类别是'接口 - 电信'
接口 - 电信 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 电阻 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 功率(瓦特) | HTS代码 | 最大功率耗散 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 功能 | 资历状况 | 最大输出电流 | 工作电源电压 | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 电路数量 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 电源电流 | 最大电源电流 | uPs/uCs/外围ICs类型 | 时钟频率 | 电源电流-最大值 | 电流源 | 逻辑功能 | 数据率 | 增益带宽积 | 地址总线宽度 | 边界扫描 | 外部数据总线宽度 | 通信IC类型 | 消费者集成电路类型 | 串行I/O数 | 总线兼容性 | 最大数据传输率 | 通信协议 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | RoHS状态 | 无铅 | |||
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 | HT18LG-G | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | 540.001716mg | 0°C~50°C | Tape & Reel (TR) | 2014 | e3 | 活跃 | 1 (Unlimited) | 8 | 哑光锡 | 800mW | DUAL | 鸥翼 | 260 | 2.3V | 40 | HT18 | Switch | 不合格 | 6V | 1 | 350V | 4.9mm | 3.9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | MT8880CSR1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 20-SOIC (0.295, 7.50mm Width) | 20 | -40°C~85°C | Tape & Reel (TR) | 2006 | e3 | yes | 活跃 | 3 (168 Hours) | 20 | 哑光锡 | 4.75V~5.25V | DUAL | 鸥翼 | 260 | 5V | 3.58MHz | 30 | DTMF 收发器 | 5V | 5V | 1 | 7mA | 收发器 | DTMF信号电路 | 2.65mm | 7.5mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
 | LE9530CETCT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | -40°C | Industrial grade | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | TQFP | YES | 48-eTQFP | 85°C | Tape & Reel (TR) | 2011 | 活跃 | 3 (168 Hours) | 48 | QUAD | 鸥翼 | 3.3V | 0.5mm | S-PQFP-G48 | Subscriber Line Interface Concept (SLIC) | 3.3V | INDUSTRIAL | Parallel | 2 | 4.33mA | 7mm | 7mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | ST7570 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 48-VFQFN Exposed Pad | 48 | -40°C~85°C | Tray | e3 | 活跃 | 3 (168 Hours) | 48 | 5A002.A.2 | Matte Tin (Sn) - annealed | 8V~18V | QUAD | 鸥翼 | 260 | 13V | 0.5mm | 8MHz | 40 | ST7570 | Power Line Networking System-On-Chip | 1.4A | 13V | UART | 1 | 35mA | 0.03mA | 2.4 kbps | 电信电路 | 7mm | 7mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
 | VSC8575XKS-14 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | -40°C | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-BGA | YES | 125°C | Tray | 2016 | 活跃 | 4 (72 Hours) | 256 | BOTTOM | BALL | 1 | 1V | 1mm | unknown | S-PBGA-B256 | AUTOMOTIVE | 以太网收发器 | 1.8mm | 17mm | 17mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | VSC7421XJQ-02 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 1 month ago) | 表面贴装 | TQFP | 302-TQFP (24x24) | Tray | SparX™-III-17um | 不用于新设计 | 4 (72 Hours) | 125°C | 0°C | 1V | 以太网交换机 | Serial | 1 | 1 Gbps | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SI32171-B-FM1R | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 42-WFQFN Exposed Pad | 0°C~70°C | Tape & Reel (TR) | 2000 | ProSLIC® | yes | 活跃 | 3 (168 Hours) | Subscriber Line Interface Concept (SLIC), CODEC | 3.3V | GCI, PCM, SPI | 1 | 电信电路 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png) | LE88131BLC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 44-LQFP | Tray | 1993 | 活跃 | 3 (168 Hours) | 3V 5V | Telecom Circuit | PCM | 1 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LE88830KQCT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 24-QFN | Tape & Reel (TR) | 2008 | 活跃 | 3 (168 Hours) | Telecom Circuit | PCM | 2 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SI32182-A-FMR | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 36-VFQFN Exposed Pad | YES | 0°C~70°C | Tape & Reel (TR) | 2000 | ProSLIC® | 活跃 | 3 (168 Hours) | 36 | 3.3V | QUAD | 无铅 | 未说明 | 1 | 3.3V | 未说明 | R-XQCC-N36 | 3-Wire | 1 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LE9652PQC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 48-VFQFN Exposed Pad | YES | Industrial grade | -40°C~85°C | Tray | 2014 | miSLIC™ | 活跃 | 3 (168 Hours) | 48 | 3.135V~3.465V | QUAD | 无铅 | 3.3V | 0.5mm | unknown | S-XQCC-N48 | Subscriber Line Interface Concept (SLIC) | 4-Wire | 2 | 25mA | 1mm | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| SI32176-C-FM1 | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 42-WFQFN Exposed Pad | YES | 0°C~70°C | Tray | 2000 | ProSLIC® | 活跃 | 3 (168 Hours) | 42 | 3.3V | BOTTOM | BUTT | 未说明 | 3.3V | 0.5mm | 未说明 | R-XBCC-B42 | Subscriber Line Interface Concept (SLIC), CODEC | GCI, PCM, SPI | 1 | 电信电路 | 0.9mm | 7mm | 5mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MT3171BE1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | -40°C~85°C | Tube | e3 | yes | Obsolete | 1 (Unlimited) | 8 | 哑光锡 | 4.75V~5.25V | DUAL | 260 | 5V | 2.54mm | 4.19MHz | 30 | DTMF接收器 | 5V | 5V | Parallel | 1 | 3mA | 3mA | Receiver | DTMF信号电路 | 5.33mm | 9.59mm | 7.62mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
