类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 界面 | 内存大小 | 端口的数量 | 电源电流 | 操作模式 | 最大电源电流 | 时钟频率 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 访问时间（最大） | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 通用闪存接口 | I2C控制字节 | 反向引脚排列 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | S29GL256P90FFIR20 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 64-LBGA | 64 | Non-Volatile | -40°C~85°C TA | Tray | 2015 | GL-P | e1 | 活跃 | 3 (168 Hours) | 64 | 3A991.B.1.A | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.32.00.51 | 3V~3.6V | BOTTOM | 260 | 1 | 3.3V | 1mm | 40 | 3.6V | 3.3V | 3V | 256Mb 32M x 8 | 110mA | FLASH | Parallel | 8b | 256MX1 | 1 | 90ns | 256 Mb | 0.000005A | 90 ns | Asynchronous | 3V | 8 | YES | YES | YES | 256 | 128K | 8/16words | YES | YES | 1.4mm | 13mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||
 | W25Q256JVFIQ | Winbond Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tube | 2002 | SpiFlash® | yes | 活跃 | 3 (168 Hours) | 16 | 2.7V~3.6V | DUAL | 未说明 | 1 | 3V | 1.27mm | 未说明 | R-PDSO-G16 | 3.6V | 2.7V | SPI, Serial | 256Mb 32M x 8 | SYNCHRONOUS | 133MHz | FLASH | SPI - Quad I/O | 32MX8 | 8 | 3ms | 268435456 bit | 3V | 2.64mm | 10.31mm | 7.49mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1512KV18-250BZI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 165-LBGA | 165 | Volatile | -40°C~85°C TA | Tray | 2003 | e0 | no | 活跃 | 3 (168 Hours) | 165 | Tin/Lead (Sn/Pb) | PIPELINED ARCHITECTURE; IT ALSO OPERATES AT 1.5V | 1.7V~1.9V | BOTTOM | 235 | 1 | 1.8V | 1mm | 20 | CY7C1512 | 165 | 1.8V | 1.9V | 1.7V | 72Mb 4M x 18 | 2 | 650mA | 250MHz | 450 ps | SRAM | Parallel | 4MX18 | 3-STATE | 18 | 21b | 72 Mb | SEPARATE | Synchronous | 18b | 1.7V | 1.4mm | 15mm | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||
 | CY7C1019DV33-10BVXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 48-VFBGA | 48 | Volatile | -40°C~85°C TA | Tray | 2002 | e1 | yes | 活跃 | 3 (168 Hours) | 48 | Tin/Silver/Copper (Sn/Ag/Cu) | 3V~3.6V | BOTTOM | 260 | 1 | 3.3V | 0.75mm | 30 | CY7C1019 | 48 | 3.3V | 3.6V | 3V | 1Mb 128K x 8 | 1 | 60mA | SRAM | Parallel | 3-STATE | 8 | 10ns | 17b | 1 Mb | 0.003A | 100MHz | COMMON | Asynchronous | 8b | 2V | 8mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||
 | CY62136ESL-45ZSXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | 44 | Volatile | -40°C~85°C TA | Tray | 2001 | MoBL® | e4 | 活跃 | 3 (168 Hours) | 44 | Nickel/Palladium/Gold (Ni/Pd/Au) | IT ALSO OPERATES WITH 4.5V TO 5.5V SUPPLY | 2.2V~5.5V | DUAL | 260 | 1 | 3V | 0.8mm | 30 | CY62136 | 44 | 3.6V | 2.5/3.3/5V | 2.2V | 2Mb 128K x 16 | 1 | 20mA | SRAM | Parallel | 3-STATE | 16 | 45ns | 17b | 2 Mb | 0.000003A | 22MHz | 45 ns | COMMON | Asynchronous | 16b | 1V | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||
 | S25FL064P0XMFI003 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Tin | 表面贴装 | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | 16 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2013 | FL-P | e3 | Obsolete | 3 (168 Hours) | 16 | 3A991.B.1.A | 8542.32.00.51 | 2.7V~3.6V | DUAL | 1 | 3V | 1.27mm | 3.6V | 3/3.3V | 2.7V | SPI, Serial | 64Mb 8M x 8 | 26mA | 104MHz | 8 ns | FLASH | SPI - Quad I/O | 8b | 64MX1 | 1 | 5μs, 3ms | 1b | 64 Mb | 0.00001A | Synchronous | 1b | 3V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 256B | 2.65mm | 10.3mm | 无 | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||
 | 24AA025-I/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2004 | e3 | yes | 活跃 | 不适用 | 8 | EAR99 | 1.7V~5.5V | DUAL | 1 | 2.5V | 2.54mm | 24AA025 | 8 | 5.5V | 2/5V | 1.7V | I2C, Serial | 2Kb 256 x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 2 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | 1010DDDR | 5.334mm | 9.27mm | 7.62mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||
 | BR24S32FVM-WTR | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | Copper, Tin | 表面贴装 | 表面贴装 | 8-VSSOP, 8-MSOP (0.110, 2.80mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2009 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.7V~5.5V | DUAL | 1 | 2.5V | 0.65mm | BR24S32 | 8 | 5.5V | 1.7V | 2-Wire, I2C, Serial | 32Kb 4K x 8 | 2mA | 400kHz | 900 ns | EEPROM | I2C | 8 | 5ms | 32 kb | 0.000002A | I2C | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 1010DDDR | 0.9mm | 2.9mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
 | 24LC128-E/MF | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | 表面贴装 | 8-VDFN Exposed Pad | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2010 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1000000 ERASE/WRITE CYCLES, HARDWARE WRITE PROTECT, DATA RETENTION > 200 YEARS | 2.5V~5.5V | DUAL | 260 | 1 | 4.5V | 1.27mm | 40 | 24LC128 | 8 | 不合格 | 5V | I2C, Serial | 128Kb 16K x 8 | 3mA | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 128 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 1mm | 6mm | 5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
 | 34AA02T-E/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2008 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 40 | 34AA02 | 8 | 不合格 | 5V | 1.7V | I2C, Serial | 2Kb 256 x 8 | 3mA | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 2 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1010DDDR | 1.2mm | 4.4mm | 3mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
 | CY7C1019DV33-10ZSXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 32-SOIC (0.400, 10.16mm Width) | 32 | Volatile | -40°C~85°C TA | Tray | 2002 | e3 | yes | Obsolete | 3 (168 Hours) | 32 | Matte Tin (Sn) | 3V~3.6V | DUAL | 260 | 1 | 3.3V | 30 | CY7C1019 | 32 | 3.3V | 3.6V | 3V | 1Mb 128K x 8 | 1 | 60mA | SRAM | Parallel | 3-STATE | 8 | 10ns | 17b | 1 Mb | 0.003A | 100MHz | COMMON | Asynchronous | 8b | 2V | 20.95mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||
 | 24LC024HT-I/MNY | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Gold | 表面贴装 | 表面贴装 | 8-WFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2008 | e4 | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 4.5V | 0.5mm | 40 | 24LC024H | 8 | 5V | I2C, Serial | 2Kb 256 x 8 | 3mA | 1MHz | 400ns | EEPROM | I2C | 8 | 5ms | 2 kb | I2C | 5ms | 3mm | 2mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | FM25040B-G | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | 540.001716mg | Non-Volatile | -40°C~85°C TA | Tube | 2004 | F-RAM™ | e3 | 活跃 | 3 (168 Hours) | 8 | EAR99 | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 30 | FM25040 | 8 | 5V | 5V | SPI, Serial | 4Kb 512 x 8 | 4mA | 20MHz | 20 ns | FRAM | SPI | 8b | 4 kb | 0.00001A | 8b | 1.5mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||
 | IS25LP016D-JNLE-TR | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | Non-Volatile | -40°C~105°C TA | Tape & Reel (TR) | e3 | yes | 活跃 | 3 (168 Hours) | 8 | Tin (Sn) | 8542.32.00.51 | 2.3V~3.6V | DUAL | 260 | 1 | 3V | 1.27mm | 10 | R-PDSO-G8 | 3.6V | 2.3V | 16Mb 2M x 8 | SYNCHRONOUS | 133MHz | FLASH | SPI - Quad I/O, QPI, DTR | 2MX8 | 8 | 800μs | 16777216 bit | SERIAL | 3V | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 93C66AT-I/MC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-VFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2008 | e3 | yes | 活跃 | 3 (168 Hours) | 8 | EAR99 | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | 93C66A | 8 | 5V | 5V | Serial | 4Kb 512 x 8 | 2mA | 2MHz | 250 ns | EEPROM | SPI | 8 | 2ms | 4 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 2ms | 200 | SOFTWARE | 1mm | 3mm | 2.9mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||
 | IS65C256AL-25ULA3 | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Automotive grade | 表面贴装 | 28-SOIC (0.330, 8.38mm Width) | YES | 28 | Volatile | -40°C~125°C TA | Tube | e3 | yes | 活跃 | 2 (1 Year) | 28 | EAR99 | Matte Tin (Sn) - annealed | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 40 | 28 | 5V | 5V | 256Kb 32K x 8 | 1 | 35mA | SRAM | Parallel | 32KX8 | 3-STATE | 8 | 25ns | 15b | 256 kb | 0.00005A | 25 ns | COMMON | Asynchronous | 8b | 2V | 2.84mm | 无 | Non-RoHS Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
 | IS63WV1288DBLL-10TLI | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Industrial grade | 表面贴装 | 32-SOIC (0.400, 10.16mm Width) | YES | 32 | Volatile | -40°C~85°C TA | Tray | e3 | yes | 活跃 | 3 (168 Hours) | 32 | Matte Tin (Sn) | 2.4V~3.6V | DUAL | 260 | 1 | 40 | 32 | 3.6V | 2.5/3.3V | 2.4V | 1Mb 128K x 8 | 1 | 55mA | SRAM | Parallel | 3-STATE | 8 | 10ns | 17b | 1 Mb | 0.000055A | COMMON | Asynchronous | 8b | 2V | 20.95mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
| CY7C1051DV33-10ZSXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | 44 | Volatile | -40°C~85°C TA | Tray | 2010 | e3 | yes | 活跃 | 3 (168 Hours) | 44 | Matte Tin (Sn) | 3V~3.6V | DUAL | 260 | 1 | 3.3V | 0.8mm | 10GHz | 30 | CY7C1051 | 44 | 3.3V | 3.6V | 3V | 8Mb 512K x 16 | 1 | 110mA | 110mA | SRAM | Parallel | 3-STATE | 10ns | 19b | 8 Mb | 0.02A | COMMON | Asynchronous | 16b | 2V | 1.194mm | 18.52mm | 11.938mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||
 | AT21CS01-MSHM10-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 2-SMD, No Lead | YES | Non-Volatile | -40°C~85°C TC | Tape & Reel (TR) | 活跃 | 1 (Unlimited) | 2 | 1.7V~3.6V | 未说明 | 1 | 2mm | 未说明 | AT21CS01 | R-PSSO-N2 | 3.6V | 1.7V | 1Kb 128 x 8 | 1 | SYNCHRONOUS | 125kHz | EEPROM | I2C, Single Wire | 128X8 | 8 | 5ms | 0.0000015A | 1024 bit | SERIAL | 3.6V | 1-WIRE | 100000 Write/Erase Cycles | 5ms | 100 | SOFTWARE | 8words | NO | 0.4mm | 5mm | 3.5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
 | 24AA00/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | 0°C~70°C TA | Tube | 2005 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 40 | 24AA00 | 8 | 5.5V | 2/5V | 2-Wire, I2C, Serial | 128b 16 x 8 | 3mA | 400kHz | 3500ns | EEPROM | I2C | 8 | 4ms | 128 b | 0.000001A | I2C | 1000000 Write/Erase Cycles | 4ms | 200 | 1010XXXR | 1.75mm | 4.9mm | 3.91mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||
 | 24VL024/MS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | Non-Volatile | -20°C~85°C TA | Tube | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.5V~3.6V | DUAL | 260 | 1 | 1.8V | 0.95mm | 40 | 24VL024 | 8 | 不合格 | 3.3V | 3.6V | 1.5V | 2-Wire, Serial | 2Kb 256 x 8 | 3mA | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 2 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1010DDDR | 1.1mm | 3mm | 3mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
 | S29GL256P11TFI020 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | Tin | 表面贴装 | 表面贴装 | 56-TFSOP (0.724, 18.40mm Width) | 56 | Non-Volatile | -40°C~85°C TA | Tray | 2003 | GL-P | e3 | 活跃 | 3 (168 Hours) | 56 | 3A991.B.1.A | 8542.32.00.51 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 0.5mm | 40 | 3.6V | 3/3.3V | 2.7V | 256Mb 32M x 8 | 110mA | FLASH | Parallel | 8b | 1 | 110ns | 256 Mb | 0.000005A | 110 ns | Asynchronous | 3V | 8 | YES | YES | YES | 256 | 128K | 8/16words | YES | YES | 1.2mm | 18.4mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||
 | CY7C1460AV25-250AXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 100-LQFP | 100 | Volatile | 0°C~70°C TA | Tray | 2004 | NoBL™ | e3 | yes | Obsolete | 3 (168 Hours) | 100 | 3A991.B.2.A | Matte Tin (Sn) | 流水线结构 | 2.375V~2.625V | QUAD | 260 | 1 | 2.5V | 0.65mm | 20 | CY7C1460 | 100 | 2.5V | 2.625V | 2.375V | 36Mb 1M x 36 | 4 | 435mA | 250MHz | 2.6ns | SRAM | Parallel | 1MX36 | 3-STATE | 36 | 20b | 36 Mb | 0.12A | COMMON | Synchronous | 36b | 2.38V | 1.6mm | 20mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||
 | MX25L2006EZUI-12G | Macronix | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 8-UFDFN Exposed Pad | YES | Non-Volatile | -40°C~85°C TA | Tube | 2010 | MX25xxx05/06 | 不用于新设计 | 3 (168 Hours) | 8 | 2.7V~3.6V | DUAL | 未说明 | 1 | 3V | 0.5mm | 未说明 | 8 | R-PDSO-N8 | 不合格 | 3.6V | 3/3.3V | 2.7V | SPI, Serial | 2Mb 256K x 8 | SYNCHRONOUS | 86MHz | FLASH | SPI | 1MX2 | 2 | 50μs, 3ms | 0.00001A | 2097152 bit | 2.7V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 1 | 0.6mm | 3mm | 2mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||
 | AT24CS01-MAHM-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 表面贴装 | 表面贴装 | 8-UFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Cut Tape (CT) | 2005 | yes | Discontinued | 3 (168 Hours) | 1.7V~5.5V | AT24CS01 | 2-Wire, I2C, Serial | 1Kb 128 x 8 | 3mA | 1MHz | 550ns | EEPROM | I2C | 5ms | 1 kb | 无 | ROHS3 Compliant |