类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 厂商 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | ECCN 代码 | 类型 | 端子表面处理 | 附加功能 | HTS代码 | 技术 | 电压 - 供电 | 端子位置 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 电压 | 界面 | 内存大小 | 端口的数量 | 电源电流 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 无卤素 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 访问时间（最大） | I/O类型 | 同步/异步 | 字长 | 内存IC类型 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 环境温度范围高 | 通用闪存接口 | I2C控制字节 | 产品 | 标准 | 反向引脚排列 | 组织的记忆 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||||||||||||||||||
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 | M29W040B90K1 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 32-LCC (J-Lead) | YES | 32 | Non-Volatile | 0°C~70°C TA | Tube | e0 | Obsolete | 3 (168 Hours) | 32 | EAR99 | 锡铅 | 2.7V~3.6V | QUAD | 未说明 | 1 | 3.3V | 1.27mm | 未说明 | M29W040 | 32 | 不合格 | 3.6V | 3/3.3V | 2.7V | 4Mb 512K x 8 | ASYNCHRONOUS | FLASH | Parallel | 8b | 512KX8 | 8 | 90ns | 0.0001A | 4194304 bit | 90 ns | 2.7V | 100000 Write/Erase Cycles | YES | YES | YES | 8 | 64K | 3.56mm | 13.97mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY62146EV30LL-45BVXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 48-VFBGA | 48 | Volatile | -40°C~85°C TA | Tray | 1996 | MoBL® | e1 | yes | 活跃 | 3 (168 Hours) | 48 | Tin/Silver/Copper (Sn/Ag/Cu) | 2.2V~3.6V | BOTTOM | 260 | 1 | 3V | 0.75mm | 45GHz | 30 | CY62146 | 48 | 3V | 3.6V | 2.2V | 4Mb 256K x 16 | 1 | 20mA | SRAM | Parallel | 3-STATE | 16 | 45ns | 18b | 4 Mb | 0.000007A | 45 ns | COMMON | Asynchronous | 16b | 8mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24LC16BH-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2007 | e3 | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 40 | 24LC16BH | 8 | 5V | 1.7V | I2C, Serial | 16Kb 2K x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 16 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010MMMR | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M24128-DRMN3TP/K | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | Automotive grade | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | -40°C~125°C TA | Cut Tape (CT) | Automotive, AEC-Q100 | e4 | 活跃 | 1 (Unlimited) | 8 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~5.5V | DUAL | 1 | 2.5V | 1.27mm | M24128 | 5.5V | 2-Wire, I2C, Serial | 128Kb 16K x 8 | 1MHz | 450ns | EEPROM | I2C | 8 | 4ms | 128 kb | I2C | 4ms | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24AA02/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | 0°C~70°C TA | Tube | 1999 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED | 1.7V~5.5V | DUAL | 260 | 1 | 3V | 1.27mm | 40 | 24AA02 | 8 | 5.5V | I2C, Serial | 2Kb 256 x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | OPEN-DRAIN | 5ms | 2 kb | I2C | 10ms | 1.25mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 25AA080AT-I/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2003 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 40 | 25AA080A | 8 | 5.5V | 2/5V | SPI, Serial | 8Kb 1K x 8 | 6mA | 10MHz | 160 ns | EEPROM | SPI | 8 | 5ms | 8 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST39LF010-55-4C-WHE | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 表面贴装 | 表面贴装 | 32-TFSOP (0.488, 12.40mm Width) | 32 | Non-Volatile | 0°C~70°C TA | Tray | 2010 | SST39 MPF™ | e3 | yes | 活跃 | 3 (168 Hours) | 32 | EAR99 | Matte Tin (Sn) | 3V~3.6V | DUAL | 260 | 1 | 3.3V | 0.5mm | 40 | SST39LF010 | 32 | 3.3V | 3.6V | 3V | 1Mb 128K x 8 | 20mA | 55ns | FLASH | Parallel | 8b | 128KX8 | 8 | 20μs | 17b | 1 Mb | 0.000015A | Asynchronous | 8b | 3V | YES | YES | YES | 32 | 4K | 1.2mm | 12.4mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24LC01BHT-I/MNY | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-WFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2008 | e4 | 活跃 | 1 (Unlimited) | 8 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.5V~5.5V | DUAL | 260 | 1 | 4.5V | 0.5mm | 40 | 24LC01BH | 8 | 5V | 2-Wire, Serial | 1Kb 128 x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 1 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010XXXR | 3mm | 2mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24AA025T-I/MC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Automotive grade | Tin | 表面贴装 | 表面贴装 | 8-VFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Cut Tape (CT) | 2005 | e3 | yes | 活跃 | 3 (168 Hours) | 8 | EAR99 | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 0.5mm | 40 | 24AA025 | 8 | 5V | 1.7V | I2C, Serial | 2Kb 256 x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 2 kb | 0.000001A | TS 16949 | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | 1010DDDR | 1mm | 3mm | 2mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 93LC46B-E/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2003 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 3V | 1.27mm | 40 | 93LC46B | 8 | 5.5V | 3/5V | 2.5V | Serial | 1Kb 64 x 16 | 2mA | 2MHz | 250 ns | EEPROM | SPI | 64X16 | 16 | 6ms | 1 kb | 0.000005A | MICROWIRE | 1000000 Write/Erase Cycles | 6ms | 200 | SOFTWARE | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24FC128T-I/MNY | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 8-WFDFN Exposed Pad | YES | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2010 | e4 | 活跃 | 1 (Unlimited) | 8 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 0.5mm | 40 | 24FC128 | 8 | 不合格 | 5.5V | 2/5V | 1.7V | I2C, Serial | 128Kb 16K x 8 | 3mA | SYNCHRONOUS | 1MHz | 400ns | EEPROM | I2C | 8 | 5ms | 128 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 3mm | 2mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT28HC64B-90SU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | Tin | 表面贴装 | 表面贴装 | 28-SOIC (0.295, 7.50mm Width) | 28 | Non-Volatile | -40°C~85°C TC | Tube | 1997 | e3 | yes | 活跃 | 3 (168 Hours) | 28 | 4.5V~5.5V | DUAL | 250 | 1 | 5V | 1.27mm | 90GHz | 40 | AT28HC64 | 不合格 | 5V | 5V | Parallel, SPI | 64Kb 8K x 8 | 40mA | ASYNCHRONOUS | 90ns | EEPROM | Parallel | 8KX8 | 8 | 10ms | 64 kb | 0.0001A | 5V | 100000 Write/Erase Cycles | 10ms | 10 | YES | YES | 64words | 2.65mm | 17.9mm | 7.5mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST39WF1601-70-4C-MAQE | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 48-WFBGA | YES | 48 | Non-Volatile | 0°C~70°C TA | Tray | 2010 | SST39 MPF™ | e1 | 活跃 | 3 (168 Hours) | 48 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM BOOT-BLOCK | 8542.32.00.51 | 1.65V~1.95V | BOTTOM | 260 | 1 | 1.8V | 0.5mm | 40 | SST39WF1601 | 48 | 1.8V | 1.95V | 1.65V | 16Mb 1M x 16 | 10mA | 70ns | FLASH | Parallel | 16b | 1MX16 | 16 | 40μs | 20b | 16 Mb | 0.00004A | Asynchronous | 16b | YES | YES | YES | 512 | 2K | BOTTOM | YES | 0.73mm | 6mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M24C08-FDW6TP | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | YES | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | e3 | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 30 | M24C08 | 8 | 5.5V | 1.7V | 2-Wire, I2C, Serial | 8Kb 1K x 8 | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 8 kb | I2C | 10ms | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CAT25040VP2I-GT3 | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | Industrial grade | ACTIVE (Last Updated: 13 hours ago) | Gold | 表面贴装 | 表面贴装 | 8-WFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2008 | e4 | yes | 活跃 | 1 (Unlimited) | 8 | 1.8V~5.5V | DUAL | 260 | 1 | 5V | 0.5mm | 40 | CAT25040 | 8 | 不合格 | 5V | SPI, Serial | 4Kb 512 x 8 | 2mA | SYNCHRONOUS | 10MHz | 75 ns | EEPROM | SPI | 无卤素 | 5ms | 4 kb | 0.000002A | SPI | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE/SOFTWARE | 750μm | 3.1mm | 2.1mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M29W160EB70N6E | Micron Technology Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Gold, Tin | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | YES | 48 | Non-Volatile | -40°C~85°C TA | Tray | 1998 | e3 | yes | Obsolete | 3 (168 Hours) | 48 | SMD/SMT | EAR99 | Matte Tin (Sn) | 底部启动区块 | 8542.32.00.51 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 0.5mm | 30 | M29W160 | 48 | 3/3.3V | 2.7V | 16Mb 2M x 8 1M x 16 | 10mA | FLASH | Parallel | 1MX16 | 16 | 70ns | 16 Mb | 0.0001A | 70 ns | Asynchronous | 8 | YES | YES | YES | 12131 | 16K8K32K64K | YES | BOTTOM | YES | 1.2mm | 18.4mm | 12mm | 无 | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT24C01C-MAHM-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Automotive grade | 表面贴装 | 8-UFDFN Exposed Pad | YES | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2005 | e4 | yes | 活跃 | 3 (168 Hours) | 8 | Nickel/Palladium/Gold (Ni/Pd/Au) | ALSO HAS 1 MHZ CLOCK FREQ AT 2.5V AND 5V SUPPLY | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 0.5mm | 40 | AT24C01 | 5.5V | 1.7V | 2-Wire, I2C, Serial | 1Kb 128 x 8 | 1 | 3mA | 1MHz | 550ns | EEPROM | I2C | OPEN-DRAIN | 8 | 5ms | 1 kb | 0.000006A | ISO/TS-16949 | I2C | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE | YES | NO | 0.6mm | 3mm | 2mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24AA00T-I/MC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-VFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2007 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 0.5mm | 40 | 24AA00 | 8 | 5.5V | 2/5V | 1.7V | 2-Wire, I2C, Serial | 128b 16 x 8 | 2mA | 400kHz | 3500ns | EEPROM | I2C | 8 | 4ms | 128 b | 0.000001A | I2C | 1000000 Write/Erase Cycles | 4ms | 200 | 1010XXXR | 1mm | 3mm | 2mm | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 34AA02-E/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2011 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 40 | 34AA02 | 8 | 不合格 | 5V | 1.7V | I2C, Serial | 2Kb 256 x 8 | 3mA | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 2 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1010DDDR | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png) | MT29F64G08AJABAWP-IT:B TR | Micron | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SMD/SMT | Parallel | Asynchronous | 2.7 V | - 40 C | + 85 C | 50 mA | NAND | 1000 | Tape & Reel (TR) | 活跃 | 3.6 V | MT29F64G08AJABAWP-IT:BTR | 活跃 | MICRON TECHNOLOGY INC | 5.68 | 表面贴装 | TSOP-48 | 48-TSOP I | Micron Technology Inc. | Details | -40°C ~ 85°C (TA) | Reel | MT29F | 无引导块 | FLASH - NAND (SLC) | 2.7V ~ 3.6V | compliant | Parallel | 64 Gbit | 50 mA | 20 | FLASH | ONFI | 8 bit | 8 G x 8 | 20ns | 64 | FLASH | 2.7 V | NAND闪存 | 不支持 | 8G x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 47L16-I/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tube | e3 | 活跃 | 1 (Unlimited) | 8 | Matte Tin (Sn) - annealed | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 0.65mm | 40 | 47L16 | R-PDSO-G8 | 3.6V | 2.7V | 16Kb 2K x 8 | SYNCHRONOUS | 1MHz | 400ns | EERAM | I2C | 2KX8 | 8 | 1ms | 16384 bit | 1.2mm | 4.4mm | 3mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | FM25V02A-G | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2008 | F-RAM™ | e4 | 活跃 | 3 (168 Hours) | 8 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 2V~3.6V | DUAL | 260 | 1 | 3.3V | 1.27mm | 30 | 3.3V | 3.6V | 2V | 256Kb 32K x 8 | SYNCHRONOUS | 40MHz | 9 ns | FRAM | SPI | 8b | 8 | 256 kb | 85°C | 1.727mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24C65/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Commercial grade | Tin | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | Non-Volatile | 0°C~70°C TA | Tube | 2003 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED | 4.5V~6V | DUAL | 1 | 5V | 2.54mm | 24C65 | 8 | 5V | 6V | 5V | 2-Wire, I2C, Serial | 64Kb 8K x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | OPEN-DRAIN | 5ms | 64 kb | 0.000005A | I2C | 100000 Write/Erase Cycles | 5ms | 200 | SOFTWARE | 1010DDDR | 4.953mm | 10.16mm | 7.112mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY62167DV30LL-55ZXIT | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | 48 | Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2003 | MoBL® | e3 | yes | 活跃 | 3 (168 Hours) | 48 | Matte Tin (Sn) | CONFIGURABLE AS 2M X 8 ALSO | 2.2V~3.6V | DUAL | 260 | 1 | 3V | 0.5mm | 55GHz | 30 | CY62167 | 3V | 3.6V | 2.2V | 16Mb 1M x 16 | 1 | 30mA | SRAM | Parallel | 3-STATE | 16 | 55ns | 20b | 16 Mb | 55 ns | COMMON | Asynchronous | 16b | 8 | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CAV25128VE-GT3 | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Automotive grade | ACTIVE (Last Updated: 23 hours ago) | Gold | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2008 | Automotive, AEC-Q100 | e4 | yes | 活跃 | 1 (Unlimited) | 8 | 2.5V~5.5V | DUAL | 未说明 | 1 | 5V | 1.27mm | 未说明 | 8 | 不合格 | 5.5V | 3/5V | 2.5V | SPI, Serial | 128Kb 16K x 8 | 2mA | SYNCHRONOUS | 10MHz | 40 ns | EEPROM | SPI | 无卤素 | 8 | 5ms | 1 Mb | 0.000003A | SPI | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE/SOFTWARE | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | 无铅 |