类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 界面 | 内存大小 | 端口的数量 | 电源电流 | 操作模式 | 最大电源电流 | 时钟频率 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 筛选水平 | 访问时间（最大） | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 环境温度范围高 | 通用闪存接口 | I2C控制字节 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||
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 | S34ML01G100BHI000 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 63-VFBGA | 63 | Non-Volatile | -40°C~85°C TA | Tray | 2014 | ML-1 | Discontinued | 3 (168 Hours) | 63 | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 1 | 3.3V | 0.8mm | 3.3V | 3.6V | 2.7V | 1Gb 128M x 8 | 30mA | 20 ns | FLASH | Parallel | 8b | 128MX8 | 25ns | 28b | 1 Gb | 0.00005A | Asynchronous | 8b | 3V | NO | NO | YES | 1K | 128K | 2kB | YES | 1mm | 11mm | 9mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||
 | W25Q16JVSNIQ | Winbond Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tube | 2016 | SpiFlash® | 活跃 | 3 (168 Hours) | 8 | ALSO IT OPERATES AT 2.7V TO 3V WITH 104 MHZ | 8542.32.00.51 | 2.7V~3.6V | DUAL | 未说明 | 1 | 3.3V | 1.27mm | 未说明 | R-PDSO-G8 | 3.6V | 3V | 16Mb 2M x 8 | SYNCHRONOUS | 133MHz | FLASH | SPI - Quad I/O | 2MX8 | 8 | 3ms | 16777216 bit | SERIAL | 3V | 1 | 1.75mm | 4.85mm | 3.9mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24LC08B-E/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2008 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | 2.5V~5.5V | DUAL | 1 | 5V | 2.54mm | 24LC08B | 8 | 5.5V | 3/5V | 2.5V | I2C, Serial | 8Kb 256 x 8 x 4 | 3mA | 400kHz | 900ns | EEPROM | I2C | 5ms | 8 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010XMMR | 195μm | 400μm | 280μm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
 | AT28HC256F-90LM/883 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 23 Weeks | Military grade | Lead, Tin | 表面贴装 | 表面贴装 | 32-CLCC | 32 | Non-Volatile | -55°C~125°C TC | Tube | 1997 | no | 活跃 | 3 (168 Hours) | 32 | 自动写入 | 4.5V~5.5V | QUAD | 1 | 5V | 1.27mm | 90GHz | AT28HC256 | 不合格 | 5V | 5V | Parallel, SPI | 256Kb 32K x 8 | 80mA | ASYNCHRONOUS | 90ns | EEPROM | Parallel | 8 | 3ms | 256 kb | 0.0003A | MIL-STD-883 Class C | 5V | 10000 Write/Erase Cycles | 3ms | YES | YES | 64words | 2.54mm | 13.97mm | 11.43mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||
 | M95010-RDW6TP | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | ACTIVE (Last Updated: 6 months ago) | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | e4 | 活跃 | 1 (Unlimited) | 8 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 30 | M95010 | 8 | 5V | SPI, Serial | 1Kb 128 x 8 | 3mA | 20MHz | 60 ns | EEPROM | SPI | 8 | 5ms | 1 kb | 0.0005A | SPI | 1000000 Write/Erase Cycles | 10ms | 40 | HARDWARE/SOFTWARE | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1011DV33-10BVXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 48-VFBGA | 48 | Volatile | -40°C~85°C TA | Tray | 2002 | e1 | yes | 活跃 | 3 (168 Hours) | 48 | Tin/Silver/Copper (Sn/Ag/Cu) | 3V~3.6V | BOTTOM | 260 | 1 | 3.3V | 0.75mm | 10GHz | 30 | CY7C1011 | 48 | 3.3V | 3.6V | 3V | 2Mb 128K x 16 | 1 | 90mA | SRAM | Parallel | 3-STATE | 16 | 10ns | 17b | 2 Mb | COMMON | Asynchronous | 16b | 2V | 8mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
| 93AA66/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 28 Weeks | Automotive grade | Tin | 通孔 | 8-DIP (0.300, 7.62mm) | NO | 8 | Non-Volatile | 0°C~70°C TA | Tube | 2004 | e3 | yes | 活跃 | 不适用 | 8 | EAR99 | 100K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS | 1.8V~5.5V | DUAL | 1 | 3V | 2.54mm | 93AA66 | 8 | 1.8V | 5.5V | 2/5V | Serial | 4Kb 512 x 8 256 x 16 | 3mA | 2MHz | 2 μs | EEPROM | SPI | 256X16 | 3-STATE | 16 | 10ms | 4 kb | 0.00003A | TS 16949 | MICROWIRE | 10000000 Write/Erase Cycles | 10ms | 200 | SOFTWARE | 8 | 4.32mm | 9.46mm | 7.62mm | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||
 | 24FC64FT-I/OT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | SC-74A, SOT-753 | YES | 5 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2012 | e3 | 活跃 | 1 (Unlimited) | 5 | 1.7V~5.5V | DUAL | 24FC64F | 5.5V | I2C, Serial | 64Kb 8K x 8 | 1MHz | 400ns | EEPROM | I2C | 8KX8 | 8 | 5ms | 64 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 200 | HARDWARE | 1010DDDR | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT28HC256-70JU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Tin | 表面贴装 | 表面贴装 | 32-LCC (J-Lead) | 32 | Non-Volatile | -40°C~85°C TC | Tube | 1997 | e3 | yes | 活跃 | 3 (168 Hours) | 32 | 4.5V~5.5V | QUAD | 245 | 1 | 5V | 1.27mm | 40 | AT28HC256 | 5V | 5V | 256Kb 32K x 8 | 80mA | 70ns | EEPROM | Parallel | 8 | 10ms | 256 kb | 5V | 10000 Write/Erase Cycles | 10ms | YES | YES | NO | 64words | 3.556mm | 13.97mm | 11.43mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | CY14B256LA-SZ25XI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | Gold, Tin | 表面贴装 | 表面贴装 | 32-SOIC (0.295, 7.50mm Width) | 32 | Non-Volatile | -40°C~85°C TA | Tube | 2008 | e3 | yes | 活跃 | 3 (168 Hours) | 32 | EAR99 | Matte Tin (Sn) | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 1.27mm | 30 | CY14*256 | 32 | 3V | 3.6V | 2.7V | 256Kb 32K x 8 | 70mA | NVSRAM | Parallel | 8b | 8 | 25ns | 256 kb | 0.005A | 25 ns | 8b | 2.54mm | 20.726mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | S29GL256S90DHI010 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 表面贴装 | 64-LBGA | 64 | Non-Volatile | -40°C~85°C TA | Tray | 2003 | GL-S | 活跃 | 3 (168 Hours) | 64 | 3A991.B.1.A | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 1 | 3V | 1mm | 3.6V | 3/3.3V | 2.7V | 256Mb 16M x 16 | 60mA | 90ns | FLASH | Parallel | 16b | 32MX8 | 8 | 60ns | 24b | 256 Mb | 0.0001A | Asynchronous | 16b | 3V | YES | YES | YES | 256 | 64K | 32B | YES | BOTTOM/TOP | YES | 1.4mm | 9mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
| 11AA020-I/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | Tin | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2008 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.8V~5.5V | DUAL | 1 | 5V | 2.54mm | 11AA020 | 8 | 5.5V | 2/5V | Serial | 2Kb 256 x 8 | 5mA | 100kHz | EEPROM | 单线 | 5ms | 2 kb | 0.000005A | 1-WIRE | 1000000 Write/Erase Cycles | 10ms | 200 | SOFTWARE | 4.953mm | 10.16mm | 7.112mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | 24AA08T/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED | 1.7V~5.5V | DUAL | 260 | 1 | 3V | 1.27mm | 40 | 24AA08 | 8 | 5.5V | 2/5V | I2C, Serial | 8Kb 256 x 8 x 4 | 3mA | 400kHz | 900ns | EEPROM | I2C | OPEN-DRAIN | 8 | 5ms | 8 kb | 0.00003A | I2C | 1000000 Write/Erase Cycles | 10ms | 200 | HARDWARE | 1010XMMR | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||
| S25FS128SAGMFI101 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | 8 | 540.001716mg | Non-Volatile | -40°C~85°C TA | Tube | 2013 | FS-S | 活跃 | 3 (168 Hours) | 8 | 1.7V~2V | DUAL | 1 | 1.8V | 1.27mm | 1.8V | 2V | 1.7V | SPI, Serial | 128Mb 16M x 8 | 65mA | 133MHz | 8 ns | FLASH | SPI - Quad I/O, QPI | 8b | 32MX4 | 4 | 128 Mb | 2 | 2.159mm | 无 | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT93C56B-MAHM-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 25 Weeks | Gold | 表面贴装 | 表面贴装 | 8-UFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 1997 | e4 | yes | 活跃 | 3 (168 Hours) | 8 | ALSO OPERATES WITH 1.7V-5.5V AND 2.5V-5.5V SUPPLY | 1.7V~5.5V | DUAL | 260 | 1 | 5V | 0.5mm | 40 | AT93C56B | 5.5V | 4.5V | Serial | 2Kb 256 x 8 128 x 16 | 2mA | 2MHz | EEPROM | SPI | 16 | 5ms | 2 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 5ms | 100 | SOFTWARE | 8 | 0.6mm | 3mm | 2mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
| CY62136FV30LL-45BVXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 48-VFBGA | 48 | Volatile | -40°C~85°C TA | Tray | 2001 | MoBL® | e1 | yes | 活跃 | 3 (168 Hours) | 48 | Tin/Silver/Copper (Sn/Ag/Cu) | 2.2V~3.6V | BOTTOM | 260 | 1 | 3V | 0.75mm | 30 | CY62136 | 48 | 3V | 3.6V | 2.2V | 2Mb 128K x 16 | 1 | 18mA | SRAM | Parallel | 3-STATE | 16 | 45ns | 17b | 2 Mb | 0.000004A | 22MHz | 45 ns | COMMON | Asynchronous | 16b | 8mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||
