类别是'振荡器'
振荡器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | 尺寸/尺寸 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | 电容量 | 电压 - 供电 | 电源电压 | 深度 | 频率 | 频率稳定性 | 输出量 | 引脚数量 | 功能 | 基本谐振器 | 最大电流源 | 输出的数量 | 物理尺寸 | 工作频率 | 工作电源电压 | 上升时间-最大值 | 最大下降时间 | 对称性-最大值 | 电流 - 电源（禁用）（最大值） | 最大电源电压 | 最小电源电压 | 负载电容 | 最大电源电流 | 最大工作周期 | 输出电平 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | 评级结果 | |||||||||||||||||||||||||||
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 | DSC1001DL2-049.5000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-VDFN | -40°C~105°C | Tape & Reel (TR) | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | yes | 活跃 | 3 (168 Hours) | XO (Standard) | 1.8V~3.3V | 3.3V | 49.5MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 49.5MHz | 2ns | 2ns | 55/45% | 15μA | 7.2mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | DSC1121AI2-050.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 6-SMD, No Lead Exposed Pad | 6 | -40°C~85°C | Tube | DSC1121 | 0.276Lx0.197W 7.00mmx5.00mm | yes | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | 2.25V~3.6V | 50MHz | ±25ppm | CMOS | Enable/Disable | MEMS | 7.0mm x 5.0mm x 0.9mm | 50MHz | 2ns | 2ns | 55/45% | 22mA | 15pF | 35mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LTC6900IS5#TRMPBF (CUT REEL) | Analog Devices | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 无 | Resistor | 0.001 to 20 | ±2.5% | ±0.004%/°C | 0.04%/V | 55 | Single-Ended | 2.7 | 5.5 | 5|3.3 | 1.2 | 0.6%(Typ) | -40 | 有 | 85 | Industrial | SOT | TSOT-23 | 表面贴装 | 0.9(Max) | 2.9 | 1.75(Max) | 5 | Gull-wing | EAR99 | 卷带 | 活跃 | 硅振荡器 | 5 | 1 | CMOS | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1001DE5-019.2000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -20°C~70°C | Tube | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | e3 | yes | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | Matte Tin (Sn) | 1.8V~3.3V | 3.3V | 19.2MHz | ±10ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 19.2MHz | 2ns | 2ns | 55/45% | 15μA | 15pF | 6.3mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | DSC557-0344FI0 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 14-SMD, No Lead | Industrial grade | -40°C~85°C | Tube | 2013 | DSC557-03 | 0.126Lx0.098W 3.20mmx2.50mm | 活跃 | 1 (Unlimited) | XO (Standard) | 85°C | -40°C | 2.25V~3.6V | 100MHz | ±100ppm | HCSL | Enable/Disable | MEMS | 60mA Typ | 23mA | 60mA | 889μm | 0.035 0.90mm | 3.2004mm | 2.4892mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1123AL1-150.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 6-SMD, No Lead Exposed Pad | -40°C~105°C | Tube | DSC1123 | 0.276Lx0.197W 7.00mmx5.00mm | yes | 活跃 | 3 (168 Hours) | XO (Standard) | 2.25V~3.63V | 150MHz | ±50ppm | LVDS | Enable/Disable | MEMS | 7.0mm x 5.0mm x 0.9mm | 150MHz | 52/48% | 22mA | 32mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | DSC1001AI5-027.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 4-SMD, No Lead Exposed Pad | Automotive grade | -40°C~85°C | Tube | DSC1001 | 0.276Lx0.197W 7.00mmx5.00mm | yes | 活跃 | 1 (Unlimited) | 4 | XO (Standard) | ALSO OPERATES AT 2.5V AND 1.8V SUPPLY VOLTAGE | 1.8V~3.3V | 3.3V | 27MHz | ±10ppm | CMOS | Enable/Disable | MEMS | 7.0mm x 5.0mm x 0.9mm | 27MHz | 2ns | 2ns | 55/45% | 15μA | 7.2mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | DSC1001BI2-012.