类别是'接口 - 电信'
接口 - 电信 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 功率(瓦特) | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 功能 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 界面 | 电路数量 | 工作电源电流 | 电源电流 | 最大电源电流 | 电流源 | 逻辑功能 | 数据率 | 通信IC类型 | 发射器数量 | 负电源电压 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | ||
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 | HC5515CM | Rochester Electronics, LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 28-LCC (J-Lead) | YES | 0°C~70°C | Tube | e0 | no | Obsolete | 1 (Unlimited) | 28 | 锡铅 | 1.5W | 4.75V~5.25V | QUAD | J BEND | 240 | 5V | 30 | S-PQCC-J28 | Subscriber Line Interface Concept (SLIC) | COMMERCIAL | 1 | -5V | Non-RoHS Compliant | |||||||||||||||||||||||||||||||
| HC55140IM | Rochester Electronics, LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | -40°C | YES | 85°C | e0 | no | Obsolete | 1 (Unlimited) | 28 | 锡铅 | QUAD | J BEND | 225 | 1 | 5V | 30 | S-PQCC-J28 | COMMERCIAL | INDUSTRIAL | SLIC | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
| HC55142IM | Rochester Electronics, LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | -40°C | YES | 85°C | e0 | no | Obsolete | 3 (168 Hours) | 28 | 锡铅 | QUAD | J BEND | 240 | 1 | 5V | 30 | S-PQCC-J28 | COMMERCIAL | INDUSTRIAL | SLIC | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
 | VSC8489YJU-17 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 196-LBGA, FCBGA | 196-FCBGA (15x15) | -40°C~110°C | Tray | 活跃 | 4 (72 Hours) | 1V 1.2V | Ethernet | SPI | 2 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
 | VSC8530XMW-05 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 48-VFQFN Exposed Pad | 48-QFN (6x6) | 活跃 | 3 (168 Hours) | Ethernet | RMII | 1 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
 | VSC8256YMR-01 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 256-BBGA, FCBGA | 256-FCBGA (17x17) | Tray | 活跃 | 4 (72 Hours) | 1V 1.2V | Ethernet | SPI | 4 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
| VSC8257YMR-01 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 256-BBGA, FCBGA | 256-FCBGA (17x17) | Tray | 活跃 | 3 (168 Hours) | 1V 1.2V | Ethernet | SPI | 4 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
| VSC8491YJU-17 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 196-LBGA, FCBGA | 196-FCBGA (15x15) | Tray | 活跃 | 4 (72 Hours) | 1V 1.2V | Ethernet | SPI | 2 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | HC55121IB | Rochester Electronics, LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 28-SOIC (0.295, 7.50mm Width) | YES | -40°C~85°C | Tube | UniSLIC14 | e0 | no | Obsolete | 1 (Unlimited) | 28 | 锡铅 | 2W | 4.75V~5.25V | DUAL | 鸥翼 | 240 | 5V | 未说明 | R-PDSO-G28 | Subscriber Line Interface Concept (SLIC) | COMMERCIAL | 1 | 2.25mA | 2.65mm | 7.5mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||
| HC55185CIM | Rochester Electronics, LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 28-LCC (J-Lead) | YES | -40°C~85°C | Tube | RSLIC18 | e0 | no | Obsolete | 1 (Unlimited) | 28 | 锡铅 | QUAD | J BEND | 225 | 5V | 未说明 | S-PQCC-J28 | Subscriber Line Interface Concept (SLIC) | 不合格 | 1 | 4.57mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
 | HC9P5504B-5X96 | Rochester Electronics, LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 24-SOIC (0.295, 7.50mm Width) | YES | 0°C~75°C | Tape & Reel (TR) | e0 | no | Obsolete | 1 (Unlimited) | 24 | 锡铅 | 4.75V~5.25V | DUAL | 鸥翼 | 240 | 5V | 未说明 | R-PDSO-G24 | Subscriber Line Interface Concept (SLIC) | 不合格 | 1 | 7.493mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
 | CYW15G0101DXB-BBC | Rochester Electronics, LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 100-LBGA | YES | 0°C~70°C | Tray | HOTlink II™ | e0 | no | Obsolete | 3 (168 Hours) | 100 | 锡铅 | 3.135V~3.465V | BOTTOM | BALL | 未说明 | 3.3V | 1mm | unknown | 未说明 | S-PBGA-B100 | 收发器 | COMMERCIAL | LVTTL | 390mA | 电信电路 | 1.4mm | 11mm | 11mm | Non-RoHS Compliant | |||||||||||||||||||||||||
| HC55185GIM | Rochester Electronics, LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 28-LCC (J-Lead) | YES | -40°C~85°C | Tube | RSLIC18 | e0 | no | Obsolete | 3 (168 Hours) | 28 | 锡铅 | QUAD | J BEND | 240 | 5V | 未说明 | S-PQCC-J28 | Subscriber Line Interface Concept (SLIC) | 不合格 | 1 | 4.57mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
