类别是'接口 - 电信'
接口 - 电信 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | 最大功率耗散 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 功能 | 资历状况 | 输出电压 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 通道数量 | 界面 | 电路数量 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 端口的数量 | 电源电流 | 功率耗散 | 输出电流 | 最大电源电流 | 电源电流-最大值 | 接通延迟时间 | 电流源 | 逻辑功能 | 数据率 | 输出特性 | 输出极性 | 输入特性 | 驱动程序位数 | 输入电容 | 通信IC类型 | 消费者集成电路类型 | 负供电电压 | 输出低电流-最大值 | 内置保护器 | ISDN接入速率 | 参考点 | 输出高电压-最小 | 输出低电压-最大值 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||||
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 | ZL50114GAG2 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 552-BGA | 552 | -40°C~85°C | Tray | 2009 | e1 | 活跃 | 3 (168 Hours) | 552 | 锡银铜 | 1.65V~1.95V | BOTTOM | BALL | 1.8V | ZL50114 | Telecom Circuit | 1.8V | TDM | 1 | 950mA | 1 Gbps | 2.53mm | 35mm | 35mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | VSC7423XJG-02 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | -40°C | IN PRODUCTION (Last Updated: 1 month ago) | 672-BGA | YES | 125°C | Caracal™ Lite | 活跃 | 4 (72 Hours) | 672 | BOTTOM | BALL | 1 | 1V | 1mm | S-PBGA-B672 | AUTOMOTIVE | 以太网收发器 | 2.36mm | 27mm | 27mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SI3019-F-FTR | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Tin | 表面贴装 | 16-TSSOP (0.173, 4.40mm Width) | YES | 16 | 0°C~70°C | Tape & Reel (TR) | 1999 | e3 | yes | 活跃 | 3 (168 Hours) | 16 | 3V~3.6V | DUAL | 鸥翼 | 0.65mm | Direct Access Arrangement (DAA) | 3.3V | 3.6V | 3V | GCI, PCM, SPI | 1 | 8.5mA | 消费电路 | 5mm | 4.4mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ST7580 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 表面贴装 | 48-VFQFN Exposed Pad | 48 | Industrial grade | -40°C~85°C | Tray | e4 | 活跃 | 3 (168 Hours) | 48 | 5A992.C | Nickel/Palladium/Gold (Ni/Pd/Au) | 8V~18V | QUAD | 13V | 0.5mm | 8MHz | ST7580 | Power Line Networking System-On-Chip | 13V | UART | 1 | 500μA | 0.03mA | 57.6 kbps | 电信电路 | 7mm | 7mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MT88L70AS1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 18-SOIC (0.295, 7.50mm Width) | 18 | -40°C~85°C | Tube | e3 | yes | 活跃 | 3 (168 Hours) | 18 | 哑光锡 | 500mW | 2.7V~3.6V | DUAL | 鸥翼 | 260 | 3V | 3.58MHz | 30 | DTMF接收器 | 3V | 3V | 1 | 2mA | Receiver | DTMF信号电路 | 2.65mm | 7.5mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| VSC7424XJG-02 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 672-BGA | 672-HSBGA (27x27) | Tray | SparX™-III-10 | 活跃 | 4 (72 Hours) | 1V | 以太网交换机 | Serial | 1 | 1 Gbps | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | DS3680N | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 2 days ago) | 通孔 | 通孔 | 14-DIP (0.300, 7.62mm) | 14 | 927.99329mg | 10 μs | 0°C~70°C | Tube | e4 | yes | 活跃 | 1 (Unlimited) | 14 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | DUAL | DS3680 | Driver | 60V | -52V | 4 | -60V | -10V | 50mA | 1.15W | 100mA | 10 μs | DIFFERENTIAL | TRUE | DIFFERENTIAL | 4 | -52V | TRANSIENT | 5.08mm | 19.3mm | 6.35mm | 3.9mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||
 | MT88E39ASR1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | YES | -40°C~85°C | Tape & Reel (TR) | 2006 | e3 | yes | 活跃 | 3 (168 Hours) | 16 | 哑光锡 | IT CAN ALSO OPERATE WITH 5V NOMINAL VOLTAGE | 2.7V~5.5V | DUAL | 鸥翼 | 260 | 3V | 30 | Telecom Circuit | 不合格 | 3-Wire | 1 | 1.9mA | 电话呼叫无识别电路 | 2.65mm | 7.5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MT9074AP1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 68-LCC (J-Lead) | 68 | -40°C~85°C | Tube | 2011 | e3 | yes | 活跃 | 1 (Unlimited) | 68 | 哑光锡 | 4.75V~5.25V | QUAD | J BEND | 260 | 5V | 30 | 收发器 | 5V | 1 | 200mA | FRAMER | 4.57mm | 24.23mm | 24.23mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MT9171AP1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | PLCC | 28 | 28-PLCC | -40°C~85°C | Tube | e3 | 活跃 | 1 (Unlimited) | 28 | 哑光锡 | 4.75V~5.25V | QUAD | J BEND | 260 | 5V | 30 | Subscriber Line Interface Concept (SLIC) | 5V | 1 | 10mA | 160 kbps | 数码单反 | 4.57mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MT9171AN1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 24-SSOP (0.209, 5.30mm Width) | 24 | 220.105698mg | -40°C~85°C | Tube | e3 | 活跃 | 3 (168 Hours) | 24 | 哑光锡 | 4.75V~5.25V | DUAL | 鸥翼 | 260 | 5V | 0.65mm | 30 | Subscriber Line