类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 质量 | 制造商包装标识符 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 界面 | 内存大小 | 端口的数量 | 电源电流 | 操作模式 | 时钟频率 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 无卤素 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 访问时间（最大） | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 环境温度范围高 | 通用闪存接口 | I2C控制字节 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||
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 | AT93C86A-10SU-1.8 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | e3 | yes | 活跃 | 3 (168 Hours) | 8 | 1.8V~5.5V | DUAL | 260 | 1 | 2.7V | 1.27mm | 40 | AT93C86A | 5V | Serial | 16Kb 2K x 8 1K x 16 | 2mA | 2MHz | 250 ms | EEPROM | SPI | 1KX16 | 10ms | 16 kb | 1e-7A | PARALLEL | MICROWIRE | 1000000 Write/Erase Cycles | 10ms | 100 | SOFTWARE | 1.5mm | 5mm | 3.99mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||
 | 24AA02T-I/MS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 40 | 24AA02 | 8 | 5.5V | 2/5V | 1.7V | I2C, Serial | 2Kb 256 x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 2 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010XXXR | 1.1mm | 3mm | 3mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||
 | AT27LV040A-90JU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | Tin | 表面贴装 | 表面贴装 | 32-LCC (J-Lead) | 32 | Non-Volatile | -40°C~85°C TC | Tube | 1997 | e3 | yes | 活跃 | 2 (1 Year) | 32 | ALSO OPERATES AT 5V SUPPLY | 3V~3.6V 4.5V~5.5V | QUAD | 245 | 1 | 3.3V | 1.27mm | 90GHz | 40 | AT27LV040 | 5V | 3.6V | 3V | 4Mb 512K x 8 | 30mA | 90ns | EPROM | Parallel | 512KX8 | 3-STATE | 8 | 4 Mb | 0.00002A | COMMON | 3.556mm | 13.97mm | 11.43mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||
 | M95640-RDW6TP | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | e4 | 活跃 | 1 (Unlimited) | 8 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 1 MILLION ERASE/WRITE CYCLES; 40 YEARS DATA RETENTION | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 30 | M95640 | 8 | 5V | SPI, Serial | 64Kb 8K x 8 | 5mA | 20MHz | 20 ns | EEPROM | SPI | 8 | 5ms | 64 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE/SOFTWARE | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||
| M24C04-RDW6TP | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | ACTIVE (Last Updated: 7 months ago) | Gold, Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | e4 | 活跃 | 1 (Unlimited) | 8 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 30 | M24C04 | 8 | 5V | 2-Wire, I2C, Serial | 4Kb 512 x 8 | 800μA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 4 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 1010DDMR | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||
 | FM24CL64B-G | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | 540.001716mg | Non-Volatile | -40°C~85°C TA | Tube | 2008 | F-RAM™ | e3 | 活跃 | 3 (168 Hours) | 8 | EAR99 | 2.7V~3.65V | DUAL | 260 | 1 | 3.3V | 1.27mm | 30 | FM24CL64 | 3.3V | 3.65V | 2.7V | 2-Wire, I2C | 64Kb 8K x 8 | 300μA | 1MHz | 550ns | FRAM | I2C | 8b | 64 kb | 0.000006A | 8b | 85°C | 1.727mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||
 | CY62128EV30LL-45SXIT | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 32-SOIC (0.445, 11.30mm Width) | 32 | Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2003 | MoBL® | e4 | yes | 活跃 | 3 (168 Hours) | 32 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.2V~3.6V | DUAL | 260 | 1 | 3V | 45GHz | 30 | CY62128 | 3V | 3.6V | 2.2V | 1Mb 128K x 8 | 1 | 16mA | SRAM | Parallel | 3-STATE | 8 | 45ns | 17b | 1 Mb | 0.000003A | 45 ns | COMMON | Asynchronous | 8b | 2.997mm | 20.4465mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||
