类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 终端数量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 端口的数量 | 电源电流 | 操作模式 | 最大电源电流 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 无卤素 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 访问时间(最大) | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 内存IC类型 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 页面尺寸 | 引导模块 | 环境温度范围高 | I2C控制字节 | 反向引脚排列 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||||||||||||||||||||||
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![]() | CY7C1041DV33-10ZSXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | 44 | Volatile | -40°C~85°C TA | Tray | 1996 | yes | Obsolete | 3 (168 Hours) | SMD/SMT | 3V~3.6V | 100MHz | CY7C1041 | 44 | 3.3V | 4Mb 256K x 16 | 1 | 90mA | 90mA | SRAM | Parallel | 10ns | 18b | 4 Mb | Asynchronous | 16b | 1.04mm | 18.52mm | 10.26mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CAT34C02VP2IGT4A | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | Industrial grade | ACTIVE (Last Updated: 23 hours ago) | Gold | 表面贴装 | 表面贴装 | 8-WFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2008 | e4 | yes | 活跃 | 1 (Unlimited) | 8 | 100 YEAR DATA RETENTION | 1.7V~5.5V | DUAL | 1 | 5V | 0.5mm | CAT34C02 | 8 | 5.5V | 1.7V | 2-Wire, I2C, Serial | 2Kb 256 x 8 | 2mA | 400kHz | 900ns | EEPROM | I2C | 16X16 | 无卤素 | 5ms | 2 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE/SOFTWARE | 1010DDDR | 500μm | 3.1mm | 2.1mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 93LC56T/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 29 Weeks | Tin | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2004 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 100K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 93LC56 | 8 | 6V | 3/5V | 2V | 2-Wire, Serial | 2Kb 256 x 8 128 x 16 | 3mA | 2MHz | 6 ms | EEPROM | SPI | 3-STATE | 8 | 10ms | 2 kb | 0.00003A | MICROWIRE | 10000000 Write/Erase Cycles | 10ms | 200 | SOFTWARE | 16 | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 93C46C-I/MS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2008 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | 93C46C | 8 | 5V | 5V | Serial | 1Kb 128 x 8 64 x 16 | 2mA | 3MHz | 200 ns | EEPROM | SPI | 64X16 | 2ms | 1 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 6ms | 200 | SOFTWARE | 950μm | 3mm | 3mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AT24C1024BN-SH25-B | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | 8-SOIC | Non-Volatile | -40°C~85°C TA | Tube | 1997 | Obsolete | 1 (Unlimited) | 85°C | -40°C | 2.5V~5.5V | 1MHz | AT24C1024 | 5V | 2-Wire, I2C, Serial | 5.5V | 2.5V | 1Mb 128K x 8 | 3mA | 1MHz | 550ns | EEPROM | I2C | 5ms | 1 Mb | 1MHz | 1.5mm | 5mm | 3.99mm | 无 | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY7C1513KV18-250BZXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 表面贴装 | 165-LBGA | 165 | Volatile | 0°C~70°C TA | Tray | 2003 | e1 | 活跃 | 3 (168 Hours) | 165 | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 1.7V~1.9V | BOTTOM | 260 | 1 | 1.8V | 1mm | 30 | CY7C1513 | 165 | 1.8V | 1.9V | 1.7V | 72Mb 4M x 18 | 2 | 500mA | 250MHz | 450 ps | SRAM | Parallel | 4MX18 | 3-STATE | 18 | 20b | 72 Mb | SEPARATE | Synchronous | 18b | 1.7V | 1.4mm | 15mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SST26VF016B-104I/MF | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 8-WDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2006 | SST26 SQI® | e3 | 活跃 | 3 (168 Hours) | 8 | 3A991.B.1.A | Matte Tin (Sn) - annealed | 2.7V~3.6V | DUAL | 未说明 | 1 | 3V | 1.27mm | 未说明 | SST26VF016B | 不合格 | 3.6V | 3/3.3V | 2.7V | SPI, Serial | 16Mb 2M x 8 | SYNCHRONOUS | 104MHz | 0.025mA | FLASH | SPI - Quad I/O | 16MX1 | 1.5ms | 16 Mb | 0.000025A | 2.7V | SPI | 100000 Write/Erase Cycles | 100 | HARDWARE/SOFTWARE | 256B | BOTTOM/TOP | NO | 800μm | 6mm | 5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CAV24C64WE-GT3 | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Automotive grade | ACTIVE (Last Updated: 2 days ago) | Gold | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2008 | Automotive, AEC-Q100 | e4 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 1 | 5V | 1.27mm | CAV24C64 | 8 | 5.5V | 2.5V | 2-Wire, I2C, Serial | 64Kb 8K x 8 | 2mA | 400kHz | 900ns | EEPROM | I2C | 64KX1 | 