类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 厂商 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 电压 - 供电 | 端子位置 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 端口的数量 | 电源电流 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 无卤素 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 访问时间（最大） | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 引导模块 | 刷新周期 | 通用闪存接口 | I2C控制字节 | 顺序突发长度 | 交错突发长度 | 反向引脚排列 | 产品类别 | 组织的记忆 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||||||||||||||
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 | SST26VF032BA-104I/MF | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 8-WDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2013 | SST26 SQI® | e3 | 活跃 | 3 (168 Hours) | Matte Tin (Sn) - annealed | 2.7V~3.6V | 未说明 | 未说明 | SST26VF032 | 不合格 | 3V | SPI, Serial | 32Mb 4M x 8 | 104MHz | 3 ns | FLASH | SPI - Quad I/O | 1.5ms | 32 Mb | SPI | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 256B | 750μm | 6mm | 5mm | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | W948D6FBHX5E | Winbond Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 60-TFBGA | 60 | Volatile | -25°C~85°C TC | Tray | 2002 | Obsolete | 3 (168 Hours) | 60 | EAR99 | AUTO/SELF REFRESH | 8542.32.00.02 | 1.7V~1.95V | BOTTOM | 1 | 1.8V | 0.8mm | 60 | 1.8V | 1.95V | 1.7V | 256Mb 16M x 16 | 1 | 55mA | 200MHz | 5ns | DRAM | Parallel | 16b | 8MX16 | 3-STATE | 16 | 15ns | 15b | 256 Mb | 0.00001A | COMMON | 8192 | 24816 | 24816 | 1.025mm | 9mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 93LC56C-E/MS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2003 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 3V | 0.65mm | 40 | 93LC56C | 8 | 5.5V | 3/5V | 2.5V | Serial | 2Kb 256 x 8 128 x 16 | 2mA | 3MHz | 200 ns | EEPROM | SPI | 256X16 | 16 | 6ms | 2 kb | 0.000005A | MICROWIRE | 1000000 Write/Erase Cycles | 6ms | 200 | SOFTWARE | 8 | 1.1mm | 4.9mm | 3mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C199C-15VC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 28-BSOJ (0.300, 7.62mm Width) | YES | 28 | Volatile | 0°C~70°C TA | Tube | 2003 | e0 | no | Obsolete | 3 (168 Hours) | 28 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.41 | 4.5V~5.5V | DUAL | 220 | 1 | 5V | 1.27mm | not_compliant | 15GHz | 未说明 | CY7C199 | 28 | 不合格 | 5.5V | 5V | 4.5V | 256Kb 32K x 8 | SRAM | Parallel | 32KX8 | 3-STATE | 8 | 15ns | 0.01A | 262144 bit | 15 ns | COMMON | 4.5V | 3.556mm | 17.907mm | 7.5057mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 25LC160DT-H/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~150°C TA | Tape & Reel (TR) | 2013 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | 3A001.A.2.A | Matte Tin (Sn) | 2.5V~5.5V | DUAL | 260 | 1 | 2.7V | 1.27mm | 40 | 25LC160D | 8 | 5V | SPI, Serial | 16Kb 2K x 8 | 5mA | 5MHz | 100 ns | EEPROM | SPI | 8 | 6ms | 16 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 6ms | 200 | HARDWARE/SOFTWARE | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | IS61LV51216-10TLI | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | 44 | Volatile | -40°C~85°C TA | Tray | e3 | yes | Obsolete | 3 (168 Hours) | 44 | Matte Tin (Sn) - annealed | 3.135V~3.6V | DUAL | 260 | 1 | 3.3V | 0.8mm | 40 | 44 | 3.3V | 3.63V | 8Mb 512K x 16 | 1 | 110mA | SRAM | Parallel | 3-STATE | 10ns | 19b | 8 Mb | 0.025A | COMMON | Asynchronous | 16b | 1.05mm | 18.52mm | 10.29mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png) | 5962-8855203XA | Renesas Electronics America Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tube | Volatile | 5962-8855203 | This product may require additional documentation to export from the United States. | + 125 C | 5.5 V | - 55 C | 13 | 4.5 V | 通孔 | Parallel | Renesas Electronics | Renesas Electronics | N | SRAM | 通孔 | 28-CDIP (0.600", 15.24mm) | 28-CDIP | Renesas Electronics America Inc | 活跃 | -55°C ~ 125°C (TA) | Tube | - | Asynchronous | Memory & Data Storage | 4.5V ~ 5.5V | 256Kbit | 125 mA | 55 ns | SRAM | Parallel | 32 k x 8 | 55ns | SRAM | 32K x 8 | 1.65 mm | 37.2 mm | 15.24 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CAV24C128YE-GT3 | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | ACTIVE (Last Updated: 22 hours ago) | Gold | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2008 | Automotive, AEC-Q100 | e4 | yes | 活跃 | 1 (Unlimited) | 8 | 2.5V~5.5V | DUAL | 未说明 | 1 | 5V | 0.65mm | 未说明 | 8 | 不合格 | 5.5V | 3/5V | 2.5V | 2-Wire, I2C, Serial | 128Kb 16K x 8 | SYNCHRONOUS | 1MHz | 400ns | EEPROM | I2C | 无卤素 | 8 | 5ms | 1 Mb | 0.000005A | SPI | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE | 1010DDDR | 1.2mm | 4.4mm | 3mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S25FL256SAGBHIY00 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 24-TBGA | YES | 24 | Non-Volatile | -40°C~85°C TA | Tray | 2016 | FL-S | 活跃 | 3 (168 Hours) | 24 | 2.7V~3.6V | BOTTOM | 未说明 | 1 | 3V | 未说明 | SPI, Serial | 256Mb 32M x 8 | SYNCHRONOUS | 133MHz | FLASH | SPI - Quad I/O | 8b | 32MX8 | 8 | 268435456 bit | CONFIGURABLE | 3V | SPI | 1 | YES | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 93C66BT-E/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2005 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 4.5V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 40 | 93C66B | 8 | 5V | 5V | Serial | 4Kb 256 x 16 | 2mA | 2MHz | 250 ns | EEPROM | SPI | 256X16 | 16 | 2ms | 4 kb | 0.000005A | MICROWIRE | 1000000 Write/Erase Cycles | 2ms | 200 | SOFTWARE | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT93C86AY6-10YH-1.8-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 8-UFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | yes | 活跃 | 1 (Unlimited) | 8 | 1.8V~5.5V | DUAL | 未说明 | 1 | 5V | 0.5mm | 未说明 | AT93C86A | 5.5V | 4.5V | Serial | 16Kb 2K x 8 1K x 16 | 2mA | SYNCHRONOUS | 2MHz | EEPROM | SPI | 1024X16 | 16 | 10ms | 16 kb | MICROWIRE | 10ms | 8 | 0.6mm | 3mm | 2mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT25080B-MAHL-E | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 8-UFDFN Exposed Pad | YES | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 1997 | 活跃 | 3 (168 Hours) | 8 | EAR99 | ALSO OPERATES AT MIN 1.8 V AT 5 MHZ | 8542.32.00.51 | 1.8V~5.5V | DUAL | 未说明 | 1 | 5V | 0.5mm | 未说明 | R-PDSO-N8 | 5.5V | 4.5V | 8Kb 1K x 8 | SYNCHRONOUS | 20MHz | EEPROM | SPI | 1KX8 | 8 | 5ms | 8192 bit | SERIAL | SPI | 5ms | 0.6mm | 3mm | 2mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST39VF6401B-70-4I-B1KE-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 48-TFBGA | 48 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2010 | SST39 MPF™ | e1 | 活跃 | 3 (168 Hours) | 48 | Tin/Silver/Copper (Sn/Ag/Cu) | 2.7V~3.6V | BOTTOM | 0.8mm | SST39VF6401B | 3.3V | 64Mb 4M x 16 | 18mA | 70ns | FLASH | Parallel | 16b | 4MX16 | 16 | 10μs | 22b | 64 Mb | 0.00002A | Asynchronous | 16b | YES | YES | YES | 2K | 2K | BOTTOM | YES | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST39LF020-45-4C-NHE | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 32-LCC (J-Lead) | YES | 32 | Non-Volatile | 0°C~70°C TA | Tube | 2010 | SST39 MPF™ | e3 | yes | Obsolete | 3 (168 Hours) | 32 | 3A991.B.1.A | 哑光锡 | 3V~3.6V | QUAD | 245 | 1 | 3.3V | 1.27mm | 40 | SST39LF020 | 32 | 3.3V | 3.6V | 3V | 2Mb 256K x 8 | 20mA | 45ns | FLASH | Parallel | 8b | 256KX8 | 8 | 20μs | 18b | 2 Mb | 0.000015A | Asynchronous | 8b | 3V | YES | YES | YES | 64 | 4K | 2.8448mm | 13.97mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24VL025T/MNY | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Gold | 表面贴装 | 表面贴装 | 8-WFDFN Exposed Pad | 8 | Non-Volatile | -20°C~85°C TA | Tape & Reel (TR) | 2009 | e4 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.5V~3.6V | DUAL | 260 | 1 | 1.8V | 0.5mm | 40 | 24VL025 | 8 | 3.3V | 3.6V | 1.5V | 2-Wire, Serial | 2Kb 256 x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 2 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | SOFTWARE | 1010DDDR | 3mm | 2mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY62157EV18LL-55BVXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 48-VFBGA | 48 | Volatile | -40°C~85°C TA | Tray | 2001 | MoBL® | e1 | yes | 活跃 | 3 (168 Hours) | 48 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.65V~2.25V | BOTTOM | 260 | 1 | 1.8V | 0.75mm | 30 | CY62157 | 48 | 1.8V | 2.25V | 8Mb 512K x 16 | 1 | 25mA | SRAM | Parallel | 3-STATE | 16 | 55ns | 19b | 8 Mb | 0.000003A | 55 ns | COMMON | Asynchronous | 16b | 1V | 8mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 93LC66AX/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | 0°C~70°C TA | Tube | 2003 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS | 2.5V~5.5V | DUAL | 260 | 1 | 3V | 1.27mm | 40 | 93LC66A | 8 | 5.5V | 6V | 3/5V | 2.5V | 2-Wire, Serial | 4Kb 512 x 8 | 1.5mA | 2MHz | 6 ms | EEPROM | SPI | 8 | 4 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 200 | SOFTWARE | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 34AA02T-I/MS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2010 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 40 | 34AA02 | 8 | 不合格 | 5V | 1.7V | I2C, Serial | 2Kb 256 x 8 | 3mA | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 2 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1010DDDR | 1.1mm | 3mm | 3mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 93LC56CXT-E/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2008 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 3V | 1.27mm | 40 | 93LC56C | 8 | 5.5V | 3/5V | 2.5V | Serial | 2Kb 256 x 8 128 x 16 | 2mA | 3MHz | 200 ns | EEPROM | SPI | 16 | 6ms | 2 kb | 0.000005A | MICROWIRE | 1000000 Write/Erase Cycles | 6ms | 200 | SOFTWARE | 8 | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1460KV25-250AXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 100-LQFP | YES | Volatile | 0°C~70°C TA | Tray | 2015 | NoBL™ | 活跃 | 3 (168 Hours) | 100 | 3A991 | 流水线结构 | 8542.32.00.41 | 2.375V~2.625V | QUAD | 1 | 2.5V | 0.65mm | R-PQFP-G100 | 2.625V | 2.375V | 36Mb 1M x 36 | 250MHz | 2.5ns | SRAM | Parallel | 1MX36 | 36 | 37748736 bit | 1.6mm | 20mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24LC08BT-E/MNY | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-WFDFN Exposed Pad | 8 | 8-TDFN (2x3) | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2008 | 活跃 | 1 (Unlimited) | 125°C | -40°C | 2.5V~5.5V | 400kHz | 24LC08B | 5V | I2C, Serial | 5.5V | 2.5V | 8Kb 256 x 8 x 4 | 3mA | 400kHz | 900ns | EEPROM | I2C | 5ms | 8 kb | 400kHz | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C0832AV-167AXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 表面贴装 | 表面贴装 | 120-LQFP | 120 | Volatile | 0°C~70°C TA | Tray | 2003 | e3 | Obsolete | 3 (168 Hours) | 120 | Matte Tin (Sn) | 流水线结构 | 3.135V~3.465V | QUAD | 260 | 1 | 3.3V | 0.4mm | 30 | CY7C0832 | 120 | 3.3V | 3.465V | 3.135V | 4.5Mb 256K x 18 | 2 | 300mA | 167MHz | 4 ns | SRAM | Parallel | 3-STATE | 18 | 18b | 4 Mb | 0.075A | COMMON | Synchronous | 18b | 3.14V | 1.6mm | 14mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 11LC161T-I/TT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | TO-236-3, SC-59, SOT-23-3 | 3 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 3 | EAR99 | Matte Tin (Sn) - annealed | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 0.95mm | 40 | 11LC161 | 3 | 不合格 | 5.5V | 2.5V | Serial | 16Kb 2K x 8 | 5mA | SYNCHRONOUS | 100kHz | EEPROM | 单线 | 2KX8 | 8 | 5ms | 16 kb | 0.000005A | 1-WIRE | 1000000 Write/Erase Cycles | 10ms | 200 | SOFTWARE | 1.12mm | 2.9mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24C01CT-E/MC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | Tin | 表面贴装 | 表面贴装 | 8-VFDFN Exposed Pad | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2008 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 0.5mm | 40 | 24C01C | 8 | 5V | 5V | I2C, Serial | 1Kb 128 x 8 | 3mA | 100kHz | 3500ns | EEPROM | I2C | 8 | 1.5ms | 1 kb | 0.00005A | I2C | 1000000 Write/Erase Cycles | 1.5ms | 200 | 1010DDDR | 1mm | 3mm | 2mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 11AA010T-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.8V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 11AA010 | 8 | 5.5V | 2/5V | Serial | 1Kb 128 x 8 | 5mA | 100kHz | EEPROM | 单线 | 8 | 5ms | 1 kb | 0.000005A | 1-WIRE | 1000000 Write/Erase Cycles | 10ms | 200 | SOFTWARE | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant |