 17mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT24C01B-TH-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2004 | Obsolete | 1 (Unlimited) | 8 | 1.8V~5.5V | DUAL | 1 | 5V | 0.65mm | AT24C01 | 5V | 2-Wire, I2C, Serial | 1Kb 128 x 8 | 3mA | 1MHz | 550ns | EEPROM | I2C | 8 | 5ms | 1 kb | I2C | 5ms | 1.2mm | 4.4mm | 3mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IS61WV20488BLL-10TLI | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Industrial grade | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | YES | 44 | Volatile | -40°C~85°C TA | Tray | e3 | yes | 活跃 | 3 (168 Hours) | 44 | Matte Tin (Sn) - annealed | 2.4V~3.6V | DUAL | 260 | 1 | 3V | 0.8mm | 40 | 44 | 3.6V | 2.5/3.3V | 2.4V | 16Mb 2M x 8 | 1 | 100mA | SRAM | Parallel | 2MX8 | 3-STATE | 8 | 10ns | 21b | 16 Mb | 0.025A | COMMON | Asynchronous | 8b | 无 | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 23LCV1024T-I/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2012 | e3 | 活跃 | 1 (Unlimited) | 8 | Matte Tin (Sn) - annealed | 2.5V~5.5V | 260 | 1 | 0.65mm | 40 | 23LCV1024 | R-PDSO-G8 | 不合格 | 5.5V | 3/5V | 2.5V | SPI, Serial | 1Mb 128K x 8 | 1, (3 LINE) | SYNCHRONOUS | 20MHz | NVSRAM | SPI - Dual I/O | 128KX8 | 3-STATE | 8 | 0.00001A | 1048576 bit | SEPARATE | 2.5V | 1.2mm | 4.4mm | 3mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 25AA040AX-I/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2007 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | DATA RETENTION > 200 YEARS; 1,000,000 ERASE/WRITE CYCLES | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 40 | 25AA040A | 8 | 5V | SPI, Serial | 4Kb 512 x 8 | 5mA | 10MHz | 50 ns | EEPROM | SPI | 8 | 5ms | 4 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M27C2001-10B1 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 通孔 | 32-DIP (0.600, 15.24mm) | 32 | Non-Volatile | 0°C~70°C TA | Tube | e3 | Obsolete | 1 (Unlimited) | 32 | EAR99 | Matte Tin (Sn) | 4.5V~5.5V | DUAL | 1 | 5V | 2.54mm | 100GHz | M27C2001 | 32 | 5V | 5V | 2Mb 256K x 8 | 30mA | 50mA | 100ns | EPROM | Parallel | 256KX8 | 3-STATE | 2 Mb | 0.0001A | 6pF | COMMON | 4.06mm | 42.04mm | 13.84mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24FC128-I/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2007 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1000000 ERASE/WRITE CYCLES, HARDWARE WRITE PROTECT, DATA RETENTION > 200 YEARS | 1.7V~5.5V | DUAL | 1 | 2.5V | 2.54mm | 24FC128 | 8 | 5.5V | 2/5V | 1.7V | I2C, Serial | 128Kb 16K x 8 | 3mA | 1MHz | 400ns | EEPROM | I2C | 8 | 5ms | 128 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 5.334mm | 9.271mm | 7.62mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png) | 24LC32A-I/MSG | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 1 | 4000 | PLASTIC/EPOXY | TSSOP8,.19 | -40 °C | 40 | 85 °C | 有 | 24LC32A-I/MSG | 0.4 MHz | 4096 words | 5 V | TSSOP | SQUARE | Microchip Technology Inc | 活跃 | MICROCHIP TECHNOLOGY INC | 5.14 | MSOP | YES | 8 | TSSOP, TSSOP8,.19 | e3 | 有 | EAR99 | Matte Tin (Sn) | 2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED | 8542.32.00.51 | EEPROMs | CMOS | DUAL | 鸥翼 | 260 | 1 | 0.65 mm | compliant | 8 | S-PDSO-G8 | 不合格 | 5.5 V | 2/5 V | INDUSTRIAL | 2.5 V | SYNCHRONOUS | 0.003 mA | 4KX8 | 1.1 mm | 8 | 0.000001 A | 32768 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 1010DDDR | 3 mm | 3 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | FM28V020-TG | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 26 Weeks | 表面贴装 | 表面贴装 | 32-TFSOP (0.724, 18.40mm Width) | 32 | Non-Volatile | -40°C~85°C TA | Tray | 2011 | F-RAM™ | e3 | 活跃 | 3 (168 