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1001 | 0.197Lx0.126W 5.00mmx3.20mm | e3 | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | Matte Tin (Sn) | 1.8V~3.3V | 3.3V | 12MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 5.0mm x 3.2mm x 0.85mm | 12MHz | 3.3V | 2ns | 2ns | 55/45% | 15μA | 15pF | 6.3mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | DSC1123CI2-125.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tube | DSC1123 | 0.126Lx0.098W 3.20mmx2.50mm | e4 | 活跃 | 1 (Unlimited) | Solder | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.25V~3.63V | 125MHz | ±25ppm | LVDS | Enable/Disable | MEMS | 3.2mm x 2.5mm x 0.85mm | 125MHz | 52/48% | 22mA | 2pF | 32mA | 52 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | DSC1001CI1-027.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 4-VDFN | 4 | -40°C~85°C | Tape & Reel (TR) | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | e3 | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | Matte Tin (Sn) | 1.8V~3.3V | 3.3V | 27MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.85mm | 27MHz | 3.3V | 2ns | 2ns | 15μA | 15pF | 7.2mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1001CI2-033.3330 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 4-SMD, No Lead | YES | Automotive grade | -40°C~85°C | Tube | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | e4 | 活跃 | 1 (Unlimited) | 4 | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | ALSO OPERATES AT 2.5V AND 1.8V SUPPLY VOLTAGE | 1.8V~3.3V | 3.3V | 33.333MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 7.2mA | 3.2mm x 2.5mm x 0.9mm | 33.333MHz | 2ns | 2ns | 55/45% | 15μA | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ASDMB-50.000MHZ-LC-T | Abracon LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 表面贴装 | 4-SMD, No Lead | 4 | -40°C~85°C | Cut Tape (CT) | ASDMB, Pure Silicon™ | 0.098Lx0.079W 2.50mmx2.00mm | 活跃 | 1 (Unlimited) | SMD/SMT | XO (Standard) | 85°C | -40°C | 1.8V~3.3V | 50MHz | ±50ppm | LVCMOS | Standby (Power Down) | MEMS | 16mA | 3.3V | 15μA | 4V | -300mV | 15pF | 16mA | 889μm | 0.035 0.90mm | 2.4892mm | 2.0066mm | 无SVHC | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1001DI2-125.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tube | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 1.8V~3.3V | 3.3V | 125MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 125MHz | 3.3V | 2ns | 2ns | 55/45% | 15μA | 15pF | 8.7mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1001CE2-024.5760 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -20°C~70°C | Tube | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 1.8V~3.3V | 3.3V | 24.576MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.85mm | 24.576MHz | 3.3V | 2ns | 2ns | 55/45% | 15μA | 15pF | 6.3mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1121CL5-050.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~105°C | Tube | DSC1121 | 0.126Lx0.098W 3.20mmx2.50mm | e3 | yes | 活跃 | 3 (168 Hours) | XO (Standard) | Matte Tin (Sn) | 15pF | 2.25V~3.6V | 50MHz | ±10ppm | CMOS | Enable/Disable | MEMS | 3.2mm x 2.5mm x 0.9mm | 50MHz | 2ns | 2ns | 55/45% | 22mA | 35mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1001BC1-020.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | 0°C~70°C | Tape & Reel (TR) | DSC1001 | 0.197Lx0.126W 5.00mmx3.20mm | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 70°C | 0°C | 1.8V~3.3V | 20MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 6.3mA | 3.3V | 15μA | 3.6V | 1.7V | 15pF | 6.3mA | 55 % | 889μm | 0.035 0.90mm | 5.0038mm | 3.2004mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1001AI2-054.