类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 端口的数量 | 电源电流 | 操作模式 | 最大电源电流 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 筛选水平 | 访问时间（最大） | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 输出启用 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 环境温度范围高 | 刷新周期 | 通用闪存接口 | I2C控制字节 | 顺序突发长度 | 交错突发长度 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||
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 | M25P16-VMF6P | Micron Technology Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | YES | 16 | Non-Volatile | -40°C~85°C TA | Tube | 2007 | yes | Obsolete | 1 (Unlimited) | 16 | SMD/SMT | EAR99 | 8542.32.00.51 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 1.27mm | 30 | M25P16 | 16 | 3.3V | 2.7V | SPI, Serial | 16Mb 2M x 8 | 8mA | 75MHz | 1.4 ms | FLASH | SPI | 2MX8 | 8 | 15ms, 5ms | 1b | 16 Mb | 0.00001A | Synchronous | 8b | SPI | 100000 Write/Erase Cycles | 15ms | 20 | HARDWARE/SOFTWARE | 256B | 2.65mm | 10.3mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C144E-55JXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 68-LCC (J-Lead) | 68 | Volatile | 0°C~70°C TA | Tube | 1996 | e3 | Obsolete | 3 (168 Hours) | 68 | EAR99 | Matte Tin (Sn) | 4.5V~5.5V | QUAD | 260 | 1 | 5V | 20 | 68 | 5V | 5V | 64Kb 8K x 8 | 2 | 275mA | SRAM | Parallel | 8KX8 | 3-STATE | 8 | 55ns | 26b | 64 kb | 0.0005A | 55 ns | COMMON | Asynchronous | 8b | 5.08mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24LC08BHT-E/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2008 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | 24LC08BH | 8 | 不合格 | 5V | I2C, Serial | 8Kb 256 x 8 x 4 | 3mA | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 8 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010XMMR | 1.2mm | 4.4mm | 3mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C024-55AC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 100-LQFP | YES | Volatile | 0°C~70°C TA | Tray | 2004 | e0 | Obsolete | 3 (168 Hours) | 100 | EAR99 | Tin/Lead (Sn/Pb) | 中断标志 | 8542.32.00.41 | 4.5V~5.5V | QUAD | 235 | 1 | 5V | 0.5mm | not_compliant | 未说明 | CY7C024 | 100 | S-PQFP-G100 | 不合格 | 5.5V | 5V | 4.5V | 64Kb 4K x 16 | 2 | 0.22mA | SRAM | Parallel | 4KX16 | 3-STATE | 16 | 55ns | 0.015A | 65536 bit | 55 ns | COMMON | 2V | YES | 1.6mm | 14mm | 14mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24LC01BH-I/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2008 | e3 | 活跃 | 1 (Unlimited) | 8 | SMD/SMT | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 4.5V | 0.65mm | 40 | 24LC01BH | 8 | 5V | 2-Wire, I2C, Serial | 1Kb 128 x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 1 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010XXXR | 1.2mm | 4.4mm | 3mm | 无 | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 93LC66BT-E/MS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2011 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 3V | 0.65mm | 40 | 93LC66B | 8 | 5.5V | 3/5V | 2.5V | Serial | 4Kb 256 x 16 | 2mA | 2MHz | 250 ns | EEPROM | SPI | 256X16 | 16 | 6ms | 4 kb | 0.000005A | MICROWIRE | 1000000 Write/Erase Cycles | 6ms | 200 | SOFTWARE | 1.1mm | 3mm | 3mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT28C010-15UM/883 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 23 Weeks | Military grade | Lead, Tin | 通孔 | 通孔 | 30-BCPGA | 30 | Non-Volatile | -55°C~125°C TC | Tray | 1998 | e0 | no | 活跃 | 1 (Unlimited) | 30 | Tin/Lead (Sn/Pb) | AUTOMATIC WRITE; DATA RETENTION: 10 YEARS | 4.5V~5.5V | PERPENDICULAR | 未说明 | 1 | 5V | 2.54mm | 150GHz | 未说明 | AT28C010 | 不合格 | 5V | 5V | 1Mb 128K x 8 | 80mA | ASYNCHRONOUS | 150ns | EEPROM | Parallel | 128KX8 | 3-STATE | 8 | 10ms | 1 Mb | 0.0003A | MIL-STD-883 | 5V | 10000 Write/Erase Cycles | 10ms | YES | YES | NO | 128words | 4.4mm | 16.5mm | 14mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1370D-167AXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 表面贴装 | 表面贴装 | 100-LQFP | 100 | Volatile | -40°C~85°C TA | Tray | 2006 | NoBL™ | e3 | yes | Obsolete | 3 (168 Hours) | 100 | 3A991.B.2.A | Matte Tin (Sn) | 流水线结构 | 3.135V~3.6V | QUAD | 250 | 1 | 3.3V | 0.65mm | 40 | CY7C1370 | 100 | 3.3V | 3.6V | 3.135V | 18Mb 512K x 36 | 4 | 275mA | 167MHz | 3.4ns | SRAM | Parallel | 512KX36 | 3-STATE | 19b | 18 Mb | 0.07A | COMMON | Synchronous | 36b | 1.4mm | 20mm | 14mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MX25R4035FM1IL0 | Macronix | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tube | MXSMIO™ | 活跃 | 3 (168 Hours) | 8 | IT IS ALSO CONFIGURED AS 4M X 1 | 1.65V~3.6V | DUAL | 未说明 | 1 | 1.8V | 1.27mm | 未说明 | R-PDSO-G8 | 3.6V | 1.65V | 4Mb 512K x 8 | SYNCHRONOUS | 33MHz | FLASH | SPI | 1MX4 | 4 | 100μs, 10ms | 4194304 bit | SERIAL | 3V | 2 | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | W9751G6KB25I | Winbond Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 84-TFBGA | 84 | Volatile | -40°C~95°C TC | Tray | 2014 | e1 | 最后一次购买 | 3 (168 Hours) | 84 | EAR99 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | AUTO/SELF REFRESH | 8542.32.00.28 | 1.7V~1.9V | BOTTOM | 1 | 1.8V | 0.8mm | 84 | 1.8V | 1.9V | 1.7V | 512Mb 32M x 16 | 1 | 165mA | 400MHz | 400ps | DRAM | Parallel | 32MX16 | 3-STATE | 16 | 15ns | 15b | 512 Mb | 0.008A | 800MHz | COMMON | 8192 | 48 | 48 | 1.2mm | 12.5mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | IS45S16800F-7TLA2 | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Automotive grade | 表面贴装 | 54-TSOP (0.400, 10.16mm Width) | YES | 54 | Volatile | -40°C~105°C TA | Tray | e3 | 活跃 | 3 (168 Hours) | 54 | EAR99 | Matte Tin (Sn) | AUTO/SELF REFRESH | 3V~3.6V | DUAL | 1 | 3.3V | 0.8mm | 54 | 不合格 | 3.6V | 3.3V | 3V | 128Mb 8M x 16 | 1 | SYNCHRONOUS | 143MHz | 5.4ns | DRAM | Parallel | 16b | 8MX16 | 3-STATE | 16 | 0.002A | 134217728 bit | AEC-Q100 | COMMON | 4096 | 1248FP | 1248 | 1.2mm | 22.22mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST39VF400A-70-4C-EKE-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | YES | 48 | Non-Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2000 | SST39 MPF™ | e3 | yes | 活跃 | 3 (168 Hours) | 48 | EAR99 | Matte Tin (Sn) - annealed | 8542.32.00.51 | 2.7V~3.6V | DUAL | 260 | 0.5mm | 40 | SST39VF400A | 3.3V | 4Mb 256K x 16 | 30mA | 70ns | FLASH | Parallel | 16b | 256KX16 | 16 | 20μs | 18b | 4 Mb | 0.00002A | Asynchronous | 16b | YES | YES | YES | 128 | 2K | YES | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1248KV18-400BZXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 表面贴装 | 165-LBGA | 165 | Volatile | 0°C~70°C TA | Tray | 2003 | e1 | 活跃 | 3 (168 Hours) | 165 | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 1.7V~1.9V | BOTTOM | 260 | 1 | 1.8V | 30 | CY7C1248 | 165 | 1.8V | 36Mb 2M x 18 | 1 | 550mA | 400MHz | 450 ps | SRAM | Parallel | 3-STATE | 18 | 20b | 36 Mb | COMMON | Synchronous | 18b | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT45DB081E-SSHN-T | Adesto Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Gold | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | 540.001716mg | Non-Volatile | -40°C~85°C TC | Tape & Reel (TR) | 2005 | e4 | 活跃 | 1 (Unlimited) | 8 | 1.7V~3.6V | DUAL | 260 | 1 | 3V | 1.27mm | 未说明 | 不合格 | 3.6V | 1.7V | SPI, Serial | 8Mb 264Bytes x 4096 pages | SYNCHRONOUS | 15mA | 85MHz | 6 ns | FLASH | SPI | 8b | 1 | 8μs, 4ms | 8 Mb | 0.000001A | 2.7V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 1.75mm | 4.925mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S25FL512SDSMFB010 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | Automotive grade | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | YES | Non-Volatile | -40°C~105°C TA | Tray | Automotive, AEC-Q100, FL-S | 活跃 | 3 (168 Hours) | 16 | ITS ALSO CONFIGURABLE AS 512MX1 | 8542.32.00.51 | 2.7V~3.6V | DUAL | 未说明 | 1 | 3V | 1.27mm | 未说明 | R-PDSO-G16 | 3.6V | 2.7V | SPI, Serial | 512Mb 64M x 8 | SYNCHRONOUS | 80MHz | FLASH | SPI - Quad I/O | 64MX8 | 8 | 512753664 bit | AEC-Q100; TS 16949 | 3V | 1 | 2.65mm | 10.3mm | 7.5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24AA02H-I/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2005 | e3 | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 40 | 24AA02H | 8 | 2.5V | 5.5V | 2/5V | 1.7V | I2C, Serial | 2Kb 256 x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 2 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010XXXR | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST39VF1601C-70-4I-B3KE-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 48-TFBGA | 48 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2000 | SST39 MPF™ | e1 | 活跃 | 3 (168 Hours) | 48 | Tin/Silver/Copper (Sn/Ag/Cu) | 2.7V~3.6V | BOTTOM | 0.8mm | SST39VF1601C | 3.3V | 16Mb 1M x 16 | 18mA | 70ns | FLASH | Parallel | 16b | 1MX16 | 16 | 10μs | 20b | 16 Mb | 0.00002A | Asynchronous | 16b | YES | YES | YES | 12131 | 8K4K16K32K | YES | BOTTOM | YES | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 93LC56CT-E/MNY | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Automotive grade | Gold | 表面贴装 | 表面贴装 | 8-WFDFN Exposed Pad | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2011 | e4 | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 0.5mm | 40 | 93LC56C | 8 | 5.5V | 2.5V | 2Kb 256 x 8 128 x 16 | 2mA | SYNCHRONOUS | 3MHz | 250 ns | EEPROM | SPI | 16 | 6ms | 2 kb | TS 16949 | SERIAL | MICROWIRE | 6ms | 8 | 125°C | 800μm | 3mm | 2mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT24C32A-10PU-2.7 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | 8-PDIP | Non-Volatile | -40°C~85°C TA | Tube | Obsolete | 1 (Unlimited) | 85°C | -40°C | 2.7V~5.5V | 400kHz | AT24C32 | 2-Wire, I2C, Serial | 5.5V | 2.7V | 32Kb 4K x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 5ms | 32 kb | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 11LC010-E/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 11LC010 | 8 | 5V | Serial | 1Kb 128 x 8 | 5mA | 100kHz | EEPROM | 单线 | 5ms | 1 kb | 0.000005A | 1-WIRE | 1000000 Write/Erase Cycles | 10ms | 200 | SOFTWARE | 1.5mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT28C256F-15JU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | 表面贴装 | 32-LCC (J-Lead) | 32 | Non-Volatile | -40°C~85°C TC | Tube | 1997 | e3 | yes | 活跃 | 2 (1 Year) | 32 | 4.5V~5.5V | QUAD | 245 | 1 | 5V | 1.27mm | 5MHz | 40 | AT28C256 | 5V | 5V | Parallel, SPI | 256Kb 32K x 8 | 50mA | 150ns | EEPROM | Parallel | 8 | 3ms | 256 kb | 0.0002A | 5V | 10000 Write/Erase Cycles | 3ms | 10 | HARDWARE/SOFTWARE | YES | YES | 64words | 3.556mm | 13.97mm | 11.43mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C027V-15AXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 表面贴装 | 100-LQFP | 100 | Volatile | -40°C~85°C TA | Tray | 2004 | e4 | yes | Obsolete | 3 (168 Hours) | 100 | Nickel/Palladium/Gold (Ni/Pd/Au) | AUTOMATIC POWER-DOWN | 3V~3.6V | QUAD | 260 | 1 | 3.3V | 0.5mm | 30 | CY7C027 | 100 | 3.3V | 3.6V | 3V | 512Kb 32K x 16 | 2 | SRAM | Parallel | 3-STATE | 16 | 15ns | 15b | 512 kb | 0.00005A | 15 ns | COMMON | Asynchronous | 16b | 2V | 1.6mm | 14mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST39VF512-70-4C-WHE | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 32-TFSOP (0.724, 18.40mm Width) | 32 | Non-Volatile | 0°C~70°C TA | Tray | 2000 | SST39 MPF™ | e3 | yes | Obsolete | 3 (168 Hours) | 32 | EAR99 | 哑光锡 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 0.5mm | 40 | SST39VF512 | 32 | 3.3V | 3.6V | 2.7V | 512Kb 64K x 8 | 20mA | 70ns | FLASH | Parallel | 8b | 64KX8 | 8 | 20μs | 16b | 512 kb | 0.000015A | Asynchronous | 8b | 2.7V | YES | YES | YES | 16 | 4K | 1.2mm | 12.4mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| 34LC02-I/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2008 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.2V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 40 | 34LC02 | 8 | 不合格 | 5V | 2.2V | I2C, Serial | 2Kb 256 x 8 | 3mA | SYNCHRONOUS | 1MHz | 400ns | EEPROM | I2C | 8 | 5ms | 2 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1010DDDR | 1.2mm | 4.4mm | 3mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1019DV33-10BVXIT | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 48-VFBGA | 48 | Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2002 | e1 | yes | 活跃 | 3 (168 Hours) | 48 | Tin/Silver/Copper (Sn/Ag/Cu) | 3V~3.6V | BOTTOM | 260 | 1 | 3.3V | 0.75mm | 30 | CY7C1019 | 3.3V | 3.6V | 3V | 1Mb 128K x 8 | 1 | 60mA | SRAM | Parallel | 3-STATE | 8 | 10ns | 17b | 1 Mb | 0.003A | 100MHz | COMMON | Asynchronous | 8b | 2V | 8mm | 无 | ROHS3 Compliant | 无铅 |