| W25X20CLSNIG | Winbond Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2016 | SpiFlash® | 活跃 | 3 (168 Hours) | 8 | EAR99 | 2.3V~3.6V | DUAL | 1 | 3V | 1.27mm | 8 | 3.6V | 2.5/3.3V | 2.7V | SPI, Serial | 2Mb 256K x 8 | 14mA | 104MHz | 8 ns | FLASH | SPI | 2MX1 | 1 | 800μs | 24b | 2 Mb | 0.000005A | Synchronous | 3V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 1.75mm | 4.9mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
 | SST39SF020A-55-4C-WHE | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 32-TFSOP (0.488, 12.40mm Width) | YES | 32 | Non-Volatile | 0°C~70°C TA | Tray | 2010 | SST39 MPF™ | e3 | yes | 活跃 | 3 (168 Hours) | 32 | 3A991.B.1.A | Matte Tin (Sn) | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 0.5mm | 40 | SST39SF020A | 32 | 5V | 5V | 2Mb 256K x 8 | 25mA | 55ns | FLASH | Parallel | 8b | 256KX8 | 8 | 20μs | 18b | 2 Mb | 0.0001A | Asynchronous | 8b | 5V | YES | YES | YES | 64 | 4K | 1.2mm | 12.4mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||
| S34ML02G100BHI000 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 63-VFBGA | 63 | Non-Volatile | -40°C~85°C TA | Tray | 2014 | ML-1 | 活跃 | 3 (168 Hours) | 63 | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 1 | 3.3V | 0.8mm | 3.3V | 3.6V | 2.7V | 2Gb 256M x 8 | 30mA | 20 ns | FLASH | Parallel | 8b | 256MX8 | 25ns | 29b | 2 Gb | 0.00005A | Asynchronous | 8b | 3V | NO | NO | YES | 2K | 128K | 2kB | YES | 1mm | 11mm | 9mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||
| 93C66CT-E/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2008 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 4.5V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 40 | 93C66C | 8 | 5V | 5V | Serial | 4Kb 512 x 8 256 x 16 | 2mA | 3MHz | 200 ns | EEPROM | SPI | 256X16 | 16 | 2ms | 4 kb | 0.000005A | MICROWIRE | 1000000 Write/Erase Cycles | 2ms | 200 | SOFTWARE | 8 | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||
| S29GL128S90DHI010 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 64-LBGA | 64 | Non-Volatile | -40°C~85°C TA | Tray | 2015 | GL-S | e1 | 活跃 | 3 (168 Hours) | 64 | 3A991.B.1.A | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 260 | 1 | 3V | 1mm | 3.6V | 3/3.3V | 2.7V | 128Mb 8M x 16 | 60mA | 90ns | FLASH | Parallel | 16b | 16MX8 | 8 | 60ns | 23b | 128 Mb | 0.0001A | Asynchronous | 16b | 3V | YES | YES | YES | 128 | 64K | 32B | YES | BOTTOM/TOP | YES | 1.4mm | 9mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||
 | 24AA01T-I/MC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 22 Weeks | Tin | 表面贴装 | 表面贴装 | 8-VFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2007 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 0.5mm | 40 | 24AA01 | 8 | 5V | 1Kb 128 x 8 | 3mA | 400kHz | 3500ns | EEPROM | I2C | 8 | 5ms | 1 kb | 0.000001A | SERIAL | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 85°C | 1010XXXR | 1mm | 3mm | 2mm | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||
| 11LC160-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 11LC160 | 8 | 5V | Serial | 16Kb 2K x 8 | 5mA | 100kHz | 5 ms | EEPROM | 单线 | 16 kb | 0.000005A | 1-WIRE | 1000000 Write/Erase Cycles | 10ms | 200 | SOFTWARE | 1.25mm | 4.9mm | 3.9mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
| S29GL01GS11DHIV10 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 64-LBGA | 64 | Non-Volatile | -40°C~85°C TA | Tray | 2012 | GL-S | 活跃 | 3 (168 Hours) | 64 | 8542.32.00.51 | 1.65V~3.6V | BOTTOM | 1 | 3V | 1mm | 3.6V | 3/3.3V | 2.7V | 1Gb 64M x 16 | 60mA | 110ns | FLASH | Parallel | 16b | 128MX8 | 8 | 60ns | 26b | 1 Gb | 0.0001A | Asynchronous | 16b | 3V | YES | YES | YES | 1K | 64K | 32B | YES | BOTTOM/TOP | 85°C | YES | 1.4mm | 9mm | 无 | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
 | M93C46-MN6 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | -40°C~85°C TA | Tube | Obsolete | 3 (168 Hours) | 8 | 4.5V~5.5V | DUAL | 1 | 5V | 1.27mm | M93C46 | 8 | 5.5V | 5V | 4.5V | Serial | 1Kb 128 x 8 64 x 16 | 2MHz | EEPROM | SPI | 64X16 | 3-STATE | 16 | 5ms | 1 kb | 0.00005A | MICROWIRE | 1000000 Write/Erase Cycles | 5ms | 40 | SOFTWARE | 8 | 1.75mm | 4.9mm | 3.9mm | 无 | 无SVHC | ROHS3 Compliant |