类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 额定直流 | 电压 - 供电 | 端子位置 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 端口的数量 | 电源电流 | 操作模式 | 最大电源电流 | 时钟频率 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 筛选水平 | 访问时间（最大） | I/O类型 | 同步/异步 | 字长 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 环境温度范围高 | 刷新周期 | 通用闪存接口 | I2C控制字节 | 顺序突发长度 | 交错突发长度 | 反向引脚排列 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||
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 | AT28HC256-12LM/883 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 23 Weeks | Military grade | 表面贴装 | 表面贴装 | 32-CLCC | 32 | Non-Volatile | -55°C~125°C TC | Tube | 1997 | e0 | no | 活跃 | 3 (168 Hours) | 32 | Tin/Lead (Sn/Pb) | 自动写入 | 4.5V~5.5V | QUAD | 225 | 1 | 5V | 1.27mm | 120GHz | 30 | AT28HC256 | 5V | 5V | Parallel, SPI | 256Kb 32K x 8 | 80mA | 120ns | EEPROM | Parallel | 3-STATE | 8 | 10ms | 256 kb | 0.0003A | MIL-STD-883 Class C | 5V | 10000 Write/Erase Cycles | 10ms | YES | YES | 64words | 2.54mm | 13.97mm | 11.43mm | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24LC08BT-E/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 24LC08B | 8 | 5.5V | 3/5V | 2.5V | I2C, Serial | 8Kb 256 x 8 x 4 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 8 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010XMMR | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT34C04-MA5M-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 8-UFDFN Exposed Pad | YES | Non-Volatile | -20°C~125°C TA | Tape & Reel (TR) | 2012 | e4 | yes | 活跃 | 3 (168 Hours) | 8 | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.7V~3.6V | DUAL | 260 | 1 | 2V | 0.5mm | 40 | AT34C04 | R-PDSO-N8 | 不合格 | 3.6V | 1.8/3.3V | 1.7V | 2-Wire, I2C, Serial | 4Kb 512 x 8 | SYNCHRONOUS | 1MHz | EEPROM | I2C | 4KX1 | 1 | 5ms | 0.000003A | 4096 bit | I2C | 1000000 Write/Erase Cycles | 5ms | 100 | SOFTWARE | 1010DDDR | 0.6mm | 3mm | 2mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S25FL512SAGMFI011 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | 16 | 200.686274mg | Non-Volatile | -40°C~85°C TA | Tube | 2013 | FL-S | e3 | 活跃 | 3 (168 Hours) | 16 | Matte Tin (Sn) | IT ALSO HAVE MEMORY WIDTH X1 | 8542.32.00.51 | 2.7V~3.6V | DUAL | 1 | 3V | 1.27mm | 3.6V | 3/3.3V | 2.7V | Parallel, SPI, Serial | 512Mb 64M x 8 | 75mA | 35mA | 133MHz | 8 ns | FLASH | SPI - Quad I/O | 8b | 64MX8 | 8 | 32b | 512 Mb | 0.0001A | Asynchronous | 3V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 1 | 512B | 2.65mm | 10.3mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24AA16T-E/OT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | Tin | 表面贴装 | 表面贴装 | SC-74A, SOT-753 | 5 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 5 | EAR99 | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 40 | 24AA16 | 5 | 1.8V | 2-Wire, I2C, Serial | 16Kb 2K x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 2KX8 | 5ms | 16 kb | I2C | 1000000 Write/Erase Cycles | 200 | HARDWARE | 1010MMMR | 1.3mm | 3.1mm | 1.8mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 11LC080-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | SMD/SMT | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 11LC080 | 8 | 5V | Serial | 8Kb 1K x 8 | 5mA | 100kHz | 5 ms | EEPROM | 单线 | 8 kb | 0.000005A | 1-WIRE | 1000000 Write/Erase Cycles | 10ms | 200 | SOFTWARE | 1.25mm | 4.9mm | 3.9mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24LC256-E/MS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Automotive grade | Tin | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2013 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 0.65mm | 40 | 24LC256 | 8 | 5.5V | 3/5V | 2.5V | I2C, Serial | 256Kb 32K x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 5ms | 256 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | NO | 950μm | 3mm | 3mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C15632KV18-400BZXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 表面贴装 | 165-LBGA | 165 | Volatile | 0°C~70°C TA | Tray | 2003 | e1 | 活跃 | 3 (168 Hours) | 165 | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 1.7V~1.9V | BOTTOM | 260 | 1 | 1.8V | 1mm | 30 | CY7C15632 | 165 | 1.8V | 1.9V | 1.7V | 72Mb 4M x 18 | 2 | 710mA | 400MHz | 450 ps | SRAM | Parallel | 4MX18 | 3-STATE | 18 | 20b | 72 Mb | SEPARATE | Synchronous | 18b | 1.7V | 1.4mm | 15mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT29LV040A-20TI | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 32-TFSOP (0.724, 18.40mm Width) | 32 | 32-TSOP I | Non-Volatile | -40°C~85°C TC | Tray | 1997 | Obsolete | 3 (168 Hours) | SMD/SMT | 85°C | -40°C | 3V~3.6V | 200GHz | AT29LV040 | Parallel | 3.6V | 3V | 4Mb 512K x 8 | 200ns | FLASH | Parallel | 8b | 20ms | 无SVHC | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24AA256-E/SM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | Automotive grade | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2010 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.7V~5.5V | DUAL | 260 | 1 | 1.27mm | 40 | 24AA256 | 8 | 5.5V | 1.7V | I2C, Serial | 256Kb 32K x 8 | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 256 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | NO | 2.03mm | 5.26mm | 5.25mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | NAND512W3A2SN6E | Micron Technology Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tin | 表面贴装 | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | 48 | Non-Volatile | -40°C~85°C TA | Tray | 2010 | e4 | yes | Obsolete | 3 (168 Hours) | 48 | 3A991.B.1.A | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.32.00.51 | 3V | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 0.5mm | 30 | NAND512-A | 48 | 3V | 512Mb 64M x 8 | 8mA | FLASH | Parallel | 64MX8 | 8 | 50ns | 26b | 512 Mb | Asynchronous | 8b | 512B | 85°C | 1.2mm | 18.4mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 25LC080AT-E/MS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | 8-MSOP | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2004 | 活跃 | 1 (Unlimited) | 125°C | -40°C | 2.5V~5.5V | 10MHz | 25LC080A | SPI, Serial | 5.5V | 2.5V | 8Kb 1K x 8 | 6mA | 10MHz | 100 ns | EEPROM | SPI | 5ms | 8 kb | 10MHz | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST39LF020-45-4C-B3KE | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 表面贴装 | 48-TFBGA | YES | 48 | Non-Volatile | 0°C~70°C TA | Tray | 2010 | SST39 MPF™ | e1 | yes | Obsolete | 3 (168 Hours) | 48 | 3A991.B.1.A | 锡银铜 | 8542.32.00.51 | 3V~3.6V | BOTTOM | 260 | 1 | 3.3V | 0.8mm | 40 | SST39LF020 | 48 | 3.3V | 3.6V | 3V | 2Mb 256K x 8 | 20mA | 45ns | FLASH | Parallel | 8b | 256KX8 | 8 | 20μs | 18b | 2 Mb | 0.000015A | Asynchronous | 8b | 3V | YES | YES | YES | 64 | 4K | 1.2mm | 8mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||
 | MX29LV320EBTI-70G | Macronix | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | 48 | Non-Volatile | -40°C~85°C TA | Tray | 2010 | MX29LV | 活跃 | 3 (168 Hours) | 48 | 3A991.B.1.A | 底部启动区块 | 8542.32.00.51 | 2.7V~3.6V | DUAL | 1 | 3V | 0.5mm | 48 | 3.6V | 3/3.3V | 2.7V | 32Mb 4M x 8 | 16mA | FLASH | Parallel | 2MX16 | 16 | 70ns | 21b | 32 Mb | 0.000015A | 70 ns | Asynchronous | 3V | 8 | YES | YES | YES | 863 | 8K64K | YES | BOTTOM | 85°C | YES | 1.2mm | 18.4mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT27LV256A-90JU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 32-LCC (J-Lead) | 32 | Non-Volatile | -40°C~85°C TC | Tube | 1997 | e3 | yes | 活跃 | 2 (1 Year) | 32 | Matte Tin (Sn) - annealed | 3V~3.6V 4.5V~5.5V | QUAD | 245 | 1 | 3.3V | 1.27mm | 90GHz | 40 | AT27LV256 | 5V | 3.6V | 3V | 256Kb 32K x 8 | 20mA | 90ns | EPROM | Parallel | 3-STATE | 8 | 256 kb | 0.00002A | COMMON | 13V | 3.556mm | 13.97mm | 11.43mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | FM28V020-SG | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | Tin | 表面贴装 | 表面贴装 | 28-SOIC (0.295, 7.50mm Width) | 28 | 2.214806g | Non-Volatile | -40°C~85°C TA | Tube | 2013 | F-RAM™ | e3 | 活跃 | 3 (168 Hours) | 28 | EAR99 | 8542.32.00.71 | 2V~3.6V | DUAL | 1 | 3.3V | 1.27mm | FM28V020 | 28 | 3.3V | 3.6V | 2V | 256Kb 32K x 8 | 12mA | FRAM | Parallel | 8b | 32KX8 | 140ns | 256 kb | 0.00015A | 140 ns | 8b | 2.37mm | 18.11mm | 7.62mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 93AA76B-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2008 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 40 | 93AA76B | 8 | 不合格 | 5V | Serial | 8Kb 512 x 16 | 3mA | SYNCHRONOUS | 3MHz | 100 ns | EEPROM | SPI | 512X16 | 16 | 5ms | 8 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 5ms | 200 | SOFTWARE | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | W9751G6KB-25 | Winbond Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tin | 表面贴装 | 表面贴装 | 84-TFBGA | 84 | Volatile | 0°C~85°C TC | Tray | 2013 | 最后一次购买 | 3 (168 Hours) | 84 | EAR99 | AUTO/SELF REFRESH | 8542.32.00.28 | 1.7V~1.9V | BOTTOM | 1 | 1.8V | 0.8mm | 84 | 1.8V | 1.9V | 1.7V | 512Mb 32M x 16 | 1 | 165mA | 400MHz | 400ps | DRAM | Parallel | 16b | 32MX16 | 3-STATE | 16 | 15ns | 15b | 512 Mb | 0.008A | 800MHz | COMMON | 8192 | 48 | 48 | 1.2mm | 12.5mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24LC014H-I/MS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2008 | e3 | yes | 活跃 | 2 (1 Year) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 4.5V | 0.65mm | 40 | 24LC014H | 8 | 5V | 2-Wire, I2C, Serial | 1Kb 128 x 8 | 3mA | 1MHz | 400ns | EEPROM | I2C | 5ms | 1 kb | I2C | 5ms | 950μm | 3mm | 3mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 93LC56AT-E/OT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | SOT-23-6 | 6 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 1998 | e3 | yes | 活跃 | 1 (Unlimited) | 6 | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 0.95mm | 40 | 93LC56A | 6 | 5.5V | 3/5V | 2.5V | Serial | 2Kb 256 x 8 | 2mA | 2MHz | 250 ns | EEPROM | SPI | 8 | 6ms | 2 kb | 0.000005A | MICROWIRE | 1000000 Write/Erase Cycles | 200 | SOFTWARE | 1.45mm | 2.9mm | 1.55mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24VL014T/MNY | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | Gold | 表面贴装 | 表面贴装 | 8-WFDFN Exposed Pad | 8 | Non-Volatile | -20°C~85°C TA | Tape & Reel (TR) | 2008 | e4 | yes | 活跃 | 1 (Unlimited) | 8 | SMD/SMT | EAR99 | 1.5V~3.6V | DUAL | 260 | 1 | 1.8V | 0.5mm | 40 | 24VL014 | 8 | 3.3V | 3.6V | 1.5V | 2-Wire, I2C, Serial | 1Kb 128 x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 5ms | 1 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 730μm | 2mm | 3mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S29GL032N90TFI020 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Tin | 表面贴装 | 表面贴装 | 56-TFSOP (0.724, 18.40mm Width) | 56 | Non-Volatile | -40°C~85°C TA | Tray | 2008 | GL-N | e3 | 活跃 | 3 (168 Hours) | 56 | 3A991.B.1.A | 8542.32.00.51 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 0.5mm | 40 | 3.6V | 3/3.3V | 2.7V | 32Mb 4M x 8 2M x 16 | 50mA | FLASH | Parallel | 16b | 2MX16 | 16 | 90ns | 32 Mb | 0.000005A | 90 ns | Asynchronous | 3V | 8 | YES | YES | YES | 64 | 64K | 8/16words | YES | BOTTOM/TOP | YES | 1.2mm | 18.4mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | CY62138FV30LL-45ZAXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 32-TFSOP (0.465, 11.80mm Width) | 32 | Volatile | -40°C~85°C TA | Tray | 2003 | MoBL® | e4 | yes | 活跃 | 3 (168 Hours) | 32 | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.2V~3.6V | DUAL | 260 | 1 | 3V | 0.5mm | 1MHz | 30 | CY62138 | 32 | 3V | 3.6V | 2.2V | 2Mb 256K x 8 | 1 | 18mA | 18mA | SRAM | Parallel | 256KX8 | 3-STATE | 45ns | 18b | 2 Mb | 0.000004A | 45 ns | COMMON | Asynchronous | 8b | 1.05mm | 11.9mm | 8.1mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24LC512-E/MF | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | 表面贴装 | 8-VDFN Exposed Pad | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2010 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 4.5V | 1.27mm | 40 | 24LC512 | 8 | 5.5V | 3/5V | 2.5V | 2-Wire, I2C, Serial | 512Kb 64K x 8 | 5mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 512 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 1mm | 6mm | 5mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST25VF032B-66-4I-S2AF | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | 8 | 540.001716mg | Non-Volatile | -40°C~85°C TA | Tube | 2010 | SST25 | e4 | yes | Obsolete | 3 (168 Hours) | 8 | 3A991.B.1.A | 镍钯金 | 2.7V~3.6V | DUAL | 1 | 3V | 1.27mm | SST25VF032B | 8 | 3.3V | 3.6V | 2.7V | SPI, Serial | 32Mb 4M x 8 | 20mA | 20mA | 66MHz | 6 ns | FLASH | SPI | 8b | 8 | 10μs | 1b | 32 Mb | 0.00002A | Synchronous | 8b | 2.7V | SPI | 100000 Write/Erase Cycles | 100 | HARDWARE/SOFTWARE | 2.16mm | 5.275mm | 无 | ROHS3 Compliant | 无铅 |