类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 端口的数量 | 电源电流 | 操作模式 | 时钟频率 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 最高频率 | 筛选水平 | 访问时间（最大） | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 环境温度范围高 | 通用闪存接口 | I2C控制字节 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||
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 | CY7C1010DV33-10ZSXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | 44 | Volatile | -40°C~85°C TA | Tray | 1996 | e4 | yes | 活跃 | 3 (168 Hours) | 44 | Nickel/Palladium/Gold (Ni/Pd/Au) | 3V~3.6V | DUAL | 260 | 1 | 3.3V | 0.8mm | 10GHz | 30 | CY7C1010 | 44 | 3.3V | 3.6V | 3V | 2Mb 256K x 8 | 1 | 90mA | SRAM | Parallel | 256KX8 | 3-STATE | 8 | 10ns | 18b | 2 Mb | COMMON | Asynchronous | 8b | 2V | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT24HC02BN-SH-B | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | 8-SOIC | Non-Volatile | -40°C~85°C TA | Tube | 1997 | Obsolete | 1 (Unlimited) | 85°C | -40°C | 1.8V~5.5V | 1MHz | AT24HC02 | 2-Wire, I2C, Serial | 5.5V | 1.8V | 2Kb 256 x 8 | 3mA | 1MHz | 550ns | EEPROM | I2C | 5ms | 2 kb | 400kHz | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 25C160/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | 0°C~70°C TA | Tube | 2004 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | Matte Tin (Sn) | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 25C160 | 8 | 5V | 5V | SPI, Serial | 16Kb 2K x 8 | 5mA | 3MHz | 150 ns | EEPROM | SPI | 5ms | 16 kb | 0.000005A | SPI | 10000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1.55mm | 5mm | 3.99mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | 93LC66BT-I/MS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2011 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 3V | 0.65mm | 40 | 93LC66B | 8 | 5.5V | 3/5V | 2.5V | Serial | 4Kb 256 x 16 | 2mA | 2MHz | 250 ns | EEPROM | SPI | 256X16 | 16 | 6ms | 4 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 6ms | 200 | SOFTWARE | 1.1mm | 3mm | 3mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||
 | 24LC014-I/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | Tin | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | 通孔 | 2.5V~5.5V | DUAL | 1 | 3V | 2.54mm | 24LC014 | 8 | 5.5V | 3/5V | 2.5V | 2-Wire, I2C, Serial | 1Kb 128 x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 5ms | 1 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 4.953mm | 10.16mm | 7.112mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | BR24G08FJ-3GTE2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 1999 | 活跃 | 1 (Unlimited) | 8 | 1.6V~5.5V | DUAL | 未说明 | 1 | 2.5V | 1.27mm | 未说明 | BR24G08 | 5.5V | 1.6V | 2-Wire, I2C, Serial | 8Kb 1K x 8 | SYNCHRONOUS | 400kHz | EEPROM | I2C | 1 | 5ms | I2C | 5ms | 4.9mm | 3.9mm | Unknown | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | IS62WV25616BLL-55TLI | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Industrial grade | 表面贴装 | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | 44 | Volatile | -40°C~85°C TA | Tray | e3 | yes | 活跃 | 3 (168 Hours) | 44 | Matte Tin (Sn) | 2.5V~3.6V | DUAL | 260 | 1 | 0.8mm | 40 | 44 | 3.3V | 3.6V | 2.5V | 4Mb 256K x 16 | 1 | 15mA | SRAM | Parallel | 3-STATE | 55ns | 18b | 4 Mb | 18MHz | 55 ns | COMMON | Asynchronous | 16b | 1.05mm | 18.52mm | 10.29mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S29JL064J70TFI003 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | 48 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2002 | JL-J | 活跃 | 3 (168 Hours) | 48 | 3A991.B.1.A | TOP BOOT BLOCK, BOTTOM BOOT BLOCK | 8542.32.00.51 | 2.7V~3.6V | DUAL | 1 | 3V | 0.5mm | 3.6V | 3/3.3V | 2.7V | 64Mb 8M x 8 4M x 16 | 16mA | FLASH | Parallel | 8b | 4MX16 | 16 | 70ns | 64 Mb | 0.000005A | 70 ns | Asynchronous | 3V | 8 | YES | YES | YES | 16126 | 8K64K | YES | BOTTOM/TOP | YES | 1.2mm | 18.4mm | 无 | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
