类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 端口的数量 | 电源电流 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 筛选水平 | 访问时间（最大） | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 刷新周期 | I2C控制字节 | 顺序突发长度 | 交错突发长度 | 反向引脚排列 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||
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 | 24LC1026T-E/SM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2005 | e3 | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 1.27mm | 40 | 24LC1026 | 8 | 不合格 | 5.5V | 2.5V | 2-Wire, I2C, Serial | 1Mb 128K x 8 | 5mA | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 1 Mb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDMR | NO | 2.03mm | 5.26mm | 5.25mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
 | BR24A32F-WLBH2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 表面贴装 | 8-SOIC (0.173, 4.40mm Width) | YES | Non-Volatile | -40°C~105°C TA | Cut Tape (CT) | 活跃 | 1 (Unlimited) | 8 | ALSO AVAILABLE IN 100KHZ AND SEATED HT-CALCULATED | 2.5V~5.5V | DUAL | 未说明 | 1 | 1.27mm | 未说明 | R-PDSO-G8 | 5.5V | 2.5V | 32Kb 4K x 8 | SYNCHRONOUS | 400kHz | EEPROM | I2C | 4KX8 | 8 | 5ms | 32768 bit | SERIAL | I2C | 5ms | 1.71mm | 5mm | 4.4mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C25652KV18-500BZI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 表面贴装 | 165-LBGA | 165 | Volatile | -40°C~85°C TA | Tray | 2003 | e0 | 活跃 | 3 (168 Hours) | 165 | Tin/Lead (Sn/Pb) | 流水线结构 | 1.7V~1.9V | BOTTOM | 235 | 1 | 1.8V | 1mm | 20 | CY7C25652 | 1.8V | 1.9V | 1.7V | 72Mb 2M x 36 | 2 | 1.21A | 500MHz | 450 ps | SRAM | Parallel | 3-STATE | 36 | 19b | 72 Mb | 0.36A | SEPARATE | Synchronous | 36b | 1.7V | 1.4mm | 15mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||
 | 24LC014T-E/OT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | Tin | 表面贴装 | 表面贴装 | SOT-23-6 | 6 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2010 | yes | 活跃 | 1 (Unlimited) | 6 | 2.5V~5.5V | DUAL | 1 | 0.95mm | 24LC014 | 5V | I2C, Serial | 1Kb 128 x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 128X8 | 8 | 5ms | 1 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 10100DDR | 1.45mm | 2.9mm | 1.55mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
| BR25G320F-3GE2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 表面贴装 | 8-SOIC (0.173, 4.40mm Width) | YES | Non-Volatile | -40°C~85°C TA | Cut Tape (CT) | 活跃 | 1 (Unlimited) | 8 | SEATED HT-CALCULATED | 1.6V~5.5V | DUAL | 未说明 | 1 | 1.8V | 1.27mm | 未说明 | R-PDSO-G8 | 5.5V | 1.6V | 32Kb 4K x 8 | SYNCHRONOUS | 20MHz | EEPROM | SPI | 4KX8 | 8 | 5ms | 32768 bit | SERIAL | SPI | 5ms | 1.71mm | 5mm | 4.4mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | GD25Q64CWIGR | GigaDevice Semiconductor (HK) Limited | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | 表面贴装 | 8-WDFN Exposed Pad | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2016 | 活跃 | 3 (168 Hours) | 2.7V~3.6V | 64Mb 8M x 8 | 120MHz | FLASH | SPI - Quad I/O | 50μs, 2.4ms | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 23A256T-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Volatile | -40°C~85°C TA | Tape & Reel (TR) | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) - annealed | 1.7V~1.95V | DUAL | 260 | 1 | 1.8V | 40 | 23A256 | 8 | 1.8V | SPI, Serial | 256Kb 32K x 8 | 1 | 10mA | 20MHz | 32 ns | SRAM | SPI | 3-STATE | 8 | 1b | 256 kb | 5e-7A | SEPARATE | Synchronous | 8b | 4.9mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
