类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 电压 - 额定直流 | 电压 - 供电 | 端子位置 | 峰值回流焊温度(摄氏度) | 功能数量 | 电源电压 | 端子间距 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 电压 | 界面 | 内存大小 | 端口的数量 | 电源电流 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 无卤素 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 访问时间(最大) | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 环境温度范围高 | 刷新周期 | 通用闪存接口 | I2C控制字节 | 顺序突发长度 | 交错突发长度 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||
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![]() | 93C56BT-E/OT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | SOT-23-6 | 6 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2003 | e3 | yes | 活跃 | 1 (Unlimited) | 6 | EAR99 | 8542.32.00.51 | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 0.95mm | 40 | 93C56B | 6 | 5V | 5V | Serial | 2Kb 128 x 16 | 2mA | 2MHz | 250 ns | EEPROM | SPI | 16 | 2ms | 2 kb | 0.000005A | MICROWIRE | 1000000 Write/Erase Cycles | 2ms | 200 | SOFTWARE | 8 | 1.45mm | 2.9mm | 1.55mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||
![]() | 25LC640AX-E/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | YES | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2007 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | 25LC640A | 8 | 5V | SPI, Serial | 64Kb 8K x 8 | 5mA | 10MHz | 100 ns | EEPROM | SPI | 8 | 5ms | 64 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MX25L6433FZNI-08G | Macronix | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 8-WDFN Exposed Pad | YES | Non-Volatile | -40°C~85°C TA | Tray | 2017 | MXSMIO™ | e3 | 活跃 | 3 (168 Hours) | 8 | Matte Tin (Sn) | ALSO IT CAN BE CONFIGURED AS 64M X 1 BIT | 2.65V~3.6V | DUAL | 260 | 1 | 3V | 1.27mm | 40 | R-PDSO-N8 | 3.6V | 2.65V | 64Mb 8M x 8 | SYNCHRONOUS | 133MHz | FLASH | SPI - Quad I/O | 16MX4 | 4 | 50μs, 1.2ms | 67108864 bit | SERIAL | 3V | 2 | 0.8mm | 6mm | 5mm | Non-RoHS Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 93AA56AT-I/MC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | Tin | 表面贴装 | 表面贴装 | 8-VFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Cut Tape (CT) | 2008 | e3 | yes | Discontinued | 1 (Unlimited) | 8 | EAR99 | 1.8V~5.5V | DUAL | 260 | 1 | 5V | 0.5mm | 40 | 93AA56A | 8 | 5V | Serial | 2Kb 256 x 8 | 2mA | 2MHz | 250 ns | EEPROM | SPI | 8 | 6ms | 2 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 6ms | 200 | SOFTWARE | 1mm | 3mm | 2mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | 24LC025T-E/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 1.27mm | 40 | 24LC025 | 8 | 不合格 | 5.5V | 3/5V | 2.5V | I2C, Serial | 2Kb 256 x 8 | 3mA | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 2 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | 1010DDDR | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | RMLV0816BGBG-4S2#KC0 | Renesas Electronics America | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 表面贴装 | 48-TFBGA | YES | Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2015 | yes | 活跃 | 3 (168 Hours) | 48 | 2.4V~3.6V | BOTTOM | 未说明 | 1 | 3V | 未说明 | 48 | R-PBGA-B48 | 3.6V | 2.7V | 8Mb 512K x 16 | ASYNCHRONOUS | SRAM | Parallel | 512KX16 | 16 | 45ns | 8388608 bit | 45 ns | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | IS42S32800D-7BLI | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 90-TFBGA | YES | 90 | Volatile | -40°C~85°C TA | Tray | e1 | yes | Obsolete | 3 (168 Hours) | 90 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | AUTO/SELF REFRESH | 3V~3.6V | BOTTOM | 260 | 1 | 3.3V | 0.8mm | 40 | 90 | 不合格 | 3.6V | 3.3V | 3V | 256Mb 8M x 32 | 1 | SYNCHRONOUS | 143MHz | 5.4ns | DRAM | Parallel | 8MX32 | 32 | 0.003A | 268435456 bit | COMMON | 4096 | 1248FP | 1248 | 1.2mm | 13mm | 8mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | IS43R16800E-6TLI | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 66-TSSOP (0.400, 10.16mm Width) | YES | 66 | Volatile | -40°C~85°C TA | Tray | 活跃 | 3 (168 Hours) | 66 | AUTO/SELF REFRESH | 2.3V~2.7V | DUAL | 1 | 2.5V | 0.65mm | 不合格 | 2.7V | 2.5V | 2.3V | 128Mb 8M x 16 | 1 | SYNCHRONOUS | 166MHz | 700ps | DRAM | Parallel | 16b | 