Interface Concept (SLIC) | 5V | 1 | 10mA | 160 kbps | 数码单反 | 2mm | 8.2mm | 5.3mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LM567CN/NOPB | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 6 days ago) | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | 930.006106mg | 0°C~70°C | Tube | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 1.1W | 4.75V~9V | DUAL | 5V | 2.54mm | 500kHz | LM567 | 音频解码器 | 5V | 1 | 12mA | 12mA | Decoder | 5.08mm | 9.81mm | 6.35mm | 3.9mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LE9540CUQC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | QFN | YES | 40 | 40-QFN | 117.310327mg | 85°C | Tray | 2011 | 活跃 | 3 (168 Hours) | 40 | QUAD | 3.3V | 0.5mm | Subscriber Line Interface Concept (SLIC) | 3.3V | INDUSTRIAL | Serial | 2 | 1mm | 6mm | 6mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LE88266TQC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | QFN | 64 | 64-QFN | Tray | 活跃 | 3 (168 Hours) | 4.75V~35V | Telecom Circuit | PCM | 2 | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT9172AN1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 24-SSOP (0.209, 5.30mm Width) | 24 | -40°C~85°C | Tube | e3 | 活跃 | 3 (168 Hours) | 24 | 哑光锡 | 4.75V~5.25V | DUAL | 鸥翼 | 260 | 5V | 0.65mm | 30 | Subscriber Line Interface Concept (SLIC) | 5V | 1 | 10mA | 160 kbps | 数码单反 | 2mm | 8.2mm | 5.3mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | VSC8664XIC-03 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | BGA | 256-BGA (17x17) | Tray | 活跃 | 3 (168 Hours) | 100°C | -40°C | Ethernet | 1 | 1.25 Gbps | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MT8889CS1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 20-SOIC (0.295, 7.50mm Width) | 20 | 800.987426mg | -40°C~85°C | Tube | e3 | yes | 活跃 | 3 (168 Hours) | 20 | 哑光锡 | 1W | 4.75V~5.25V | DUAL | 鸥翼 | 260 | 5V | 3.579MHz | 30 | DTMF 收发器 | 5V | 5V | 1 | 7mA | 收发器 | DTMF信号电路 | 2.65mm | 7.5mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LE88266DLC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 80-LQFP | 80 | 80-eLQFP | 639.990485mg | Tray | 2001 | 活跃 | 3 (168 Hours) | 4.75V~35V | Telecom Circuit | 2 | PCM | 2 | 35V | 4.75V | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | VSC8584XKS-14 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-BGA | YES | -40°C | Tray | 2016 | 活跃 | 3 (168 Hours) | 256 | 1V | BOTTOM | BALL | 2.5V | unknown | S-PBGA-B256 | Ethernet | AUTOMOTIVE | GMII, SerDes, SPI, TBI | 1 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MT9173AN1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | SSOP | 24-SSOP | -40°C~85°C | Tube | e3 | 活跃 | 1 (Unlimited) | 24 | 哑光锡 | 4.75V~5.25V | DUAL | 鸥翼 | 260 | 5V | 0.65mm | 30 | R-PDSO-G24 | Subscriber Line Interface Concept (SLIC) | 5V | 5V | 1 | 10mA | 160 kbps | 数码单反 | 0.005A | BASIC | S | 2.4V | 0.4V | 2mm | 8.2mm | 5.3mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | MT90866AG2 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 344-BBGA | 344 | -40°C~85°C | Tray | 2006 | e1 | yes | 活跃 | 3 (168 Hours) | 344 | Tin/Silver/Copper (Sn/Ag/Cu) | 3V~3.6V | BOTTOM | BALL | 3.3V | Switch | 3.3V | 1 | 480mA | 2.53mm | 27mm | 27mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MT8985AP1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 44-LCC (J-Lead) | 44 | 2.386605g | -40°C~85°C | Tube | 2006 | e3 | yes | 活跃 | 3 (168 Hours) | 44 | 哑光锡 | 2W | 4.75V~5.25V | QUAD | J BEND | 260 | 5V | 30 | Switch | 5V | 5V | 1 | 10mA | 8 | 10mA | 4.57mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LM567CN | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | 0°C~70°C | Tube | e0 | no | Obsolete | 1 (Unlimited) | 8 | EAR99 | Tin/Lead (Sn/Pb) | 1.1W | 4.75V~9V | DUAL | 5V | 2.54mm | 10mHz | LM567 | 音频解码器 | 5V | 1 | 12mA | 12mA | Decoder | 25pF | 7.62mm | 无 | 无SVHC | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MT90823AB1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 100-LQFP | 100 | -40°C~85°C | Tray | 2006 | e3 | yes | 活跃 | 1 (Unlimited) | 100 | 哑光锡 | 3V~3.6V | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 30 | Switch | 3.3V | 1 | 45mA | 16 | 70mA | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LE79234KVC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 128-TQFP | 128-TQFP | Tray | 2011 | 活跃 | 3 (168 Hours) | 2-Wire | 无 | ROHS3 Compliant |