Hours) | 32 | EAR99 | Tin (Sn) | 2V~3.6V | DUAL | 260 | 1 | 3.3V | 0.5mm | 40 | FM28V020 | 32 | 不合格 | 3.3V | 3.6V | 2V | 256Kb 32K x 8 | 8mA | SYNCHRONOUS | FRAM | Parallel | 8b | 140ns | 256 kb | 0.00015A | 140 ns | 8b | 1.02mm | 11.9mm | 8.1mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S25FL256SAGMFIG00 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | 16 | Non-Volatile | -40°C~85°C TA | Tray | 2015 | FL-S | 活跃 | 3 (168 Hours) | 16 | ALSO CONFIGURABLE AS 256M X 1 | 8542.32.00.51 | 2.7V~3.6V | DUAL | 未说明 | 1 | 3V | 1.27mm | 未说明 | 不合格 | 3V | 3.6V | 2.7V | SPI, Serial | 256Mb 32M x 8 | 75mA | 133MHz | 8 ns | FLASH | SPI - Quad I/O | 32MX8 | 8 | 1b | 256 Mb | 0.0001A | Synchronous | 1b | 3V | SPI | 100000 Write/Erase Cycles | 500ms | 20 | HARDWARE/SOFTWARE | 2 | BOTTOM | 2.65mm | 10.3mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AT24C04D-XHM-B | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Automotive grade | Gold | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Bulk | 1997 | e4 | yes | 活跃 | 3 (168 Hours) | 8 | ALSO OPERATES 1.7V AT 100 KHZ | 1.7V~3.6V | DUAL | 260 | 1 | 1.8V | 0.65mm | 40 | AT24C04 | 不合格 | 3.6V | 1.7V | 2-Wire, I2C, Serial | 4Kb 512 x 8 | SYNCHRONOUS | 1MHz | 450ns | EEPROM | I2C | OPEN-DRAIN | 5ms | 4 kb | ISO/TS-16949 | I2C | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE | YES | 16words | 1010DDMR | NO | 1.05mm | 3.1mm | 4.5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24AA02H-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2008 | e3 | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 40 | 24AA02H | 8 | 2.5V | 5.5V | 2/5V | 1.7V | I2C, Serial | 2Kb 256 x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 2 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010XXXR | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24LC04BH-E/MS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2007 | e3 | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 0.65mm | 40 | 24LC04BH | 8 | 不合格 | 5V | I2C, Serial | 4Kb 256 x 8 x 2 | 3mA | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 4 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010XXMR | 1.1mm | 3mm | 3mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C028V-20AC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 100-LQFP | 100 | Volatile | 0°C~70°C TA | Tray | 2002 | e0 | no | Obsolete | 3 (168 Hours) | 100 | Tin/Lead (Sn/Pb) | AUTOMATIC POWER-DOWN | 3V~3.6V | QUAD | 235 | 1 | 3.3V | 0.5mm | CY7C028 | 100 | 3.3V | 3.6V | 3V | 1Mb 64K x 16 | 2 | 175mA | SRAM | Parallel | 64KX16 | 3-STATE | 16 | 20ns | 16b | 1 Mb | 0.00005A | COMMON | Asynchronous | 16b | 2V | 1.6mm | 14mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 25AA160T-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2004 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 40 | 25AA160 | 8 | 5.5V | 2/5V | SPI, Serial | 16Kb 2K x 8 | 5mA | 1MHz | 475 ns | EEPROM | SPI | 8 | 5ms | 16 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1.75mm | 4.9mm | 3.91mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | IS43DR16160A-37CBL | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 84-TFBGA | 84 | Volatile | 0°C~70°C TA | Tray | e1 | yes | Obsolete | 3 (168 Hours) | 84 | EAR99 | 锡银铜 | AUTO/SELF REFRESH | 8542.32.00.24 | 1.7V~1.9V | BOTTOM | 260 | 1 | 1.8V | 0.8mm | 40 | 84 | 1.8V | 1.9V | 1.7V | 256Mb 16M x 16 | 1 | 270mA | 120mA | 266MHz | 500ps | DRAM | Parallel | 16b | 16MX16 | 3-STATE | 16 | 15ns | 15b | 256 Mb | 0.005A | COMMON | 256MB | 8192 | 48 | 48 | 1.2mm | 12.5mm | 无 | 无SVHC | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S29GL512P10FFCR10 