类别是'接口 - 电信'
接口 - 电信 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 表面安装 | 终端数量 | Date Of Intro | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 应用 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 温度等级 | 电源电流-最大值 | 数据率 | 座位高度-最大 | 通信IC类型 | 负电源电压 | 运输载体类型 | 电池供电 | PSRR-Min | 混合动力车 | 电池供电 | 马克斯噪音 | 长度 | 宽度 | ||||||||||||||
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PBL3726/6 | Ericsson | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||
UM6551 | United Microelectronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | UNITED MICROELECTRONICS CORP (USA) | , | Transferred | unknown | |||||||||||||||||||||||||||||||||||||||||||||
AM7947PC | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | ADVANCED MICRO DEVICES INC | DIP | DIP, DIP28,.6 | 70 °C | PLASTIC/EPOXY | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | 5 V | -38.9 TO -58 V | 28 | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 28 | R-PDIP-T28 | 不合格 | COMMERCIAL | 8.5 mA | 5.715 mm | SLIC | -5 V | 28 dB | 2-4 CONVERSION | CONSTANT CURRENT | 14 dBrnC | 37.084 mm | 15.24 mm | ||||||||||||
LXT380BE | Inphi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | INPHI CORP | BGA, | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 3.3 V | 160 | Transferred | 8542.39.00.01 | BOTTOM | BALL | 1 | 1 mm | compliant | S-PBGA-B160 | 不合格 | INDUSTRIAL | 1.8 mm | pcm收发器 | 15 mm | 15 mm | ||||||||||||||||||||||||
LXT380BE | Cortina Systems Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | CORTINA SYSTEMS INC | BGA | BGA, | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 3.3 V | 160 | Transferred | 8542.39.00.01 | BOTTOM | BALL | 1 | 1 mm | compliant | 160 | S-PBGA-B160 | 不合格 | INDUSTRIAL | 1.8 mm | pcm收发器 | 15 mm | 15 mm | ||||||||||||||||||||||
T5551-PAE | Atmel Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | ATMEL CORP | , MODULE,12LEAD,1.2 | 1 | 85 °C | -40 °C | PLASTIC/EPOXY | MODULE,12LEAD,1.2 | RECTANGULAR | 微电子组件 | 2 | 无 | 无 | 8542.39.00.01 | DUAL | UNSPECIFIED | 1 | compliant | R-PDMA-X2 | 不合格 | INDUSTRIAL | 电信电路 | ||||||||||||||||||||||||||
T5551-PAE | Temic Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | TEMIC SEMICONDUCTORS | 85 °C | -40 °C | Transferred | 1 | unknown | 不合格 | INDUSTRIAL | 电信电路 | ||||||||||||||||||||||||||||||||||||||||
TEA1083A | Philips Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Transferred | 飞利浦半导体 | DIP, DIP16,.3 | 70 °C | -25 °C | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | 3.6 V | 16 | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T16 | 不合格 | OTHER | 4 mA | ||||||||||||||||||||||||
TEA1083A | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | NXP SEMICONDUCTORS | DIP | 0.300 INCH, PLASTIC, DIP-16 | 75 °C | -25 °C | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | 3.6 V | 16 | Obsolete | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | compliant | 16 | R-PDIP-T16 | 不合格 | 商业扩展 | 0.004 mA | 4.7 mm | 电信电路 | 21.6 mm | 7.62 mm | ||||||||||||||||||||
MDBT40-P256RV3 | Raytec Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||
PEF24624E | Infineon Technologies AG | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | INFINEON TECHNOLOGIES AG | 19 X 19 MM, PLASTIC, LBGA-324 | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.8 V | 324 | Obsolete | 8542.39.00.01 | BOTTOM | BALL | 1 | unknown | S-PBGA-B324 | INDUSTRIAL | 电信电路 | |||||||||||||||||||||||||||||
PEF24624E | Lantiq | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | LANTIQ | BGA, | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.8 V | 324 | Obsolete | 8542.39.00.01 | BOTTOM | BALL | 1 | compliant | S-PBGA-B324 | INDUSTRIAL | 电信电路 | |||||||||||||||||||||||||||||
R8075J | Conexant Systems Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | 康讯系统 | QCCJ, LDCC28,.5SQ | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | 5 V | 28 | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | J BEND | 1.27 mm | compliant | S-PQCC-J28 | 不合格 | COMMERCIAL | ||||||||||||||||||||||||||
R8075J | Synaptics Incorporated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 活跃 | SYNAPTICS INC | QCCJ, LDCC28,.5SQ | 5 V | CHIP CARRIER | SQUARE | LDCC28,.5SQ | QCCJ | PLASTIC/EPOXY | 70 °C | 28 | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | J BEND | 1.27 mm | compliant | S-PQCC-J28 | 不合格 | COMMERCIAL | ||||||||||||||||||||||||||
ATA5746-PXPW | Atmel Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | ATMEL CORP | QFN | HVQCCN, LCC24,.2SQ,25 | 105 °C | -40 °C | UNSPECIFIED | HVQCCN | LCC24,.2SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 3 V | 24 | 有 | 8542.39.00.01 | QUAD | 无铅 | 1 | 0.65 mm | compliant | 24 | S-XQCC-N24 | 不合格 | INDUSTRIAL | 0.01 mA | 1 mm | 电信电路 | 5 mm | 5 mm | |||||||||||||||||||
MH88634K | Zarlink Semiconductor Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | ZARLINK SEMICONDUCTOR INC | SIP, SIP21,.13 | 70 °C | PLASTIC/EPOXY | SIP | SIP21,.13 | RECTANGULAR | IN-LINE | 5 V | 21 | 无 | e0 | 锡铅 | 8542.39.00.01 | SINGLE | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PSIP-T21 | 不合格 | COMMERCIAL | 0.013 mA | 15.9 mm | SLIC | -5 V | |||||||||||||||||||||
R8050P | Synaptics Incorporated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | 活跃 | SYNAPTICS INC | DIP-28 | 70 °C | PLASTIC/EPOXY | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | 5 V | 28 | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | compliant | R-PDIP-T28 | 不合格 | COMMERCIAL | 48 mA | 1544 Mbps | T-1(DS1) | |||||||||||||||||||||||
QCA4531-BL3B | Qualcomm | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | QUALCOMM INC | 2019-10-21 | 活跃 | unknown | 无线局域网电路 | ||||||||||||||||||||||||||||||||||||||||||||
GA9102-2MC | TriQuint Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | TRIQUINT SEMICONDUCTOR INC | QFN | QCCJ, LDCC28,.5SQ | 1 | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | 5 V | 28 | 无 | 8542.39.00.01 | QUAD | J BEND | 1.27 mm | unknown | 28 | S-PQCC-J28 | 不合格 | COMMERCIAL | 0.18 mA | 4.3688 mm | ATM/SONET/SDH RECEIVER | 11.303 mm | 11.303 mm | ||||||||||||||||||||
GA9102-2MC | Qorvo | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 活跃 | QORVO INC | QCCJ, LDCC28,.5SQ | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | 5 V | 28 | 无 | 8542.39.00.01 | QUAD | J BEND | 1.27 mm | compliant | S-PQCC-J28 | 不合格 | COMMERCIAL | 180 mA | |||||||||||||||||||||||||||
SARA-U270-53S-00 | u-blox AG | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | U-BLOX AG | PACKAGE-96 | 4 | 55 °C | -20 °C | UNSPECIFIED | RECTANGULAR | 微电子组件 | 3.8 V | 96 | 有 | 8542.39.00.01 | UNSPECIFIED | 无铅 | 1 | unknown | R-XXMA-N96 | OTHER | 3.25 mm | 电信电路 | 26 mm | 16 mm | |||||||||||||||||||||||||
SY87701ALZI | Micrel Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | MICREL INC | SOIC | SOP, SOP28,.4 | 1 | 85 °C | 3.3 V | 小概要 | RECTANGULAR | SOP28,.4 | SOP | PLASTIC/EPOXY | -40 °C | 28 | 无 | e0 | Tin/Lead (Sn75Pb25) | ATM; SDH; SONET | 8542.39.00.01 | DUAL | 鸥翼 | 240 | 1 | 1.27 mm | not_compliant | 30 | 28 | R-PDSO-G28 | 不合格 | INDUSTRIAL | 0.16 mA | 2.65 mm | ATM/SONET/SDH CLOCK RECOVERY CIRCUIT | 17.93 mm | 7.52 mm | |||||||||||||
RTL8812FR-CG | TDK Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||
RFDA0057SQ | Qorvo | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | QORVO INC | BCC, | 3 | 85 °C | -40 °C | UNSPECIFIED | BCC | SQUARE | CHIP CARRIER | 5 V | 32 | Obsolete | 8542.39.00.01 | BOTTOM | BUTT | 1 | 0.7 mm | compliant | S-XBCC-B32 | INDUSTRIAL | 1.25 mm | 射频和基带电路 | 7 mm | 7 mm | ||||||||||||||||||||||||
RFDA0057SQ | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | RF MICRO DEVICES INC | MCM | BCC, | 3 | 85 °C | -40 °C | UNSPECIFIED | BCC | SQUARE | CHIP CARRIER | 5 V | 32 | 有 | 有 | 5A991.G | 8542.33.00.01 | BOTTOM | BUTT | 1 | 0.7 mm | compliant | 32 | S-XBCC-B32 | INDUSTRIAL | 1.25 mm | 射频和基带电路 | 7 mm | 7 mm |