 | 71V30L35TFGI | Renesas Electronics America Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Industrial grade | 表面贴装 | 64-LQFP | Volatile | -40°C~85°C TA | Tray | 活跃 | 3 (168 Hours) | 3V~3.6V | IDT71V30 | 8Kb 1K x 8 | SRAM | Parallel | 35ns | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1399B-15VXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 28-BSOJ (0.300, 7.62mm Width) | YES | 28 | Volatile | 0°C~70°C TA | Tube | 2005 | e4 | Obsolete | 1 (Unlimited) | 28 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.32.00.41 | 3V~3.6V | DUAL | 260 | 1 | 3.3V | 1.27mm | unknown | 15GHz | 40 | CY7C1399 | 28 | 不合格 | 3.6V | 3.3V | 3V | 256Kb 32K x 8 | 0.05mA | SRAM | Parallel | 32KX8 | 3-STATE | 8 | 15ns | 0.00002A | 262144 bit | 15 ns | COMMON | 2V | 3.556mm | 17.907mm | 7.5mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||
 | AT45DB161E-SHD-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | 8-SOIC | Non-Volatile | -40°C~85°C TC | Cut Tape (CT) | 1997 | Obsolete | 1 (Unlimited) | 2.5V~3.6V | AT45DB161 | 16Mb 528Bytes x 4096 pages | 85MHz | FLASH | SPI | 8μs, 6ms | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1354SV25-166BZC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Volatile | 0°C~70°C TA | Tray | 1996 | 活跃 | 3 (168 Hours) | 2.375V~2.625V | CY7C1354 | 9Mb 256K x 36 | 166MHz | 3.5ns | SRAM | Parallel | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1372KV33-167AXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 100-LQFP | YES | Volatile | -40°C~85°C TA | Tray | 2011 | NoBL™ | 活跃 | 3 (168 Hours) | 100 | 3A991.B.2.B | 流水线结构 | 8542.32.00.41 | 3.135V~3.6V | QUAD | 1 | 3.3V | 0.65mm | R-PQFP-G100 | 3.6V | 3.135V | 18Mb 1M x 18 | 167MHz | 3.4ns | SRAM | Parallel | 1MX18 | 18 | 18874368 bit | 1.6mm | 20mm | 14mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST39WF400B-70-4C-MAQE | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 48-WFBGA | 48 | Non-Volatile | 0°C~70°C TA | Tray | 2010 | SST39 MPF™ | e1 | yes | 活跃 | 3 (168 Hours) | 48 | 3A991.B.1.A | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.32.00.51 | 1.65V~1.95V | BOTTOM | 260 | 1 | 1.8V | 0.5mm | 40 | SST39WF400B | 48 | 1.8V | 1.95V | 1.65V | 4Mb 256K x 16 | 15mA | 70ns | FLASH | Parallel | 16b | 256KX16 | 16 | 40μs | 18b | 4 Mb | Asynchronous | 16b | 0.73mm | 6mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
| CY7C2170KV18-400BZXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 表面贴装 | 165-LBGA | 165 | Volatile | 0°C~70°C TA | Tray | 2003 | e1 | 活跃 | 3 (168 Hours) | 165 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.7V~1.9V | BOTTOM | 260 | 1 | 1.8V | 1mm | 30 | CY7C2170 | 165 | 1.8V | 1.9V | 1.7V | 18Mb 512K x 36 | 2 | 640mA | 400MHz | 450 ps | SRAM | Parallel | 3-STATE | 36 | 18b | 18 Mb | COMMON | Synchronous | 36b | 1.4mm | 15mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
 | W948D2FBJX6E | Winbond Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 90-TFBGA | 90 | Volatile | -25°C~85°C TC | Tray | 2016 | 活跃 | 3 (168 Hours) | 90 | EAR99 | AUTO/SELF REFRESH | 8542.32.00.02 | 1.7V~1.95V | BOTTOM | 1 | 1.8V | 0.8mm | 90 | 1.8V | 1.95V | 1.7V | 256Mb 8M x 32 | 1 | 50mA | 166MHz | 5ns | DRAM | Parallel | 32b | 4MX32 | 3-STATE | 32 | 15ns | 14b | 256 Mb | 0.00001A | COMMON | 4096 | 24816 | 24816 | 1.025mm | 13mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | SST25VF040B-50-4I-QAE-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 8-WDFN Exposed Pad | YES | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 1998 | SST25 | e3 | 活跃 | 1 (Unlimited) | 8 | Matte Tin (Sn) - annealed | 2.7V~3.6V | DUAL | 1 | 1.27mm | SST25VF040B | 3.3V | 3.6V | 2.7V | SPI, Serial | 4Mb 512K x 8 | 50MHz | FLASH | SPI | 4MX1 | 1 | 10μs | 4 Mb | 2.7V | 6mm | 5mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M95080-MN6TP | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | e4 | yes | Obsolete | 3 (168 Hours) | 8 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 30 | M95080 | 8 | 5V | 5V | SPI, Serial | 8Kb 1K x 8 | 5mA | 10MHz | 35 ns | EEPROM | SPI | 8 | 5ms | 8 kb | 0.000002A | SPI | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE/SOFTWARE | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