 | M24512-DRMF3TG/K | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | Automotive grade | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 8-WFDFN Exposed Pad | YES | 8 | Non-Volatile | -40°C~125°C TA | Cut Tape (CT) | Automotive, AEC-Q100 | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.8V~5.5V | DUAL | 未说明 | 1 | 2.5V | 0.5mm | 未说明 | M24512 | 5.5V | 512Kb 64K x 8 | SYNCHRONOUS | 1MHz | 450ns | EEPROM | I2C | 图腾柱 | 8 | 4ms | SERIAL | 5V | I..C | 4ms | 50 | 125°C | 800μm | 3mm | 2mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | 25LC040T/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2001 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | DATA RETENTION > 200 YEARS; 1M ENDURANCE CYCLES | 2.5V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 40 | 25LC040 | 8 | 5.5V | 3/5V | 2.5V | SPI, Serial | 4Kb 512 x 8 | 5mA | 2MHz | 230 ns | EEPROM | SPI | 8 | 5ms | 4 kb | 0.000002A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||
.png) | AT28C256-15SUSL383 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Parallel | 256 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S29JL064J70TFI000 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Tin | 表面贴装 | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | 48 | Non-Volatile | -40°C~85°C TA | Tray | 2011 | JL-J | e3 | 活跃 | 3 (168 Hours) | 48 | 3A991.B.1.A | TOP BOOT BLOCK, BOTTOM BOOT BLOCK | 8542.32.00.51 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 0.5mm | 40 | 3.6V | 3/3.3V | 2.7V | 64Mb 8M x 8 4M x 16 | 16mA | FLASH | Parallel | 8b | 4MX16 | 70ns | 64 Mb | 0.000005A | 70 ns | Asynchronous | 3V | YES | YES | YES | 16126 | 8K64K | YES | BOTTOM/TOP | YES | 1.05mm | 18.5mm | 12.1mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||
| S29AL008J70TFI020 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | 48 | Non-Volatile | -40°C~85°C TA | Tray | 2012 | AL-J | e3 | 活跃 | 3 (168 Hours) | 48 | Matte Tin (Sn) - with Silver (Ag) barrier | 底部启动区块 | 8542.32.00.51 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 0.5mm | 40 | 3.6V | 33.3V | 2.7V | 8Mb 1M x 8 512K x 16 | 12mA | FLASH | Parallel | 8b | 512KX16 | 70ns | 8 Mb | 0.000005A | 70 ns | Asynchronous | 3V | YES | YES | YES | 12115 | 16K8K32K64K | YES | BOTTOM | 85°C | YES | 1.2mm | 18.5mm | 12.1mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||
| S34ML01G100TFI000 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | 48 | f16-038 | Non-Volatile | -40°C~85°C TA | Tray | 2012 | ML-1 | e3 | 活跃 | 3 (168 Hours) | 48 | 8542.32.00.51 | 2.7V~3.6V | DUAL | 1 | 3.3V | 0.5mm | 3.3V | 3.6V | 2.7V | 1Gb 128M x 8 | 30mA | 20 ns | FLASH | Parallel | 8b | 128MX8 | 25ns | 28b | 1 Gb | 0.00005A | Asynchronous | 8b | 3V | NO | NO | YES | 1K | 128K | 2kB | YES | 85°C | 1.2mm | 18.5mm | 12.1mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||
 | M93S56-WMN6P | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | Industrial grade | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | e4 | 活跃 | 1 (Unlimited) | 8 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 30 | M93S56 | 8 | 5.5V | 3/5V | 2.5V | Serial | 2Kb 128 x 16 | 2mA | 2MHz | 5 ms | EEPROM | SPI | 16 | 2 kb | 0.000005A | MICROWIRE | 1000000 Write/Erase Cycles | 40 | HARDWARE/SOFTWARE | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
 | SST25VF010A-33-4C-SAE-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2010 | SST25 | e3 | 活跃 | 3 (168 Hours) | 8 | Matte Tin (Sn) | 2.7V~3.6V | DUAL | 1.27mm | SST25VF010A | 3.3V | SPI, Serial | 1Mb 128K x 8 | 10mA | 33MHz | 12 ns | FLASH | SPI | 8b | 8 | 20μs | 1b | 1 Mb | 0.000015A | Synchronous | 8b | SPI | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | CAT24C32HU4I-GT3 | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Industrial grade | ACTIVE (Last Updated: 3 days ago) | Gold | 表面贴装 | 表面贴装 | 8-UFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 1997 | e4 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 100 YEAR DATA RETENTION | 1.7V~5.5V | DUAL | 260 | 1 | 5V | 0.5mm | 40 | CAT24C32 | 8 | 5V | 1.7V | 2-Wire, I2C, Serial | 32Kb 4K x 8 | 2mA | 1MHz | 400ns | EEPROM | I2C | 无卤素 | 5ms | 32 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE | 1010DDDR | 500μm | 3.05mm | 2.05mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||