8MX16 | 3-STATE | 16 | 12ns | 0.003A | 134217728 bit | COMMON | 4096 | 248 | 248 | 1.2mm | 22.22mm | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | BR25A256FVT-3MGE2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | YES | Non-Volatile | -40°C~105°C TA | Cut Tape (CT) | 2014 | 活跃 | 1 (Unlimited) | 8 | ALSO OPERATES AT 2.5V WITH 5MHZ | 2.5V~5.5V | DUAL | 未说明 | 1 | 0.65mm | 未说明 | R-PDSO-G8 | 5.5V | 4V | 256Kb 32K x 8 | SYNCHRONOUS | 10MHz | EEPROM | SPI | 32KX8 | 8 | 5ms | 262144 bit | SERIAL | SPI | 5ms | 1.2mm | 4.4mm | 3mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SST39VF402C-70-4I-EKE | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | 48 | Non-Volatile | -40°C~85°C TA | Tray | 2011 | SST39 MPF™ | e3 | 活跃 | 3 (168 Hours) | 48 | EAR99 | Matte Tin (Sn) - annealed | TOP BOOT BLOCK | 8542.32.00.51 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 0.5mm | 40 | SST39VF402C | 48 | 3.3V | 3.6V | 2.7V | 4Mb 256K x 16 | 18mA | 70ns | FLASH | Parallel | 256KX16 | 10μs | 1b | 4 Mb | 0.00002A | Asynchronous | 16b | 2.7V | YES | YES | YES | 128 | 2K | YES | TOP | YES | 1.05mm | 18.5mm | 12.2mm | 无 | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||
![]() | TC58NVG0S3HTAI0 | Kioxia America, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tray | 活跃 | 3 (168 Hours) | 48 | 2.7V~3.6V | DUAL | 1 | 3.3V | 0.5mm | R-PDSO-G48 | 3.6V | 2.7V | 1Gb 128M x 8 | ASYNCHRONOUS | FLASH | Parallel | 128MX8 | 8 | 25ns | 1073741824 bit | 3.3V | 1.2mm | 18.4mm | 12mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY15B102Q-SXET | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Automotive grade | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2008 | Automotive, AEC-Q100, F-RAM™ | 活跃 | 3 (168 Hours) | 8 | EAR99 | 2V~3.6V | DUAL | 未说明 | 1 | 3.3V | 1.27mm | 未说明 | 不合格 | 3.3V | 3.6V | 2V | SPI, Serial | 2Mb 256K x 8 | SYNCHRONOUS | 25MHz | 16 ns | FRAM | SPI | 8b | 8 | 2 Mb | 0.00075A | 2.03mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | NAND512R3A2SZA6E | Micron Technology Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 63-TFBGA | 63 | Non-Volatile | -40°C~85°C TA | Tray | 2011 | e1 | yes | Obsolete | 3 (168 Hours) | 63 | 3A991.B.1.A | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.32.00.51 | 1.8V | 1.7V~1.95V | BOTTOM | 260 | 1 | 1.8V | 0.8mm | 30 | NAND512 | 63 | 1.8V | 1.8V | 512Mb 64M x 8 | 15mA | FLASH | Parallel | 64MX8 | 8 | 50ns | 26b | 512 Mb | Asynchronous | 8b | 512B | 85°C | 1.05mm | 11mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | IS62WV25616DBLL-45BLI | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 48-TFBGA | YES | 48 | Volatile | -40°C~85°C TA | Tray | e1 | yes | Discontinued | 3 (168 Hours) | 48 | Tin/Silver/Copper (Sn/Ag/Cu) | 2.5V~3.6V | BOTTOM | 260 | 1 | 0.75mm | 40 | 48 | 3.6V | 2.5/3.3V | 2.3V | 4Mb 256K x 16 | 1 | 18mA | SRAM | Parallel | 3-STATE | 16 | 45ns | 18b | 4 Mb | 0.000007A | 45 ns | COMMON | Asynchronous | 16b | 8mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S29GL01GS11TFV020 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 56-TFSOP (0.724, 18.40mm Width) | YES | Non-Volatile | -40°C~105°C TA | Tray | 2015 | GL-S | e3 | 活跃 | 3 (168 Hours) | 56 | 哑光锡 | 8542.32.00.51 | 2.7V~3.6V | DUAL | 未说明 | 1 | 3V | 0.5mm | 未说明 | R-PDSO-G56 | 不合格 | 3.6V | 3/3.3V | 2.7V | 1Gb 64M x 16 | ASYNCHRONOUS | 0.08mA | 110ns | FLASH | Parallel | 64MX16 | 16 | 60ns | 0.0002A | 1073741824 bit | 3V | YES | YES | YES | 1K | 64K | 16words | YES | BOTTOM/TOP | YES | 1.2mm | 18.4mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