 | M24C01-WMN6T | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | e0 | no | Obsolete | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 1 | 5V | 1.27mm | M24C01 | 8 | 6.5V | 5.5V | 3/5V | 2.5V | 2-Wire, I2C, Serial | 1Kb 128 x 8 | 400kHz | 900ns | EEPROM | I2C | OPEN-DRAIN | 8 | 5ms | 1 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 1010DDDR | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | M95040-RMB6TG | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 8-UFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | e4 | Obsolete | 1 (Unlimited) | 8 | SMD/SMT | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 0.5mm | 30 | M95040 | 8 | 5V | SPI, Serial | 4Kb 512 x 8 | 3mA | 20MHz | 60 ns | EEPROM | SPI | 5ms | 4 kb | 0.000002A | SPI | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE/SOFTWARE | 530μm | 2mm | 3mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | S29GL064N11TFIV10 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Tin | 表面贴装 | 表面贴装 | 56-TFSOP (0.724, 18.40mm Width) | 56 | Non-Volatile | -40°C~85°C TA | Tray | 2003 | GL-N | e3 | 活跃 | 3 (168 Hours) | 56 | 3A991.B.1.A | 8542.32.00.51 | 1.65V~3.6V | DUAL | 260 | 1 | 3V | 0.5mm | 40 | 3.6V | 1.8/3.33/3.3V | 2.7V | 64Mb 8M x 8 4M x 16 | 50mA | FLASH | Parallel | 16b | 4MX16 | 16 | 110ns | 64 Mb | 0.000005A | 110 ns | Asynchronous | 3V | 8 | YES | YES | YES | 128 | 64K | 8/16words | YES | BOTTOM/TOP | YES | 1.2mm | 18.4mm | 无 | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
 | 25LC128T-E/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2011 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | 25LC128 | 8 | 5V | SPI, Serial | 128Kb 16K x 8 | 5mA | 10MHz | 50 ns | EEPROM | SPI | 8 | 5ms | 128 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||
| BR24G64FJ-3GTE2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Industrial grade | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2013 | 活跃 | 1 (Unlimited) | 8 | SEATED HT-CALCULATED | 1.6V~5.5V | DUAL | 未说明 | 1 | 1.27mm | 未说明 | BR24G64 | 5.5V | 1.6V | 2-Wire, I2C, Serial | 64Kb 8K x 8 | SYNCHRONOUS | 400kHz | 900 ns | EEPROM | I2C | 8 | 5ms | 64 kb | I2C | 5ms | 1.65mm | 4.9mm | 3.9mm | Unknown | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24C01CT/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2008 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | DATA RETENTION > 200 YEARS, 1000000 ERASE/WRITE CYCLES GUARANTEED | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 24C01C | 8 | 5V | 5V | I2C, Serial | 1Kb 128 x 8 | 3mA | 400kHz | 3500ns | EEPROM | I2C | 8 | 1.5ms | 1 kb | 0.00005A | I2C | 1000000 Write/Erase Cycles | 1ms | 200 | 1010DDDR | 1.75mm | 4.9mm | 3.91mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
| 11LC080-I/MS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | 11LC080 | 8 | 5V | Serial | 8Kb 1K x 8 | 5mA | 100kHz | 5 ms | EEPROM | 单线 | 8 | 8 kb | 0.000005A | 1-WIRE | 1000000 Write/Erase Cycles | 10ms | 200 | SOFTWARE | 1.1mm | 3mm | 3mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | BR24G128F-3GTE2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2013 | 活跃 | 1 (Unlimited) | 8 | SEATED HT-CALCULATED | 1.6V~5.5V | DUAL | 未说明 | 1 | 2.5V | 1.27mm | 未说明 | BR24G128 | 不合格 | 5.5V | 1.6V | 2-Wire, I2C, Serial | 128Kb 16K x 8 | SYNCHRONOUS | 400kHz | 900 ns | EEPROM | I2C | 8 | 5ms | 128 kb | 0.000002A | I2C | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 1010DDDR | 1.71mm | 5mm | 4.4mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