| AT24HC04B-TH-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 1997 | e4 | yes | 活跃 | 3 (168 Hours) | 8 | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 40 | AT24HC04 | 5V | 2-Wire, I2C, Serial | 4Kb 512 x 8 | 3mA | 1MHz | 550ns | EEPROM | I2C | 8 | 5ms | 4 kb | 0.000003A | I2C | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE | 1010DDMR | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
 | AT24C08D-STUM-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | Tin | 表面贴装 | 表面贴装 | SOT-23-5 Thin, TSOT-23-5 | Non-Volatile | -40°C~85°C TC | Tape & Reel (TR) | 1997 | e3 | yes | 活跃 | 1 (Unlimited) | 5 | 1.7V~3.6V | DUAL | 260 | 1 | 1.8V | 0.95mm | 40 | AT24C08 | R-PDSO-G5 | 3.6V | 1.7V | 2-Wire, I2C, Serial | 8Kb 1K x 8 | SYNCHRONOUS | 1MHz | 4.5μs | EEPROM | I2C | 1KX8 | 8 | 5ms | 8 kb | I2C | 5ms | 1mm | 2.9mm | 1.6mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
| 24AA02UID-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3 Weeks | Automotive grade | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2006 | e3 | 活跃 | 1 (Unlimited) | 8 | Matte Tin (Sn) - annealed | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 40 | 24AA02UID | 5.5V | 1.7V | 2-Wire, I2C, Serial | 2Kb 128 x 8 x 2 | 3mA | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 5ms | 2 kb | TS 16949 | I2C | 5ms | 1.5mm | 4.9mm | 3.9mm | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
| FM25640B-GTR | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2011 | F-RAM™ | e3 | yes | 活跃 | 3 (168 Hours) | 8 | EAR99 | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 30 | FM25640 | 8 | 不合格 | 5V | 5V | 64Kb 8K x 8 | 4mA | SYNCHRONOUS | 20MHz | 20 ns | FRAM | SPI | 8b | 8 | 64 kb | 0.00001A | 8b | 85°C | 1.727mm | 4.9mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||
 | 93LC46BT-I/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2004 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS | 2.5V~5.5V | DUAL | 260 | 1 | 3V | 0.65mm | 40 | 93LC46B | 8 | 5.5V | 3/5V | 2.5V | Serial | 1Kb 64 x 16 | 2mA | 2MHz | 250 ns | EEPROM | SPI | 64X16 | 16 | 6ms | 1 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 6ms | 200 | SOFTWARE | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||
| M95128-DRMF3TG/K | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | Automotive grade | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 8-WFDFN Exposed Pad | YES | Non-Volatile | -40°C~125°C TA | Cut Tape (CT) | Automotive, AEC-Q100 | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.8V~5.5V | DUAL | 未说明 | 1 | 2.5V | 0.5mm | 未说明 | M95128 | R-PDSO-N8 | 5.5V | 1.8V | SPI, Serial | 128Kb 16K x 8 | SYNCHRONOUS | 20MHz | EEPROM | SPI | 16KX8 | 8 | 4ms | 131072 bit | SPI | 4ms | 0.8mm | 3mm | 2mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
| 24AA02T-I/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 40 | 24AA02 | 8 | 5.5V | 2/5V | 1.7V | I2C, Serial | 2Kb 256 x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 2 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010XXXR | 1.1mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||
| 25LC320A-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2004 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 25LC320A | 8 | 5V | SPI, Serial | 32Kb 4K x 8 | 5mA | 10MHz | 160 ns | EEPROM | SPI | 5ms | 32 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1.25mm | 4.9mm | 3.9mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||
 | 25LC256-E/SM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 表面贴装 | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2005 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 25LC256 | 8 | 5V | SPI, Serial | 256Kb 32K x 8 | 6mA | 10MHz | 50 ns | EEPROM | SPI | 8 | 5ms | 256 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 2.03mm | 5.245mm | 5.23mm | 无 | ROHS3 Compliant | 无铅 |