类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 最大功率耗散 | 电压 - 供电 | 端子位置 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 界面 | 内存大小 | 端口的数量 | 电源电流 | 操作模式 | 最大电源电流 | 时钟频率 | 电源电流-最大值 | 访问时间 | 逻辑功能 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 无卤素 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 访问时间（最大） | I/O类型 | 同步/异步 | 字长 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 时间格式 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 刷新周期 | 通用闪存接口 | I2C控制字节 | 顺序突发长度 | 交错突发长度 | 反向引脚排列 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||
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 | 11AA020T-I/MNY | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Gold | 表面贴装 | 表面贴装 | 8-WFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2008 | e4 | yes | 活跃 | 1 (Unlimited) | 8 | SMD/SMT | EAR99 | 1.8V~5.5V | DUAL | 260 | 1 | 5V | 0.5mm | 40 | 11AA020 | 8 | 5.5V | 2/5V | Serial | 2Kb 256 x 8 | 5mA | 100kHz | EEPROM | 单线 | 5ms | 2 kb | 0.000005A | 1-WIRE | 1000000 Write/Erase Cycles | 10ms | 200 | SOFTWARE | 730μm | 2mm | 3mm | 无 | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24AA08HT-I/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Gold | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2008 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) - annealed | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 40 | 24AA08H | 8 | 5V | 1.7V | I2C, Serial | 8Kb 256 x 8 x 4 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 8 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010XMMR | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | S29AS016J70BFV040 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 48-VFBGA | YES | 48 | Non-Volatile | -40°C~105°C TA | Tray | AS-J | Obsolete | 3 (168 Hours) | 48 | 8542.32.00.51 | 1.65V~1.95V | BOTTOM | 未说明 | 1 | 1.8V | 0.8mm | 未说明 | 1.95V | 1.65V | 16Mb 2M x 8 1M x 16 | ASYNCHRONOUS | FLASH | Parallel | 1MX16 | 16 | 70ns | 16777216 bit | 70 ns | 1.8V | 8 | BOTTOM | 1mm | 8.15mm | 6.15mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1513KV18-300BZC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 表面贴装 | 165-LBGA | 165 | Volatile | 0°C~70°C TA | Tray | 2003 | e0 | 活跃 | 3 (168 Hours) | 165 | Tin/Lead (Sn/Pb) | 流水线结构 | 1.7V~1.9V | BOTTOM | 235 | 1 | 1.8V | 1mm | 20 | CY7C1513 | 165 | 1.8V | 1.9V | 1.7V | 72Mb 4M x 18 | 2 | 570mA | 300MHz | 450 ps | SRAM | Parallel | 4MX18 | 3-STATE | 18 | 20b | 72 Mb | SEPARATE | Synchronous | 18b | 1.7V | 1.4mm | 15mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CAT24C164WI-GT3 | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | Gold | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2006 | e4 | yes | Obsolete | 1 (Unlimited) | 8 | EAR99 | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 40 | CAT24C164 | 8 | 5V | 2-Wire, I2C, Serial | 16Kb 2K x 8 | 1mA | 400kHz | 900ns | EEPROM | I2C | 无卤素 | 5ms | 16 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE | 1DDDMMMR | 1.5mm | 5mm | 4mm | 无 | 无SVHC | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | S29VS064RABBHI000 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 表面贴装 | 44-VFBGA | YES | 44 | Non-Volatile | -40°C~85°C TA | Tray | VS-R | e3 | 活跃 | 3 (168 Hours) | 44 | Matte Tin (Sn) | 8542.32.00.51 | 1.7V~1.95V | BOTTOM | 260 | 1.8V | 0.5mm | 40 | 不合格 | 1.8V | 64Mb 4M x 16 | 108MHz | 0.076mA | 80ns | FLASH | Parallel | 16b | 4MX16 | 16 | 60ns | 0.00007A | 67108864 bit | YES | YES | YES | 4127 | 8K32K | YES | TOP | YES | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 93LC56CT-E/MS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2008 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 3V | 0.65mm | 40 | 93LC56C | 8 | 5.5V | 3/5V | 2.5V | Serial | 2Kb 256 x 8 128 x 16 | 2mA | 3MHz | 200 ns | EEPROM | SPI | 256X16 | 16 | 6ms | 2 kb | 0.000005A | MICROWIRE | 1000000 Write/Erase Cycles | 6ms | 200 | SOFTWARE | 8 | 1.1mm | 4.9mm | 3mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | CAT24C64ZI-GT3 | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Gold | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2011 | e4 | yes | Obsolete | 1 (Unlimited) | 8 | EAR99 | 100 YEAR DATA RETENTION | 1.7V~5.5V | DUAL | 未说明 | 1 | 5V | 0.65mm | 未说明 | CAT24C64 | 8 | 不合格 | 5.5V | 1.7V | 