类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 端口的数量 | 电源电流 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 筛选水平 | 访问时间（最大） | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 输出启用 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | I2C控制字节 | 反向引脚排列 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||
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 | MX25L4006EZUI-12G | Macronix | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 8-UFDFN Exposed Pad | YES | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2010 | MX25xxx05/06 | e3 | 不用于新设计 | 3 (168 Hours) | 8 | Matte Tin (Sn) - annealed | 2.7V~3.6V | DUAL | 未说明 | 1 | 3V | 0.5mm | 未说明 | R-PDSO-N8 | 不合格 | 3.6V | 3/3.3V | 2.7V | SPI, Serial | 4Mb 512K x 8 | SYNCHRONOUS | 86MHz | FLASH | SPI | 2MX2 | 2 | 50μs, 3ms | 4 Mb | 0.00001A | 2.7V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 1 | 0.6mm | 3mm | 2mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
 | 23A1024T-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2012 | e3 | 活跃 | 1 (Unlimited) | 8 | Matte Tin (Sn) - annealed | 1.7V~2.2V | DUAL | 260 | 1 | 40 | 23A1024 | 不合格 | 1.8V | 1.7V | SPI, Serial | 1Mb 128K x 8 | 2 | 10mA | 20MHz | 25 ns | SRAM | SPI - Quad I/O | 3-STATE | 8 | 24b | 1 Mb | COMMON/SEPARATE | Synchronous | 8b | 1.7V | NO | NO | 1.75mm | 4.9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST39SF010A-55-4C-WHE | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 32-TFSOP (0.488, 12.40mm Width) | 32 | Non-Volatile | 0°C~70°C TA | Tray | 2010 | SST39 MPF™ | e3 | yes | 活跃 | 3 (168 Hours) | 32 | EAR99 | Matte Tin (Sn) | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 0.5mm | 40 | SST39SF010A | 32 | 5V | 5V | 1Mb 128K x 8 | 25mA | 55ns | FLASH | Parallel | 8b | 128KX8 | 8 | 20μs | 17b | 1 Mb | 0.0001A | Asynchronous | 8b | 5V | YES | YES | YES | 32 | 4K | 1.2mm | 12.4mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | SST39SF020A-70-4C-NHE-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3 Weeks | 表面贴装 | 表面贴装 | 32-LCC (J-Lead) | 32 | Non-Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2004 | SST39 MPF™ | 活跃 | 3 (168 Hours) | 32 | 4.5V~5.5V | QUAD | 5V | 1.27mm | SST39SF020A | 5V | 5V | 2Mb 256K x 8 | 25mA | 70ns | FLASH | Parallel | 8b | 256KX8 | 8 | 20μs | 18b | 2 Mb | 0.0001A | Asynchronous | 8b | YES | YES | YES | 64 | 4K | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | STK11C68-SF45 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 表面贴装 | 28-SOIC (0.342, 8.69mm Width) | 28 | Non-Volatile | 0°C~70°C TA | Tube | 2005 | e3 | yes | Obsolete | 3 (168 Hours) | 28 | EAR99 | Matte Tin (Sn) | 8542.32.00.41 | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 20 | STK11C68 | 28 | 5V | 5V | 64Kb 8K x 8 | 65mA | NVSRAM | Parallel | 8b | 8KX8 | 8 | 45ns | 64 kb | 0.00075A | 45 ns | 8b | 2.794mm | 18.3895mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1021B-15ZC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | 44 | Volatile | 0°C~70°C TA | Tray | 2006 | e0 | no | Obsolete | 3 (168 Hours) | 44 | Tin/Lead (Sn/Pb) | 4.5V~5.5V | DUAL | 240 | 1 | 5V | 0.8mm | not_compliant | 15GHz | 30 | CY7C1021 | 44 | 不合格 | 5V | 5V | 1Mb 64K x 16 | 1 | 130mA | SRAM | Parallel | 3-STATE | 16 | 15ns | 16b | 1 Mb | COMMON | Asynchronous | 16b | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT93C66-10TI-2.7 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | 8-TSSOP | Non-Volatile | -40°C~85°C TA | Tube | Obsolete | 1 (Unlimited) | 85°C | -40°C | 2.7V~5.5V | 2MHz | AT93C66 | Serial | 5.5V | 2.7V | 4Kb 512 x 8 256 x 16 | 2MHz | 2 μs | EEPROM | SPI | 10ms | 1MHz | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S25FL132K0XBHI033 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 24-TBGA | YES | 24 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2013 | FL1-K | e1 | Obsolete | 3 (168 Hours) | 24 | 锡银铜 | ALSO CONFIGURABLE AS 32M X 1 | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 1 | 3V | 1mm | 3.6V | 3/3.3V | 2.7V | SPI, Serial | 32Mb 4M x 8 | 108MHz | 0.025mA | FLASH | SPI - Quad I/O | 8MX4 | 4 | 3ms | 32 Mb | 0.000005A | 3V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 2 | 256B | 1.2mm | 8mm | 6mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
