类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 端口的数量 | 电源电流 | 操作模式 | 时钟频率 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 筛选水平 | 访问时间（最大） | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 通用闪存接口 | I2C控制字节 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | AT24C01A-10SU-2.7 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | e3 | Obsolete | 1 (Unlimited) | 8 | Matte Tin (Sn) | 2.7V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | AT24C01 | 5V | 2.7V | 2-Wire, I2C, Serial | 1Kb 128 x 8 | 3mA | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 1 kb | 0.000004A | I2C | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MT41K512M16HA-107:A | Micron Technology Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 96-TFBGA | 96 | Volatile | 0°C~95°C TC | Tray | 2015 | Obsolete | 3 (168 Hours) | 96 | EAR99 | AUTO/SELF REFRESH | 1.283V~1.45V | BOTTOM | 未说明 | 1 | 1.35V | 0.8mm | 未说明 | 1.35V | 1.45V | 1.283V | 8Gb 512M x 16 | 1 | SYNCHRONOUS | 933MHz | 20ns | DRAM | Parallel | 16b | 512MX16 | 16 | 16b | 8 Gb | 1.2mm | 14mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 71V256SA15PZGI8 | Renesas Electronics America Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | Industrial grade | 表面贴装 | 28-TSSOP (0.465, 11.80mm Width) | 28-TSOP | Volatile | -40°C~85°C TA | Tape & Reel (TR) | 活跃 | 3 (168 Hours) | 3V~3.6V | IDT71V256 | 256Kb 32K x 8 | 15ns | SRAM | Parallel | 15ns | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 93LC46BXT-I/SNG | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2005 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 3V | 1.27mm | 40 | 93LC46B | 8 | 不合格 | 5.5V | 3/5V | 2.5V | Serial | 1Kb 64 x 16 | 2mA | SYNCHRONOUS | 2MHz | EEPROM | SPI | 64X16 | 16 | 6ms | 1 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 6ms | 200 | SOFTWARE | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
| 93LC46BT-E/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2008 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 3V | 1.27mm | 40 | 93LC46B | 8 | 5.5V | 3/5V | 2.5V | Serial | 1Kb 64 x 16 | 2mA | 2MHz | 250 ns | EEPROM | SPI | 64X16 | 16 | 6ms | 1 kb | 0.000005A | MICROWIRE | 1000000 Write/Erase Cycles | 6ms | 200 | SOFTWARE | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
 | BR24G128NUX-3ATTR | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Industrial grade | Tin | 表面贴装 | 表面贴装 | 8-UFDFN Exposed Pad | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2015 | 活跃 | 1 (Unlimited) | 8 | 1.7V~5.5V | DUAL | 未说明 | 1 | 0.5mm | 未说明 | BR24G128 | R-PDSO-N8 | 5.5V | 1.7V | 2-Wire, I2C, Serial | 128Kb 16K x 8 | SYNCHRONOUS | 1MHz | 450 ns | EEPROM | I2C | 16KX8 | 8 | 5ms | 128 kb | I2C | 5ms | 0.6mm | 3mm | 2mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT93C86A-10TU-1.8 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | e3 | yes | 活跃 | 3 (168 Hours) | 8 | 1.8V~5.5V | DUAL | 260 | 1 | 2.7V | 0.65mm | 40 | AT93C86A | 不合格 | 5V | Serial | 16Kb 2K x 8 1K x 16 | 2mA | SYNCHRONOUS | 2MHz | EEPROM | SPI | 1KX16 | 10ms | 16 kb | 1e-7A | PARALLEL | MICROWIRE | 1000000 Write/Erase Cycles | 10ms | 100 | SOFTWARE | 1.05mm | 4.5mm | 3.1mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24AA08H-I/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2008 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 40 | 24AA08H | 8 | 5V | 1.7V | I2C, Serial | 8Kb 256 x 8 x 4 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 8 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010XMMR | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