2-Wire, I2C, Serial | 64Kb 8K x 8 | 2mA | SYNCHRONOUS | 1MHz | 400ns | EEPROM | I2C | 无卤素 | 5ms | 64 kb | 0.000003A | I2C | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE | 1010DDDR | 950μm | 3.1mm | 3.1mm | 无SVHC | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | S29GL01GS11FHI010 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 表面贴装 | 64-LBGA | 64 | Non-Volatile | -40°C~85°C TA | Tray | 2015 | GL-S | e1 | 活跃 | 3 (168 Hours) | 64 | 3A991.B.1.A | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 260 | 1 | 3V | 1mm | 40 | 3.6V | 3/3.3V | 2.7V | 1Gb 64M x 16 | 60mA | 110ns | FLASH | Parallel | 16b | 128MX8 | 8 | 60ns | 26b | 1 Gb | 0.0001A | Asynchronous | 16b | 2.7V | YES | YES | YES | 1K | 64K | 32B | YES | BOTTOM/TOP | YES | 1.4mm | 13mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
| 23K256-E/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Volatile | -40°C~125°C TA | Tube | 2011 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) - annealed | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 0.65mm | 40 | 23K256 | 8 | 不合格 | 3.3V | 3.6V | 2.7V | SPI, Serial | 256Kb 32K x 8 | 1 | 10mA | 20MHz | 25 ns | SRAM | SPI | 3-STATE | 1b | 256 kb | 0.000004A | SEPARATE | Synchronous | 8b | 2.7V | 1.05mm | 4.5mm | 3.1mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | W9425G6KH-5 | Winbond Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 66-TSSOP (0.400, 10.16mm Width) | YES | Volatile | 0°C~70°C TA | Tray | 2013 | 活跃 | 3 (168 Hours) | 66 | EAR99 | AUTO/SELF REFRESH | 2.3V~2.7V | DUAL | 260 | 1 | 2.5V | 0.65mm | 未说明 | R-PDSO-G66 | 2.7V | 2.3V | 256Mb 16M x 16 | 1 | SYNCHRONOUS | 200MHz | 55ns | DRAM | Parallel | 16MX16 | 16 | 15ns | 268435456 bit | 1.2mm | 22.22mm | 10.16mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 11LC010-E/MS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | YES | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | 11LC010 | 8 | 5V | Serial | 1Kb 128 x 8 | 5mA | 100kHz | EEPROM | 单线 | 5ms | 1 kb | 0.000005A | 1-WIRE | 1000000 Write/Erase Cycles | 10ms | 200 | SOFTWARE | 950μm | 3mm | 3mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT45DB161E-SHD-B | Adesto Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Gold | 表面贴装 | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | 8 | Non-Volatile | -40°C~85°C TC | Tube | 1997 | e4 | yes | 不用于新设计 | 1 (Unlimited) | 8 | EAR99 | 2.5V~3.6V | DUAL | 260 | 1 | 3V | 1.27mm | 8 | 3.3V | 3.6V | 2.5V | SPI, Serial | 16Mb 528Bytes x 4096 pages | 26mA | 85MHz | 6 ns | FLASH | SPI | 8b | 16MX1 | 8μs, 4ms | 21b | 16 Mb | 0.00001A | Synchronous | 2.7V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 512B | 1.91mm | 5.35mm | 5.4mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | AT28HC256-12FM/883 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 23 Weeks | Military grade | 表面贴装 | 28-CFlatPack | YES | Non-Volatile | -55°C~125°C TC | Tube | 2017 | e0 | no | 活跃 | 3 (168 Hours) | 28 | 锡铅 | 自动写入 | 4.5V~5.5V | DUAL | 未说明 | 1 | 5V | 1.27mm | 未说明 | AT28HC256 | R-CDFP-F28 | 不合格 | 5.5V | 5V | 4.5V | 256Kb 32K x 8 | ASYNCHRONOUS | 0.08mA | 120ns | EEPROM | Parallel | 32KX8 | 3-STATE | 8 | 10ms | 0.0003A | 262144 bit | MIL-STD-883 Class C | 5V | 10000 Write/Erase Cycles | 3ms | YES | YES | NO | 64words | 3.02mm | 18.285mm | 10.16mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||
 | 93AA56CX-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2003 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 40 | 93AA56C | 8 | 5.5V | 2/5V | Serial | 2Kb 256 x 8 128 x 16 | 2mA | 3MHz | 200 ns | EEPROM | SPI | 16 | 6ms | 2 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 6ms | 200 | SOFTWARE | 8 | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY14B108L-ZS45XI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Gold | 表面贴装 | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | 44 | Non-Volatile | -40°C~85°C TA | Tray | 2007 | e3 | yes | 活跃 | 3 (168 Hours) | 44 | 3A991.B.2.A | Matte Tin (Sn) | 8542.32.00.41 | 1W | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 0.8mm | 30 | CY14B108 | 44 | 3V | 3.6V | 2.7V | 8Mb 1M x 8 | 57mA | Clock | NVSRAM | Parallel | 16b | 1MX8 | 8 | 45ns | 8 Mb | 0.01A | 45 ns | 8b | HH:MM:SS | 1.194mm | 18.415mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | MX25V4006EM1I-13G | Macronix | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tube | 2010 | MX25xxx05/06 | 不用于新设计 | 3 (168 Hours) | 8 | 3A991.B.1.B.1 | 8542.32.00.51 | 2.35V~3.6V | DUAL | 未说明 | 1 | 2.5V | 1.27mm | 未说明 | 8 | R-PDSO-G8 | 不合格 | 3.6V | 2.5/3.3V | 2.35V | SPI, Serial | 4Mb 512K x 8 | SYNCHRONOUS | 75MHz | FLASH | SPI | 2MX2 | 2 | 50μs, 1ms | 4 Mb | 0.00001A | 3V | 3-WIRE | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 1 | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| 25AA640AX-I/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | YES | 8 | Non-Volatile | -40°C~85°C TA | Tube | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 40 | 25AA640A | 8 | 5V | SPI, Serial | 64Kb 8K x 8 | 5mA | 10MHz | 160 ns | EEPROM | SPI | 8 | 5ms | 64 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | IS43DR16160B-3DBLI | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Industrial grade | 表面贴装 | 表面贴装 | 84-TFBGA | 84 | Volatile | -40°C~85°C TA | Tray | e1 | 活跃 | 3 (168 Hours) | 84 | EAR99 | 锡银铜 | AUTO/SELF REFRESH | 8542.32.00.24 | 1.7V~1.9V | BOTTOM | 260 | 1 | 1.8V | 0.8mm | 10 | 不合格 | 1.8V | 1.9V | 1.7V | 256Mb 16M x 16 | 1 | 250mA | SYNCHRONOUS | 333MHz | 450ps | DRAM | Parallel | 16b | 16MX16 | 3-STATE | 16 | 15ns | 13b | 256 Mb | 0.025A | COMMON | 8192 | 48 | 48 | 1.2mm | 12.5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
| 24VL014/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -20°C~85°C TA | Tube | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.5V~3.6V | DUAL | 260 | 1 | 1.8V | 0.65mm | 40 | 24VL014 | 8 | 不合格 | 3.3V | 3.6V | 1.5V | I2C, Serial | 1Kb 128 x 8 | 3mA | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 1 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 1.2mm | 4.4mm | 3mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | S29GL01GS11DHI010 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 64-LBGA | 64 | Non-Volatile | -40°C~85°C TA | Tray | 2014 | GL-S | 活跃 | 3 (168 Hours) | 64 | 3A991.B.1.A | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 1 | 3V | 1mm | 3.6V | 3/3.3V | 2.7V | 1Gb 64M x 16 | 60mA | 110ns | FLASH | Parallel | 16b | 128MX8 | 8 | 60ns | 26b | 1 Gb | 0.0001A | Asynchronous | 16b | 2.7V | YES | YES | YES | 1K | 64K | 32B | YES | YES | 1.4mm | 9mm | 无 | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
| 24AA04H-I/MS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | Automotive grade | Tin | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2008 | e3 | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.7V~5.5V | DUAL | 260 | 1 | 0.65mm | 40 | 24AA04H | 8 | 5V | 1.7V | I2C, Serial | 4Kb 256 x 8 x 2 | 3mA | 400kHz | 900ns | EEPROM | I2C | OPEN-DRAIN | 8 | 5ms | 4 kb | 0.000001A | ISO/TS-16949 | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | YES | 16words | 1010XXMR | NO | 1.1mm | 3mm | 3mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
| SST25PF020B-80-4C-QAE-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 2 Weeks | Automotive grade | 表面贴装 | 8-WDFN Exposed Pad | YES | 8 | 10.886217mg | Non-Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2006 | SST25 | e3 | 活跃 | 3 (168 Hours) | 8 | Matte Tin (Sn) - annealed | 2.3V~3.6V | DUAL | 1 | 1.27mm | SST25PF020B | 3.6V | 2.5/3.3V | 2.3V | SPI, Serial | 2Mb 256K x 8 | 12mA | 80MHz | FLASH | SPI | 8b | 2MX1 | 1 | 10μs | 1b | 2 Mb | 0.00002A | TS 16949 | 2.7V | SPI | 100000 Write/Erase Cycles | 100 | HARDWARE/SOFTWARE | 6mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MB85RC16VPNF-G-JNN1ERE1 | Fujitsu Electronics America, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8-SOP | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 活跃 | 3 (168 Hours) | 3V~5.5V | 16Kb 2K x 8 | 1MHz | 550ns | FRAM | I2C | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CY7C1313KV18-250BZXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 165-LBGA | 165 | Volatile | 0°C~70°C TA | Tray | 2003 | e1 | 最后一次购买 | 3 (168 Hours) | 165 | 3A991 | Tin/Silver/Copper (Sn/Ag/Cu) | 突发架构 | 1.7V~1.9V | BOTTOM | 260 | 1 | 1.8V | 1mm | 30 | CY7C1313 | 1.8V | 1.9V | 1.7V | 18Mb 1M x 18 | 2 | 440mA | 250MHz | 450 ps | SRAM | Parallel | 1MX18 | 3-STATE | 18 | 18b | 18 Mb | SEPARATE | Synchronous | 18b | 1.7V | 1.4mm | 15mm | 无 | ROHS3 Compliant |