类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 端口的数量 | 电源电流 | 电流 | 操作模式 | 最大电源电流 | 时钟频率 | 访问时间 | 逻辑功能 | 内存格式 | 内存接口 | 数据总线宽度 | 最大输入电压 | 组织结构 | 输出特性 | 无卤素 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 筛选水平 | 访问时间（最大） | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 时间格式 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 刷新周期 | 通用闪存接口 | I2C控制字节 | 顺序突发长度 | 交错突发长度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | AT27C010-12PC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 32-DIP (0.600, 15.24mm) | 32 | 32-PDIP | Non-Volatile | 0°C~70°C TC | Tube | 1998 | Obsolete | 1 (Unlimited) | 70°C | -40°C | 4.5V~5.5V | 120GHz | AT27C010 | Parallel | 4.5V | 1Mb 128K x 8 | 35mA | 120ns | EPROM | Parallel | 13V | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | BR93H76RFVT-2CE2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | Automotive grade | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | YES | 8 | Non-Volatile | -40°C~125°C TA | Cut Tape (CT) | 2012 | Automotive, AEC-Q100 | 活跃 | 1 (Unlimited) | 8 | 2.5V~5.5V | DUAL | 未说明 | 1 | 4V | 0.65mm | 未说明 | 不合格 | 5.5V | 3/5V | 2.5V | 8Kb 512 x 16 | SYNCHRONOUS | 2MHz | EEPROM | SPI | 512X16 | 16 | 4ms | 0.00001A | SERIAL | MICROWIRE | 1000000 Write/Erase Cycles | 4ms | 100 | SOFTWARE | 1.2mm | 4.4mm | 3mm | Unknown | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT27C1024-70PI | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 40-DIP (0.600, 15.24mm) | 40 | 40-PDIP | Non-Volatile | -40°C~85°C TC | Tube | 1998 | Obsolete | 1 (Unlimited) | 85°C | -40°C | 4.5V~5.5V | 70GHz | AT27C1024 | 5V | Parallel | 4.5V | 1Mb 64K x 16 | 70ns | EPROM | Parallel | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S25FL032P0XMFI003 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tin | 表面贴装 | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | 16 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2015 | FL-P | Obsolete | 3 (168 Hours) | 16 | 3A991.B.1.A | 8542.32.00.51 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 1.27mm | 40 | 3.6V | 3/3.3V | 2.7V | SPI, Serial | 32Mb 4M x 8 | 38mA | 104MHz | 8 ns | FLASH | SPI - Quad I/O | 8b | 16 | 5μs, 3ms | 1b | 32 Mb | 0.00001A | Synchronous | 8b | 3V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 256B | 2.65mm | 10.3mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M24C08-FMH6TG | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 5-UFDFN | YES | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 活跃 | 1 (Unlimited) | 5 | 1.7V~5.5V | DUAL | 未说明 | 1 | 0.4mm | 未说明 | M24C08 | R-PDSO-N5 | 5.5V | 1.7V | 8Kb 1K x 8 | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 1KX8 | 8 | 5ms | 8192 bit | SERIAL | I2C | 5ms | 0.6mm | 1.7mm | 1.4mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT24C512C-SSHMEU-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | 8-SOIC | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 1997 | 活跃 | 3 (168 Hours) | 85°C | -40°C | 1.7V~3.6V | 1MHz | AT24C512C | 2-Wire, I2C, Serial | 3.6V | 1.7V | 512Kb 64K x 8 | 400kHz | 900ns | EEPROM | I2C | 5ms | 1MHz | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24VL024T/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Gold | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -20°C~85°C TA | Tape & Reel (TR) | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) - annealed | 1.5V~3.6V | DUAL | 260 | 1 | 1.8V | 0.65mm | 40 | 24VL024 | 8 | 不合格 | 3.3V | 3.6V | 1.5V | 2-Wire, Serial | 2Kb 256 x 8 | 3mA | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 2 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1010DDDR | 1.2mm | 4.4mm | 3mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C2264XV18-366BZXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 165-LBGA | YES | 165 | Volatile | 0°C~70°C TA | Tray | 2003 | e1 | 活跃 | 3 (168 Hours) | 165 | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 1.7V~1.9V | BOTTOM | 260 | 1 | 1.8V | 1mm | 30 | CY7C2264 | 165 | 1.8V | 1.9V | 1.7V | 36Mb 1M x 36 | 2 | 366MHz | 2.5 ns | SRAM | Parallel | 1MX36 | 3-STATE | 36 | 19b | 36 Mb | SEPARATE | 1.7V | 1.4mm | 15mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 93C66-E/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 29 Weeks | Tin | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2000 | e0 | no | 活跃 | 不适用 | 8 | 10K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS | 4.5V~5.5V | DUAL | 1 | 5V | 2.54mm | 93C66 | 8 | 5V | 5V | 2-Wire, Serial | 4Kb 512 x 8 256 x 16 | 4mA | 2MHz | 6 ms | EEPROM | SPI | 3-STATE | 8 | 2ms | 4 kb | 0.0001A | MICROWIRE | 1000000 Write/Erase Cycles | 1ms | 40 | SOFTWARE | 16 | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CAV25M01YE-GT3 | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Automotive grade | ACTIVE (Last Updated: 1 day ago) | Gold | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2008 | Automotive, AEC-Q100 | e4 | yes | 活跃 | 1 (Unlimited) | 8 | 2.5V~5.5V | DUAL | 未说明 | 1 | 5V | 0.65mm | 未说明 | 8 | 5.5V | 2.5V | SPI, Serial | 1Mb 128K x 8 | SYNCHRONOUS | 10MHz | 40 ns | EEPROM | SPI | 无卤素 | 8 | 5ms | 1 Mb | SPI | 5ms | 1.2mm | 4.4mm | 3mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | IS43TR16128B-125KBL | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 96-TFBGA | YES | Volatile | 0°C~95°C TC | Tray | 活跃 | 3 (168 Hours) | 96 | AUTO/SELF REFRESH | 1.425V~1.575V | BOTTOM | 1 | 1.5V | 0.8mm | R-PBGA-B96 | 不合格 | 1.575V | 1.5V | 1.425V | 2Gb 128M x 16 | 1 | ASYNCHRONOUS | 800MHz | 20ns | DRAM | Parallel | 128MX16 | 3-STATE | 16 | 15ns | 0.014A | 2147483648 bit | COMMON | 8192 | 48 | 48 | 1.2mm | 13mm | 9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY14B108M-ZSP25XI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Tin | 表面贴装 | 表面贴装 | 54-TSOP (0.400, 10.16mm Width) | 54 | Non-Volatile | -40°C~85°C TA | Tray | 2005 | e3 | 活跃 | 3 (168 Hours) | 54 | 3A991.B.2.A | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 0.8mm | 30 | CY14B108 | 54 | 3V | 3.6V | 2.7V | 8Mb 512K x 16 | 75mA | Clock | NVSRAM | Parallel | 16b | 512KX16 | 16 | 25ns | 8 Mb | 0.01A | 25 ns | 16b | HH:MM:SS | 1.2mm | 22.415mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S25FS512SDSBHM210 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | Automotive grade | 表面贴装 | 24-TBGA | YES | Non-Volatile | -40°C~125°C TA | Tray | Automotive, AEC-Q100, FS-S | 活跃 | 3 (168 Hours) | 24 | IT IS ALSO CONFIGURED AS 512M X 1 | 8542.32.00.51 | 1.7V~2V | BOTTOM | 未说明 | 1 | 1.8V | 1mm | 未说明 | R-PBGA-B24 | 2V | 1.7V | 512Mb 64M x 8 | SYNCHRONOUS | 80MHz | FLASH | SPI - Quad I/O, QPI | 128MX4 | 4 | 536870912 bit | AEC-Q100; TS 16949 | SERIAL | 1.8V | 2 | 1.2mm | 8mm | 6mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S25FL256LAGBHM020 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 表面贴装 | 24-TBGA | YES | Non-Volatile | -40°C~125°C TA | Tray | 2016 | Automotive, AEC-Q100, FL-L | 活跃 | 3 (168 Hours) | 24 | IT ALSO HAVE MEMORY WIDTH X 1 | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 未说明 | 1 | 3V | 1mm | 未说明 | R-PBGA-B24 | 3.6V | 2.7V | 256Mb 32M x 8 | SYNCHRONOUS | 133MHz | FLASH | SPI - Quad I/O, QPI | 64MX4 | 4 | 268435456 bit | SERIAL | 3V | 2 | 1.2mm | 8mm | 6mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S29AL008J55BFIR20 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 48-VFBGA | 48 | Non-Volatile | -40°C~85°C TA | Tray | 2009 | AL-J | e1 | 活跃 | 3 (168 Hours) | 48 | EAR99 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 底部启动区块 | 8542.32.00.51 | 3V~3.6V | BOTTOM | 260 | 1 | 3.3V | 0.8mm | 40 | 3.3V | 3.6V | 3V | 8Mb 1M x 8 512K x 16 | 12mA | FLASH | Parallel | 8b | 512KX16 | 16 | 55ns | 8 Mb | 0.000005A | 55 ns | Asynchronous | 3V | 8 | YES | YES | YES | 12115 | 16K8K32K64K | YES | BOTTOM | YES | 1mm | 8.15mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | 93AA86BT-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2012 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 40 | 93AA86B | 8 | 不合格 | 5V | Serial | 16Kb 1K x 16 | 3mA | SYNCHRONOUS | 3MHz | 100 ns | EEPROM | SPI | 1KX16 | 16 | 5ms | 16 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 6ms | 200 | SOFTWARE | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT25DF641A-SH-T | Adesto Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Gold | 表面贴装 | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | 8 | Non-Volatile | -40°C~85°C TC | Tape & Reel (TR) | 1997 | e4 | 活跃 | 1 (Unlimited) | 8 | 3A991.B.1.A | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 1.27mm | 未说明 | 8 | 不合格 | 3.3V | 3.6V | 2.7V | SPI, Serial | 64Mb 256Bytes x 32K pages | 19mA | 38mA | 100MHz | 5 ns | FLASH | SPI | 8b | 64MX1 | 1 | 30μs, 6ms | 24b | 64 Mb | 0.00002A | Synchronous | 8b | 2.7V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE | 256B | 2.16mm | 5.29mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | IS42S16100H-6TL | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Commercial grade | 表面贴装 | 50-TSOP (0.400, 10.16mm Width) | YES | Volatile | 0°C~70°C TA | Tray | 活跃 | 3 (168 Hours) | 50 | EAR99 | PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH | 3V~3.6V | DUAL | 1 | 3.3V | 0.8mm | R-PDSO-G50 | 不合格 | 3.6V | 3.3V | 3V | 16Mb 1M x 16 | 1 | SYNCHRONOUS | 166MHz | 5.5ns | DRAM | Parallel | 1MX16 | 3-STATE | 16 | 0.002A | 16777216 bit | COMMON | 2048 | 1248FP | 1248 | 1.2mm | 20.95mm | 10.16mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | W25Q32FWZPIG | Winbond Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 表面贴装 | 8-WDFN Exposed Pad | YES | Non-Volatile | -40°C~85°C TA | Tube | 2016 | SpiFlash® | Obsolete | 3 (168 Hours) | 8 | 1.65V~1.95V | DUAL | 未说明 | 1 | 1.8V | 1.27mm | 未说明 | R-PDSO-N8 | 不合格 | 1.95V | 1.8V | 1.65V | SPI, Serial | 32Mb 4M x 8 | SYNCHRONOUS | 104MHz | FLASH | SPI - Quad I/O, QPI | 4MX8 | 8 | 60μs, 5ms | 0.00002A | 33554432 bit | 1.8V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 1 | 0.8mm | 6mm | 5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | W9464G6KH-5 | Winbond Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 66-TSSOP (0.400, 10.16mm Width) | YES | Volatile | 0°C~70°C TA | Tray | 2016 | 活跃 | 3 (168 Hours) | 66 | AUTO/SELF REFRESH | 2.3V~2.7V | DUAL | 未说明 | 1 | 2.5V | 0.65mm | 未说明 | R-PDSO-G66 | 2.7V | 2.3V | 64Mb 4M x 16 | 1 | SYNCHRONOUS | 200MHz | 55ns | DRAM | Parallel | 4MX16 | 16 | 15ns | 67108864 bit | 1.2mm | 22.22mm | 10.16mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MX29F200CTTI-70G | Macronix | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | 48 | Non-Volatile | -40°C~85°C TA | Tray | 2009 | MX29F | 活跃 | 3 (168 Hours) | 48 | EAR99 | TOP BOOT BLOCK | 8542.32.00.51 | 4.5V~5.5V | DUAL | 1 | 5V | 0.5mm | 48 | 5V | 5V | 2Mb 256K x 8 | 50mA | FLASH | Parallel | 128KX16 | 16 | 70ns | 2 Mb | 0.000005A | 70 ns | Asynchronous | 5V | 100000 Write/Erase Cycles | 8 | YES | YES | YES | 1213 | 16K8K32K64K | YES | TOP | 1.2mm | 18.4mm | 12mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 47C16T-E/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Automotive grade | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | YES | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | e3 | 活跃 | 1 (Unlimited) | 8 | Matte Tin (Sn) - annealed | IT ALSO HAS EEPROM BACKUP OF 2K X 8 BITS | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | 47C16 | R-PDSO-G8 | 5.5V | 4.5V | 16Kb 2K x 8 | SYNCHRONOUS | 1MHz | 400ns | EERAM | I2C | 2KX8 | 8 | 1ms | 16384 bit | TS 16949 | 1.2mm | 4.4mm | 3mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25M512JVEIQ | Winbond Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 8-WDFN Exposed Pad | YES | Non-Volatile | -40°C~85°C TA | Tube | 2009 | SpiFlash® | yes | 活跃 | 3 (168 Hours) | 8 | 2.7V~3.6V | DUAL | 未说明 | 1 | 1.27mm | 未说明 | R-PDSO-N8 | 3.6V | 2.7V | SPI, Serial | 512Mb 64M x 8 | SYNCHRONOUS | 104MHz | FLASH | SPI | 64MX8 | 8 | 536870912 bit | 3V | 1 | 0.8mm | 8mm | 6mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT27BV010-90JU-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 32-LCC (J-Lead) | YES | Non-Volatile | -40°C~85°C TC | Tape & Reel (TR) | 活跃 | 3 (168 Hours) | 32 | ALSO OPERATES AT 5V SUPPLY | 2.7V~3.6V 4.5V~5.5V | QUAD | 1 | 3V | 1.27mm | R-PQCC-J32 | 3.6V | 2.7V | 1Mb 128K x 8 | ASYNCHRONOUS | 90ns | EPROM | Parallel | 128KX8 | 8 | 1048576 bit | 3.556mm | 13.97mm | 11.43mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CY7C1314JV18-250BZXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 165-LBGA | 165 | Volatile | 0°C~70°C TA | Tray | 2003 | e1 | Obsolete | 3 (168 Hours) | 165 | 锡银铜 | 流水线结构 | 1.7V~1.9V | BOTTOM | 260 | 1 | 1.8V | unknown | 20 | CY7C1314 | 165 | 不合格 | 1.8V | 18Mb 512K x 36 | 1 | 900mA | 250MHz | 450 ps | SRAM | Parallel | 36 | 18b | 18 Mb | Synchronous | 36b | ROHS3 Compliant |