![]() | FM25L16B-DG | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-VDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2008 | F-RAM™ | e3 | yes | 活跃 | 3 (168 Hours) | 8 | EAR99 | Matte Tin (Sn) | 2.7V~3.6V | DUAL | 260 | 1 | 3.3V | 0.95mm | 30 | FM25L16 | 8 | 不合格 | 3.3V | 3.6V | 2.7V | SPI, Serial | 16Kb 2K x 8 | 3mA | SYNCHRONOUS | 20MHz | 20 ns | FRAM | SPI | 8b | 8 | 16 kb | 0.000006A | 8b | 4.5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | W25Q64FVSSIQ | Winbond Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tube | 2016 | SpiFlash® | Obsolete | 3 (168 Hours) | 8 | 2.7V~3.6V | DUAL | 1 | 1.27mm | S-PDSO-G8 | 不合格 | 3.6V | 3V | 64Mb 8M x 8 | SYNCHRONOUS | 104MHz | FLASH | SPI - Quad I/O, QPI | 8MX8 | 3-STATE | 8 | 50μs, 3ms | 0.00005A | 67108864 bit | SERIAL | SPI | 20 | HARDWARE/SOFTWARE | 1 | 2.16mm | 5.28mm | 5.28mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY15B256Q-SXA | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2008 | F-RAM™ | 活跃 | 3 (168 Hours) | 8 | EAR99 | 2V~3.6V | DUAL | 未说明 | 1 | 3.3V | 1.27mm | 未说明 | 3.3V | 3.6V | 2V | SPI, Serial | 256Kb 32K x 8 | SYNCHRONOUS | 40MHz | 16 ns | FRAM | SPI | 8b | 8 | 256 kb | 1.727mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AT24CS64-SSHM-B | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Industrial grade | Gold | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | Non-Volatile | -40°C~85°C TA | Bulk | 2005 | e4 | 活跃 | 3 (168 Hours) | EAR99 | 8542.32.00.51 | 1.7V~5.5V | 260 | 40 | AT24CS64 | 2-Wire, I2C, Serial | 64Kb 8K x 8 | 1MHz | 550ns | EEPROM | I2C | 5ms | I2C | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CAV24M01WE-GT3 | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | Automotive grade | ACTIVE (Last Updated: 1 week ago) | Gold | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2008 | Automotive, AEC-Q100 | e4 | yes | 活跃 | 1 (Unlimited) | 8 | 2.5V~5.5V | DUAL | 未说明 | 1 | 5V | 1.27mm | 未说明 | 8 | 5.5V | 2.5V | 2-Wire, I2C, Serial | 1Mb 128K x 8 | SYNCHRONOUS | 1MHz | 400ns | EEPROM | I2C | 无卤素 | 8 | 5ms | 1 Mb | I2C | 5ms | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S25FL128SDPMFIG11 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | 16 | Non-Volatile | -40°C~85°C TA | Tube | 2016 | FL-S | 活跃 | 3 (168 Hours) | 16 | ALSO CONFIGURABLE AS 128M X 1 | 8542.32.00.51 | 2.7V~3.6V | DUAL | 1 | 3V | 1.27mm | 3.6V | 3/3.3V | 2.7V | SPI, Serial | 128Mb 16M x 8 | 75mA | 66MHz | 8 ns | FLASH | SPI - Quad I/O | 8b | 8 | 1b | 128 Mb | 0.0001A | Synchronous | 1b | 3V | SPI | 100000 Write/Erase Cycles | 500ms | 20 | HARDWARE/SOFTWARE | 2 | BOTTOM | 2.65mm | 10.3mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | S29PL064J55BFI120 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 48-VFBGA | 48 | Non-Volatile | -40°C~85°C TA | Tray | 2015 | PL-J | e1 | Obsolete | 3 (168 Hours) | 48 | 3A991.B.1.A | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 上下靴块 | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 260 | 1 | 3V | 0.8mm | 40 | 3.6V | 3/3.3V | 2.7V | 64Mb 4M x 16 | 55mA | FLASH | Parallel | 16b | 4MX16 | 16 | 55ns | 22b | 64 Mb | 0.000005A | 55 ns | Asynchronous | 16b | 3V | YES | YES | YES | 16126 | 4K32K | 8words | YES | BOTTOM/TOP | YES | 1mm | 8.15mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||
![]() | 24LC32AFT-E/MNY | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 24 Weeks | Gold | 表面贴装 | 表面贴装 | 8-WFDFN Exposed Pad | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2009 | e4 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 0.5mm | 40 | 24LC32AF | 8 | 不合格 | 5V | I2C, Serial | 32Kb 4K x 8 | 3mA | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 32 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE | 1010DDDR | 3mm | 2mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | 24AA16HT-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Gold | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2008 | e3 | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) - annealed | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 40 | 24AA16H | 8 | 5V | 1.7V | I2C, Serial | 16Kb 2K x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 16 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010MMMR | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | 93C56CT-E/MS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2008 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | 93C56C | 8 | 5V | 5V | Serial | 2Kb 256 x 8 128 x 16 | 2mA | 3MHz | 200 ns | EEPROM | SPI | 16 | 2ms | 2 kb | 0.000005A | MICROWIRE | 1000000 Write/Erase Cycles | 2ms | 200 | SOFTWARE | 8 | 1.1mm | 3mm | 3mm | 无 | ROHS3 Compliant | 无铅 |