类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 工作电源电流 | 端口的数量 | 电源电流 | 操作模式 | 最大电源电流 | 时钟频率 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 访问时间（最大） | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 输出启用 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 环境温度范围高 | 通用闪存接口 | I2C控制字节 | 反向引脚排列 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | M48Z12-70PC1 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 25 Weeks | Commercial grade | 通孔 | 通孔 | 24-DIP Module (0.600, 15.24mm) | 24 | Non-Volatile | 0°C~70°C TA | Tube | e3 | 活跃 | 1 (Unlimited) | 24 | EAR99 | Matte Tin (Sn) | BATTERY BACK-UP; POWER SUPPLY WRITE PROTECTION | 8542.32.00.41 | 4.5V~5.5V | DUAL | 1 | 5V | 2.54mm | 70GHz | M48Z12 | 24 | 5V | 5V | 16Kb 2K x 8 | 1 | 80mA | NVSRAM | Parallel | 8b | 2KX8 | 3-STATE | 70ns | 16 kb | 0.003A | 70 ns | 8b | YES | 8.89mm | 34.8mm | 18.34mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C144AV-25AXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 64-LQFP | 100 | Volatile | 0°C~70°C TA | Tray | 2000 | e4 | yes | Obsolete | 3 (168 Hours) | 64 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 3V~3.6V | QUAD | 260 | 1 | 3.3V | 0.8mm | 25GHz | 30 | CY7C144 | 64 | S-PQFP-G64 | 3.3V | 3.6V | 3V | 64Kb 8K x 8 | 2 | 165mA | SRAM | Parallel | 8KX8 | 3-STATE | 8 | 25ns | 26b | 64 kb | 0.00005A | COMMON | Asynchronous | 8b | 2V | 1.6mm | 14mm | 无 | Unknown | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | M24C08-WMN6T | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | e0 | no | Obsolete | 3 (168 Hours) | 8 | EAR99 | 2.5V~5.5V | DUAL | 1 | 5V | 1.27mm | M24C08 | 8 | 6.5V | 5.5V | 3/5V | 2.5V | 2-Wire, I2C, Serial | 8Kb 1K x 8 | 2mA | 400kHz | 900ns | EEPROM | I2C | OPEN-DRAIN | 8 | 5ms | 8 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 1010DMMR | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1020D-10ZSXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | 44 | Volatile | -40°C~85°C TA | Tray | 1996 | e4 | yes | 活跃 | 3 (168 Hours) | 44 | Nickel/Palladium/Gold (Ni/Pd/Au) | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 0.8mm | 100MHz | 30 | CY7C1020 | 44 | 5V | 5V | 512Kb 32K x 16 | 1 | 80mA | SRAM | Parallel | 3-STATE | 10ns | 15b | 512 kb | 0.003A | COMMON | Asynchronous | 16b | 2V | 1.044mm | 18.52mm | 10.262mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1367C-166AXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 100-LQFP | 100 | Volatile | 0°C~70°C TA | Tray | 2004 | e3 | yes | 活跃 | 3 (168 Hours) | 100 | Matte Tin (Sn) | 流水线结构 | 3.135V~3.6V | QUAD | 260 | 1 | 3.3V | 0.65mm | 20 | CY7C1367 | 100 | 3.3V | 3.6V | 3.135V | 9Mb 512K x 18 | 2 | 180mA | 166MHz | 3.5ns | SRAM | Parallel | 3-STATE | 18 | 19b | 9 Mb | 0.03A | COMMON | Synchronous | 18b | 3.14V | 1.6mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M27C256B-12C1 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 32-LCC (J-Lead) | 32 | Non-Volatile | 0°C~70°C TA | Tube | e3 | Obsolete | 1 (Unlimited) | 32 | EAR99 | Matte Tin (Sn) | 4.5V~5.5V | QUAD | 未说明 | 1 | 5V | 1.27mm | 120GHz | 未说明 | M27C256 | 32 | 不合格 | 5V | 5V | 256Kb 32K x 8 | 30mA | 50mA | ASYNCHRONOUS | 120ns | EPROM | Parallel | 3-STATE | 8 | 256 kb | 0.0001A | COMMON | 3.56mm | 13.97mm | 11.43mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | IS62WV25616DBLL-45TLI | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Industrial grade | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | YES | 44 | Volatile | -40°C~85°C TA | Tray | e3 | yes | Discontinued | 3 (168 Hours) | 44 | 哑光锡 | 2.5V~3.6V | DUAL | 260 | 1 | 0.8mm | 40 | 44 | 3.6V | 2.5/3.3V | 2.3V | 4Mb 256K x 16 | 1 | 18mA | 3mA | SRAM | Parallel | 3-STATE | 45ns | 18b | 4 Mb | 0.000007A | 45 ns | COMMON | Asynchronous | 16b | 1.05mm | 18.54mm | 10.29mm | 无 | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT25M02-SSHD-B | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 25 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | Non-Volatile | -40°C~85°C TC | Bulk | 2005 | e4 | yes | 活跃 | 3 (168 Hours) | 8 | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.5V~5.5V | DUAL | 1 | 3V | 1.27mm | R-PDSO-G8 | 5.5V | 2.5V | SPI, Serial | 2Mb 256K x 8 | SYNCHRONOUS | 5MHz | EEPROM | SPI | 256KX8 | 8 | 10ms | 2097152 bit | SPI | 5ms | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | FM25V02A-DG | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 8-WDFN Exposed Pad | YES | Non-Volatile | -40°C~85°C TA | Tube | 2004 | F-RAM™ | e4 | 活跃 | 3 (168 Hours) | 8 | EAR99 | 镍钯金 | 8542.32.00.71 | 2V~3.6V | DUAL | 260 | 1 | 3.3V | 0.95mm | 30 | R-PDSO-N8 | 3.6V | 2V | 256Kb 32K x 8 | SYNCHRONOUS | 40MHz | 16 ns | FRAM | SPI | 32KX8 | 8 | 262144 bit | 85°C | 800μm | 4.5mm | 4mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 25LC128-I/SM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2011 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 25LC128 | 8 | 5.5V | 3/5V | 2.5V | SPI, Serial | 128Kb 16K x 8 | 5mA | 10MHz | 50 ns | EEPROM | SPI | 8 | 5ms | 128 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 2.03mm | 5.26mm | 5.25mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | 93C56BT-E/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2003 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | 1000K ERASE/WRITE CYCLES; DATA RETENTION > 200 YEARS | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 93C56B | 8 | 5V | 5V | Serial | 2Kb 128 x 16 | 2mA | 2MHz | 250 ns | EEPROM | SPI | 16 | 2ms | 2 kb | 0.000005A | MICROWIRE | 1000000 Write/Erase Cycles | 2ms | 200 | SOFTWARE | 8 | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| 24AA32AT-I/SM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2010 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 40 | 24AA32A | 8 | 5.5V | 2/5V | 1.7V | I2C, Serial | 32Kb 4K x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 32 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 2.03mm | 5.26mm | 5.25mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | CY62128EV30LL-45ZAXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 32-TFSOP (0.465, 11.80mm Width) | 32 | Volatile | -40°C~85°C TA | Tray | 2003 | MoBL® | e4 | yes | 活跃 | 3 (168 Hours) | 32 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.2V~3.6V | DUAL | 260 | 1 | 3V | 0.5mm | 45GHz | 30 | CY62128 | 32 | 3V | 3.6V | 2.2V | 1Mb 128K x 8 | 1 | 16mA | SRAM | Parallel | 3-STATE | 8 | 45ns | 17b | 1 Mb | 0.000003A | 45 ns | COMMON | Asynchronous | 8b | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| SST25WF040B-40I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2006 | SST25 | e3 | 活跃 | 1 (Unlimited) | 8 | Matte Tin (Sn) - annealed | 1.65V~1.95V | DUAL | 260 | 1 | 1.8V | 1.27mm | 40 | SST25WF040 | 1.8V | 1.95V | 1.65V | SPI, Serial | 4Mb 512K x 8 | 4mA | 40MHz | FLASH | SPI | 4MX1 | 1ms | 4 Mb | 256B | 1.25mm | 4.9mm | 3.9mm | 无 | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S29JL032J70TFI210 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | 48 | Non-Volatile | -40°C~85°C TA | Tray | 2011 | JL-J | e3 | 活跃 | 3 (168 Hours) | 48 | 3A991.B.1.A | Matte Tin (Sn) | TOP BOOT BLOCK | 8542.32.00.51 | 2.7V~3.6V | DUAL | 1 | 3V | 0.5mm | 3.6V | 3/3.3V | 2.7V | Parallel, Serial | 32Mb 4M x 8 2M x 16 | 16mA | FLASH | Parallel | 8b | 2MX16 | 16 | 70ns | 32 Mb | 0.000005A | 70 ns | Asynchronous | 3V | 8 | YES | YES | 863 | 8K64K | YES | TOP | 1.2mm | 18.4mm | 无 | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
 | 25LC640AT-E/MNY | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-WFDFN Exposed Pad | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2009 | e4 | 活跃 | 1 (Unlimited) | 8 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.5V~5.5V | DUAL | 260 | 1 | 4.5V | 0.5mm | 40 | 25LC640A | 8 | 5V | SPI, Serial | 64Kb 8K x 8 | 5mA | 10MHz | 100 ns | EEPROM | SPI | 8 | 5ms | 64 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 3mm | 2mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24LC04BT-E/MNY | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Gold | 表面贴装 | 表面贴装 | 8-WFDFN Exposed Pad | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2007 | e4 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 0.5mm | 40 | 24LC04B | 8 | 5V | I2C, Serial | 4Kb 256 x 8 x 