| S29GL128S10TFI020 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | Tin | 表面贴装 | 表面贴装 | 56-TFSOP (0.724, 18.40mm Width) | 56 | Non-Volatile | -40°C~85°C TA | Tray | 2011 | GL-S | e3 | 活跃 | 3 (168 Hours) | 56 | 3A991.B.1.A | 8542.32.00.51 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 0.5mm | 3.3V | 3.6V | 2.7V | 128Mb 8M x 16 | 60mA | 100ns | FLASH | Parallel | 16b | 16MX8 | 8 | 60ns | 23b | 128 Mb | 0.0001A | Asynchronous | 16b | 2.7V | YES | YES | YES | 128 | 64K | 32B | YES | YES | 1.2mm | 18.4mm | 无 | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | M25P32-VME6G | Micron Technology Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 8-VDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tray | 2007 | yes | Obsolete | 3 (168 Hours) | 8 | SMD/SMT | 3A991.B.1.A | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 1.27mm | 30 | M25P32 | 8 | 3.3V | 2.7V | 32Mb 4M x 8 | 12mA | 75MHz | 8 ns | FLASH | SPI | 8 | 15ms, 5ms | 22b | 32 Mb | 0.00001A | SERIAL | Synchronous | 8b | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 256B | 85°C | 850μm | 无 | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
| SST25WF020AT-40I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2013 | SST25 | e3 | 活跃 | 1 (Unlimited) | 8 | Matte Tin (Sn) - annealed | 1.65V~1.95V | DUAL | 260 | 1 | 1.8V | 1.27mm | 40 | SST25WF020 | 1.8V | 1.95V | 1.65V | SPI, Serial | 2Mb 256K x 8 | 40MHz | FLASH | SPI | 8b | 2MX1 | 1 | 3.5ms | 2 Mb | 256B | 1.75mm | 4.9mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | IS62WV1288DBLL-45HLI | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 32-TFSOP (0.465, 11.80mm Width) | YES | 32 | Volatile | -40°C~85°C TA | Tray | e3 | yes | 不用于新设计 | 3 (168 Hours) | 32 | EAR99 | Matte Tin (Sn) | 2.3V~3.6V | DUAL | 260 | 1 | 3.3V | 0.5mm | 40 | 32 | 不合格 | 3.6V | 2.5/3.3V | 2.3V | 1Mb 128K x 8 | 1 | 8mA | SRAM | Parallel | 3-STATE | 45ns | 17b | 1 Mb | 0.000004A | 22MHz | 45 ns | COMMON | Asynchronous | 8b | 1.05mm | 18.5mm | 8.2mm | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
| 24AA16-E/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.7V~5.5V | DUAL | NOT APPLICABLE | 1 | 2.5V | 2.54mm | NOT APPLICABLE | 24AA16 | 8 | 不合格 | 5.5V | 2/5V | 2-Wire, I2C, Serial | 16Kb 2K x 8 | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010MMMR | 4.32mm | 9.46mm | 7.62mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | M95640-DFDW6TP | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | Industrial grade | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | e4 | 活跃 | 1 (Unlimited) | 8 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | ALSO OPERATES 1.7 V SUPPLY AT 5MHZ | 1.7V~5.5V | DUAL | 1 | 5V | 0.65mm | M95640 | 8 | 5.5V | 4.5V | SPI, Serial | 64Kb 8K x 8 | 20MHz | 20 ns | EEPROM | SPI | 5ms | 64 kb | SPI | 5ms | 1.05mm | 4.5mm | 3.1mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24LC04B/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | 0°C~70°C TA | Tube | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 40 | 24LC04B | 8 | 5.5V | I2C, Serial | 4Kb 256 x 8 x 2 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 4 kb | I2C | 5ms | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT28HC256E-90JU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Military grade | 表面贴装 | 表面贴装 | 32-LCC (J-Lead) | 32 | Non-Volatile | -40°C~85°C TC | Tube | 1997 | e3 | yes | 活跃 | 2 (1 Year) | 32 | Matte Tin (Sn) - annealed | 自动写入 | 4.5V~5.5V | QUAD | 245 | 1 | 5V | 1.27mm | 5MHz | 40 | AT28HC256 | 5V | 5V | 256Kb 32K x 8 | 80mA | 90ns | EEPROM | Parallel | 3-STATE | 8 | 10ms | 256 kb | 0.0003A | MIL-STD-883 | 5V | 100000 Write/Erase Cycles | 10ms | YES | YES | NO | 64words | 3.556mm | 13.97mm | 11.43mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
| 24LC04BH-E/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2007 | e3 | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 0.65mm | 40 | 24LC04BH | 8 | 不合格 | 5V | I2C, Serial | 4Kb 256 x 8 x 2 | 3mA | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 4 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010XXMR | 1.2mm | 4.4mm | 3mm | ROHS3 Compliant |