 | BR25H160FVT-2CE2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | Automotive grade | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | YES | 8 | Non-Volatile | -40°C~125°C TA | Cut Tape (CT) | 2013 | Automotive, AEC-Q100 | 活跃 | 1 (Unlimited) | 8 | ALSO OPERATES AT 2.5V WITH 5MHZ | 2.5V~5.5V | DUAL | 未说明 | 1 | 5V | 0.65mm | 未说明 | 不合格 | 5.5V | 3/5V | 4.5V | 16Kb 2K x 8 | SYNCHRONOUS | 10MHz | EEPROM | SPI | 8 | 4ms | 0.00001A | SERIAL | SPI | 1000000 Write/Erase Cycles | 4ms | 100 | HARDWARE/SOFTWARE | 1.2mm | 4.4mm | 3mm | Unknown | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | S25FS256SAGNFI000 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | Tin | 表面贴装 | 表面贴装 | 8-WDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tray | 2016 | FS-S | 活跃 | 3 (168 Hours) | 8 | 1.7V~2V | DUAL | 1 | 1.8V | 1.27mm | 1.8V | 2V | 1.7V | SPI, Serial | 256Mb 32M x 8 | 133MHz | 8 ns | FLASH | SPI - Quad I/O, QPI | 64MX4 | 4 | 256 Mb | 2 | 6mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY14B104NA-ZS20XI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Gold, Tin | 表面贴装 | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | 44 | Non-Volatile | -40°C~85°C TA | Tray | 2011 | e4 | yes | 活跃 | 3 (168 Hours) | 44 | 3A991.B.2.B | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.32.00.41 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 0.8mm | 30 | CY14B104 | 44 | 不合格 | 3V | 3.6V | 2.7V | 4Mb 256K x 16 | 70mA | ASYNCHRONOUS | NVSRAM | Parallel | 16b | 256KX16 | 16 | 20ns | 4 Mb | 0.005A | 20 ns | 16b | 1.194mm | 18.415mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
 | IS62WV10248EBLL-45TLI | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Industrial grade | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | YES | 44 | Volatile | -40°C~85°C TA | Tray | 活跃 | 3 (168 Hours) | 44 | 2.2V~3.6V | DUAL | 未说明 | 1 | 3.3V | 0.8mm | 未说明 | 3.6V | 2.2V | 8Mb 1M x 8 | SRAM | Parallel | 1MX8 | 8 | 45ns | 8388608 bit | 45 ns | 1.2mm | 18.41mm | 10.16mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CY62137FV30LL-55ZSXET | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | 44 | Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2001 | MoBL® | e4 | yes | 活跃 | 3 (168 Hours) | 44 | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.2V~3.6V | DUAL | 260 | 1 | 3V | 0.8mm | 30 | CY62137 | 3V | 3.6V | 2.2V | 2Mb 128K x 16 | 1 | 25mA | SRAM | Parallel | 3-STATE | 16 | 55ns | 17b | 2 Mb | 55 ns | COMMON | Asynchronous | 16b | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1312CV18-167BZI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 165-LBGA | YES | 165 | Volatile | -40°C~85°C TA | Tray | 2003 | e0 | Obsolete | 3 (168 Hours) | 165 | 3A991.B.2.A | Tin/Lead (Sn/Pb) | 流水线结构 | 8542.32.00.41 | 1.7V~1.9V | BOTTOM | 220 | 1 | 1.8V | 1mm | not_compliant | 未说明 | CY7C1312 | 165 | 不合格 | 1.8V | 1.9V | 1.7V | 18Mb 1M x 18 | 167MHz | 0.8mA | 500 ps | SRAM | Parallel | 1MX18 | 3-STATE | 18 | 18 Mb | 0.36A | SEPARATE | 1.7V | 1.4mm | 15mm | 13mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||
 | CY14B256L-SP45XC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 48-BSSOP (0.295, 7.50mm Width) | 48 | Non-Volatile | 0°C~70°C TA | Tube | 2008 | e4 | Obsolete | 3 (168 Hours) | 48 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.32.00.41 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 0.635mm | unknown | 20 | CY14*256 | 48 | 不合格 | 3.3V | 3.6V | 2.7V | 256Kb 32K x 8 | 50mA | ASYNCHRONOUS | NVSRAM | Parallel | 8b | 32KX8 | 8 | 45ns | 256 kb | 0.003A | 45 ns | 8b | 2.794mm | 15.875mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||