2 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 4 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010XXMR | NO | 3mm | 2mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | BR93L76RFV-WE2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 表面贴装 | 表面贴装 | 8-LSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2005 | e2 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Tin/Copper (Sn/Cu) | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 10 | BR93L76 | 8 | 5V | Serial | 8Kb 512 x 16 | 4.5mA | 2MHz | 200 ns | EEPROM | SPI | 512X16 | 16 | 5ms | 8 kb | 0.000002A | MICROWIRE | 1000000 Write/Erase Cycles | 5ms | 40 | SOFTWARE | 1.25mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | BR25H128FJ-2CE2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | Automotive grade | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | -40°C~125°C TA | Cut Tape (CT) | 2014 | Automotive, AEC-Q100 | 活跃 | 1 (Unlimited) | 8 | IT ALSO HAVE FREQUENCY 5 MHZ OPERATES AT 2.5 TO 5.5 V SUPPLY VOLTAGE; SEATED HGT CALCULATED | 2.5V~5.5V | DUAL | 未说明 | 1 | 5V | 1.27mm | 未说明 | 不合格 | 5.5V | 3/5V | 4.5V | 128Kb 16K x 8 | SYNCHRONOUS | 10MHz | EEPROM | SPI | 8 | 4ms | 0.00001A | 131072 bit | SERIAL | SPI | 1000000 Write/Erase Cycles | 4ms | 100 | HARDWARE/SOFTWARE | 1.65mm | 4.9mm | 3.9mm | Unknown | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | TC58BVG0S3HBAI4 | Kioxia America, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 63-VFBGA | YES | Non-Volatile | -40°C~85°C TA | Tray | Benand™ | 活跃 | 3 (168 Hours) | 63 | 2.7V~3.6V | BOTTOM | 1 | 3.3V | 0.8mm | R-PBGA-B63 | 3.6V | 2.7V | 1Gb 128M x 8 | ASYNCHRONOUS | FLASH | Parallel | 128MX8 | 8 | 25ns | 1073741824 bit | 3.3V | 1mm | 11mm | 9mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24AA64F-I/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.7V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | 24AA64F | 8 | 不合格 | 5V | 1.7V | I2C, Serial | 64Kb 8K x 8 | 3mA | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 64 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 1.2mm | 4.4mm | 3mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | BR24T02F-WE2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | Copper, Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2011 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | Matte Tin (Sn) | 1.6V~5.5V | DUAL | 225 | 1 | 2.5V | 1.27mm | 未说明 | BR24T02 | 不合格 | 5.5V | 1.6V | 2-Wire, I2C, Serial | 2Kb 256 x 8 | SYNCHRONOUS | 400kHz | 900 ns | EEPROM | I2C | 8 | 5ms | 2 kb | 0.000002A | I2C | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 1010DDDR | 1.71mm | 5mm | 4.4mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | 25LC320/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 通孔 | 8-DIP (0.300, 7.62mm) | NO | 8 | Non-Volatile | 0°C~70°C TA | Tube | 2005 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 1M ENDURANCE CYCLE; 200 YEARS DATA RETENTION | 2.5V~5.5V | DUAL | 1 | 2.54mm | 25LC320 | 8 | 2.5V | 5.5V | 3/5V | SPI, Serial | 32Kb 4K x 8 | 5mA | 2MHz | 230 ns | EEPROM | SPI | 8 | 5ms | 32 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AT24C08B-PU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | 8-PDIP | Non-Volatile | -40°C~85°C TA | Tube | 2005 | Obsolete | 1 (Unlimited) | 85°C | -40°C | 1.8V~5.5V | 1MHz | AT24C08 | 5V | 2-Wire, I2C, Serial | 5.5V | 1.8V | 8Kb 1K x 8 | 3mA | 1MHz | 550ns | EEPROM | I2C | 5ms | 8 kb | 400kHz | 3.3mm | 9.27mm | 6.35mm | 无 | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M29W256GL70N6E | Micron Technology Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Gold, Tin | 表面贴装 | 56-TFSOP (0.724, 18.40mm Width) | YES | 56 | Non-Volatile | -40°C~85°C TA | Tray | 2010 | e3 | yes | Obsolete | 3 (168 Hours) | 56 | 3A991.B.1.A | 哑光锡 | 8542.32.00.51 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 0.5mm | 30 | M29W256 | 56 | 3/3.3V | 2.7V | 256Mb 32M x 8 16M x 16 | 10mA | FLASH | Parallel | 16MX16 | 16 | 70ns | 256 Mb | 0.0001A | 70 ns | Asynchronous | 0.00007ms | 8 | YES | YES | YES | 256 | 128K | 8/16words | YES | YES | 1.2mm | 20mm | 14mm | 无 | ROHS3 Compliant |