类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 终端数量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 工作电源电流 | 端口的数量 | 电源电流 | 操作模式 | 最大电源电流 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 无卤素 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 筛选水平 | 访问时间（最大） | 并行/串行 | 输入电容 | I/O类型 | 同步/异步 | 字长 | 内存IC类型 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 环境温度范围高 | 通用闪存接口 | I2C控制字节 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||||||||||||||||||||||||
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 | S29GL256P11FFIV10 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 表面贴装 | 64-LBGA | 64 | Non-Volatile | -40°C~85°C TA | Tray | 2012 | GL-P | e1 | 活跃 | 3 (168 Hours) | 64 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.32.00.51 | 1.65V~3.6V | BOTTOM | 260 | 1 | 3V | 1mm | 40 | 3.6V | 1.8/3.33/3.3V | 2.7V | 256Mb 32M x 8 | 110mA | FLASH | Parallel | 8b | 256MX1 | 1 | 110ns | 256 Mb | 0.000005A | 110 ns | Asynchronous | 3V | 8 | YES | YES | YES | 256 | 128K | 8/16words | YES | YES | 1.4mm | 13mm | 无 | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24FC515-I/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 2 Weeks | Tin | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2008 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 1 | 4.5V | 2.54mm | 24FC515 | 8 | 5.5V | 3/5V | 2.5V | I2C, Serial | 512Kb 64K x 8 | 3mA | 1MHz | 400ns | EEPROM | I2C | 8 | 5ms | 512 kb | 0.000005A | I2C | 100000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010MDDR | 5.334mm | 9.27mm | 7.62mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST25VF064C-80-4I-Q2AE | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 8-WDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tray | 2005 | SST25 | Obsolete | 3 (168 Hours) | 8 | 2.7V~3.6V | 1 | 1.27mm | SST25VF064C | 3.3V | 3.6V | 2.7V | SPI, Serial | 64Mb 8M x 8 | 12mA | 80MHz | 6 ns | FLASH | SPI - Dual I/O | 8b | 64MX1 | 2.5ms | 1b | 64 Mb | 0.00002A | Synchronous | 8b | 2.7V | SPI | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 256B | 750μm | 8mm | 6mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LE24512AQF-AH | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | ACTIVE (Last Updated: 2 days ago) | 表面贴装 | 表面贴装 | 8-WFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2012 | yes | 活跃 | 1 (Unlimited) | 1.7V~3.6V | 8 | 2-Wire, I2C, Serial | 512Kb 64K x 8 | 400kHz | 900ns | EEPROM | I2C | 无卤素 | 5ms | 512 kb | 750μm | 2mm | 3mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CAT24C32HU3I-GT3 | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 8-UFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2013 | e4 | yes | Obsolete | 1 (Unlimited) | 8 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 100 YEAR DATA RETENTION | 1.7V~5.5V | DUAL | 260 | 1 | 5V | 0.5mm | 40 | CAT24C32 | 8 | 5.5V | 2/5V | 1.7V | 2-Wire, I2C, Serial | 32Kb 4K x 8 | 2mA | 1MHz | 900ns | EEPROM | I2C | 无卤素 | 8 | 5ms | 32 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE | 1010DDDR | 0.55mm | 3mm | 2mm | 无 | 无SVHC | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | RMLV0416EGBG-4S2#AC0 | Renesas Electronics America | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 表面贴装 | 48-TFBGA | YES | Volatile | -40°C~85°C TA | Tray | 2013 | yes | 活跃 | 3 (168 Hours) | 48 | 2.7V~3.6V | BOTTOM | 1 | 3V | 0.75mm | RMLV0416 | 48 | R-PBGA-B48 | 不合格 | 3.6V | 3/3.3V | 2.7V | 4Mb 256K x 16 | ASYNCHRONOUS | 0.025mA | SRAM | Parallel | 256KX16 | 3-STATE | 16 | 45ns | 0.000002A | 4194304 bit | 45 ns | COMMON | 1.5V | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 25AA256-E/SM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | Tin | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | YES | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2013 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 40 | 25AA256 | 8 | 不合格 | 5.5V | 2/5V | SPI, Serial | 256Kb 32K x 8 | SYNCHRONOUS | 10MHz | EEPROM | SPI | 8 | 5ms | 0.000001A | 262144 bit | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 2.03mm | 5.21mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CAV24C32WE-GT3 | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Automotive grade | ACTIVE (Last Updated: 2 days ago) | Gold | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2008 | Automotive, AEC-Q100 | e4 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 1 | 3.3V | 1.27mm | CAV24C32 | 8 | 5.5V | 2.5V | 2-Wire, I2C, Serial | 32Kb 4K x 8 | 2mA | 400kHz | 900ns | EEPROM | I2C | 无卤素 | 5ms | 32 kb | I2C | 5ms | 1.5mm | 5mm | 4mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY62148DV30LL-55SXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 表面贴装 | 表面贴装 | 32-SOIC (0.445, 11.30mm Width) | 32 | 766.089163mg | Volatile | -40°C~85°C TA | Tube | 2003 | MoBL® | e4 | yes | Obsolete | 3 (168 Hours) | 32 | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.2V~3.6V | DUAL | 260 | 1 | 3V | 1MHz | 30 | CY62148 | 32 | 3V | 3.6V | 2.2V | 4Mb 512K x 8 | 1 | 10mA | 10mA | SRAM | Parallel | 3-STATE | 8 | 55ns | 19b | 4 Mb | 0.000006A | 55 ns | COMMON | Asynchronous | 8b | 2.997mm | 20.4465mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 23LCV512-I/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 2 Weeks | Automotive grade | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2001 | e3 | 活跃 | 1 (Unlimited) | 8 | Matte Tin (Sn) - annealed | 2.5V~5.5V | 260 | 1 | 0.65mm | 40 | 23LCV512 | 5.5V | 2.5V | SPI, Serial | 512Kb 64K x 8 | 1 | 10mA | 20MHz | 25 ns | NVSRAM | SPI - Dual I/O | 16b | 512 kb | Synchronous | 8b | 1.05mm | 3.1mm | 4.5mm | 无 | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M95160-MN6T | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | e0 | Obsolete | 3 (168 Hours) | 8 | EAR99 | 锡铅 | MINIMUM 1 MILLION ERASE/WRITE CYCLES; 40 YEARS DATA RETENTION | 4.5V~5.5V | DUAL | 1 | 5V | 1.27mm | M95160 | 8 | 5V | 5V | SPI, Serial | 16Kb 2K x 8 | 10MHz | 60 ns | EEPROM | SPI | 3-STATE | 8 | 5ms | 16 kb | 0.00001A | SPI | 1000000 Write/Erase Cycles | 10ms | 40 | HARDWARE/SOFTWARE | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M27C4001-80XF1 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 通孔 | 32-CDIP (0.600, 15.24mm) Window | 32 | Non-Volatile | 0°C~70°C TA | Tube | e3 | Obsolete | 1 (Unlimited) | 32 | EAR99 | Matte Tin (Sn) | 4.75V~5.25V | DUAL | 245 | 1 | 5V | 2.54mm | 80GHz | M27C4001 | 32 | 5V | 5V | 4Mb 512K x 8 | 50mA | 50mA | 80ns | EPROM | Parallel | 512KX8 | 3-STATE | 4 Mb | 0.0001A | 6pF | COMMON | 4.5mm | 42.04mm | 13.36mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 93LC76C-I/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2008 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 1 | 3V | 2.54mm | 93LC76C | 8 | 5.5V | 3/5V | 2.5V | Serial | 8Kb 1K x 8 512 x 16 | 3mA | 3MHz | 100 ns | EEPROM | SPI | 512X16 | 5ms | 8 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 4.953mm | 10.16mm | 7.112mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST39VF800A-70-4I-EKE | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | YES | 48 | Non-Volatile | -40°C~85°C TA | Tray | 2000 | SST39 MPF™ | e3 | yes | 活跃 | 3 (168 Hours) | 48 | 3A991.B.1.A | Matte Tin (Sn) - annealed | 8542.32.00.51 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 0.5mm | 40 | SST39VF800A | 48 | 3.3V | 3.6V | 2.7V | 8Mb 512K x 16 | 30mA | 30mA | 70ns | FLASH | Parallel | 16b | 512KX16 | 16 | 20μs | 19b | 8 Mb | 0.00002A | Asynchronous | 16b | 2.7V | YES | YES | YES | 256 | 2K | YES | 1.2mm | 18.4mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png) | K4B4G1646E-BYMA | Samsung | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 11LC010-I/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | Non-Volatile | -40°C~85°C TA | Tube | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 1 | 5V | 2.54mm | 11LC010 | 8 | 5V | Serial | 1Kb 128 x 8 | 5mA | 100kHz | 5 ms | EEPROM | 单线 | 8 | 1 kb | 0.000005A | 1-WIRE | 1000000 Write/Erase Cycles | 10ms | 200 | SOFTWARE | 5.334mm | 9.271mm | 7.62mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M95080-RMC6TG | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 表面贴装 | 8-UFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.8V~5.5V | DUAL | 1 | 0.5mm | M95080 | 5.5V | SPI, Serial | 8Kb 1K x 8 | 20MHz | 80 ns | EEPROM | SPI | 8 | 5ms | 8 kb | SPI | 5ms | 0.6mm | 3mm | 2mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MX66L51235FMI-10G | Macronix | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | YES | 16 | Non-Volatile | -40°C~85°C TA | Tube | MX25xxx35/36 - MXSMIO™ | e3 | 不用于新设计 | 3 (168 Hours) | 16 | Matte Tin (Sn) | ALSO IT CAN BE CONFIGURED AS 512M X 1 BIT | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 1.27mm | 40 | 不合格 | 3.6V | 3/3.3V | 2.7V | SPI, Serial | 512Mb 64M x 8 | SYNCHRONOUS | 104MHz | FLASH | SPI | 128MX4 | 4 | 40ms, 3ms | 0.00004A | 536870912 bit | 3V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 2 | 2.65mm | 10.3mm | 7.52mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M24C16-WMN6 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | e0 | no | Obsolete | 3 (168 Hours) | 8 | EAR99 | 2.5V~5.5V | DUAL | 未说明 | 1 | 5V | 1.27mm | unknown | 未说明 | M24C16 | 8 | 不合格 | 5.5V | 3/5V | 2.5V | 2-Wire, I2C, Serial | 16Kb 2K x 8 | 2mA | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | OPEN-DRAIN | 5ms | 16 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 1010MMMR | 1.25mm | 4.9mm | 3.9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24AA32AT-I/MSG | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | TSSOP, TSSOP8,.19 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 1 | 4000 | PLASTIC/EPOXY | TSSOP8,.19 | -40 °C | 40 | 85 °C | 有 | 24AA32AT-I/MSG | 0.1 MHz | 4096 words | 2.5 V | TSSOP | SQUARE | Microchip Technology Inc | 活跃 | MICROCHIP TECHNOLOGY INC | 5.29 | MSOP | 表面贴装 | YES | 8 | 8 | Compliant | Tape & Reel (TR) | e3 | 有 | EAR99 | Matte Tin (Sn) | 85 °C | -40 °C | 2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED | 8542.32.00.51 | EEPROMs | CMOS | DUAL | 鸥翼 | 260 | 1 | 0.65 mm | compliant | 400 kHz | 8 | S-PDSO-G8 | 不合格 | 5.5 V | 2/5 V | INDUSTRIAL | 1.7 V | I2C, Serial | 5.5 V | 1.8 V | 4 kB | 3 mA | SYNCHRONOUS | 0.003 mA | 900 ns | 4KX8 | 1.1 mm | 8 | 32 kb | 0.000001 A | 32768 bit | 400 kHz | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 1010DDDR | 3 mm | 3 mm | 无 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S25FL128SAGMFB013 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Automotive grade | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | YES | Non-Volatile | -40°C~105°C TA | Tape & Reel (TR) | 2011 | FL-S | e3 | 活跃 | 3 (168 Hours) | 16 | Matte Tin (Sn) | ALSO CONFIGURABLE AS 128M X 1 | 8542.32.00.51 | 2.7V~3.6V | DUAL | 未说明 | 1 | 3V | 1.27mm | 未说明 | R-PDSO-G16 | 3.6V | 2.7V | SPI, Serial | 128Mb 16M x 8 | SYNCHRONOUS | 133MHz | FLASH | SPI - Quad I/O | 32MX4 | 4 | 134217728 bit | AEC-Q100 | 3V | 500ms | 2 | 2.65mm | 10.3mm | 7.5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT24C256BN-SH-B | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8-SOIC | Non-Volatile | -40°C~85°C TA | Tube | 1997 | Obsolete | 1 (Unlimited) | 1.8V~5.5V | AT24C256 | 256Kb 32K x 8 | 1MHz | 550ns | EEPROM | I2C | 5ms | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | W25Q128JVSIM | Winbond Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tube | 2016 | SpiFlash® | yes | 活跃 | 3 (168 Hours) | 8 | IT ALSO OPERATES AT 104 MHZ CLOCK FREQUENCY AT 2.7 TO 3.0 V SUPPLY VOLTAGE | 2.7V~3.6V | DUAL | 未说明 | 1 | 3.3V | 1.27mm | 未说明 | S-PDSO-G8 | 3.6V | 3V | SPI | 128Mb 16M x 8 | SYNCHRONOUS | 133MHz | FLASH | SPI - Quad I/O, QPI, DTR | 16MX8 | 8 | 3ms | 134217728 bit | SERIAL | 3V | 1 | 85°C | 2.16mm | 5.23mm | 5.23mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST25LF020A-33-4C-SAE-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2011 | SST25 | e3 | 活跃 | 3 (168 Hours) | 8 | Matte Tin (Sn) - annealed | 3V~3.6V | DUAL | 3.3V | 1.27mm | SST25LF020A | 3.3V | SPI, Serial | 2Mb 256K x 8 | 10mA | 33MHz | 12 ns | FLASH | SPI | 8b | 8 | 20μs | 1b | 2 Mb | 0.000015A | Synchronous | 8b | SPI | 100000 Write/Erase Cycles | 100 | HARDWARE/SOFTWARE | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MX25L3206EM2I-12G | Macronix | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tube | 2009 | MX25xxx05/06 | e3 | yes | 不用于新设计 | 3 (168 Hours) | 8 | 3A991.B.1.A | Matte Tin (Sn) | 8542.32.00.51 | 2.7V~3.6V | DUAL | 260 | 1 | 3.3V | 1.27mm | 40 | 8 | R-PDSO-G8 | 不合格 | 3.6V | 3/3.3V | 2.7V | SPI, Serial | 32Mb 4M x 8 | SYNCHRONOUS | 86MHz | FLASH | SPI | 16MX2 | 图腾柱 | 2 | 50μs, 3ms | 32 Mb | 0.00004A | 3.3V | 3-WIRE | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 1 | 2.16mm | 5.28mm | 5.23mm | ROHS3 Compliant | 无铅 |