 | ISL5571AIB-T | Rochester Electronics, LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | YES | -40°C~85°C | Tape & Reel (TR) | no | Obsolete | 4 (72 Hours) | 16 | 未说明 | 4.5V~5.5V | DUAL | 鸥翼 | 240 | 5V | 未说明 | 接入高压开关 | COMMERCIAL | 1 | 电信电路 | 2.65mm | 7.5mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
 | CYP15G0401TB-BGC | Rochester Electronics, LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 256-LBGA Exposed Pad | YES | 0°C~70°C | Tray | HOTlink II™ | e0 | no | Obsolete | 3 (168 Hours) | 256 | 锡铅 | 3.135V~3.465V | BOTTOM | BALL | 未说明 | 3.3V | 1.27mm | unknown | 未说明 | S-PBGA-B256 | Driver | COMMERCIAL | LVTTL | 4 | 590mA | 电信电路 | 27mm | 27mm | Non-RoHS Compliant | |||||||||||||||||||||||||
 | DS2153Q-A7 | Rochester Electronics, LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 44-LCC (J-Lead) | YES | 0°C~70°C | Tube | e0 | no | Obsolete | 3 (168 Hours) | 44 | 锡铅 | 4.75V~5.25V | QUAD | J BEND | 240 | 5V | 20 | S-PQCC-J44 | Single-Chip Transceiver | COMMERCIAL | E1 | 1 | 65mA | FRAMER | 4.572mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||
 | DS21352LN | Rochester Electronics, LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 100-LQFP | YES | -40°C~85°C | Tray | e0 | no | Obsolete | 3 (168 Hours) | 100 | 锡铅 | 3.14V~3.47V | QUAD | 鸥翼 | 240 | 3.3V | 0.5mm | 20 | Single-Chip Transceiver | COMMERCIAL | HDLC, T1 | 1 | 75mA | pcm收发器 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
| CYP15G0401RB-BGC | Rochester Electronics, LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 256-LBGA Exposed Pad | YES | 0°C~70°C | Tray | HOTlink II™ | e0 | no | Obsolete | 3 (168 Hours) | 256 | 锡铅 | 3.135V~3.465V | BOTTOM | BALL | 未说明 | 3.3V | 1.27mm | unknown | 未说明 | S-PBGA-B256 | Receiver | COMMERCIAL | LVTTL | 4 | 640mA | 电信电路 | 27mm | 27mm | Non-RoHS Compliant | |||||||||||||||||||||||||
| HC55130IBZ | Rochester Electronics, LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 28-SOIC (0.295, 7.50mm Width) | YES | -40°C~85°C | Tube | UniSLIC14 | e3 | yes | Obsolete | 3 (168 Hours) | 28 | 哑光锡 | 2W | 4.75V~5.25V | DUAL | 鸥翼 | 260 | 5V | 40 | R-PDSO-G28 | Subscriber Line Interface Concept (SLIC) | COMMERCIAL | 1 | 2.25mA | 2.65mm | 7.5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||
| CYP15G0401TB-BGXC | Rochester Electronics, LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 256-LBGA Exposed Pad | YES | 0°C~70°C | Tray | HOTlink II™ | e1 | yes | Obsolete | 3 (168 Hours) | 256 | 锡银铜 | 3.135V~3.465V | BOTTOM | BALL | 260 | 3.3V | 1.27mm | unknown | 20 | S-PBGA-B256 | Driver | COMMERCIAL | LVTTL | 4 | 590mA | 电信电路 | 27mm | 27mm | ROHS3 Compliant | |||||||||||||||||||||||||
 | CYV15G0201DXB-BBC | Rochester Electronics, LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 196-LBGA | YES | 0°C~70°C | Tray | HOTlink II™ | e0 | no | Obsolete | 3 (168 Hours) | 196 | 锡铅 | 3.135V~3.465V | BOTTOM | BALL | 220 | 3.3V | 1mm | unknown | 未说明 | S-PBGA-B196 | 收发器 | COMMERCIAL | LVTTL | 2 | 570mA | 电信电路 | 1.5mm | 15mm | 15mm | Non-RoHS Compliant | ||||||||||||||||||||||||
 | DS2155GN | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 21 Weeks | 表面贴装 | 表面贴装 | 100-LFBGA, CSPBGA | 100 | -40°C~85°C | Tray | 2006 | e0 | no | Obsolete | 3 (168 Hours) | EAR99 | Tin/Lead (Sn/Pb) | 3.14V~3.47V | BOTTOM | BALL | 240 | 3.3V | 0.8mm | not_compliant | 20 | DS2155 | Single-Chip Transceiver | 不合格 | 3.3V | E1, HDLC, J1, T1 | 75mA | 75mA | 收发器 | 64 kbps | FRAMER | 1 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||
 | DS2175S+ | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | 16 | -40°C~85°C | Tube | 1999 | e3 | yes | Obsolete | 1 (Unlimited) | 16 | EAR99 | Tin (Sn) | 4.5V~5.5V | DUAL | 鸥翼 | 260 | 5V | DS2175 | 弹性存储 | 5V | 5V | PCM | 1 | 9mA | 9mA | 16mA | 弹性缓冲器 | 2.65mm | 7.5mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||
 | HC55143IM | Renesas Electronics America Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 32-LCC (J-Lead) | -40°C~85°C | Tube | UniSLIC14 | Obsolete | 3 (168 Hours) | 1.4W | 4.75V~5.25V | 未说明 | 未说明 | HC55143 | Subscriber Line Interface Concept (SLIC) | 1 | 2.25mA | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||
| DS3170+ | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 100-LBGA, CSBGA | 100 | 0°C~70°C | Tray | 2011 | e3 | yes | Obsolete | 4 (72 Hours) | EAR99 | Matte Tin (Sn) | 3.135V~3.465V | BOTTOM | BALL | 260 | 3.3V | DS3170 | Single-Chip Transceiver | 3.3V | DS3, E3 | 120mA | 145mA | 收发器 | 44.736 Mbps | FRAMER | 1 | 无 | ROHS3 Compliant | 无铅 |