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead Exposed Pad | -40°C~85°C | Tape & Reel (TR) | DSC1001 | 0.276Lx0.197W 7.00mmx5.00mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 1.8V~3.3V | 3.3V | 54MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 7.0mm x 5.0mm x 0.85mm | 54MHz | 3.3V | 2ns | 2ns | 55/45% | 15μA | 15pF | 7.2mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1001DL1-027.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -40°C~105°C | Tape & Reel (TR) | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | e3 | yes | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | Matte Tin (Sn) | 1.8V~3.3V | 3.3V | 27MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 27MHz | 2ns | 2ns | 55/45% | 15μA | 15pF | 7.2mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1123CI5-100.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tube | DSC1123 | 0.126Lx0.098W 3.20mmx2.50mm | e4 | 活跃 | 1 (Unlimited) | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.25V~3.63V | 100MHz | ±10ppm | LVDS | Enable/Disable | MEMS | 3.2mm x 2.5mm x 0.85mm | 100MHz | 52/48% | 22mA | 32mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1001AL2-027.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 4-SMD, No Lead Exposed Pad | 4 | -40°C~105°C | Tube | DSC1001 | 0.276Lx0.197W 7.00mmx5.00mm | yes | 活跃 | 1 (Unlimited) | Solder | XO (Standard) | 1.8V~3.3V | 3.3V | 27MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 7.0mm x 5.0mm x 0.85mm | 27MHz | 3.3V | 2ns | 2ns | 15μA | 15pF | 7.2mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC557-0344FL1T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 14-SMD, No Lead | -40°C~105°C | Tape & Reel (TR) | 2013 | DSC557-03 | 0.126Lx0.098W 3.20mmx2.50mm | 活跃 | 3 (168 Hours) | XO (Standard) | 105°C | -40°C | 2.25V~3.6V | 100MHz | ±50ppm | HCSL | Enable/Disable | MEMS | 60mA Typ | 23mA | 60mA | 889μm | 0.035 0.90mm | 3.2004mm | 2.4892mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 570BAB000544DG | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Gold | 表面贴装 | 表面贴装 | 8-SMD, No Lead | 8 | 186.029571mg | -40°C~85°C | Strip | 2004 | Si570 | 0.276Lx0.197W 7.00mmx5.00mm | yes | 活跃 | 1 (Unlimited) | 8 | XO (Standard) | ENABLE/DISABLE FUNCTION; TRAY | 3.3V | 3.3V | 5mm | 156.25MHz | ±50ppm | LVDS | Enable/Disable (Reprogrammable) | Crystal | 810MHz | 3.3V | 0.35ns | 0.35ns | 55/45% | 75mA | 108mA | 1.8034mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1122CI2-150.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 6-SMD, No Lead | 6 | -40°C~85°C | Tape & Reel (TR) | DSC1122 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 2.25V~3.6V | 150MHz | ±25ppm | LVPECL | Enable/Disable | MEMS | 3.2mm x 2.5mm x 0.85mm | 150MHz | 52/48% | 22mA | 58mA | 52 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | DSC1124NI1-100.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1124 | 0.276Lx0.197W 7.00mmx5.00mm | e3 | yes | 活跃 | 1 (Unlimited) | XO (Standard) | Matte Tin (Sn) | 2.25V~3.6V | 100MHz | ±50ppm | HCSL | Enable/Disable | MEMS | 7.0mm x 5.0mm x 0.85mm | 100MHz | 0.4ns | 52/48% | 22mA | 42mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1121AE2-025.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Standard, Surface Mount | 表面贴装 | 6-SMD, No Lead Exposed Pad | -20°C~70°C | Tape & Reel (TR) | DSC1121 | 0.276Lx0.197W 7.00mmx5.00mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 2.25V~3.6V | 25MHz | ±25ppm | CMOS | Enable/Disable | MEMS | 7.0mm x 5.0mm x 0.9mm | 25MHz | 2ns | 2ns | 55/45% | 22mA | 15pF | 35mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 |