 | 24FC64-I/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2007 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | 3A991.A.2 | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 40 | 24FC64 | 8 | 不合格 | 5.5V | 2/5V | 1.7V | I2C, Serial | 64Kb 8K x 8 | 3mA | SYNCHRONOUS | 1MHz | 400ns | EEPROM | I2C | 8 | 5ms | 64 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 1.2mm | 4.4mm | 3mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
 | 25AA160-I/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 通孔 | 8-DIP (0.300, 7.62mm) | NO | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2004 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | 1.8V~5.5V | DUAL | 1 | 2.5V | 2.54mm | 25AA160 | 8 | 5.5V | 2/5V | SPI, Serial | 16Kb 2K x 8 | 5mA | 1MHz | 475 ns | EEPROM | SPI | 8 | 5ms | 16 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 4.32mm | 9.46mm | 7.62mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
| 47L16-I/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Automotive grade | 通孔 | 8-DIP (0.300, 7.62mm) | NO | Non-Volatile | -40°C~85°C TA | Tube | e3 | 活跃 | 不适用 | 8 | Matte Tin (Sn) - annealed | IT ALSO HAS EEPROM BACKUP OF 2K X 8 BITS | 2.7V~3.6V | DUAL | 1 | 3V | 2.54mm | 47L16 | R-PDIP-T8 | 3.6V | 2.7V | 16Kb 2K x 8 | SYNCHRONOUS | 1MHz | 400ns | EERAM | I2C | 2KX8 | 8 | 1ms | 16384 bit | TS 16949 | 5.334mm | 9.271mm | 7.62mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | W972GG8JB-25 | Winbond Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 60-TFBGA | 60 | Volatile | 0°C~85°C TC | Tray | 2011 | Obsolete | 3 (168 Hours) | 60 | EAR99 | AUTO/SELF REFRESH | 8542.32.00.36 | 1.7V~1.9V | BOTTOM | 未说明 | 1 | 1.8V | 0.8mm | 未说明 | 60 | 不合格 | 1.8V | 1.9V | 1.7V | 2Gb 256M x 8 | 1 | 135mA | SYNCHRONOUS | 200MHz | 400ps | DRAM | Parallel | 8b | 256MX8 | 3-STATE | 8 | 15ns | 18b | 2 Gb | 0.012A | 800MHz | COMMON | 8192 | 48 | 48 | 1.2mm | 11.5mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||
 | M27C256B-70C1 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 32-LCC (J-Lead) | 32 | Non-Volatile | 0°C~70°C TA | Tube | e3 | Obsolete | 1 (Unlimited) | 32 | EAR99 | Matte Tin (Sn) | 12.75V PROGRAMMING VOLTAGE | 4.5V~5.5V | QUAD | 未说明 | 1 | 5V | 1.27mm | 70GHz | 未说明 | M27C256 | 32 | 不合格 | 5V | 5V | 256Kb 32K x 8 | 50mA | ASYNCHRONOUS | 70ns | EPROM | Parallel | 3-STATE | 8 | 256 kb | 0.0001A | COMMON | 3.56mm | 13.97mm | 11.43mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | BR24G256FV-3GTE2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | Tin | 表面贴装 | 表面贴装 | 8-LSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2016 | 活跃 | 1 (Unlimited) | 8 | SEATED HT-CALCULATED | 1.6V~5.5V | DUAL | 未说明 | 1 | 0.65mm | 未说明 | BR24G256 | 5.5V | 1.6V | 2-Wire, I2C, Serial | 256Kb 32K x 8 | SYNCHRONOUS | 400kHz | 900 ns | EEPROM | I2C | 8 | 5ms | 256 kb | I2C | 5ms | 1.35mm | 4.4mm | 3mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| BR25H080F-2CE2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | Automotive grade | 表面贴装 | 8-SOIC (0.173, 4.40mm Width) | YES | 8 | Non-Volatile | -40°C~125°C TA | Cut Tape (CT) | 2013 | Automotive, AEC-Q100 | 活跃 | 1 (Unlimited) | 8 | ALSO OPERATES AT 2.5V WITH 5MHZ AND SEATED HT-CALCULATED | 2.5V~5.5V | DUAL | 未说明 | 1 | 5V | 1.27mm | 未说明 | 不合格 | 5.5V | 3/5V | 4.5V | 8Kb 1K x 8 | SYNCHRONOUS | 10MHz | EEPROM | SPI | 8 | 4ms | SERIAL | SPI | 1000000 Write/Erase Cycles | 4ms | 100 | HARDWARE/SOFTWARE | 1.71mm | 5mm | 4.4mm | Unknown | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
 | 25LC010AT-I/MNY | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Automotive grade | 表面贴装 | 表面贴装 | 8-WFDFN Exposed Pad | 8 | 8-TDFN (2x3) | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2005 | 活跃 | 1 (Unlimited) | 85°C | -40°C | 2.5V~5.5V | 10MHz | 25LC010A | SPI, Serial | 5.5V | 2.5V | 1Kb 128 x 8 | 5mA | 10MHz | 50 ns | EEPROM | SPI | 5ms | 1 kb | 10MHz | 750μm | 2mm | 3mm | 无 | ROHS3 Compliant |