| 25LC080DT-H/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~150°C TA | Tape & Reel (TR) | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | 3A001.A.2.A | Matte Tin (Sn) | 2.5V~5.5V | DUAL | 260 | 1 | 2.7V | 1.27mm | 40 | 25LC080D | 8 | 5V | SPI, Serial | 8Kb 1K x 8 | 5mA | 5MHz | 100 ns | EEPROM | SPI | 8 | 6ms | 8 kb | SPI | 6ms | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S25FL512SAGBHBA13 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | Automotive grade | 表面贴装 | 24-TBGA | YES | 24 | Non-Volatile | -40°C~105°C TA | Tape & Reel (TR) | 2007 | Automotive, AEC-Q100, FL-S | 活跃 | 3 (168 Hours) | 24 | ITS ALSO CONFIGURABLE AS 512MX1 | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 未说明 | 1 | 3V | 1mm | 未说明 | 3.6V | 2.7V | SPI, Serial | 512Mb 64M x 8 | SYNCHRONOUS | 133MHz | FLASH | SPI - Quad I/O | 64MX8 | 8 | 512753664 bit | AEC-Q100; TS 16949 | 3V | 1 | 1.2mm | 8mm | 6mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1314KV18-250BZC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 表面贴装 | 165-LBGA | 165 | Volatile | 0°C~70°C TA | Tray | 2003 | e0 | 活跃 | 3 (168 Hours) | 165 | Tin/Lead (Sn/Pb) | 流水线结构 | 1.7V~1.9V | BOTTOM | 235 | 1 | 1.8V | 1mm | 20 | CY7C1314 | 165 | 1.8V | 1.9V | 1.7V | 18Mb 512K x 36 | 2 | 670mA | 250MHz | 450 ps | SRAM | Parallel | 3-STATE | 36 | 18b | 18 Mb | SEPARATE | Synchronous | 36b | 1.7V | 1.4mm | 15mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST39VF200A-70-4I-B3KE | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 48-TFBGA | YES | 48 | Non-Volatile | -40°C~85°C TA | Tray | 2000 | SST39 MPF™ | e1 | yes | 活跃 | 2 (1 Year) | 48 | 3A991.B.1.A | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 260 | 1 | 3V | 0.8mm | 40 | SST39VF200A | 48 | 3.3V | 3.6V | 2.7V | 2Mb 128K x 16 | 30mA | 70ns | FLASH | Parallel | 16b | 128KX16 | 16 | 20μs | 17b | 2 Mb | 0.00002A | Asynchronous | 16b | 2.7V | YES | YES | YES | 64 | 2K | YES | 1.2mm | 8mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | 24VL025T/OT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Gold | 表面贴装 | 表面贴装 | SOT-23-6 | 6 | Non-Volatile | -20°C~85°C TA | Tape & Reel (TR) | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | SMD/SMT | EAR99 | Matte Tin (Sn) - annealed | 8542.32.00.51 | 1.5V~3.6V | DUAL | 260 | 1 | 1.8V | 0.95mm | 40 | 24VL025 | 8 | R-PDSO-G8 | 3.3V | 1.5V | 2-Wire, I2C, Serial | 2Kb 256 x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 5ms | 2 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | SOFTWARE | 1010DDDR | 1.3mm | 3.1mm | 1.8mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||
| 24LC014HT-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2008 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 4.5V | 1.27mm | 40 | 24LC014H | 8 | 5V | I2C, Serial | 1Kb 128 x 8 | 3mA | 1MHz | 400ns | EEPROM | I2C | 8 | 5ms | 1 kb | I2C | 5ms | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CYD09S36V18-167BBXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 表面贴装 | 表面贴装 | 256-LBGA | 256 | Volatile | 0°C~70°C TA | Tray | 2006 | e1 | yes | Obsolete | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V | 1.42V~1.58V 1.7V~1.9V | BOTTOM | 260 | 1 | 1.5V | 1mm | 30 | CYD09S36 | 256 | 1.8V | 1.58V | 9Mb 256K x 36 | 2 | 570mA | 167MHz | 4ns | SRAM | Parallel | 3-STATE | 36 | 18b | 9 Mb | COMMON | Synchronous | 36b | 1.4V | 1.7mm | 17mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| AT24C01B-TH-B | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2005 | Obsolete | 1 (Unlimited) | 8 | 1.8V~5.5V | DUAL | 1 | 5V | 0.65mm | AT24C01 | 5.5V | 2-Wire, I2C, Serial | 1Kb 128 x 8 | 3mA | 1MHz | 550ns | EEPROM | I2C | 8 | 5ms | 1 kb | I2C | 5ms | 1.2mm | 4.4mm | 3mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CAT24S128C4ATR | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 4-XFBGA, WLCSP | YES | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2016 | e1 | yes | 活跃 | 1 (Unlimited) | 4 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.7V~5.5V | BOTTOM | 1 | 5V | 0.4mm | S-PBGA-B4 | 5.5V | 2.5V | 128K 16K x 8 | SYNCHRONOUS | 1MHz | 400ns | EEPROM | I2C | 16KX8 | 8 | 5ms | 131072 bit | SERIAL | I2C | 5ms | 0.3mm | 0.85mm | 0.85mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M24C64-DFMN6TP | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | ACTIVE (Last Updated: 7 months ago) | Gold | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.7V~5.5V | DUAL | 1 | 2.5V | 1.27mm | M24C64 | 5.5V | 1.7V | 2-Wire, I2C, Serial | 64Kb 8K x 8 | 1MHz | 450ns | EEPROM | I2C | 8 | 5ms | 64 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 1010DDDR | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CY7C1245KV18-400BZC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 表面贴装 | 165-LBGA | 165 | Volatile | 0°C~70°C TA | Tray | 2003 | e0 | 活跃 | 3 (168 Hours) | 165 | Tin/Lead (Sn/Pb) | 流水线结构 | 1.7V~1.9V | BOTTOM | 220 | 1 | 1.8V | 1mm | 30 | CY7C1245 | 165 | 1.8V | 1.9V | 1.7V | 36Mb 1M x 36 | 2 | 920mA | 400MHz | 450 ps | SRAM | Parallel | 1MX36 | 3-STATE | 36 | 18b | 36 Mb | 0.31A | SEPARATE | Synchronous | 36b | 1.7V | 1.4mm | 15mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24AA02H-I/MS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | 8-MSOP | Non-Volatile | -40°C~85°C TA | Tube | 2008 | 活跃 | 1 (Unlimited) | 85°C | -40°C | 1.7V~5.5V | 400kHz | 24AA02H | 2.5V | I2C, Serial | 5.5V | 1.7V | 2Kb 256 x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 5ms | 2 kb | 400kHz | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MX29LV800CTTI-70G | Macronix | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tray | 2008 | MX29LV | e6 | yes | 活跃 | 3 (168 Hours) | 48 | 3A991.B.1.A | Tin/Bismuth (Sn/Bi) | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 260 | 1 | 3V | 0.8mm | unknown | 40 | 48 | R-PBGA-B48 | 不合格 | 3.6V | 3/3.3V | 2.7V | 8Mb 1M x 8 | ASYNCHRONOUS | FLASH | Parallel | 8MX16 | 16 | 70ns | 8 Mb | 0.000005A | 70 ns | 3V | 8 | YES | YES | YES | 12115 | 16K8K32K64K | YES | TOP | YES | 1.2mm | 8mm | 6mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||
 | SST39SF010A-55-4C-NHE | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 32-LCC (J-Lead) | 32 | Non-Volatile | 0°C~70°C TA | Tube | 2010 | SST39 MPF™ | e3 | yes | 活跃 | 3 (168 Hours) | 32 | 3A991.B.1.A | Matte Tin (Sn) | 4.5V~5.5V | QUAD | 245 | 1 | 5V | 1.27mm | 40 | SST39SF010A | 32 | 5V | 5V | 1Mb 128K x 8 | 25mA | 55ns | FLASH | Parallel | 8b | 128KX8 | 8 | 20μs | 17b | 1 Mb | 0.0001A | Asynchronous | 8b | 5V | YES | YES | YES | 32 | 4K | 3.556mm | 13.97mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
 | IS25LQ020B-JNLE | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~105°C TA | Tube | e3 | 活跃 | 3 (168 Hours) | 8 | Tin (Sn) | 2.3V~3.6V | DUAL | 1 | 3V | 1.27mm | 3.3V | 3.6V | 2.3V | SPI, Serial | 2Mb 256K x 8 | SYNCHRONOUS | 104MHz | 8 ns | FLASH | SPI - Quad I/O | 2MX1 | 1 | 800μs | 24b | 2 Mb | 3V | 256B | 1.75mm | 4.9mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1021CV33-10ZSXA | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | Automotive grade | 表面贴装 | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | 44 | Volatile | -40°C~85°C TA | Tray | 1996 | e4 | 活跃 | 3 (168 Hours) | 44 | Nickel/Palladium/Gold (Ni/Pd/Au) | 3V~3.6V | DUAL | 260 | 1 | 3.3V | 0.8mm | 30 | CY7C1021 | 44 | 3.3V | 3.63V | 2.97V | 1Mb 64K x 16 | 1 | 90mA | SRAM | Parallel | 3-STATE | 16 | 10ns | 16b | 1 Mb | 0.005A | COMMON | Asynchronous | 16b | 3V | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| 23LC512-E/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 19 Weeks | Automotive grade | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | Volatile | -40°C~125°C TA | Tube | 2012 | e3 | 活跃 | 1 (Unlimited) | 8 | Matte Tin (Sn) - annealed | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 23LC512 | R-PDSO-G8 | 5.5V | 2.5V | 512Kb 64K x 8 | SYNCHRONOUS | 16MHz | SRAM | SPI - Quad I/O | 64KX8 | 8 | 524288 bit | TS 16949 | SERIAL | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant |