类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 端口的数量 | 电源电流 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 无卤素 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 访问时间（最大） | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 内存IC类型 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 引导模块 | 刷新周期 | 通用闪存接口 | I2C控制字节 | 顺序突发长度 | 交错突发长度 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||||||||||||||||||||||
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 | BR25G128FVT-3GE2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | YES | 8 | Non-Volatile | -40°C~85°C TA | Cut Tape (CT) | 2014 | 活跃 | 1 (Unlimited) | 8 | IT ALSO OPERATES AT 3MHZ AT 1.6 MIN | 1.6V~5.5V | DUAL | 未说明 | 1 | 5V | 0.65mm | 未说明 | 5.5V | 4.5V | SPI, Serial | 128Kb 16K x 8 | SYNCHRONOUS | 20MHz | EEPROM | SPI | 8 | 5ms | 131072 bit | SPI | 5ms | 1.2mm | 4.4mm | 3mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CAT24C02TDI-GT3 | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 40 Weeks | Gold | 表面贴装 | 表面贴装 | SOT-23-5 Thin, TSOT-23-5 | 5 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2012 | e4 | yes | Obsolete | 1 (Unlimited) | 5 | EAR99 | 1.7V~5.5V | DUAL | 260 | 1 | 3.3V | 40 | CAT24C02 | 5 | 1.7V | 2-Wire, I2C, Serial | 2Kb 256 x 8 | 2mA | 400kHz | 900ns | EEPROM | I2C | 2KX1 | 无卤素 | 1 | 5ms | 2 kb | 0.000003A | I2C | 1000000 Write/Erase Cycles | 100 | HARDWARE | 1010000R | 1mm | 2.9mm | 1.6mm | 无 | 无SVHC | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 93AA66AT-I/MC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | Tin | 表面贴装 | 表面贴装 | 8-VFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Cut Tape (CT) | 2002 | e3 | yes | Discontinued | 1 (Unlimited) | 8 | EAR99 | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 40 | 93AA66A | 8 | 5V | Serial | 4Kb 512 x 8 | 2mA | 2MHz | 250 ns | EEPROM | SPI | 8 | 6ms | 4 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 6ms | 200 | SOFTWARE | 1mm | 3mm | 2.9mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png) | 24LC08B-I/MSG | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 1 | 1000 | PLASTIC/EPOXY | TSSOP8,.19 | -40 °C | 40 | 85 °C | 有 | 24LC08B-I/MSG | 0.4 MHz | 1024 words | 5 V | TSSOP | SQUARE | Microchip Technology Inc | 活跃 | MICROCHIP TECHNOLOGY INC | 5.13 | MSOP | YES | 8 | ROHS COMPLIANT, PLASTIC, MSOP-8 | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | EEPROMs | CMOS | DUAL | 鸥翼 | 260 | 1 | 0.65 mm | compliant | 8 | S-PDSO-G8 | 不合格 | 5.5 V | 3/5 V | INDUSTRIAL | 2.5 V | SYNCHRONOUS | 0.003 mA | 1KX8 | 1.1 mm | 8 | 0.000001 A | 8192 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 1010XMMR | 3 mm | 3 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 25LC160C-E/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) - annealed | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 25LC160C | 8 | 5V | SPI, Serial | 16Kb 2K x 8 | 5mA | 10MHz | 100 ns | EEPROM | SPI | 8 | 5ms | 16 kb | 0.000005A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 23A512-I/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | Automotive grade | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | YES | Volatile | -40°C~85°C TA | Tube | 2012 | e3 | 活跃 | 1 (Unlimited) | 8 | Matte Tin (Sn) - annealed | 1.7V~2.2V | DUAL | 260 | 1 | 0.65mm | 40 | 23A512 | R-PDSO-G8 | 不合格 | 2.2V | 1.8/2V | 1.7V | SPI, Serial | 512Kb 64K x 8 | 1, (3 LINE) | SYNCHRONOUS | 20MHz | SRAM | SPI - Quad I/O | 64KX8 | 8 | 0.000004A | 524288 bit | TS 16949 | SEPARATE | 1.7V | 1.2mm | 4.4mm | 3mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT25F512N-10SI-2.7 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8-SOIC | Non-Volatile | -40°C~85°C TC | Tube | Obsolete | 1 (Unlimited) | 2.7V~3.6V | AT25F512 | 512Kb 64K x 8 | 20MHz | FLASH | SPI | 100μs | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24LC024T-E/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 1.27mm | 40 | 24LC024 | 8 | 不合格 | 5.5V | 3/5V | 2.5V | I2C, Serial | 2Kb 256 x 8 | 3mA | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 2 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24AA02HT-I/OT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | SC-74A, SOT-753 | 5 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2008 | e3 | 活跃 | 1 (Unlimited) | 5 | EAR99 | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 40 | 24AA02H | 5 | 5V | 3.6V | 1.7V | I2C, Serial | 2Kb 256 x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 2 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 200 | HARDWARE | 1010XXXR | 2.9mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M28W320FCT70N6E | Micron Technology Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | Tin | 表面贴装 | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | 48 | Non-Volatile | -40°C~85°C TA | Tray | 2008 | e3 | yes | Obsolete | 3 (168 Hours) | 48 | 3A991.B.1.A | TOP BOOT BLOCK | 8542.32.00.51 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 0.5mm | 30 | M28W320 | 48 | 3.6V | 3/3.3V | 2.7V | 32Mb 2M x 16 | 18mA | FLASH | Parallel | 2MX16 | 16 | 70ns | 21b | 32 Mb | 0.000005A | 70 ns | Asynchronous | 16b | 3V | NO | NO | YES | 863 | 4K32K | TOP | YES | 1.2mm | 18.4mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT41J256M16HA-125:E | Micron Technology Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 96-TFBGA | 96 | Volatile | 0°C~95°C TC | Tray | 2012 | e1 | Obsolete | 3 (168 Hours) | 96 | AUTO/SELF REFRESH | 1.425V~1.575V | BOTTOM | 260 | 1 | 1.5V | 0.8mm | 30 | MT41J256M16 | 1.5V | 1.575V | 1.425V | 4Gb 256M x 16 | 1 | 235mA | 800MHz | 13.75ns | DRAM | Parallel | 16b | 256MX16 | 3-STATE | 16 | 18b | 4 Gb | 0.018A | COMMON | 8192 | 8 | 8 | 1.2mm | 14mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24AA512-I/ST14G | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 1 | 64000 | PLASTIC/EPOXY | TSSOP14,.25 | -40 °C | 40 | 85 °C | 有 | 24AA512-I/ST14G | 0.4 MHz | 65536 words | 2.5 V | TSSOP | RECTANGULAR | Microchip Technology Inc | 活跃 | MICROCHIP TECHNOLOGY INC | 5.44 | TSSOP | YES | 14 | TSSOP, TSSOP14,.25 | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | EEPROMs | CMOS | DUAL | 鸥翼 | 260 | 1 | 0.65 mm | compliant | 14 | R-PDSO-G14 | 不合格 | 5.5 V | 2/5 V | INDUSTRIAL | 1.7 V | SYNCHRONOUS | 0.003 mA | 64KX8 | 1.2 mm | 8 | 0.000001 A | 524288 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 1010DDDR | 5 mm | 4.4 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 93AA56A-I/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2003 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.8V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | 93AA56A | 8 | 5.5V | 2/5V | Serial | 2Kb 256 x 8 | 2mA | 2MHz | 250 ns | EEPROM | SPI | 8 | 6ms | 2 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 6ms | 200 | SOFTWARE | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1415KV18-250BZC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 165-LBGA | 165 | Volatile | 0°C~70°C TA | Tray | 2003 | e0 | 最后一次购买 | 3 (168 Hours) | 165 | Tin/Lead (Sn/Pb) | 流水线结构 | 1.7V~1.9V | BOTTOM | 235 | 1 | 1.8V | 1mm | 20 | CY7C1415 | 165 | 1.8V | 1.9V | 1.7V | 36Mb 1M x 36 | 2 | 640mA | 250MHz | 450 ps | SRAM | Parallel | 1MX36 | 3-STATE | 36 | 18b | 36 Mb | SEPARATE | Synchronous | 36b | 1.7V | 1.4mm | 15mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 23A640T-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2011 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) - annealed | 1.7V~1.95V | DUAL | 260 | 1 | 1.8V | 40 | 23A640 | 8 | 1.8V | SPI, Serial | 64Kb 8K x 8 | 1 | 10mA | 20MHz | 32 ns | SRAM | SPI | 3-STATE | 8 | 1b | 64 kb | SEPARATE | Synchronous | 8b | 4.9mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MX25L3235EM2I-10G | Macronix | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tube | 2009 | MX25xxx35/36 - MXSMIO™ | e3 | 不用于新设计 | 3 (168 Hours) | 8 | Tin (Sn) | IT ALSO CONFIGURED AS 32M X 1 | 2.7V~3.6V | DUAL | 260 | 1 | 3.3V | 1.27mm | 40 | R-PDSO-G8 | 不合格 | 3.6V | 3/3.3V | 2.7V | SPI, Serial | 32Mb 4M x 8 | SYNCHRONOUS | 104MHz | FLASH | SPI | 8MX4 | 4 | 50μs, 3ms | 32 Mb | 0.00004A | 2.7V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 2 | 2.16mm | 5.28mm | 5.23mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CAV24C512WE-GT3 | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | Automotive grade | ACTIVE (Last Updated: 2 days ago) | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2008 | Automotive, AEC-Q100 | e4 | yes | 活跃 | 1 (Unlimited) | 8 | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.5V~5.5V | DUAL | 未说明 | 1 | 3.3V | 1.27mm | 未说明 | 8 | 不合格 | 5.5V | 3/5V | 2.5V | 2-Wire, I2C, Serial | 512Kb 64K x 8 | SYNCHRONOUS | 1MHz | 900ns | EEPROM | I2C | 无卤素 | 8 | 5ms | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE | 1010DDDR | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | BR24T08FVM-WTR | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Tin | 表面贴装 | 表面贴装 | 8-VSSOP, 8-MSOP (0.110, 2.80mm Width) | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | Matte Tin (Sn) | 1.6V~5.5V | DUAL | 225 | 1 | 2.5V | 0.65mm | 未说明 | BR24T08 | R-PDSO-G8 | 不合格 | 5.5V | 1.8/5V | 1.6V | 2-Wire, I2C, Serial | 8Kb 1K x 8 | SYNCHRONOUS | 400kHz | 900 ns | EEPROM | I2C | 1KX8 | 8 | 5ms | 8 kb | 0.000002A | I2C | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 1010DMMR | 0.9mm | 2.9mm | 2.8mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24FC64-I/MC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | 表面贴装 | 8-VFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2007 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 0.5mm | 40 | 24FC64 | 8 | 5V | 1.7V | I2C, Serial | 64Kb 8K x 8 | 3mA | 1MHz | 400ns | EEPROM | I2C | 8 | 5ms | 64 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 1mm | 3mm | 2mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 47C16-I/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 28 Weeks | Automotive grade | 通孔 | 8-DIP (0.300, 7.62mm) | NO | Non-Volatile | -40°C~85°C TA | Tube | e3 | 活跃 | 不适用 | 8 | Matte Tin (Sn) - annealed | IT ALSO HAS EEPROM BACKUP OF 2K X 8 BITS | 4.5V~5.5V | DUAL | 1 | 5V | 2.54mm | 47C16 | R-PDIP-T8 | 5.5V | 4.5V | 16Kb 2K x 8 | SYNCHRONOUS | 1MHz | 400ns | EERAM | I2C | 2KX8 | 8 | 1ms | 16384 bit | TS 16949 | 5.334mm | 9.271mm | 7.62mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT49BV320D-70CU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 表面贴装 | 47-VFBGA, CSBGA | 47 | 47-CBGA (7x10) | Non-Volatile | -40°C~85°C TC | Tray | 1997 | Obsolete | 3 (168 Hours) | 85°C | -40°C | 2.65V~3.6V | AT49BV320 | Parallel | 3.6V | 2.65V | 32Mb 2M x 16 | 15mA | 70ns | FLASH | Parallel | 16b | 120μs | 21b | 32 Mb | Asynchronous | 16b | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24C00/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | 0°C~70°C TA | Tube | 2007 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 24C00 | 8 | 5V | 5V | 2-Wire, I2C, Serial | 128b 16 x 8 | 3mA | 400kHz | 3500ns | EEPROM | I2C | 4ms | 128 b | 0.000001A | I2C | 1000000 Write/Erase Cycles | 4ms | 200 | 1010XXXR | 1.5mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| BR24L08FVT-WE2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | Copper, Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2009 | e2 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 锡铜 | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 10 | BR24L08 | 8 | 不合格 | 5.5V | 2/5V | 2-Wire, I2C, SPI, Serial | 8Kb 1K x 8 | SYNCHRONOUS | 400kHz | EEPROM | I2C | 8 | 5ms | 8 kb | 0.000002A | I2C | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 1010DMMR | 1.25mm | 4.4mm | 3mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M24C16-FMN6TP | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | Industrial grade | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.7V~5.5V | DUAL | 未说明 | 1 | 1.8V | 1.27mm | 未说明 | M24C16 | 不合格 | 5.5V | 1.7V | 2-Wire, I2C, Serial | 16Kb 2K x 8 | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 16 kb | 0.000001A | I2C | 4000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010MMMR | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M24C08-WBN6P | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | Non-Volatile | -40°C~85°C TA | Tube | e3 | Obsolete | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) - annealed | 2.5V~5.5V | DUAL | 1 | 5V | 2.54mm | M24C08 | 8 | 5.5V | 3/5V | 2.5V | 2-Wire, I2C, Serial | 8Kb 1K x 8 | 2mA | 400kHz | 900ns | EEPROM | I2C | 5ms | 8 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 1010DMMR | 3.3mm | 9.27mm | 6.35mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 |