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 64-LBGA | 64 | Non-Volatile | 0°C~85°C TA | Tray | 2012 | GL-P | e1 | Obsolete | 3 (168 Hours) | 64 | 3A991.B.1.A | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 1 | 3.3V | 1mm | 3.6V | 3.3V | 3V | 512Mb 32M x 16 | 110mA | FLASH | Parallel | 8b | 512MX1 | 1 | 100ns | 512 Mb | 0.000005A | 100 ns | Asynchronous | 3V | 8 | YES | YES | YES | 512 | 128K | 8/16words | YES | YES | 1.4mm | 13mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | BR24G04F-3GTE2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2013 | 活跃 | 1 (Unlimited) | 8 | 1.6V~5.5V | DUAL | 未说明 | 1 | 2.5V | 1.27mm | 未说明 | BR24G04 | 5.5V | 1.6V | 2-Wire, I2C, Serial | 4Kb 512 x 8 | SYNCHRONOUS | 400kHz | 900 ns | EEPROM | I2C | 8 | 5ms | 4 kb | I2C | 5ms | 1.71mm | 5mm | 4.4mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24AA024-I/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2004 | e3 | yes | 活跃 | 不适用 | 8 | EAR99 | 1.7V~5.5V | DUAL | 1 | 2.5V | 2.54mm | 24AA024 | 8 | 5.5V | 2/5V | 1.7V | I2C, Serial | 2Kb 256 x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 2 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 5.334mm | 9.27mm | 7.62mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S29GL256P11TFI010 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 表面贴装 | 56-TFSOP (0.724, 18.40mm Width) | 56 | Non-Volatile | -40°C~85°C TA | Tray | 2012 | GL-P | e3 | 活跃 | 3 (168 Hours) | 56 | 3A991.B.1.A | Matte Tin (Sn) | 8542.32.00.51 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 0.5mm | 40 | 3.6V | 3/3.3V | 2.7V | 256Mb 32M x 8 | 110mA | FLASH | Parallel | 8b | 1 | 110ns | 256 Mb | 0.000005A | 110 ns | Asynchronous | 3V | 8 | YES | YES | YES | 256 | 128K | 8/16words | YES | YES | 1.2mm | 18.4mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24LC32AT-E/MC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-VFDFN Exposed Pad | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2010 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 0.5mm | 40 | 24LC32A | 8 | 5.5V | 3/5V | 2.5V | 2-Wire, I2C, Serial | 32Kb 4K x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 32 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 1mm | 3mm | 2mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M95M01-DFMN6TP | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | Industrial grade | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | e4 | 活跃 | 1 (Unlimited) | 8 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.7V~5.5V | DUAL | 1 | 1.8V | 1.27mm | M95M01 | 5.5V | 1.7V | SPI, Serial | 1Mb 128K x 8 | 5mA | 16MHz | 25 ns | EEPROM | SPI | 8 | 5ms | 1 Mb | 0.000001A | SPI | 4000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 93AA46C-I/MS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2005 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 40 | 93AA46C | 8 | 5.5V | 2/5V | Serial | 1Kb 128 x 8 64 x 16 | 2mA | 3MHz | 200 ns | EEPROM | SPI | 64X16 | 6ms | 1 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 6ms | 200 | SOFTWARE | 850μm | 3mm | 3mm | 无 | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 93LC46-I/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | Tin | 通孔 | 8-DIP (0.300, 7.62mm) | NO | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2004 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | 2.5V~5.5V | DUAL | 1 | 5V | 2.54mm | 93LC46 | 8 | 6V | 3/5V | 2.5V | Serial | 1Kb 128 x 8 64 x 16 | 3mA | 2MHz | 500 ns | EEPROM | SPI | 3-STATE | 10ms | 1 kb | 0.00003A | MICROWIRE | 1000000 Write/Erase Cycles | 10ms | 200 | SOFTWARE | 3.3mm | 9.27mm | 6.35mm | 无 | ROHS3 Compliant | 无铅 |