无卤素 | 5ms | 64 kb | 0.000005A | 5V | I2C | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE | 1010DDDR | 1.5mm | 5mm | 4mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 24LC32AFT-E/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 23 Weeks | Gold | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) - annealed | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 24LC32AF | 8 | 不合格 | 5V | I2C, Serial | 32Kb 4K x 8 | 3mA | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 32 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE | 1010DDDR | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 93LC56BT-I/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2011 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | 93LC56B | 8 | 5.5V | 3/5V | 2.5V | Serial | 2Kb 128 x 16 | 2mA | 2MHz | 250 ns | EEPROM | SPI | 16 | 6ms | 2 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 6ms | 200 | SOFTWARE | 8 | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SST25VF020-20-4C-SAE-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2004 | SST25 | e3 | 活跃 | 3 (168 Hours) | 8 | Matte Tin (Sn) - annealed | 2.7V~3.6V | DUAL | 1.27mm | SST25VF020 | 3.3V | SPI, Serial | 2Mb 256K x 8 | 10mA | 20MHz | 23 ns | FLASH | SPI | 8b | 8 | 20μs | 18b | 2 Mb | 0.000015A | Synchronous | 8b | SPI | 100000 Write/Erase Cycles | 100 | HARDWARE/SOFTWARE | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY62256NLL-55ZXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 表面贴装 | 表面贴装 | 28-TSSOP (0.465, 11.80mm Width) | 28 | Volatile | -40°C~85°C TA | Tray | 2002 | MoBL® | e4 | yes | 最后一次购买 | 3 (168 Hours) | 28 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 0.55mm | 1MHz | 20 | CY62256 | 28 | 5V | 5V | 256Kb 32K x 8 | 1 | 50mA | 50mA | SRAM | Parallel | 32KX8 | 3-STATE | 55ns | 15b | 256 kb | 55 ns | COMMON | Asynchronous | 8b | 2V | 1.02mm | 11.9mm | 8.1mm | 无 | Unknown | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SST25VF040B-80-4I-SAE | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | 540.001716mg | Non-Volatile | -40°C~85°C TA | Tube | 2005 | SST25 | e3 | yes | Obsolete | 3 (168 Hours) | 8 | EAR99 | Matte Tin (Sn) | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 1.27mm | 40 | SST25VF040B | 8 | 3.3V | 3.6V | 2.7V | SPI, Serial | 4Mb 512K x 8 | 20mA | 25mA | 80MHz | 8 ns | FLASH | SPI | 8b | 4MX1 | 1 | 10μs | 1b | 4 Mb | 0.00002A | Synchronous | 8b | 2.7V | SPI | 100000 Write/Erase Cycles | 100 | HARDWARE/SOFTWARE | 1.75mm | 4.9mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CAT24C64C4CTR | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | Industrial grade | ACTIVE (Last Updated: 2 days ago) | 表面贴装 | 表面贴装 | 4-XFBGA, WLCSP | 4 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2008 | yes | 不用于新设计 | 1 (Unlimited) | 4 | 1.7V~5.5V | BOTTOM | 1 | 1.8V | 不合格 | 5.5V | 1.8/5V | 1.7V | 2-Wire, I2C, Serial | 64Kb 8K x 8 | SYNCHRONOUS | 1MHz | 400ns | EEPROM | I2C | 8KX8 | 8 | 5ms | 0.000001A | 65536 bit | I2C | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE | 1010000R | 0.35mm | 0.76mm | 0.76mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY7C028V-20AXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 表面贴装 | 表面贴装 | 100-LQFP | 100 | Volatile | -40°C~85°C TA | Tray | 2004 | e3 | Obsolete | 3 (168 Hours) | 100 | Matte Tin (Sn) | AUTOMATIC POWER-DOWN | 3V~3.6V | QUAD | 260 | 1 | 3.3V | 0.5mm | 20GHz | 30 | CY7C028 | 100 | 3.3V | 3.6V | 3V | 1Mb 64K x 16 | 2 | 140mA | SRAM | Parallel | 64KX16 | 3-STATE | 16 | 20ns | 16b | 1 Mb | 0.00005A | COMMON | Asynchronous | 16b | 2V | 85°C | 1.6mm | 14mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 24LC64T-E/MNY | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Tin | 表面贴装 | 表面贴装 | 8-WFDFN Exposed Pad | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2012 | e4 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 0.5mm | 40 | 24LC64 | 8 | 5V | I2C, Serial | 64Kb 8K x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 64 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 3mm | 2mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 24LC02BT-I/LT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | Tin | 表面贴装 | 表面贴装 | 5-TSSOP, SC-70-5, SOT-353 | 5 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2005 | e3 | yes | 活跃 | 1 (Unlimited) | 5 | SMD/SMT | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 40 | 24LC02B | 5 | 5V | I2C, Serial | 2Kb 256 x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 5ms | 2 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 200 | HARDWARE | 1010XXXR | 1mm | 2mm | 1.25mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY62148EV30LL-55SXIT | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 32-SOIC (0.445, 11.30mm Width) | 32 | Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2003 | MoBL® | e4 | yes | 活跃 | 3 (168 Hours) | 32 | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.2V~3.6V | DUAL | 260 | 1 | 3V | 30 | CY62148 | 3.6V | 2.5/3.3V | 2.2V | 4Mb 512K x 8 | 1 | 20mA | SRAM | Parallel | 3-STATE | 8 | 55ns | 19b | 4 Mb | 0.000007A | 55 ns | COMMON | Asynchronous | 8b | 2.997mm | 20.4465mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 24LCS21A-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2005 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED | 2.5V~5.5V | DUAL | 260 | 1 | 3V | 1.27mm | 40 | 24LCS21A | 8 | 5.5V | 3/5V | 2.5V | 2-Wire, I2C, SPI, Serial | 1Kb 128 x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 10ms | 1 kb | 0.00003A | I2C | 1000000 Write/Erase Cycles | 10ms | 200 | HARDWARE | 1010000R | 1.5mm | 4.9mm | 3.9mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 23K640T-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2011 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) - annealed | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 40 | 23K640 | 8 | 3.3V | 3.6V | 2.7V | SPI, Serial | 64Kb 8K x 8 | 1 | 10mA | 20MHz | 25 ns | SRAM | SPI | 3-STATE | 8 | 1b | 64 kb | 0.000004A | SEPARATE | Synchronous | 8b | 2.7V | 4.9mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY62146EV30LL-45BVXIT | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 48-VFBGA | 48 | Volatile | -40°C~85°C TA | Tape & Reel (TR) | 1996 | MoBL® | e1 | yes | 活跃 | 3 (168 Hours) | 48 | Tin/Silver/Copper (Sn/Ag/Cu) | 2.2V~3.6V | BOTTOM | 260 | 1 | 3V | 0.75mm | 45GHz | 30 | CY62146 | 3V | 3.6V | 2.2V | 4Mb 256K x 16 | 1 | 20mA | SRAM | Parallel | 3-STATE | 16 | 45ns | 18b | 4 Mb | 0.000007A | 45 ns | COMMON | Asynchronous | 16b | 8mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 24LC32AESNRVB | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 小概要 | 1 | 4000 | PLASTIC/EPOXY | -40 °C | 40 | 125 °C | 有 | 24LC32A-E/SNRVB | 0.4 MHz | 4096 words | 5 V | SOP | RECTANGULAR | Microchip Technology Inc | 活跃 | MICROCHIP TECHNOLOGY INC | 5.08 | SOIC | YES | 8 | SOP, | e3 | 有 | EAR99 | Matte Tin (Sn) | 2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED | 8542.32.00.51 | CMOS | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | 不合格 | 5.5 V | AUTOMOTIVE | 2.5 V | SYNCHRONOUS | 4KX8 | 1.75 mm | 8 | 32768 bit | SERIAL | EEPROM | I2C | 5 ms | 200 | 4.9 mm | 3.9 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | RMLV0416EGSB-4S2#AA1 | Renesas Electronics America | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | YES | Volatile | -40°C~85°C TA | Tube | yes | 活跃 | 3 (168 Hours) | 44 | 2.7V~3.6V | DUAL | 未说明 | 1 | 3V | 未说明 | 44 | R-PDSO-G44 | 3.6V | 2.7V | 4Mb 256K x 16 | ASYNCHRONOUS | SRAM | Parallel | 256KX16 | 16 | 45ns | 4194304 bit | 45 ns | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 93C86BT-E/OT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | SOT-23-6 | 6 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2008 | e3 | yes | 活跃 | 1 (Unlimited) | 6 | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 0.95mm | 40 | 93C86B | 6 | 5V | 5V | Serial | 16Kb 1K x 16 | 3mA | 3MHz | 100 ns | EEPROM | SPI | 16 | 2ms | 16 kb | 0.000005A | MICROWIRE | 1000000 Write/Erase Cycles | 2ms | 200 | SOFTWARE | 1.45mm | 2.95mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CAV25160VE-GT3 | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | ACTIVE (Last Updated: 2 days ago) | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2008 | Automotive, AEC-Q100 | e4 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 100 YEAR DATA RETENTION | 2.5V~5.5V | DUAL | 未说明 | 1 | 5V | 1.27mm | 未说明 | CAV25160 | 8 | 5.5V | 2.5V | SPI, Serial | 16Kb 2K x 8 | 3mA | SYNCHRONOUS | 20MHz | 35 ns | EEPROM | SPI | 无卤素 | 5ms | 16 kb | 0.000005A | SPI | 5ms | 100 | HARDWARE/SOFTWARE | 1.5mm | 5mm | 4mm | ROHS3 Compliant | 无铅 |