| AT28HC256E-90JU-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | Military grade | 表面贴装 | 32-LCC (J-Lead) | YES | Non-Volatile | -40°C~85°C TC | Tape & Reel (TR) | 2017 | 活跃 | 3 (168 Hours) | 32 | 自动写入 | 4.5V~5.5V | QUAD | 1 | 5V | 1.27mm | R-PQCC-J32 | 5.5V | 4.5V | 256Kb 32K x 8 | ASYNCHRONOUS | 90ns | EEPROM | Parallel | 32KX8 | 8 | 10ms | 262144 bit | MIL-STD-883 | 5V | 10ms | 3.556mm | 13.97mm | 11.43mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24LC32A-E/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2012 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED | 2.5V~5.5V | DUAL | 1 | 5V | 2.54mm | 24LC32A | 8 | 5.5V | 3/5V | 2.5V | I2C, Serial | 32Kb 4K x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 32 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 5.33mm | 9.27mm | 7.62mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
| 11LC161-I/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | Tin | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | NOT APPLICABLE | 1 | 5V | 2.54mm | NOT APPLICABLE | 11LC161 | 8 | 不合格 | 5.5V | 3/5V | 2.5V | Serial | 16Kb 2K x 8 | 5mA | SYNCHRONOUS | 100kHz | EEPROM | 单线 | 8 | 5ms | 16 kb | 0.000005A | 1-WIRE | 1000000 Write/Erase Cycles | 10ms | 200 | SOFTWARE | 5.334mm | 9.271mm | 7.62mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
 | BR93G86FJ-3AGTE2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | Non-Volatile | -40°C~85°C TA | Cut Tape (CT) | 活跃 | 1 (Unlimited) | 8 | 1.7V~5.5V | DUAL | 1.27mm | R-PDSO-G8 | 不合格 | 1.8/5V | 16Kb 1K x 16 | 3MHz | EEPROM | SPI | 1KX16 | 16 | 5ms | 0.000002A | 16384 bit | SERIAL | 3-WIRE | 1000000 Write/Erase Cycles | 40 | SOFTWARE | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S25FL127SABBHIS00 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 24-TBGA | 24 | 24-BGA (8x6) | Non-Volatile | -40°C~85°C TA | Tray | 2006 | FL-S | 活跃 | 3 (168 Hours) | 85°C | -40°C | 2.7V~3.6V | 108MHz | SPI, Serial | 128Mb 16M x 8 | 108MHz | FLASH | SPI - Quad I/O | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MT25QU128ABA8E12-1SIT | Micron Technology Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 24-TBGA | YES | 24 | Non-Volatile | -40°C~85°C TA | Tray | yes | 活跃 | 3 (168 Hours) | 24 | 1.7V~2V | BOTTOM | 未说明 | 1 | 1.8V | 1mm | 未说明 | 1.8V | 2V | 1.7V | SPI, Serial | 128Mb 16M x 8 | SYNCHRONOUS | 133MHz | FLASH | SPI | 128MX1 | 1 | 8ms, 2.8ms | 128 Mb | 256B | 1.2mm | 8mm | 6mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | BR93H76RF-WCE2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Automotive grade | 表面贴装 | 8-SOIC (0.173, 4.40mm Width) | YES | Non-Volatile | -40°C~125°C TA | Cut Tape (CT) | 2013 | Automotive, AEC-Q100 | 活跃 | 1 (Unlimited) | 8 | 2.7V~5.5V | DUAL | 未说明 | 1 | 4V | 1.27mm | 未说明 | R-PDSO-G8 | 不合格 | 5.5V | 2/5V | 2.7V | 8Kb 512 x 16 | SYNCHRONOUS | 1.25MHz | EEPROM | SPI | 512X16 | 16 | 5ms | 0.000002A | 8192 bit | SERIAL | 3-WIRE | 1000000 Write/Erase Cycles | 10ms | 40 | SOFTWARE | 1.71mm | 5mm | 4.4mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | S25FL128SDSMFV000 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | YES | 16 | Non-Volatile | -40°C~105°C TA | Tray | 2015 | FL-S | 活跃 | 3 (168 Hours) | 16 | ALSO CONFIGURABLE AS 128M X 1 | 8542.32.00.51 | 2.7V~3.6V | DUAL | 未说明 | 1 | 3V | 1.27mm | 未说明 | 3.6V | 2.7V | SPI, Serial | 128Mb 16M x 8 | SYNCHRONOUS | 80MHz | FLASH | SPI - Quad I/O | 8 | 134217728 bit | 3V | 500ms | 2.65mm | 10.3mm | 7.5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png) | AT93C46-10PC-2.7 | Atmel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MX25L12835FZ2I-10G | Macronix | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 8-WDFN Exposed Pad | YES | Non-Volatile | -40°C~85°C TA | Tray | 2016 | MX25xxx35/36 - MXSMIO™ | e3 | 不用于新设计 | 3 (168 Hours) | 8 | Matte Tin (Sn) | IT ALSO CONFIGURED AS 128M X 1 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 1.27mm | 40 | R-PDSO-N8 | 不合格 | 3.6V | 3/3.3V | 2.7V | SPI, Serial | 128Mb 16M x 8 | SYNCHRONOUS | 104MHz | FLASH | SPI | 32MX4 | 4 | 30μs, 1.5ms | 0.00002A | 134217728 bit | 3V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 2 | 0.8mm | 8mm | 6mm | ROHS3 Compliant | 无铅 |