| VSC7422XJQ-02 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 表面贴装 | 302-TQFP (24x24) | Tray | SparX™-III-25um | 不用于新设计 | 4 (72 Hours) | 1V | 以太网交换机 | Serial | 1 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CPC7591BBTR | IXYS Integrated Circuits Division | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | 16 | 16-SOIC | 665.986997mg | -40°C~110°C | Tape & Reel (TR) | 2013 | Obsolete | 1 (Unlimited) | 100Ohm | 110°C | -40°C | 10.5mW | 10.5mW | 4.5V~5.5V | 线路卡接入开关 | 5V | 1 | 5.5V | 4.5V | 2mA | 1μA | 2mA | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC92460ZU | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 26 Weeks | 表面贴装 | 480-LBGA Exposed Pad | YES | 0°C~85°C | Tray | 2002 | e0 | Obsolete | 4 (72 Hours) | 480 | 5A991 | 锡铅 | 8542.31.00.01 | 3.15V~3.45V | BOTTOM | BALL | 220 | 1.8V | 1.27mm | 30 | MC92460 | S-PBGA-B480 | 不合格 | IEEE 1149.1 | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | 16MHz | 32 | YES | 64 | 40 | 60X | 8.3375 MBps | SYNC, HDLC | 1.65mm | 37.5mm | 37.5mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||
 | MT88E43BSR1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | LIMITED TIME BUY (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 24-SOIC (0.295, 7.50mm Width) | 24 | -40°C~85°C | Tape & Reel (TR) | 2006 | e3 | yes | 活跃 | 3 (168 Hours) | 24 | 哑光锡 | 2.7V~5.5V | DUAL | 鸥翼 | 260 | 3V | 3.58MHz | 30 | Telecom Circuit | 3-Wire | 1 | 3mA | 2.65mm | 7.5mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | VSC8540XMV-04 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 68-VFQFN Exposed Pad | 68-QFN (8x8) | Tray | 2017 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | BCM5751KFBG | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 2001 | Obsolete | 1 (Unlimited) | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LE87251NQC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 16-VFQFN Exposed Pad | 16 | 16-QFN (4x4) | -40°C~85°C | Tray | 2013 | 活跃 | 3 (168 Hours) | 85°C | -40°C | 10V~24V ±5V~12V | Driver | 2 | 4mA | 4mA | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | VSC8531XMW-04 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 48-VFQFN Exposed Pad | 48-QFN (6x6) | Tray | Obsolete | 3 (168 Hours) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | THS6226AIRHBT | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 3 days ago) | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad | 32 | -40°C~85°C | Tape & Reel (TR) | e4 | yes | 活跃 | 3 (168 Hours) | 32 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 10V~12.5V | QUAD | 无铅 | 260 | 未说明 | THS6226 | VDSL2 Line Driver Amplifier | 12V | 10V | Serial | 2 | 24.6mA | 97MHz | 消费电路 | 1mm | 5mm | 5mm | 900μm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
 | CPC5710NTR | IXYS Integrated Circuits Division | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | 8-SOIC | 540.001716mg | -40°C~85°C | Tape & Reel (TR) | 2011 | LITELINK® | 活跃 | 1 (Unlimited) | 85°C | -40°C | 300mW | 300mW | 3V~5.5V | Phone Line Monitor (PLM) | 5V | 1 | 5.5V | 3V | 10mA | 10mA | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | VSC7224XJV-02 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 48-QFN | 48-QFN (5x9) | Tray | 2017 | 活跃 | 3 (168 Hours) | 1.2V | 通道扩展器 | 1.2V | 2-Wire | 1 | 10.3125 Gbps | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SI32260-C-FM1 | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 60-WFQFN Exposed Pad | 0°C~70°C | Tray | 2000 | ProSLIC® | yes | 活跃 | 3 (168 Hours) | 3.13V~3.47V | Subscriber Line Interface Concept (SLIC), CODEC | 3.3V | GCI, PCM, SPI | 1 | 数码单反 | 符合RoHS标准 |